JPH04264709A - Chip-type solid state electrolytic capacitor - Google Patents
Chip-type solid state electrolytic capacitorInfo
- Publication number
- JPH04264709A JPH04264709A JP2591391A JP2591391A JPH04264709A JP H04264709 A JPH04264709 A JP H04264709A JP 2591391 A JP2591391 A JP 2591391A JP 2591391 A JP2591391 A JP 2591391A JP H04264709 A JPH04264709 A JP H04264709A
- Authority
- JP
- Japan
- Prior art keywords
- anode lead
- anode
- layer
- type solid
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000003990 capacitor Substances 0.000 title claims abstract description 23
- 239000007787 solid Substances 0.000 title claims description 18
- 229920005989 resin Polymers 0.000 claims abstract description 25
- 239000011347 resin Substances 0.000 claims abstract description 25
- 238000007747 plating Methods 0.000 claims abstract description 23
- 239000004020 conductor Substances 0.000 claims abstract description 12
- 229910052751 metal Inorganic materials 0.000 claims description 27
- 239000002184 metal Substances 0.000 claims description 27
- 239000007784 solid electrolyte Substances 0.000 claims description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 abstract description 11
- 229910000679 solder Inorganic materials 0.000 abstract description 10
- 229910052763 palladium Inorganic materials 0.000 abstract description 5
- 230000002093 peripheral effect Effects 0.000 abstract description 4
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 4
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 description 3
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 229910000019 calcium carbonate Inorganic materials 0.000 description 2
- 239000003054 catalyst Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- 238000000576 coating method Methods 0.000 description 2
- 238000007865 diluting Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 238000002513 implantation Methods 0.000 description 2
- 238000004898 kneading Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000003960 organic solvent Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 239000005871 repellent Substances 0.000 description 2
- 229910052715 tantalum Inorganic materials 0.000 description 2
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- -1 amine compound Chemical class 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000465 moulding Methods 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 230000002940 repellent Effects 0.000 description 1
- 238000005979 thermal decomposition reaction Methods 0.000 description 1
- 229920001187 thermosetting polymer Polymers 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明はチップ型固体電解コンデ
ンサに関し、特に陽極端子の構造に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a chip type solid electrolytic capacitor, and more particularly to the structure of an anode terminal.
【０００２】0002
【従来の技術】従来のチップ型固体電解コンデンサの陽
極端子は図３に示すように、公知の技術によって製造し
たコンデンサ素子上に絶縁樹脂層２１を形成し、この上
に陽極リード２２と接続する導電体層２３とめっき層２
４とはんだ層２５の３層，あるいは図４に示すようにめ
っき層２４とはんだ層２５の２層で形成している。2. Description of the Related Art As shown in FIG. 3, the anode terminal of a conventional chip-type solid electrolytic capacitor is made by forming an insulating resin layer 21 on a capacitor element manufactured by a known technique, and connecting an anode lead 22 thereon. Conductor layer 23 and plating layer 2
4 and a solder layer 25, or as shown in FIG. 4, it is formed of two layers, a plating layer 24 and a solder layer 25.
