JPH04259284A - Manufacture of flexible printed circuit board - Google Patents
Manufacture of flexible printed circuit boardInfo
- Publication number
- JPH04259284A JPH04259284A JP10405191A JP10405191A JPH04259284A JP H04259284 A JPH04259284 A JP H04259284A JP 10405191 A JP10405191 A JP 10405191A JP 10405191 A JP10405191 A JP 10405191A JP H04259284 A JPH04259284 A JP H04259284A
- Authority
- JP
- Japan
- Prior art keywords
- film
- polyamic acid
- printed circuit
- flexible printed
- circuit board
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004519 manufacturing process Methods 0.000 title claims description 8
- 229920005575 poly(amic acid) Polymers 0.000 claims abstract description 25
- 239000011888 foil Substances 0.000 claims abstract description 12
- 238000000034 method Methods 0.000 claims description 12
- 239000004020 conductor Substances 0.000 abstract description 17
- 239000000463 material Substances 0.000 abstract description 3
- 238000000926 separation method Methods 0.000 abstract 3
- 238000006358 imidation reaction Methods 0.000 abstract 1
- 239000010410 layer Substances 0.000 description 24
- 239000000243 solution Substances 0.000 description 8
- 238000001035 drying Methods 0.000 description 7
- 238000010438 heat treatment Methods 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 239000012790 adhesive layer Substances 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- -1 etc. Chemical class 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- VLDPXPPHXDGHEW-UHFFFAOYSA-N 1-chloro-2-dichlorophosphoryloxybenzene Chemical compound ClC1=CC=CC=C1OP(Cl)(Cl)=O VLDPXPPHXDGHEW-UHFFFAOYSA-N 0.000 description 2
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 description 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 2
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 150000008065 acid anhydrides Chemical class 0.000 description 2
- 239000003513 alkali Substances 0.000 description 2
- 239000012670 alkaline solution Substances 0.000 description 2
- 150000004985 diamines Chemical class 0.000 description 2
- 229910001873 dinitrogen Inorganic materials 0.000 description 2
- USIUVYZYUHIAEV-UHFFFAOYSA-N diphenyl ether Chemical compound C=1C=CC=CC=1OC1=CC=CC=C1 USIUVYZYUHIAEV-UHFFFAOYSA-N 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000002904 solvent Substances 0.000 description 2
- 238000004544 sputter deposition Methods 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 238000007740 vapor deposition Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- CBCKQZAAMUWICA-UHFFFAOYSA-N 1,4-phenylenediamine Chemical compound NC1=CC=C(N)C=C1 CBCKQZAAMUWICA-UHFFFAOYSA-N 0.000 description 1
- HLBLWEWZXPIGSM-UHFFFAOYSA-N 4-Aminophenyl ether Chemical compound C1=CC(N)=CC=C1OC1=CC=C(N)C=C1 HLBLWEWZXPIGSM-UHFFFAOYSA-N 0.000 description 1
- VQVIHDPBMFABCQ-UHFFFAOYSA-N 5-(1,3-dioxo-2-benzofuran-5-carbonyl)-2-benzofuran-1,3-dione Chemical compound C1=C2C(=O)OC(=O)C2=CC(C(C=2C=C3C(=O)OC(=O)C3=CC=2)=O)=C1 VQVIHDPBMFABCQ-UHFFFAOYSA-N 0.000 description 1
- JVERADGGGBYHNP-UHFFFAOYSA-N 5-phenylbenzene-1,2,3,4-tetracarboxylic acid Chemical compound OC(=O)C1=C(C(O)=O)C(C(=O)O)=CC(C=2C=CC=CC=2)=C1C(O)=O JVERADGGGBYHNP-UHFFFAOYSA-N 0.000 description 1
- 229910001006 Constantan Inorganic materials 0.000 description 1
- MQJKPEGWNLWLTK-UHFFFAOYSA-N Dapsone Chemical compound C1=CC(N)=CC=C1S(=O)(=O)C1=CC=C(N)C=C1 MQJKPEGWNLWLTK-UHFFFAOYSA-N 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- GTDPSWPPOUPBNX-UHFFFAOYSA-N ac1mqpva Chemical compound CC12C(=O)OC(=O)C1(C)C1(C)C2(C)C(=O)OC1=O GTDPSWPPOUPBNX-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 230000000740 bleeding effect Effects 0.000 description 1
- WKDNYTOXBCRNPV-UHFFFAOYSA-N bpda Chemical compound C1=C2C(=O)OC(=O)C2=CC(C=2C=C3C(=O)OC(C3=CC=2)=O)=C1 WKDNYTOXBCRNPV-UHFFFAOYSA-N 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- ZZTCPWRAHWXWCH-UHFFFAOYSA-N diphenylmethanediamine Chemical compound C=1C=CC=CC=1C(N)(N)C1=CC=CC=C1 ZZTCPWRAHWXWCH-UHFFFAOYSA-N 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000010030 laminating Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000012046 mixed solvent Substances 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 150000004986 phenylenediamines Chemical class 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006255 plastic film Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000002994 raw material Substances 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 239000007787 solid Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- SRPWOOOHEPICQU-UHFFFAOYSA-N trimellitic anhydride Chemical compound OC(=O)C1=CC=C2C(=O)OC(=O)C2=C1 SRPWOOOHEPICQU-UHFFFAOYSA-N 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Landscapes
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明は、接着剤層をもたない２
層フレキシブル印刷回路板において、孔加工された支持
フィルム層を有するフレキシブル印刷回路用基板を製造
する方法に関するものである。[Industrial Application Field] The present invention provides two
The present invention relates to a method of manufacturing a flexible printed circuit board having a perforated support film layer in a layered flexible printed circuit board.
【０００２】0002
【従来の技術】従来のフレキシブル印刷回路用基板は、
電子機器の小型・軽量化が進むにつれ、ますます用途が
拡大し、最近は従来の様な配線基板としてだけでなく、
ＴＡＢ用キャリアテープの様な支持フィルムに孔のあい
た基板の利用も増大してきている。[Prior Art] Conventional flexible printed circuit boards are
As electronic devices become smaller and lighter, their uses are expanding, and recently they are being used not only as conventional wiring boards, but also as
The use of perforated substrates in supporting films, such as TAB carrier tapes, is also increasing.
【０００３】このような、支持フィルム層に孔加工がさ
れ、かつ導体配線を有するフレキシブル印刷回路用基板
の製造方法としては、予め支持フィルム層にパンチング
等で孔加工を行い、接着剤を用いて導体層を貼合せた後
、配線回路を形成する方法や、導体層にポリアミック酸
溶液を直接塗布し、乾燥・イミド化を行うか、支持フィ
ルム層に蒸着法やスパッタリング法によって導体層を形
成した後、レーザーあるいは強アルカリ性溶液によって
支持フィルム層に孔加工を行い、その後配線回路を形成
する方法が用いられている。[0003] As a method for manufacturing such a flexible printed circuit board having holes in the support film layer and conductor wiring, holes are formed in the support film layer in advance by punching or the like, and then the holes are formed in the support film layer using an adhesive. After laminating the conductor layer, there are methods of forming a wiring circuit, directly applying a polyamic acid solution to the conductor layer, drying and imidization, or forming the conductor layer on the support film layer by vapor deposition or sputtering. After that, a method is used in which holes are formed in the support film layer using a laser or a strong alkaline solution, and then a wiring circuit is formed.
【０００４】しかし、従来用いられているこれらの方法
においては、それぞれに耐熱性、密着力、加工性、耐薬
品性に欠点を有している。まず、接着剤層をもつ３層フ
レキシブル印刷回路用基板では、接着剤層の耐熱性が低
いため、支持フィルムにポリイミドを用いても、フレキ
シブル印刷回路用基板としての耐熱性は接着剤層の耐熱
性によって決定されるという欠点を有している。導体層
を蒸着やスパッタリング法で形成した場合、支持フィル
ム層と導体層の密着力が低いという欠点、あるいは導体
層を厚くしていった場合に厚さ及び密度が不均一になる
という欠点を有している。そして導体層にポリアミック
酸溶液を直接塗布・乾燥・イミド化した後孔加工する場
合、加工に用いるレーザーは装置が非常に高価となる、
あるいはイミド化後にアルカリエッチング可能な分子構
造をもつポリイミドは、耐溶剤性が若干落ち、かつエッ
チング液として強アルカリ性溶液を用いるために危険性
が高く、また安易に廃液処理ができないという欠点を有
している。However, each of these conventionally used methods has drawbacks in heat resistance, adhesion, processability, and chemical resistance. First, in a three-layer flexible printed circuit board that has an adhesive layer, the heat resistance of the adhesive layer is low, so even if polyimide is used for the support film, the heat resistance of the adhesive layer is limited. It has the disadvantage of being determined by gender. When the conductor layer is formed by vapor deposition or sputtering, there are disadvantages such as low adhesion between the support film layer and the conductor layer, or the disadvantage that the thickness and density become uneven when the conductor layer is thickened. are doing. If a polyamic acid solution is directly applied to the conductor layer, dried, and imidized, then hole processing is performed, the laser used for processing is extremely expensive.
Alternatively, polyimide, which has a molecular structure that can be etched with alkali after imidization, has the disadvantage that its solvent resistance is slightly reduced, that it is highly dangerous because it uses a strong alkaline solution as an etching solution, and that it cannot be easily disposed of as waste liquid. ing.
【０００５】[0005]
【発明が解決しようとする課題】本発明の目的とすると
ころは、接着剤層のない２層フレキシブル印刷回路板の
本来もっている耐アルカリ性、耐溶剤性、耐熱性、電気
特性を低下させることなく、孔加工された支持フィルム
を有するフレキシブル印刷回路用基板の製造法を提供す
るものである。[Problems to be Solved by the Invention] The object of the present invention is to maintain the inherent alkali resistance, solvent resistance, heat resistance, and electrical properties of a two-layer flexible printed circuit board without an adhesive layer. The present invention provides a method for manufacturing a flexible printed circuit board having a perforated support film.
【０００６】[0006]
【課題を解決するための手段】本発明は、離型フィルム
上に半硬化させたポリアミック酸フィルムを形成させ、
次いで該半硬化フィルムに所定の開孔部を設けた後、導
体箔に該半硬化フィルム面を合せて圧着し、イミド化を
完結させることを特徴とするフレキシブル印刷回路基板
の製造方法である。[Means for Solving the Problems] The present invention forms a semi-cured polyamic acid film on a release film,
The method for manufacturing a flexible printed circuit board is characterized in that, after forming predetermined openings in the semi-cured film, the surface of the semi-cured film is pressed against a conductive foil to complete imidization.
【０００７】即ち、離型フィルム上にポリアミック酸溶
液を塗布し、タックフリー状態になるまで乾燥させ、ポ
リアミック酸フィルムを形成する。次に、その離型フィ
ルムのついたポリアミック酸フィルムを打抜き又は切断
したり、エッチングすることにより離型フィルムと共に
、あるいはポリアミック酸フィルムのみを開孔させて孔
加工を行なう。孔加工が終了した後、導体箔に該ポリア
ミック酸を加熱・圧着し、離型フィルムを剥離し、充分
にイミド化を行なう。That is, a polyamic acid solution is applied onto a release film and dried until it becomes tack-free to form a polyamic acid film. Next, the polyamic acid film with the release film attached thereto is punched, cut, or etched to form holes either together with the release film or only in the polyamic acid film. After the hole processing is completed, the polyamic acid is heated and pressed onto the conductive foil, the release film is peeled off, and imidization is sufficiently performed.
【０００８】本発明において、ポリアミック酸溶液を乾
燥させ、半硬化状態のポリアミック酸フィルムを形成さ
せる条件としては、８０〜２００℃、５〜３０分が適当
である。これより温度が低く時間が短い場合、導体箔と
加熱・圧着する際、流動性が大きく、開孔部でのにじみ
、しみ出しが大きく、フィルム厚のバラツキも大きくな
り、イミド化時の寸法変化が大きくなる。またこれより
温度が高く時間が長い場合、導体箔と加熱・圧着する際
、流動性が小さすぎ、導体箔とのピール強度が低下し、
ボイドの発生が多くなる。導体箔に加熱・圧着する条件
としては、プレス形式の場合は、７０〜２００℃、５〜
１００ｋｇ／ｃｍ２、５〜３０分、ロール式ラミネータ
の場合は、７０〜２００℃、１〜５０ｋｇ／ｃｍ、０．
１〜１０ｍ／分の条件が適当であり、特に温度としては
ポリアミック酸フィルムの乾燥温度より１０〜３０℃低
い温度で実施することが揮発物の発生もなく望ましい。In the present invention, suitable conditions for drying the polyamic acid solution to form a semi-cured polyamic acid film are 80 to 200°C for 5 to 30 minutes. If the temperature is lower than this and the time is shorter, the fluidity will be large when heating and press-bonding with the conductor foil, bleeding and exudation will be large at the openings, there will be large variations in film thickness, and dimensional changes will occur during imidization. becomes larger. If the temperature is higher than this and the time is longer, the fluidity will be too low when heating and press-bonding with the conductor foil, and the peel strength with the conductor foil will decrease.
Voids occur more frequently. The conditions for heating and press-bonding the conductor foil are 70-200°C and 5-200°C in the case of a press type.
100 kg/cm2, 5 to 30 minutes, 70 to 200°C, 1 to 50 kg/cm, 0.
Conditions of 1 to 10 m/min are appropriate, and it is particularly desirable to perform the drying at a temperature 10 to 30° C. lower than the drying temperature of the polyamic acid film to avoid generation of volatile substances.
【０００９】また、本発明におけるポリアミック酸は、
通常ジアミンと酸無水物とを反応させることにより得ら
れる。ジアミンとしては、フェニレンジアミン、ジアミ
ノジフェニルメタン、ジアミノジフェニルスルホン、ジ
アミノジフェニルエーテルなどを、酸無水物としては、
トリメリット酸無水物、ピロメリット酸二無水物、ビフ
ェニルテトラカルボン酸二無水物、ベンゾフェノンテト
ラカルボン酸二無水物などを使用することができ、それ
ぞれ１種又は２種以上を適宜組合せて用いることができ
る。ポリアミック酸フィルムの状態におけるイミド化率
は１０〜５０％、望むべくは２０〜４０％が好ましい。[0009] Furthermore, the polyamic acid in the present invention is
It is usually obtained by reacting a diamine with an acid anhydride. Examples of diamines include phenylene diamine, diaminodiphenylmethane, diaminodiphenylsulfone, diaminodiphenyl ether, etc., and acid anhydrides include:
Trimellitic anhydride, pyromellitic dianhydride, biphenyltetracarboxylic dianhydride, benzophenonetetracarboxylic dianhydride, etc. can be used, and each can be used alone or in an appropriate combination of two or more. can. The imidization rate in the state of the polyamic acid film is preferably 10 to 50%, preferably 20 to 40%.
【００１０】離型フィルムとして用いることのできる材
料としては、ポリプロピレン、ポリエステル、ポリエー
テルサルフォン、ポリイミド、ポリエチレン等のプラス
チックフィルムが挙げられる。Materials that can be used as the release film include plastic films such as polypropylene, polyester, polyethersulfone, polyimide, and polyethylene.
