JPH0426547U - - Google Patents
Info
- Publication number
- JPH0426547U JPH0426547U JP6811690U JP6811690U JPH0426547U JP H0426547 U JPH0426547 U JP H0426547U JP 6811690 U JP6811690 U JP 6811690U JP 6811690 U JP6811690 U JP 6811690U JP H0426547 U JPH0426547 U JP H0426547U
- Authority
- JP
- Japan
- Prior art keywords
- resin
- heat sink
- semiconductor device
- fixing
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 239000004020 conductor Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6811690U JPH0426547U (pt) | 1990-06-27 | 1990-06-27 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6811690U JPH0426547U (pt) | 1990-06-27 | 1990-06-27 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0426547U true JPH0426547U (pt) | 1992-03-03 |
Family
ID=31602279
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6811690U Pending JPH0426547U (pt) | 1990-06-27 | 1990-06-27 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0426547U (pt) |
-
1990
- 1990-06-27 JP JP6811690U patent/JPH0426547U/ja active Pending