JPH04271603A - Spiral coil - Google Patents

Spiral coil

Info

Publication number
JPH04271603A
JPH04271603A JP5586491A JP5586491A JPH04271603A JP H04271603 A JPH04271603 A JP H04271603A JP 5586491 A JP5586491 A JP 5586491A JP 5586491 A JP5586491 A JP 5586491A JP H04271603 A JPH04271603 A JP H04271603A
Authority
JP
Japan
Prior art keywords
coil
adhesives
spiral
card
spiral coil
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5586491A
Other languages
Japanese (ja)
Inventor
Akio Nakamura
昭雄 中村
Katsuhisa Aizawa
相沢 勝久
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shin Etsu Polymer Co Ltd
Shin Etsu Chemical Co Ltd
Original Assignee
Shin Etsu Polymer Co Ltd
Shin Etsu Chemical Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shin Etsu Polymer Co Ltd, Shin Etsu Chemical Co Ltd filed Critical Shin Etsu Polymer Co Ltd
Priority to JP5586491A priority Critical patent/JPH04271603A/en
Publication of JPH04271603A publication Critical patent/JPH04271603A/en
Pending legal-status Critical Current

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Abstract

PURPOSE:To realize the spiral coil with small size whose operation is stable and which is inexpensively mass-produced as the antenna coil used for a contactless individual object recognition card. CONSTITUTION:A pillar 4 obtained by winding a metallic foil layer 2 and an adhesive insulation layer 3 alternately in spiral onto a circumferential face of an insulating round or square pillar core member 1 and adhering and integrating them is sliced almost at a right angle to the axial direction of the said core member 1.

Description

【発明の詳細な説明】[Detailed description of the invention]

【0001】0001

【産業上の利用分野】本発明は、ラジオ周波数(RF)
帯域の電磁波を利用する個体認識(identifi−
cation) 技術を用いた、非接触タイプの自動認
識システム(以下RF−IDシステムと呼ぶ)用個体認
識カード(以下RF−IDカードと呼ぶ)に内蔵される
高性能かつ安価なアンテナコイルとして用いられるスパ
イラルコイルに関する。
[Industrial Application Field] The present invention is directed to radio frequency (RF)
Individual recognition using electromagnetic waves in the band
It is used as a high-performance and inexpensive antenna coil built into an individual recognition card (hereinafter referred to as RF-ID card) for a non-contact type automatic identification system (hereinafter referred to as RF-ID system) using technology. Regarding spiral coils.

【0002】0002

【従来の技術】入退室管理システム、自動改札システム
、物流自動認識システム等に用いられる自動認識技術に
は、文字や記号のパターンを識別するOCR(光学文字
読取り)方式や、テレビカメラからのパターン化されな
い画像データをソフトウェア処理するマシンビジョン方
式等の対象物が何であるかを直接認識する方式と、バー
コード方式、磁気ストライプカード方式等のような対象
物に付けられた標識を読むことによって対象物を判断す
る方式があり、自動認識という観点から後者が多く用い
られているが、上記RF−IDシステムが最近開発され
利用が始まっている。
[Prior Art] Automatic recognition technologies used in entry/exit control systems, automatic ticket gate systems, automatic logistics recognition systems, etc. include OCR (optical character reading) methods that identify patterns of characters and symbols, and patterns from television cameras. There are two methods that directly recognize the object, such as a machine vision method that processes image data that cannot be converted into a digital image using software, and a method that recognizes the object by reading signs attached to the object such as barcode methods and magnetic stripe card methods. There are methods for determining objects, and the latter is often used from the viewpoint of automatic recognition, but the above-mentioned RF-ID system has recently been developed and its use has begun.

【0003】このRF−IDシステムは、データを運ぶ
RF−IDカードと、データを読書きする装置とに分け
られ、RF−IDカードはアンテナコイル、変調復調回
路、メモリーIC、制御回路から構成され、読書き装置
は、アンテナと変調復調回路が一体となったヘッドと、
通信回路を通して上位コンピュータシステムとデータの
やり取りを行うコントローラから成っている。
[0003] This RF-ID system is divided into an RF-ID card that carries data and a device that reads and writes data.The RF-ID card is composed of an antenna coil, a modulation/demodulation circuit, a memory IC, and a control circuit. The read/write device has a head that integrates an antenna and a modulation/demodulation circuit,
It consists of a controller that exchanges data with a host computer system through a communication circuit.

【0004】上記のRF−IDカードは、上記したアン
テナコイル、メモリーIC等を、プラスチックパッケー
ジしたもので、微弱な電磁波を利用した電磁誘導方式に
よりデータの通信を行うことができる。すなわち、RF
−IDカードを専用の自動認識装置(以下読取り装置と
呼ぶ)に近寄せたとき、装置から発生されるRF帯域中
の100 〜400kHzの電磁波に感応して、アンテ
ナコイルに起電力が誘起されメモリーICを駆動させる
。逆に、あらかじめメモリーICに書込まれているデー
タ信号電流が、アンテナコイルに流れると、電磁誘導作
用によって磁束が発生し、読取り装置に送られて認識さ
れる。
The above-mentioned RF-ID card is a plastic package containing the above-mentioned antenna coil, memory IC, etc., and is capable of data communication using an electromagnetic induction method using weak electromagnetic waves. That is, R.F.
- When an ID card is brought close to a dedicated automatic recognition device (hereinafter referred to as a reader), it is sensitive to electromagnetic waves of 100 to 400 kHz in the RF band generated by the device, and an electromotive force is induced in the antenna coil and the memory is activated. Drive the IC. Conversely, when a data signal current previously written in the memory IC flows through the antenna coil, magnetic flux is generated by electromagnetic induction and is sent to a reading device and recognized.

【0005】しかしてRF−IDシステムは、非接触デ
ータ認識という特徴に加えて、RF−IDカード及び読
取り装置とも密閉系にできる特徴があるため、バーコー
ドシステムに比べ、(イ)水、油、埃等の環境の影響を
受けない。(ロ)データを現場で書込むことができる。 という利点があり、また磁気ストライプカードシステム
に比べ、(ハ)装置への抜き挿しという処理速度が隘路
にならない。(ニ)磁気の影響でデータが消去されない
。等の特徴があるため、読取り装置をゲート、オートド
ア、電子錠等と連動させて、工場、事務所、マンション
、ホテル、遊園地、スキー場リフトゲート、駐車場等の
入退出管理や、社員証、会員証、学生証等の身分証明書
等への応用が検討され、一部で使用され始めている。
[0005] However, in addition to the feature of non-contact data recognition, the RF-ID system has the feature that both the RF-ID card and the reader can be made into a sealed system. , unaffected by the environment such as dust. (b) Data can be written on site. In addition, compared to magnetic stripe card systems, (c) the processing speed of inserting and removing cards into and out of devices does not become a bottleneck. (d) Data is not erased due to the influence of magnetism. Because of these features, reading devices can be linked with gates, automatic doors, electronic locks, etc. to control entry and exit of factories, offices, condominiums, hotels, amusement parks, ski resort lift gates, parking lots, etc., and use employee ID cards. , application to identification cards such as membership cards and student ID cards is being considered, and is beginning to be used in some cases.

【0006】このRF−IDカードは、外形寸法がJI
S X 6301の磁気ストライプ付きクレジットカー
ド(以下JISカードと呼ぶ。)規格すなわち厚さ0.
68〜0.80mm、長辺85.47 〜85.72m
m 、短辺53.92 〜54.03mm を満足する
ように、上述したアンテナコイルとメモリーIC等をプ
ラスチックパッケージしたものであるが、従来このアン
テナコイルとしては、モーター巻線に使用されている銅
線に、熱硬化性樹脂又は熱可塑性樹脂を焼付けしたすな
わち焼付け樹脂の種類によってホルマール線、ポリウレ
タン線、ポリエステル線等と呼ばれる電線( 以下エナ
メル線と総称する。) を数百ターン巻いた巻線コイル
や、薄形プリント基板に印刷エッチング法、フォトエッ
チング法等でコイルパターンを形成したプリントコイル
等が使用されている。
[0006] This RF-ID card has external dimensions of JI
Credit card with magnetic stripe (hereinafter referred to as JIS card) standard of S
68~0.80mm, long side 85.47~85.72m
The above-mentioned antenna coil, memory IC, etc. are packaged in plastic so as to satisfy the requirements of 53.92 to 54.03 mm on the short side. A wire coil made by winding several hundred turns of electric wire (hereinafter collectively referred to as enamelled wire), which has a thermosetting resin or thermoplastic resin baked onto it, and is called a formal wire, polyurethane wire, polyester wire, etc. depending on the type of baked resin. Also used are printed coils in which a coil pattern is formed on a thin printed circuit board by a printing etching method, a photo etching method, or the like.

