JPH0426669U - - Google Patents
Info
- Publication number
- JPH0426669U JPH0426669U JP6963590U JP6963590U JPH0426669U JP H0426669 U JPH0426669 U JP H0426669U JP 6963590 U JP6963590 U JP 6963590U JP 6963590 U JP6963590 U JP 6963590U JP H0426669 U JPH0426669 U JP H0426669U
- Authority
- JP
- Japan
- Prior art keywords
- soldering
- component
- heating device
- temperature
- section
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000010438 heat treatment Methods 0.000 claims description 8
- 238000005476 soldering Methods 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 claims 3
- 230000008018 melting Effects 0.000 claims 2
- 238000002844 melting Methods 0.000 claims 2
- 239000003985 ceramic capacitor Substances 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 239000003990 capacitor Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
- Ceramic Capacitors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990069635U JPH0756123Y2 (ja) | 1990-06-29 | 1990-06-29 | 半田付け用加熱装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990069635U JPH0756123Y2 (ja) | 1990-06-29 | 1990-06-29 | 半田付け用加熱装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0426669U true JPH0426669U (sv) | 1992-03-03 |
| JPH0756123Y2 JPH0756123Y2 (ja) | 1995-12-25 |
Family
ID=31605114
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990069635U Expired - Fee Related JPH0756123Y2 (ja) | 1990-06-29 | 1990-06-29 | 半田付け用加熱装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0756123Y2 (sv) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS522277A (en) * | 1975-06-24 | 1977-01-08 | Hitachi Ltd | Soldering device |
| JPH01118369A (ja) * | 1987-10-30 | 1989-05-10 | Fujitsu Ltd | ハンダ付けリフロー炉 |
| JPH01150465A (ja) * | 1987-12-07 | 1989-06-13 | Tamura Seisakusho Co Ltd | 気相式はんだ付け装置 |
-
1990
- 1990-06-29 JP JP1990069635U patent/JPH0756123Y2/ja not_active Expired - Fee Related
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS522277A (en) * | 1975-06-24 | 1977-01-08 | Hitachi Ltd | Soldering device |
| JPH01118369A (ja) * | 1987-10-30 | 1989-05-10 | Fujitsu Ltd | ハンダ付けリフロー炉 |
| JPH01150465A (ja) * | 1987-12-07 | 1989-06-13 | Tamura Seisakusho Co Ltd | 気相式はんだ付け装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0756123Y2 (ja) | 1995-12-25 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |