JPH04255757A - Polyphenylene sulfide resin composition - Google Patents
Polyphenylene sulfide resin compositionInfo
- Publication number
- JPH04255757A JPH04255757A JP1788691A JP1788691A JPH04255757A JP H04255757 A JPH04255757 A JP H04255757A JP 1788691 A JP1788691 A JP 1788691A JP 1788691 A JP1788691 A JP 1788691A JP H04255757 A JPH04255757 A JP H04255757A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- polyphenylene sulfide
- resin composition
- pts
- nylon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004734 Polyphenylene sulfide Substances 0.000 title claims abstract description 36
- 229920000069 polyphenylene sulfide Polymers 0.000 title claims abstract description 36
- 239000011342 resin composition Substances 0.000 title claims abstract description 15
- 229920005989 resin Polymers 0.000 claims abstract description 31
- 239000011347 resin Substances 0.000 claims abstract description 31
- 239000005749 Copper compound Substances 0.000 claims abstract description 11
- 150000001880 copper compounds Chemical class 0.000 claims abstract description 11
- 239000011256 inorganic filler Substances 0.000 claims abstract description 6
- 229910003475 inorganic filler Inorganic materials 0.000 claims abstract description 6
- 229920006122 polyamide resin Polymers 0.000 claims abstract description 6
- 238000002156 mixing Methods 0.000 claims abstract description 5
- 239000000203 mixture Substances 0.000 claims abstract description 5
- 239000000463 material Substances 0.000 abstract description 9
- NLKNQRATVPKPDG-UHFFFAOYSA-M potassium iodide Chemical compound [K+].[I-] NLKNQRATVPKPDG-UHFFFAOYSA-M 0.000 abstract description 9
- FVAUCKIRQBBSSJ-UHFFFAOYSA-M sodium iodide Chemical compound [Na+].[I-] FVAUCKIRQBBSSJ-UHFFFAOYSA-M 0.000 abstract description 9
- 238000004898 kneading Methods 0.000 abstract description 6
- 239000000126 substance Substances 0.000 abstract description 6
- 229910021595 Copper(I) iodide Inorganic materials 0.000 abstract description 5
- 229920002302 Nylon 6,6 Polymers 0.000 abstract description 5
- LSXDOTMGLUJQCM-UHFFFAOYSA-M copper(i) iodide Chemical compound I[Cu] LSXDOTMGLUJQCM-UHFFFAOYSA-M 0.000 abstract description 5
- 239000003513 alkali Substances 0.000 abstract description 3
- RFKZUAOAYVHBOY-UHFFFAOYSA-M copper(1+);acetate Chemical compound [Cu+].CC([O-])=O RFKZUAOAYVHBOY-UHFFFAOYSA-M 0.000 abstract description 3
- 150000004820 halides Chemical class 0.000 abstract description 3
- 229920006111 poly(hexamethylene terephthalamide) Polymers 0.000 abstract description 3
- 235000009518 sodium iodide Nutrition 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 12
- 239000004952 Polyamide Substances 0.000 description 9
- 229920002647 polyamide Polymers 0.000 description 9
- 239000000047 product Substances 0.000 description 9
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 8
- -1 polybutylene terephthalate Polymers 0.000 description 7
- 238000006116 polymerization reaction Methods 0.000 description 7
- 239000004677 Nylon Substances 0.000 description 6
- 239000000835 fiber Substances 0.000 description 6