【０００３】0003
【発明が解決しようとする課題】前述した従来のチップ
型固体電解コンデンサはその端子構造により下記の問題
点があった。
（１）陽極が図３に示すように絶縁樹脂層２１上に導電
体層２３を介してめっき層２４，はんだ層２５の３層か
らなる場合、導電体層２３を陽極リード２２よりも熱膨
張率が１桁以上大きい導電性ペーストにより形成してい
るので陽極リードと陽極導電体層間の電気的接続信頼性
が低く、はがれ易くコンデンサ素子の誘電損失が増大す
る。そこで接続信頼性を得る為に図３のように陽極リー
ド２２と電極の接続を長くとると陽極が突出し、自動実
装時のハンドリング、特にセンタリング等においてチッ
プの姿勢が安定しない。
（２）前記（１）項の問題点を解決するため図４に示す
ように陽極リードと熱膨張率の近いめっき層２４を直接
絶縁樹脂層２１上および陽極リード２２上に形成し、電
極を形成したものがあるが、この場合図４に示すように
陽極リード２２とめっき層２４との接続長を短かくする
事ができる。しかしながら陽極リードつけ根で切断した
場合には陽極リードと端子との接続部分も含めて切断に
より失なわれ、陽極リードと端子との機械的電気的な接
続が失なわれる恐れがあるので切断部分を陽極リードつ
け根から離す必要があり、陽極の突出をなくす事ができ
ないという問題点がある。SUMMARY OF THE INVENTION The conventional chip type solid electrolytic capacitor described above has the following problems due to its terminal structure. (1) When the anode consists of three layers, a plating layer 24 and a solder layer 25 on an insulating resin layer 21 with a conductor layer 23 interposed therebetween, as shown in FIG. 3, the conductor layer 23 is thermally expanded more than the anode lead 22. Since the conductive paste is formed with a conductive paste having an order of magnitude higher ratio, the reliability of the electrical connection between the anode lead and the anode conductor layer is low, and it easily peels off, increasing the dielectric loss of the capacitor element. Therefore, in order to obtain connection reliability, if the connection between the anode lead 22 and the electrode is made long as shown in FIG. 3, the anode protrudes and the posture of the chip becomes unstable during handling during automatic mounting, especially during centering. (2) In order to solve the problem in item (1) above, as shown in FIG. 4, a plating layer 24 having a coefficient of thermal expansion similar to that of the anode lead is directly formed on the insulating resin layer 21 and the anode lead 22, and the electrode is In this case, as shown in FIG. 4, the connection length between the anode lead 22 and the plating layer 24 can be shortened. However, if the anode lead is cut at the base, the connection between the anode lead and the terminal will also be lost, and there is a risk that the mechanical and electrical connection between the anode lead and the terminal will be lost. There is a problem in that it is necessary to separate the anode lead from the base, and the protrusion of the anode cannot be eliminated.
【０００４】本発明の目的は、陽極リードとめっき層と
の接続長を短かくし、陽極リード植立面を突出のない平
面とすることができ、しかも陽極リードと端子との接続
が失なわれることがなく、基板への実装時のハンドリン
グにおいて優れた安定性が得られるチップ型固体電解コ
ンデンサを提供することにある。An object of the present invention is to shorten the connection length between the anode lead and the plating layer, to make the anode lead planting surface a flat surface without protrusions, and to prevent the connection between the anode lead and the terminal from being lost. It is an object of the present invention to provide a chip-type solid electrolytic capacitor that can be easily handled and has excellent stability during handling when mounted on a board.
【０００５】[0005]
【課題を解決するための手段】本発明のチップ型固体電
解コンデンサは、陽極リードを植立した弁作用金属から
なる陽極体上に酸化皮膜，固体電解質層および陰極導電
体層を順次形成した素子と、陽極リード植立面の対向面
以外の素子外周面上に被着した絶縁樹脂層と、陽極リー
ドおよびその周辺部上に形成した陽極端子と、陽極リー
ド植立面の対向面およびその周辺部上に形成した陰極端
子とを有するチップ型固体電解コンデンサにおいて、前
記陽極端子が順次形成された第１の金属体，第２の絶縁
樹脂層，第２の金属体を有することを特徴として構成さ
れる。[Means for Solving the Problems] The chip-type solid electrolytic capacitor of the present invention is an element in which an oxide film, a solid electrolyte layer, and a cathode conductor layer are sequentially formed on an anode body made of a valve metal with an anode lead planted thereon. , an insulating resin layer deposited on the outer circumferential surface of the element other than the surface facing the anode lead implantation surface, an anode terminal formed on the anode lead and its surrounding area, and a surface opposite to the anode lead implantation surface and its surroundings. A chip type solid electrolytic capacitor having a cathode terminal formed on a portion thereof, characterized in that the anode terminal has a first metal body, a second insulating resin layer, and a second metal body formed in this order. be done.
【０００６】[0006]
【実施例】次に本発明について図面を参照して説明する
。図１は本発明によるチップ型固体電解コンデンサの一
実施例の断面図である。DESCRIPTION OF THE PREFERRED EMBODIMENTS Next, the present invention will be explained with reference to the drawings. FIG. 1 is a sectional view of an embodiment of a chip-type solid electrolytic capacitor according to the present invention.