【0007】[0007]

【発明が解決しようとする課題】したがって上記アンテ
ナコイルに対する要求特性としては、上記カード寸法内
に収まり、インダクタンスLが1〜3mH以上で、コイ
ル抵抗が200〜300Ω以下であることが求められる
。インダクタンスLは、RF−IDカードを読取り装置
に近づけたとき動作するための距離すなわち感度を決め
るもので、実験によれば50mHで約200mm、5m
Hで約100mm、1.5mHで約50mmであった。 コイル抵抗が大きいとQ(振動系の共振の鋭さを表す値
)が小さくなるため、1kΩ程度を上限とするのが好ま
しい。
Therefore, the characteristics required for the above antenna coil are that it should fit within the above card dimensions, have an inductance L of 1 to 3 mH or more, and a coil resistance of 200 to 300 Ω or less. The inductance L determines the operating distance, that is, the sensitivity, when the RF-ID card is brought close to the reader, and according to experiments, it is approximately 200 mm at 50 mH, and 5 m
It was about 100 mm at H, and about 50 mm at 1.5 mH. If the coil resistance is large, Q (a value representing the sharpness of resonance of the vibration system) becomes small, so it is preferable to set the upper limit to about 1 kΩ.

【0008】このアンテナコイルを前記巻線コイルの方
法で作製する場合には、インダクタンスLは巻線コイル
の外径に比例するため、外径のなるべく大きな空心コイ
ルとする必要があるが、■カード形状の異形巻線加工は
特殊な技術を必要とするため委託製造業者が限られる。 ■1〜3mH以上のインダクタンスLを得るには、約2
00ターン以上の巻数が必要であるが、巻線工程で数層
の重なりが生じるため、カード厚さの制約から、直径5
0〜60μmの細いエナメル線を使用する必要があり、
作業途中で断線する等製品効率が低くなる。■巻線コイ
ルの細いエナメル線の端子処理をハンダ付けで行うこと
は大変困難である。■このコイルでは、輸送時点の巻乱
れによる不良率が高い等の欠点がある。
When this antenna coil is manufactured using the wire-wound coil method described above, since the inductance L is proportional to the outer diameter of the wire-wound coil, it is necessary to use an air-core coil with an outer diameter as large as possible. Processing irregularly shaped wire windings requires special technology, so the number of contract manufacturers is limited. ■To obtain an inductance L of 1 to 3 mH or more, approximately 2
00 turns or more is required, but since several layers overlap in the winding process, due to card thickness constraints, the diameter of 5 turns is required.
It is necessary to use a thin enameled wire of 0 to 60 μm,
Product efficiency decreases due to wire breakage during work. ■It is very difficult to solder the terminals of the thin enameled wire of the winding coil. ■This coil has drawbacks such as a high defective rate due to winding irregularities during transportation.

【0009】また、アンテナコイルを前記プリントコイ
ルの方法で作成する場合には、パターンピッチ0.2m
m以上が限界であるため、カードサイズの制約から片面
基板では100ターンが限度であり、両面スルーホール
基板を作製する必要がある。このようなファインパター
ンを得るには、フォトマスク製作→フォトレジスト塗布
→露光→現像→エッチング→レジスト剥離その他多くの
プロセスを必要とし、しかも基板の両面に以上のプロセ
スを実施するため、巻線に比べ非常に高価なものになる
という欠点があり、また角形スパイラルのファインパタ
ーンを形成する場合には、パターンの角(かど)部がエ
ッチング時に断線し易いという欠点もある。本発明は、
以上の課題のほか、従来の製造方法では解決できなかっ
た量産性の問題、製造価格の問題等を解決できるアンテ
ナコイルを提供するものである。
[0009] In addition, when creating an antenna coil by the above printed coil method, the pattern pitch is 0.2 m.
Since the limit is 100 turns for a single-sided board due to card size constraints, it is necessary to fabricate a double-sided through-hole board. Obtaining such a fine pattern requires many processes such as photomask production → photoresist coating → exposure → development → etching → resist peeling. Moreover, since the above processes are performed on both sides of the substrate, it is necessary to It has the disadvantage that it is very expensive compared to other methods, and when forming a fine rectangular spiral pattern, there is also the disadvantage that the corner portions of the pattern are easily broken during etching. The present invention
In addition to the above-mentioned problems, the present invention provides an antenna coil that can solve problems such as mass productivity and manufacturing cost that could not be solved by conventional manufacturing methods.