- 229920001778 nylon Polymers 0.000 description 6
- 229920000642 polymer Polymers 0.000 description 6
- 239000002253 acid Substances 0.000 description 4
- 229910052802 copper Inorganic materials 0.000 description 4
- 239000010949 copper Substances 0.000 description 4
- 239000000843 powder Substances 0.000 description 4
- QTBSBXVTEAMEQO-UHFFFAOYSA-N Acetic acid Chemical compound CC(O)=O QTBSBXVTEAMEQO-UHFFFAOYSA-N 0.000 description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 3
- 238000005452 bending Methods 0.000 description 3
- XTVVROIMIGLXTD-UHFFFAOYSA-N copper(II) nitrate Chemical compound [Cu+2].[O-][N+]([O-])=O.[O-][N+]([O-])=O XTVVROIMIGLXTD-UHFFFAOYSA-N 0.000 description 3
- 238000004132 cross linking Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 239000003365 glass fiber Substances 0.000 description 3
- 230000001771 impaired effect Effects 0.000 description 3
- 238000002347 injection Methods 0.000 description 3
- 239000007924 injection Substances 0.000 description 3
- 229910052751 metal Inorganic materials 0.000 description 3
- 239000002184 metal Substances 0.000 description 3
- 238000000465 moulding Methods 0.000 description 3
- 239000008188 pellet Substances 0.000 description 3
- PBLZLIFKVPJDCO-UHFFFAOYSA-N 12-aminododecanoic acid Chemical compound NCCCCCCCCCCCC(O)=O PBLZLIFKVPJDCO-UHFFFAOYSA-N 0.000 description 2
- CNPURSDMOWDNOQ-UHFFFAOYSA-N 4-methoxy-7h-pyrrolo[2,3-d]pyrimidin-2-amine Chemical compound COC1=NC(N)=NC2=C1C=CN2 CNPURSDMOWDNOQ-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- JHWNWJKBPDFINM-UHFFFAOYSA-N Laurolactam Chemical compound O=C1CCCCCCCCCCCN1 JHWNWJKBPDFINM-UHFFFAOYSA-N 0.000 description 2
- SECXISVLQFMRJM-UHFFFAOYSA-N N-Methylpyrrolidone Chemical compound CN1CCCC1=O SECXISVLQFMRJM-UHFFFAOYSA-N 0.000 description 2
- 229920000305 Nylon 6,10 Polymers 0.000 description 2
- WCUXLLCKKVVCTQ-UHFFFAOYSA-M Potassium chloride Chemical compound [Cl-].[K+] WCUXLLCKKVVCTQ-UHFFFAOYSA-M 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical class OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- 125000001931 aliphatic group Chemical group 0.000 description 2
- 229960002684 aminocaproic acid Drugs 0.000 description 2
- 239000010425 asbestos Substances 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- OSGAYBCDTDRGGQ-UHFFFAOYSA-L calcium sulfate Chemical compound [Ca+2].[O-]S([O-])(=O)=O OSGAYBCDTDRGGQ-UHFFFAOYSA-L 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- ORTQZVOHEJQUHG-UHFFFAOYSA-L copper(II) chloride Chemical compound Cl[Cu]Cl ORTQZVOHEJQUHG-UHFFFAOYSA-L 0.000 description 2
- OPQARKPSCNTWTJ-UHFFFAOYSA-L copper(ii) acetate Chemical compound [Cu+2].CC([O-])=O.CC([O-])=O OPQARKPSCNTWTJ-UHFFFAOYSA-L 0.000 description 2
- QTMDXZNDVAMKGV-UHFFFAOYSA-L copper(ii) bromide Chemical compound [Cu+2].[Br-].[Br-] QTMDXZNDVAMKGV-UHFFFAOYSA-L 0.000 description 2
- JBKVHLHDHHXQEQ-UHFFFAOYSA-N epsilon-caprolactam Chemical compound O=C1CCCCCN1 JBKVHLHDHHXQEQ-UHFFFAOYSA-N 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 2
