JPH0426573U - - Google Patents
Info
- Publication number
- JPH0426573U JPH0426573U JP6685390U JP6685390U JPH0426573U JP H0426573 U JPH0426573 U JP H0426573U JP 6685390 U JP6685390 U JP 6685390U JP 6685390 U JP6685390 U JP 6685390U JP H0426573 U JPH0426573 U JP H0426573U
- Authority
- JP
- Japan
- Prior art keywords
- copper foil
- double
- foil pattern
- printed circuit
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 7
- 239000011889 copper foil Substances 0.000 claims description 7
- 229910000679 solder Inorganic materials 0.000 claims description 2
- 238000010438 heat treatment Methods 0.000 claims 1
- 238000005476 soldering Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
Landscapes
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6685390U JPH0426573U (enExample) | 1990-06-26 | 1990-06-26 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6685390U JPH0426573U (enExample) | 1990-06-26 | 1990-06-26 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0426573U true JPH0426573U (enExample) | 1992-03-03 |
Family
ID=31599919
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6685390U Pending JPH0426573U (enExample) | 1990-06-26 | 1990-06-26 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0426573U (enExample) |
-
1990
- 1990-06-26 JP JP6685390U patent/JPH0426573U/ja active Pending