JPH04260467A - Adhesive supply apparatus - Google Patents

Abstract

PURPOSE:To perfectly remove the stringing part at the time of spot coating operation in an adhesive supply apparatus. CONSTITUTION:An adhesive supply apparatus is constituted of the dispenser 2 vertically rising and falling with respect to a substrate 1 to apply the spot coating of an adhesive to the discontinuous places on the substrate 1 and the stringing removing member 4 reciprocally moving along the region crossing the rising and falling route 3 of the dispenser 2 in synchronous relation to the rising and falling operation of the dispenser 2 and removing the stringing part of the adhesive to the substrate 1 of the dispenser 2.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an adhesive supplying apparatus, and more particularly to an adhesive supplying apparatus used for spotting adhesive onto a mounting board for fixing electronic components.

0002

2. Description of the Related Art Conventionally, when dotting adhesive onto a mounting board using an adhesive supplying device, for example, as shown in FIG. 9, while moving a dispenser 2 up and down on a board 1, It was common practice to move between P1, P2, and so on.

0003

However, in the conventional example described above, since the adhesive 7 has a constant viscosity,
This has the drawback that a stringing phenomenon occurs while moving between dotted areas, and dust and the like adhere to the stringing portion 8, inducing pattern shorts.

[0004]Also, in order to eliminate this drawback, it has been proposed to blow off the thread pulling part 8 with air or the like, but the blown thread pulling part 8 may adhere to other parts, causing This method has disadvantages in that dust and the like may adhere to it, causing pattern shorts, or the threaded portion 8 may not be completely removed.

The present invention has been made to eliminate the above-mentioned drawbacks, and an object of the present invention is to provide an adhesive supplying device that can completely eliminate stringy portions during spotting operations.

[0006]

[Means for Solving the Problems] According to the present invention, the above object is achieved by moving up and down perpendicularly to a substrate 1 and bonding it to discontinuous points on the substrate 1, as shown in FIG. 1 corresponding to the embodiment. The dispenser 2 that applies the adhesive and the area that crosses the ascending and descending path 3 of the dispenser 2 are reciprocated in synchronization with the ascending and descending movement of the dispenser 2, and the threaded part of the adhesive on the substrate 1 of the dispenser 2 is removed. This is achieved by providing an adhesive supply device having a thread cutting member 4.

Further, as shown in detail in FIG. 3, the thread cutting member 4 is arranged so that the end position of the swing stroke interferes with the lifting path 3 of the holding plate 5 of the dispenser 2, and the end position of the thread cutting member 4 It can also be formed into a biased lever 6.

[0008]

[Operation] The operation of the present invention will be explained based on FIG.

The adhesive 7 is dotted onto the substrate 1 by lowering the dispenser 2 to a predetermined position on the substrate 1, as shown in (a). When finished, the dispenser 2 is lifted again in the direction of the arrow and moved to the next dotting point, as shown in (b).

At this time, since the adhesive 7 has viscosity,
A part of it stretches while being pulled by the dispenser 2, and a stringy part 8 is generated.

On the other hand, the thread cutting member 4 is attached to the dispenser 2.
The yarn is provided so as to reciprocate along the lifting path 3 in synchronization with the lifting movement of the dispenser 2, and as shown in FIG. Remove the pull portion 8.

0012

DESCRIPTION OF THE PREFERRED EMBODIMENTS Preferred embodiments of the present invention will now be described in detail with reference to the accompanying drawings.

1 to 3 show a first embodiment of the present invention. In the figures, 9 is a conveyor for conveying the printed circuit board 1, and 10 is a conveyor for stopping the printed circuit board 1 at a predetermined position. An adhesive supply device for bonding electronic components 11 such as semiconductor elements to the component mounting surface of the printed circuit board 1 is arranged on the side of the conveyor 9.

The adhesive supply device is mounted on a stage 12 that is driven in the XY directions by a drive device (not shown), and includes a stringing prevention mechanism section 13 and a dispenser section 14.
The dispenser section 14 is composed of the above-mentioned stage 1.
It is driven up and down by a drive cylinder 15 fixed perpendicularly to 2.

The dispenser section 14 is constructed by fixing the dispenser 2 containing the adhesive 7 inside to a holding plate 5 which is L-shaped in plan view. By moving up and down, a small diameter adhesive dripping port 17 formed at the tip of the dispenser 2 is lowered to a predetermined position on the printed circuit board 1, and a predetermined amount of adhesive 7 is dotted. . Furthermore, a sliding hole 18 is formed in the holding plate 5 that holds the dispenser 2, and by inserting a guide shaft 19 erected on the stage 12 into the sliding hole 18, the dispenser 2 can be moved. The adhesive dripping port 17 is guided so as to fall accurately to a predetermined position on the printed circuit board 1.

In FIG. 1, only the fixed portion of the drive cylinder 15 of the stage 12 is shown to avoid cluttering the drawing.

Under such a configuration, when the printed circuit board 1 is conveyed by the conveyor 9 and stopped at a predetermined position, the stage 12 equipped with the adhesive supply device is moved so that the adhesive dripping port 17 of the dispenser 2 is on the printed circuit board 1. The dispenser 2 is driven until it is positioned above the 7 adhesive application points, and then the dispenser 2 is lowered by driving the drive cylinder 15, the adhesive 7 is applied onto the printed circuit board 1, and the dispenser 2 is raised.
The operation of moving the dispenser 2 by driving the stage 12 is repeated to sequentially supply the adhesive 7 onto the printed circuit board 1.