- 239000003112 inhibitor Substances 0.000 description 2
- 238000001746 injection moulding Methods 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- AMXOYNBUYSYVKV-UHFFFAOYSA-M lithium bromide Chemical compound [Li+].[Br-] AMXOYNBUYSYVKV-UHFFFAOYSA-M 0.000 description 2
- KWGKDLIKAYFUFQ-UHFFFAOYSA-M lithium chloride Chemical compound [Li+].[Cl-] KWGKDLIKAYFUFQ-UHFFFAOYSA-M 0.000 description 2
- HSZCZNFXUDYRKD-UHFFFAOYSA-M lithium iodide Chemical compound [Li+].[I-] HSZCZNFXUDYRKD-UHFFFAOYSA-M 0.000 description 2
- 230000014759 maintenance of location Effects 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 2
- IOLCXVTUBQKXJR-UHFFFAOYSA-M potassium bromide Chemical compound [K+].[Br-] IOLCXVTUBQKXJR-UHFFFAOYSA-M 0.000 description 2
- KIDHWZJUCRJVML-UHFFFAOYSA-N putrescine Chemical compound NCCCCN KIDHWZJUCRJVML-UHFFFAOYSA-N 0.000 description 2
- 239000012779 reinforcing material Substances 0.000 description 2
- 229910052895 riebeckite Inorganic materials 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 description 2
- 229910010271 silicon carbide Inorganic materials 0.000 description 2
- JHJLBTNAGRQEKS-UHFFFAOYSA-M sodium bromide Chemical compound [Na+].[Br-] JHJLBTNAGRQEKS-UHFFFAOYSA-M 0.000 description 2
- 238000003756 stirring Methods 0.000 description 2
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 description 2
- ZDPHROOEEOARMN-UHFFFAOYSA-N undecanoic acid Chemical compound CCCCCCCCCCC(O)=O ZDPHROOEEOARMN-UHFFFAOYSA-N 0.000 description 2
- XBTRYWRVOBZSGM-UHFFFAOYSA-N (4-methylphenyl)methanediamine Chemical compound CC1=CC=C(C(N)N)C=C1 XBTRYWRVOBZSGM-UHFFFAOYSA-N 0.000 description 1
- YHMYGUUIMTVXNW-UHFFFAOYSA-N 1,3-dihydrobenzimidazole-2-thione Chemical compound C1=CC=C2NC(S)=NC2=C1 YHMYGUUIMTVXNW-UHFFFAOYSA-N 0.000 description 1
- PXGZQGDTEZPERC-UHFFFAOYSA-N 1,4-cyclohexanedicarboxylic acid Chemical compound OC(=O)C1CCC(C(O)=O)CC1 PXGZQGDTEZPERC-UHFFFAOYSA-N 0.000 description 1
- OCJBOOLMMGQPQU-UHFFFAOYSA-N 1,4-dichlorobenzene Chemical compound ClC1=CC=C(Cl)C=C1 OCJBOOLMMGQPQU-UHFFFAOYSA-N 0.000 description 1
- QFGCFKJIPBRJGM-UHFFFAOYSA-N 12-[(2-methylpropan-2-yl)oxy]-12-oxododecanoic acid Chemical compound CC(C)(C)OC(=O)CCCCCCCCCCC(O)=O QFGCFKJIPBRJGM-UHFFFAOYSA-N 0.000 description 1
- HYZJCKYKOHLVJF-UHFFFAOYSA-N 1H-benzimidazole Chemical compound C1=CC=C2NC=NC2=C1 HYZJCKYKOHLVJF-UHFFFAOYSA-N 0.000 description 1
- DPQHRXRAZHNGRU-UHFFFAOYSA-N 2,4,4-trimethylhexane-1,6-diamine Chemical compound NCC(C)CC(C)(C)CCN DPQHRXRAZHNGRU-UHFFFAOYSA-N 0.000 description 1
- BDKLKNJTMLIAFE-UHFFFAOYSA-N 2-(3-fluorophenyl)-1,3-oxazole-4-carbaldehyde Chemical compound FC1=CC=CC(C=2OC=C(C=O)N=2)=C1 BDKLKNJTMLIAFE-UHFFFAOYSA-N 0.000 description 1
- FZZMTSNZRBFGGU-UHFFFAOYSA-N 2-chloro-7-fluoroquinazolin-4-amine Chemical compound FC1=CC=C2C(N)=NC(Cl)=NC2=C1 FZZMTSNZRBFGGU-UHFFFAOYSA-N 0.000 description 1
- FMGBDYLOANULLW-UHFFFAOYSA-N 3-isocyanatopropyl(trimethoxy)silane Chemical compound CO[Si](OC)(OC)CCCN=C=O FMGBDYLOANULLW-UHFFFAOYSA-N 0.000 description 1