【0010】0010

【課題を解決するための手段】本発明のスパイラルコイ
ルは、図1(a)、(b)、図2に示すように、絶縁性
円柱状又は角柱状心材1の周面に、金属箔層2と接着性
絶縁層3とを交互にスパイラル状に多重捲回して接着一
体化した柱状体4を、心材1の軸方向と直角にスライス
してなることを特徴とするものである。
[Means for Solving the Problems] As shown in FIGS. 1(a), (b), and 2, the spiral coil of the present invention includes a metal foil layer on the circumferential surface of an insulating cylindrical or prismatic core 1. 2 and an adhesive insulating layer 3 are alternately wound spirally in multiple layers and bonded together, and a columnar body 4 is sliced perpendicular to the axial direction of the core material 1.

【0011】本発明の金属箔の材料としては、銅、亜鉛
、錫、ハンダ、チタン、ベリリウム銅、ステンレス、黄
銅、青銅、りん青銅、洋白、アルミニウム、ニッケル、
鉄、金、銀、白金、パラジウム、タンタル、ニクロム、
ニオブ等が挙げられるが、電気抵抗が低く、低価格で、
機械的強度、入手し易さの点等を勘案すると銅の使用が
もっとも好ましい。
Materials for the metal foil of the present invention include copper, zinc, tin, solder, titanium, beryllium copper, stainless steel, brass, bronze, phosphor bronze, nickel silver, aluminum, nickel,
iron, gold, silver, platinum, palladium, tantalum, nichrome,
Examples include niobium, which has low electrical resistance and is inexpensive.
In consideration of mechanical strength, availability, etc., it is most preferable to use copper.

【0012】箔の厚さは、薄すぎると機械的強度が低く
取扱い作業性が悪くなり、厚すぎるとスパイラルピッチ
が大きくなって200ターン巻いた外周がカード寸法内
に収まらなくなるため、10〜100μmの範囲とする
のがよく、電気用に汎用されている18〜35μmの使
用がもっとも好ましい。
[0012] The thickness of the foil should be 10 to 100 μm because if it is too thin, the mechanical strength will be low and handling workability will be poor, and if it is too thick, the spiral pitch will become large and the outer circumference after 200 turns will not fit within the card dimensions. It is best to use a thickness in the range of 18 to 35 μm, which is commonly used for electrical applications.

【0013】接着性絶縁層は、熱可塑性又は熱硬化性接
着剤を膜状に成形したもの、またはポリエステルフィル
ム等の非接着性のフィルム基材に熱可塑性又は熱硬化性
接着剤をコーティングしたものが挙げられるが、フィル
ム基材に接着剤をコーティングしたものは、厚くなり金
属箔のところで述べたと同様スパイラルピッチが大きく
なるため、接着剤単独のものの使用の方がより好ましい
[0013] The adhesive insulating layer is formed by forming a thermoplastic or thermosetting adhesive into a film, or by coating a non-adhesive film base material such as a polyester film with a thermoplastic or thermosetting adhesive. However, if the film base material is coated with an adhesive, it will be thicker and the spiral pitch will become larger as mentioned in the case of metal foil, so it is more preferable to use an adhesive alone.

【0014】上記熱可塑性接着剤としては、共重合ポリ
エステル系接着剤、ポリアミド系接着剤、ポリ酢酸ビニ
ル系接着剤、ポリビニルアルコール系接着剤、ポリ塩化
ビニル系接着剤、塩化ビニル−酢酸ビニル共重合体系接
着剤、エチレン−酢酸ビニル共重合体系接着剤、スチレ
ン−イソプレン−スチレン共重合体系接着剤、スチレン
−ブタジエン−スチレン共重合体系接着剤等が挙げられ
る。
[0014] Examples of the thermoplastic adhesive include copolyester adhesives, polyamide adhesives, polyvinyl acetate adhesives, polyvinyl alcohol adhesives, polyvinyl chloride adhesives, and vinyl chloride-vinyl acetate copolymer adhesives. Examples include adhesives based on ethylene-vinyl acetate copolymers, adhesives based on styrene-isoprene-styrene copolymers, adhesives based on styrene-butadiene-styrene copolymers, and the like.

【0015】また熱硬化性接着剤としてはエポキシ樹脂
系接着剤、フェノール樹脂系接着剤、レゾルシノール樹
脂系接着剤、ユリア樹脂系接着剤、メラミン樹脂系接着
剤、ポリウレタン系接着剤、天然ゴム系接着剤、再生ゴ
ム系接着剤、ニトリルゴム系接着剤、クロロプレンゴム
系接着剤、スチレンブタジエンゴム系接着剤、ブチルゴ
ム系接着剤、シリコーンゴム系接着剤等が挙げられる。 以上のうち、シリコーンゴム系接着剤は耐熱性、電気特
性に優れているうえ、ゴム弾性をもつため、柱状心材の
周面に金属箔と交互にスパイラル状に多重捲回一体化し
た柱状体を、心材の軸方向に直角に回転刃によって容易
に薄くスライスすることができるので、シリコーンゴム
系接着剤の使用がもっとも好ましい。
Thermosetting adhesives include epoxy resin adhesives, phenolic resin adhesives, resorcinol resin adhesives, urea resin adhesives, melamine resin adhesives, polyurethane adhesives, and natural rubber adhesives. Examples include recycled rubber adhesives, nitrile rubber adhesives, chloroprene rubber adhesives, styrene-butadiene rubber adhesives, butyl rubber adhesives, silicone rubber adhesives, and the like. Among the above, silicone rubber adhesives have excellent heat resistance and electrical properties, as well as rubber elasticity, so silicone rubber adhesives have a columnar body that is integrated with metal foil alternately wound in multiple spirals around the circumferential surface of a columnar core material. It is most preferable to use a silicone rubber adhesive because it can be easily sliced thinly with a rotating blade perpendicular to the axial direction of the core material.

【0016】この接着剤層は金属箔にトッピング又はコ
ーティングし、必要に応じ含溶剤を揮散後、心材にスパ
イラル状に巻付けて一体化するのが望ましい。この接着
剤層の厚さは、薄すぎるとピンホールが生じ易く、金属
箔間に絶縁不良を生じ、厚すぎると上記同様スパイラル
ピッチが大きくなりすぎるため、10〜100μmの範
囲、望ましくは20〜50μmの範囲とするのがよい。
[0016] This adhesive layer is preferably topping or coating a metal foil, and after volatilizing a solvent-containing agent as necessary, it is preferably wound spirally around a core material and integrated. The thickness of this adhesive layer is in the range of 10 to 100 μm, preferably 20 to 100 μm, because if it is too thin, pinholes will easily occur and poor insulation will occur between the metal foils, and if it is too thick, the spiral pitch will become too large as described above. The range is preferably 50 μm.

【0017】本発明の心材は、回転刃で容易に切断でき
れば何を使用してもよいが、材木を切削加工した角柱又
は円柱、シリコーンゴム等のゴム材料を成形した角柱又
は円柱等のほか、紙管、塩ビ管、ポリエチレン管等の使
用が挙げられる。本発明のスライス方法は、ダイヤモン
ド刃による内周式スライシングマシンや超硬合金刃によ
る外周式スライシングマシンの使用等が挙げられる。本
発明における、スライス厚さは、プラスチックパッケー
ジの厚さを考慮してJISカード厚さを満足すればよい
が、薄すぎるとコイル抵抗が高くなりQが小さくなるた
め0.2〜0.3mmの範囲とするのが望ましい。本発
明のスパイラルコイルの内側及び外側の端子取出し処理
は、エナメル細線をハンダ付けして容易に行うことがで
きる。
[0017] The core material of the present invention may be any material as long as it can be easily cut with a rotary blade, but in addition to prismatic or cylindrical pillars made by cutting lumber, prismatic or cylindrical pillars molded from a rubber material such as silicone rubber, etc. Examples include the use of paper tubes, PVC pipes, polyethylene pipes, etc. Examples of the slicing method of the present invention include the use of an internal slicing machine using a diamond blade or an external slicing machine using a cemented carbide blade. In the present invention, the slice thickness may satisfy the JIS card thickness considering the thickness of the plastic package, but if it is too thin, the coil resistance will increase and the Q will decrease. It is preferable to set it as a range. The process of taking out terminals from the inside and outside of the spiral coil of the present invention can be easily carried out by soldering thin enameled wires.

【0018】[0018]

【実施例】厚さ18μm、幅100mmの電解銅箔に、
無溶剤型の付加タイプ加硫型自己接着シリコーンRTV
ゴム、KE1800(A・B・C)RTV(信越化学工
業(株)製、商品名)を、コンマロールコーターを用い
、加硫硬化後の厚さが15μmになるようにコーティン
グし、これを1インチ紙管(内径25.4mm、外径3
5mm)に200ターン巻付け、150℃×1時間加熱
処理してシリコーンゴム層を加硫させ銅箔層とシリコー
ンゴム層を接着一体化させ柱状体とした。
[Example] Electrolytic copper foil with a thickness of 18 μm and a width of 100 mm,
Solvent-free addition type vulcanized self-adhesive silicone RTV
Rubber, KE1800 (A, B, C) RTV (manufactured by Shin-Etsu Chemical Co., Ltd., trade name) was coated using a comma roll coater so that the thickness after vulcanization and curing was 15 μm, and this was Inch paper tube (inner diameter 25.4 mm, outer diameter 3
5 mm) and heat-treated at 150° C. for 1 hour to vulcanize the silicone rubber layer and bond and integrate the copper foil layer and silicone rubber layer to form a columnar body.

【0019】以上のスパイラルロール状柱状体を、内周
式スライシングマシン、ASM−10C型((株)岡本
工作機械製作所製、商品名)を使用してスライスし、厚
さ0.2mmの丸形スパイラルコイルを得た。このスパ
イラルコイルの端子処理は、直径60μmのエナメル線
をハンダ付けして行った。
The above spiral roll columnar body was sliced using an internal slicing machine, model ASM-10C (manufactured by Okamoto Machine Tools Co., Ltd., trade name), into a round shape with a thickness of 0.2 mm. I got a spiral coil. The terminals of this spiral coil were processed by soldering enamelled wires with a diameter of 60 μm.

【0020】この丸形スパイラルコイルは、内径D2 
=35mm、スパイラルピッチP=0.0033cm、
ターン数N200、外径D1 =48.2mmとなり、
銅の体積固有抵抗ρは1.724×10−6Ω・cmで
あるから、計算によれば、総抵抗R=ρ×π×N×〔D
2 +(N+1)×P〕/(0.0018×0.02)
=125Ωとなるが、市販のテスターでチェックしたと
ころほぼ一致する値を得た。また丸形スパイラルコイル
のインダクタンスLは、a=(D1 +D2 )/4〔
mm〕、c=(D1 −D2 )/2〔mm〕を用いる
と、L=32×10−6×a2 ×N2 /(6×a+
10×c)〔mH〕で表され、2.9mHと計算される
が、市販の4274A形マルチフリーケンシーLCRメ
ーター(横河ヒューレットパッカード(株)製、商品名
)で実測しても約3mHが得られた。このスパイラルコ
イルのサイズは、厚さ0.2mm、直径48.2mmで
あるから、JISカード規格内に充分収めることができ
る。
[0020] This round spiral coil has an inner diameter D2
=35mm, spiral pitch P=0.0033cm,
Number of turns N200, outer diameter D1 = 48.2mm,
Since the volume resistivity ρ of copper is 1.724×10-6 Ω・cm, the total resistance R=ρ×π×N×[D
2 + (N+1)×P]/(0.0018×0.02)
= 125Ω, but when checked with a commercially available tester, almost identical values were obtained. Also, the inductance L of the round spiral coil is a = (D1 + D2)/4 [
mm], c=(D1 - D2)/2 [mm], L=32×10-6×a2×N2/(6×a+
10×c) [mH] and is calculated to be 2.9 mH, but it is actually about 3 mH when measured using a commercially available 4274A multi-frequency LCR meter (manufactured by Yokogawa Hewlett-Packard Co., Ltd., trade name). was gotten. Since the spiral coil has a thickness of 0.2 mm and a diameter of 48.2 mm, it can be fully accommodated within the JIS card standard.

【0021】[0021]

【発明の効果】本発明のスパイラルコイルは、加工が容
易でなんら特殊な技術を必要とせず、量産性、歩留まり
が良好で製造価格も低いうえ、機械的強度が大で、使用
中はもちろん輸送中も不良品を生じることなく、産業上
きわめて有用なものである。
[Effects of the Invention] The spiral coil of the present invention is easy to process, does not require any special technology, has good mass productivity, good yield, and low manufacturing cost, has high mechanical strength, and can be transported not only during use. It is extremely useful industrially as it does not produce any defective products.