On the other hand, the threading prevention mechanism section 13 is disposed below the dispenser section 14, and includes a hinge member 20 fixed to the stage 12 and a lever provided with a thread cutting rod (thread cutting member 4) at the tip. 6, and the lever 6 includes two hinge tongue pieces 2 protruding from the hinge member 20.
1 and 21 so as to be swingable.

As shown in FIG. 3, the lever 6 is arranged so as to interfere with the lowering path of the holding plate 5 of the dispenser 2, and a tension spring 23 is attached near the swinging hinge 22 of the lever 6. is urged upward, that is, in the direction of the arrow in FIG.
When the upper side portion is pressed as it descends, it swings through a predetermined stroke against the biasing force of the tension spring 23.

Further, the thread cutting rod 4 swings with a stroke that completely traverses the ascending and descending path 3 of the dispenser 2 in accordance with the swing of the lever 6, thereby connecting the adhesive dripping port 17 of the dispenser 2 with the printed circuit board. 1, and in order to match the descending distance of the dispenser 2 with the required stroke of the thread cutting rod 4,
A portion of the lever 6 in contact with the holding plate 5 is an inclined side 24.

Therefore, according to this embodiment, when the dispenser 2 held at a predetermined position above the printed circuit board 1 descends to apply the adhesive 7 onto the printed circuit board 1, the lever 6 is moved by the side edge of the holding plate 5. The inclined side 24 of is pressed to swing the lever 6, and at the same time, the thread trimming rod 4 moves to a position crossing the descending path of the dispenser 2. After that, when the dispensing of the adhesive 7 from the dispenser 2 is completed and the dispenser 2 starts to rise, the pressure applied to the lever 6 by the holding plate 5 is released and the lever 6 is moved to the tension spring 23. At the same time as it returns to its original position due to the restoring force, the thread cutting rod 4 also crosses the ascending path of the dispenser 2 again and returns to its original position, and the threads of the adhesive 7 are entangled in the process of returning.

FIGS. 4 and 5 show a second embodiment of the present invention. In addition, in the description of the following embodiments, the same configurations as those in the above-mentioned embodiments are denoted by the same reference numerals in the drawings, and the description thereof will be omitted.

In this embodiment, the thread is cut by swinging the thread trimming lever (thread trimming member 4) in the direction of the arrow in a plane parallel to the component mounting surface of the printed circuit board 1.
The thread pulling prevention mechanism 13 is formed by pivoting the thread cutting lever 4 to a hinge member 20 fixed to the stage 12 so as to be able to swing freely in the horizontal direction, and in order to swing the thread cutting lever 4, A pressing rod 25 is provided on the holding plate 5 of the dispenser 2 to project downward.

Therefore, in this embodiment, when the press rod 25 presses the inclined surface 26 formed on the side edge of the thread trimming lever 4 as the dispenser 2 descends, the thread trimming lever 4 resists the biasing force of the tension spring 23. Figure 5(a)
The dispenser 2 is horizontally oscillated as shown by the arrow, and after applying the adhesive 7 to the printed circuit board 1, the dispenser 2 is lifted again and returned to its original position to perform thread cutting.

FIGS. 6 and 7 show a third embodiment of the present invention, in which a pair of thread cutting levers 4, 4 are used to cut the thread pulling section 8 to perform thread trimming.

String prevention mechanism 13 in this embodiment
has a pair of thread trimming levers 4, 4 whose ends are coaxially and swingably supported, and whose free ends are biased in the direction of closing by a spring (not shown). The expansion rod 29 of the holding plate 5 is inserted into the opening 28 formed by the notch 27 on the opposite side edge of the thread trimming lever 4, and the tip of the thread trimming lever 4 is expanded. Thread cutting is performed by pinching and cutting the thread pulling portion 8.

Note that in the above embodiment, the retaining plate 5
Although a case is shown in which the thread cutting member 4 is operated using the lowering of the cylinder 30, as shown in FIG. Alternatively, as shown in FIG. 8(b), it is also possible to configure the thread cutting member 4 to be rotated by the drive motor 31.

[0028]

As is clear from the above description, according to the present invention, the thread cutting member is configured to cross the ascending and descending path of the dispenser at a predetermined timing, so that the thread pulling section of the adhesive can be completely cut off. Can be removed.

[Brief explanation of the drawing]

FIG. 1 is an overall perspective view showing an embodiment of the present invention.

FIG. 2 is a diagram showing the operation of the present invention.

FIG. 3 is an explanatory diagram showing the operation of the lever.

FIG. 4 is a diagram showing a second embodiment of the present invention.

FIG. 5 is a plan view of FIG. 4 showing the operation of the lever.

FIG. 6 is a diagram showing a third embodiment of the present invention.

FIG. 7 is a plan view of FIG. 6 showing the operation of the lever.

FIG. 8 is a diagram showing a fourth embodiment of the present invention.

FIG. 9 is a diagram showing a conventional example.

[Explanation of symbols]

1　　　　Substrate 2 Dispenser 3. Lifting route 4 Thread cutting member 5 Holding plate 6 Lever

Claims (2)

[Claims] 1. A dispenser (2) that ascends and descends perpendicularly to a substrate (1) to apply adhesive to discontinuous locations on the substrate (1), and an elevation path (3) for the dispenser (2). ), the thread cutting member (4) reciprocates in synchronization with the vertical movement of the dispenser (2) and removes the threaded part of the adhesive from the dispenser (2) to the substrate (1). Adhesive supply device. 2. The thread cutting member (4) is attached such that the end position of the swing stroke interferes with the lifting path (3) of the holding plate (5) of the dispenser (2), and the end position of the thread trimming member (4) is attached to the end side of the swing stroke. 2. Adhesive supply device according to claim 1, characterized in that it is formed in a biased lever (6).