【０００７】弁作用を有する金属の１つである、タンタ
ルの粉末を加圧成形した後、真空焼結した陽極体１には
タンタル材を用いた陽極リード２を植立し、陽極リード
付近に撥水性樹脂層３を形成する。After pressure-molding tantalum powder, which is one of the metals that have a valve action, an anode lead 2 made of tantalum material is planted on the vacuum sintered anode body 1, and a tantalum material is used near the anode lead. A water-repellent resin layer 3 is formed.
【０００８】陽極体の外周面上に酸化皮膜層，固体電解
質層，陰極導電体層（以上図示略）を順次形成した後、
陽極リード２付近に被覆樹脂層４を形成し、陽極体外周
面上に第１のめっき層５を形成する。After sequentially forming an oxide film layer, a solid electrolyte layer, and a cathode conductor layer (not shown) on the outer peripheral surface of the anode body,
A coating resin layer 4 is formed near the anode lead 2, and a first plating layer 5 is formed on the outer peripheral surface of the anode body.
【０００９】次に陽極リード植立面の対向面以外の陽極
体全外周面に第１の絶縁樹脂層６を形成した後、陽極リ
ード植立面およびその周辺部の絶縁樹脂層上にパラジウ
ムのアミン化合物の酢酸ブチル溶液を塗布し、２００℃
３０分の条件で熱分解させて金属触媒たるパラジウムを
付着させ、そのパラジウム付着部分にめっき層から成る
第１の金属体７ａを形成する。Next, after forming the first insulating resin layer 6 on the entire outer circumferential surface of the anode body other than the surface opposite to the anode lead planting surface, palladium is coated on the insulating resin layer on the anode lead planting surface and its surrounding area. Apply a butyl acetate solution of an amine compound and heat at 200°C.
Palladium, which is a metal catalyst, is deposited by thermal decomposition for 30 minutes, and a first metal body 7a consisting of a plating layer is formed on the part where palladium is deposited.
【００１０】次に第１の金属体７ａの陽極植立面上のみ
にエポキシ樹脂パラジウム粉末，炭酸カルシウムを混練
し、少量の有機溶剤で希釈したペーストを塗布し、２０
０℃３０分間の条件で熱硬化させて第２の絶縁樹脂層８
ａを形成する。Next, a paste prepared by kneading epoxy resin palladium powder and calcium carbonate and diluting it with a small amount of organic solvent is applied only on the anode planting surface of the first metal body 7a.
The second insulating resin layer 8 is thermally cured at 0°C for 30 minutes.
form a.
【００１１】次に陽極リード植立面の対向面とその周辺
部上に導電体層９を形成する。Next, a conductor layer 9 is formed on the surface opposite to the anode lead planting surface and its peripheral portion.
【００１２】次に第２のめっき層１０とめっき層から成
る第２の金属体１１ａおよびはんだ層１２を順次形成し
た後、最後に陽極リード２を切断してチップ型固体電解
コンデンサを構成する。Next, after forming the second plating layer 10, the second metal body 11a made of the plating layer, and the solder layer 12 in sequence, the anode lead 2 is finally cut to form a chip type solid electrolytic capacitor.
【００１３】図２は本発明によるチップ型固体電解コン
デンサの他の実施例の断面図である。前述した実施例１
と同様に第１のめっき層５まで形成したコンデンサ素子
に、第１の絶縁樹脂層６を形成する。FIG. 2 is a sectional view of another embodiment of the chip type solid electrolytic capacitor according to the present invention. Example 1 mentioned above
Similarly, the first insulating resin layer 6 is formed on the capacitor element in which the first plating layer 5 has been formed.
【００１４】次に陽極リードに線径０．２ｍｍのアルミ
ニウムワイヤーを溶接して第１の金属体７ｂを形成する
。Next, an aluminum wire having a wire diameter of 0.2 mm is welded to the anode lead to form the first metal body 7b.