【００１１】導体層として用いることのできる材料とし
ては、銅、アルミニウム、コンスタンタン、ニッケル等
の金属箔が挙げられる。[0011] Materials that can be used as the conductor layer include metal foils such as copper, aluminum, constantan, and nickel.
【００１２】0012
【作用】本発明は、離型フィルム上にポリアミック酸溶
液を塗布し、乾燥させ、ポリアミック酸の半硬化状態の
フィルムにおいて孔加工を行ない、その後、導休箔と加
熱・圧着し、イミド化を完結させ、導体配線を形成する
工程をとることにより、容易にかつ安価に、生産性・収
率よく支持フィルム層に孔を有する２層フレキシブル印
刷回路基板を得ることができる。[Operation] In the present invention, a polyamic acid solution is applied onto a release film, dried, holes are formed in the semi-cured film of polyamic acid, and then the film is heated and pressed with a conductive foil to imidize it. By completing the process and forming conductor wiring, it is possible to easily and inexpensively obtain a two-layer flexible printed circuit board having holes in the support film layer with good productivity and yield.
【００１３】[0013]
【実施例】（実施例１）温度計、攪拌装置、環流コンデ
ンサー及び乾燥窒素ガス吹込み口を備えた４つ口セパラ
ブルフラスコに、精製した無水のパラフェニレンジアミ
ン１０８ｇと４，４’−ジアミノジフェニルエーテル２
００ｇをとり、これに無水のＮ−メチル−２−ピロリド
ン９０重量％とトルエン１０重量％の混合溶剤を、全仕
込原料中の固形分割合が２０重量％になるだけの量を加
えて溶解した。乾燥窒素ガスは反応の準備段階より生成
物取り出しまでの全工程にわたり流しておいた。次いで
、精製した無水の３，３’，４，４’−ビフェニルテト
ラカルボン酸二無水物２９４ｇとピロメリット酸二無水
物２１８ｇを攪拌しながら少量ずつ添加するが、発熱反
応であるため、外部水槽に約１５℃の冷水を循環させて
これを冷却した。添加後、内部温度を２０℃に設定し、
５時間攪拌し、反応を終了してポリアミック酸溶液を得
た。[Example] (Example 1) In a four-necked separable flask equipped with a thermometer, stirrer, reflux condenser, and dry nitrogen gas inlet, 108 g of purified anhydrous paraphenylene diamine and 4,4'-diaminone diphenyl ether 2
00g was taken, and a mixed solvent of 90% by weight of anhydrous N-methyl-2-pyrrolidone and 10% by weight of toluene was added thereto in an amount sufficient to make the solid content ratio in the total raw materials 20% by weight and dissolved therein. . Dry nitrogen gas was allowed to flow throughout the entire process from the preparatory stage of the reaction to the removal of the product. Next, 294 g of purified anhydrous 3,3',4,4'-biphenyltetracarboxylic dianhydride and 218 g of pyromellitic dianhydride are added little by little while stirring, but since it is an exothermic reaction, an external water tank is used. It was cooled by circulating cold water at about 15°C. After addition, set the internal temperature to 20 °C,
After stirring for 5 hours, the reaction was completed and a polyamic acid solution was obtained.
【００１４】市販のポリエステルフィルム上に、このポ
リアミック酸溶液をスピンナーで塗布し、１１０℃１５
分乾燥を行ない、離型フィルムのついたポリアミック酸
フィルムを得た。次に金型を用いて孔加工を行ない、市
販の銅箔粗化面上にポリアミック酸フィルム側を重ね合
せ、９０℃、４０ｋｇ／ｃｍ２、１５分加熱，圧着を行
なった。その後、型フィルムを剥がし、３８０℃で１時
間加熱を行ない、イミド化を完結した。得られた２層フ
レキシブル印刷回路用基板の特性は、同様のワニスを用
い通常の方法で銅箔上に直接塗布、乾燥、イミド化を行
ない作製したものと同等の特性を有していた。[0014] This polyamic acid solution was applied onto a commercially available polyester film using a spinner, and heated at 110°C and 15°C.