【図面の簡単な説明】[Brief explanation of the drawing]

【図1】(a)は本発明の丸形スパイラルコイルを得る
ためのスライス加工前の柱状体の斜視図、(b)はスラ
イス加工後の丸形スパイラルコイルの斜視図である。
FIG. 1(a) is a perspective view of a columnar body before slicing to obtain a round spiral coil of the present invention, and FIG. 1(b) is a perspective view of the round spiral coil after slicing.

【図2】本発明の角形スパイラルコイルの斜視図である
FIG. 2 is a perspective view of a rectangular spiral coil of the present invention.

【符号の説明】[Explanation of symbols]

1  心材、 2  金属箔層、 3  接着性絶縁層、 4  柱状体。 1 Heartwood, 2 Metal foil layer, 3 Adhesive insulating layer, 4 Column.

Claims (1)

【特許請求の範囲】[Claims] 【請求項1】絶縁性柱状心材の周面に、金属箔層と接着
性絶縁層とを交互にスパイラル状に多重捲回し接着一体
化して得た柱状体を、該心材の軸方向とほぼ直角にスラ
イスしてなることを特徴とするスパイラルコイル。
Claim 1: A columnar body obtained by alternately winding metal foil layers and adhesive insulating layers multiple times in a spiral shape and bonding them together on the circumferential surface of an insulating columnar core material, at approximately right angles to the axial direction of the core material. A spiral coil that is characterized by being sliced into .
JP5586491A 1991-02-27 1991-02-27 Spiral coil Pending JPH04271603A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5586491A JPH04271603A (en) 1991-02-27 1991-02-27 Spiral coil

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5586491A JPH04271603A (en) 1991-02-27 1991-02-27 Spiral coil

Publications (1)

Publication Number Publication Date
JPH04271603A true JPH04271603A (en) 1992-09-28

Family

ID=13010936

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5586491A Pending JPH04271603A (en) 1991-02-27 1991-02-27 Spiral coil

Country Status (1)

Country Link
JP (1) JPH04271603A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU673976B2 (en) * 1994-10-04 1996-11-28 Mitsubishi Denki Kabushiki Kaisha Antenna equipment
WO2006051887A1 (en) 2004-11-09 2006-05-18 Semiconductor Energy Laboratory Co., Ltd. Ic chip, antenna, and manufacturing method of the ic chip and the antenna
GB2426345A (en) * 2005-05-20 2006-11-22 Bruker Biospin Gmbh Scroll Coil Arrangement

Cited By (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
AU673976B2 (en) * 1994-10-04 1996-11-28 Mitsubishi Denki Kabushiki Kaisha Antenna equipment
WO2006051887A1 (en) 2004-11-09 2006-05-18 Semiconductor Energy Laboratory Co., Ltd. Ic chip, antenna, and manufacturing method of the ic chip and the antenna
EP1810333A1 (en) * 2004-11-09 2007-07-25 Semiconductor Energy Laboratory Co., Ltd. Ic chip, antenna, and manufacturing method of the ic chip and the antenna
EP1810333A4 (en) * 2004-11-09 2011-01-05 Semiconductor Energy Lab Ic chip, antenna, and manufacturing method of the ic chip and the antenna
US7928554B2 (en) 2004-11-09 2011-04-19 Semiconductor Energy Laboratory Co., Ltd. IC chip, antenna, and manufacturing method of the IC chip and the antenna
US8242592B2 (en) 2004-11-09 2012-08-14 Semiconductor Energy Laboratory Co., Ltd. IC chip, antenna, and manufacturing method of the IC chip and the antenna
GB2426345A (en) * 2005-05-20 2006-11-22 Bruker Biospin Gmbh Scroll Coil Arrangement
US7385398B2 (en) 2005-05-20 2008-06-10 Bruker Biospin Gmbh Radio frequency coil arrangement for magnetic resonance measurements and probe head for measuring resonance signals by utilizing such a radio frequency coil arrangement
GB2426345B (en) * 2005-05-20 2008-08-13 Bruker Biospin Gmbh A radio frequency coil arrangement for magnetic resonance measurements and a probe head for measuring resonance signals

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