【００１５】次にエポキシ樹脂と炭酸カルシウムの粉末
を混練し、少量の有機溶剤で希釈したペーストを前記第
１の金属体の先端部以外と陽極リード植立面のみに塗布
し、２００℃３０分間の条件で熱硬化させて第２の絶縁
樹脂層８ｂを形成する。Next, a paste made by kneading epoxy resin and calcium carbonate powder and diluting it with a small amount of organic solvent is applied to only the anode lead planting surface other than the tip of the first metal body, and heated at 200°C for 30 minutes. The second insulating resin layer 8b is formed by thermosetting under the following conditions.
【００１６】次に実施例１と同一の方法により陽極リー
ド植立面とその周辺部の絶縁樹脂層表面および絶縁樹脂
層から露出した前記第１の金属体先端部に金属触媒であ
るパラジウムを付着させた後、第２のめっき層１０とめ
っき層からなる第２の金属体１１ｂおよびはんだ層１２
を順次形成し最後に陽極リード２を切断してチップ型固
体電解コンデンサを構成する。Next, by the same method as in Example 1, palladium as a metal catalyst was attached to the anode lead planting surface, the surface of the insulating resin layer in the surrounding area, and the tip of the first metal body exposed from the insulating resin layer. After that, the second plating layer 10, the second metal body 11b made of the plating layer, and the solder layer 12
are sequentially formed and finally the anode lead 2 is cut to form a chip type solid electrolytic capacitor.
【００１７】次に基板への実装試験を行い、ハンドリン
グ時の落下数を計数しその結果を表１に示した。試料と
しては従来例と実施例各２水準とし、それぞれ１０００
個の試験をした。Next, a mounting test on a board was conducted, and the number of drops during handling was counted, and the results are shown in Table 1. The samples were 2 levels each for the conventional example and the example, each with 1000 samples.
I did several tests.
【００１８】ここで従来例１は陽極端子が絶縁樹脂層上
に導電体層，めっき層，はんだ層の３層からなるもので
あり、従来例２はめっき層，はんだ層の２層からなるも
のである。一方実施例１は陽極端子と陽極リードを接続
する第１の金属体がめっき層からなるものであり、実施
例２は陽極端子と陽極リードを接続する第１の金属体が
アルミニウムワイヤーからなるものである。Here, in Conventional Example 1, the anode terminal consists of three layers, a conductor layer, a plating layer, and a solder layer, on an insulating resin layer, and in Conventional Example 2, the anode terminal consists of two layers, a plating layer and a solder layer. It is. On the other hand, in Example 1, the first metal body connecting the anode terminal and the anode lead is made of a plating layer, and in Example 2, the first metal body connecting the anode terminal and the anode lead is made of aluminum wire. It is.
【００１９】[0019]
【００２０】[0020]
【発明の効果】以上説明したように本発明は絶縁樹脂層
内に陽極リードと端子を接続する金属体を有する為に陽
極リードつけ根にて切断する事により、陽極リード周囲
から金属体が失われても陽極リードと端子との接続が失
われる事がない。よって陽極リードつけ根にて切断し、
陽極リード植立面を全く突出のない平面にできる。その
結果基板への実装時のハンドリングにおいて優れた、安
定性をもつという効果を有する。[Effects of the Invention] As explained above, since the present invention has a metal body connecting the anode lead and the terminal within the insulating resin layer, the metal body is not lost from around the anode lead by cutting it at the base of the anode lead. The connection between the anode lead and the terminal will not be lost even when the anode lead is connected to the terminal. Therefore, cut at the base of the anode lead,
The anode lead planting surface can be made into a flat surface with no protrusions at all. As a result, it has the effect of providing excellent handling stability during mounting on a board.
【図１】本発明の一実施例のチップ型固体電解コンデン
サの断面図である。FIG. 1 is a sectional view of a chip-type solid electrolytic capacitor according to an embodiment of the present invention.
【図２】本発明の他の実施例のチップ型固体電解コンデ
ンサの断面図である。FIG. 2 is a sectional view of a chip-type solid electrolytic capacitor according to another embodiment of the present invention.
【図３】従来のチップ型固体電解コンデンサの一例の断
面図である。FIG. 3 is a cross-sectional view of an example of a conventional chip-type solid electrolytic capacitor.