After drying for a few minutes, a polyamic acid film with a release film was obtained. Next, holes were formed using a mold, and the polyamic acid film side was superimposed on the roughened surface of a commercially available copper foil, followed by heating and pressure bonding at 90° C. and 40 kg/cm 2 for 15 minutes. Thereafter, the mold film was peeled off and heating was performed at 380° C. for 1 hour to complete imidization. The properties of the resulting two-layer flexible printed circuit board were similar to those produced by applying the same varnish directly onto copper foil in the usual manner, drying it, and imidizing it.
【００１５】（実施例２）導体箔への加熱・圧着を、９
０℃、１０ｋｇ／ｃｍ２、０．１分の条件でラミネータ
ーを使用して行なう以外は実施例１と同様にして２層フ
レキシブル印刷回路用基板を得た。(Example 2) Heating and pressure bonding to conductor foil was carried out at 9
A two-layer flexible printed circuit board was obtained in the same manner as in Example 1, except that a laminator was used under the conditions of 0° C., 10 kg/cm 2 , and 0.1 minutes.
【００１６】通常の方法で銅箔上に直接塗布、乾燥、イ
ミド化を行ない作成した２層フレキシブル印刷回路用基
板、及び実施例１及び２で作成した２層フレキシブル印
刷回路用基板の特性を表１に示した。[0016] The characteristics of the two-layer flexible printed circuit board made by directly coating, drying, and imidizing copper foil on copper foil by the usual method, and the two-layer flexible printed circuit board made in Examples 1 and 2 are shown below. Shown in 1.
【００１７】[0017]
【表１】[Table 1]
【００１８】[0018]
【発明の効果】本発明によれば、従来と同様の方法で支
持フィルムに孔を有する２層フレキシブル印刷回路用基
板を得ることができ、さらにイミド化完結後も他の特性
を損うことなく、寸法変化率の低下及びカール発生の軽
減等の効果も得ることができた。本発明は、連続シート
を用いたフレキシブル印刷回路基板の連続生産工程にも
容易に適用できるなど、工業的な孔加工されたフレキシ
ブル印刷回路用基板の製造方法として好適なものである
。[Effects of the Invention] According to the present invention, a two-layer flexible printed circuit board having holes in the support film can be obtained by the same method as before, and furthermore, even after imidization is completed, other characteristics are not impaired. It was also possible to obtain effects such as a reduction in the rate of dimensional change and a reduction in the occurrence of curling. The present invention can be easily applied to a continuous production process of flexible printed circuit boards using continuous sheets, and is therefore suitable as an industrial method for manufacturing perforated flexible printed circuit boards.
Claims (1)
ミック酸フィルムを形成させ、次いで該半硬化フィルム
に所定の開孔部を設けた後、導体箔に該半硬化フィルム
面を合せて圧着し、イミド化を完結させることを特徴と
するフレキシブル印刷回路基板の製造方法。Claim 1: A semi-cured polyamic acid film is formed on a release film, and then predetermined openings are formed in the semi-cured film, and the surface of the semi-cured film is pressed against a conductive foil. A method for manufacturing a flexible printed circuit board, characterized by completing imidization.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3104051A JP3061885B2 (en) | 1991-02-13 | 1991-02-13 | Manufacturing method of flexible printed circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3104051A JP3061885B2 (en) | 1991-02-13 | 1991-02-13 | Manufacturing method of flexible printed circuit board |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04259284A true JPH04259284A (en) | 1992-09-14 |
| JP3061885B2 JP3061885B2 (en) | 2000-07-10 |
Family
ID=14370413
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3104051A Expired - Fee Related JP3061885B2 (en) | 1991-02-13 | 1991-02-13 | Manufacturing method of flexible printed circuit board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3061885B2 (en) |
-
1991
- 1991-02-13 JP JP3104051A patent/JP3061885B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JP3061885B2 (en) | 2000-07-10 |
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