【図４】従来のチップ型固体電解コンデンサの他の例の
断面図である。FIG. 4 is a cross-sectional view of another example of a conventional chip-type solid electrolytic capacitor.
１ 陽極体 ２ 陽極リード ３ 撥水性樹脂層 ４ 被覆樹脂層 ５ 第１のめっき層 ６ 第１の絶縁樹脂層 ７ａ，７ｂ 第１の金属体 ８ａ，８ｂ 第２の絶縁樹脂層 ９ 導電体層 １０ 第２のめっき層 １１ａ，１１ｂ 第２の金属体 １２ はんだ層 １３ 陽極端子 １４ 陰極端子 ２１ 絶縁樹脂層 ２２ 陽極リード ２３ 導電体層 ２４ めっき層 ２５ はんだ層 1 Anode body 2 Anode lead 3 Water repellent resin layer 4 Coating resin layer 5 First plating layer 6 First insulating resin layer 7a, 7b First metal body 8a, 8b Second insulating resin layer 9 Conductor layer 10 Second plating layer 11a, 11b Second metal body 12 Solder layer 13 Anode terminal 14 Cathode terminal 21 Insulating resin layer 22 Anode lead 23 Conductor layer 24 Plating layer 25 Solder layer
Claims (3)
なる陽極体上に酸化皮膜，固体電解質層および陰極導電
体層を順次形成した素子と、陽極リード植立面の対向面
以外の素子外周面上に被着した絶縁樹脂層と、陽極リー
ドおよびその周辺部上に形成した陽極端子と、陽極リー
ド植立面の対向面およびその周辺部上に形成した陰極端
子を有するチップ型固体電解コンデンサにおいて、前記
陽極端子が順次形成された第１の金属体，第２の絶縁樹
脂層，第２の金属体を有することを特徴とするチップ型
固体電解コンデンサ。Claim 1: An element in which an oxide film, a solid electrolyte layer, and a cathode conductor layer are sequentially formed on an anode body made of a valve metal on which an anode lead is planted, and the outer periphery of the element other than the surface opposite to the surface on which the anode lead is planted. A chip-type solid electrolytic capacitor that has an insulating resin layer deposited on the surface, an anode terminal formed on the anode lead and its periphery, and a cathode terminal formed on the surface opposite the anode lead planting surface and its periphery. A chip type solid electrolytic capacitor characterized in that the anode terminal has a first metal body, a second insulating resin layer, and a second metal body formed in this order.
絶縁樹脂層を介して電気的・機械的に接続されている事
を特徴とする請求項１記載のチップ型固体電解コンデン
サ。2. The chip-type solid electrolyte according to claim 1, wherein the first metal body and the second metal body are electrically and mechanically connected via a second insulating resin layer. capacitor.
，金属板のいづれか一方からなることを特徴とする請求
項１記載のチップ型固体電解コンデンサ。3. The chip type solid electrolytic capacitor according to claim 1, wherein the first metal body is made of one of a plating layer, a metal wire, and a metal plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3025913A JP3000691B2 (en) | 1991-02-20 | 1991-02-20 | Chip type solid electrolytic capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3025913A JP3000691B2 (en) | 1991-02-20 | 1991-02-20 | Chip type solid electrolytic capacitor |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04264709A true JPH04264709A (en) | 1992-09-21 |
| JP3000691B2 JP3000691B2 (en) | 2000-01-17 |
Family
ID=12179018
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3025913A Expired - Lifetime JP3000691B2 (en) | 1991-02-20 | 1991-02-20 | Chip type solid electrolytic capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3000691B2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5349496A (en) * | 1992-03-03 | 1994-09-20 | Nec Corporation | Chip-type solid electrolytic capacitor |
-
1991
- 1991-02-20 JP JP3025913A patent/JP3000691B2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5349496A (en) * | 1992-03-03 | 1994-09-20 | Nec Corporation | Chip-type solid electrolytic capacitor |
Also Published As
| Publication number | Publication date |
|---|---|
| JP3000691B2 (en) | 2000-01-17 |
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|---|---|---|---|
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