- NNTRMVRTACZZIO-UHFFFAOYSA-N 3-isocyanatopropyl-dimethoxy-methylsilane Chemical compound CO[Si](C)(OC)CCCN=C=O NNTRMVRTACZZIO-UHFFFAOYSA-N 0.000 description 1
- DCQBZYNUSLHVJC-UHFFFAOYSA-N 3-triethoxysilylpropane-1-thiol Chemical compound CCO[Si](OCC)(OCC)CCCS DCQBZYNUSLHVJC-UHFFFAOYSA-N 0.000 description 1
- LVNLBBGBASVLLI-UHFFFAOYSA-N 3-triethoxysilylpropylurea Chemical compound CCO[Si](OCC)(OCC)CCCNC(N)=O LVNLBBGBASVLLI-UHFFFAOYSA-N 0.000 description 1
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- LVACOMKKELLCHJ-UHFFFAOYSA-N 3-trimethoxysilylpropylurea Chemical compound CO[Si](OC)(OC)CCCNC(N)=O LVACOMKKELLCHJ-UHFFFAOYSA-N 0.000 description 1
- SLXKOJJOQWFEFD-UHFFFAOYSA-N 6-aminohexanoic acid Chemical compound NCCCCCC(O)=O SLXKOJJOQWFEFD-UHFFFAOYSA-N 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- KLSJWNVTNUYHDU-UHFFFAOYSA-N Amitrole Chemical compound NC1=NC=NN1 KLSJWNVTNUYHDU-UHFFFAOYSA-N 0.000 description 1
- 229910052582 BN Inorganic materials 0.000 description 1
- PZNSFCLAULLKQX-UHFFFAOYSA-N Boron nitride Chemical compound N#B PZNSFCLAULLKQX-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- 208000015943 Coeliac disease Diseases 0.000 description 1
- 229910021589 Copper(I) bromide Inorganic materials 0.000 description 1
- 229910021591 Copper(I) chloride Inorganic materials 0.000 description 1
- 229910021590 Copper(II) bromide Inorganic materials 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- 229920000571 Nylon 11 Polymers 0.000 description 1
- 229920000299 Nylon 12 Polymers 0.000 description 1
- 229920002292 Nylon 6 Polymers 0.000 description 1
- BPQQTUXANYXVAA-UHFFFAOYSA-N Orthosilicate Chemical compound [O-][Si]([O-])([O-])[O-] BPQQTUXANYXVAA-UHFFFAOYSA-N 0.000 description 1
- 229930183415 Suberin Chemical class 0.000 description 1
- GWEVSGVZZGPLCZ-UHFFFAOYSA-N Titan oxide Chemical compound O=[Ti]=O GWEVSGVZZGPLCZ-UHFFFAOYSA-N 0.000 description 1
- FDLQZKYLHJJBHD-UHFFFAOYSA-N [3-(aminomethyl)phenyl]methanamine Chemical class NCC1=CC=CC(CN)=C1 FDLQZKYLHJJBHD-UHFFFAOYSA-N 0.000 description 1
- OXIKYYJDTWKERT-UHFFFAOYSA-N [4-(aminomethyl)cyclohexyl]methanamine Chemical compound NCC1CCC(CN)CC1 OXIKYYJDTWKERT-UHFFFAOYSA-N 0.000 description 1
- ISKQADXMHQSTHK-UHFFFAOYSA-N [4-(aminomethyl)phenyl]methanamine Chemical class NCC1=CC=C(CN)C=C1 ISKQADXMHQSTHK-UHFFFAOYSA-N 0.000 description 1
- RAOSIAYCXKBGFE-UHFFFAOYSA-K [Cu+3].[O-]P([O-])([O-])=O Chemical compound [Cu+3].[O-]P([O-])([O-])=O RAOSIAYCXKBGFE-UHFFFAOYSA-K 0.000 description 1
- 238000010306 acid treatment Methods 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000001361 adipic acid Chemical class 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 150000001413 amino acids Chemical class 0.000 description 1
- 239000003963 antioxidant agent Substances 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 150000004984 aromatic diamines Chemical class 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- 239000011324 bead Substances 0.000 description 1
- 239000000440 bentonite Substances 0.000 description 1
- 229910000278 bentonite Inorganic materials 0.000 description 1
- SVPXDRXYRYOSEX-UHFFFAOYSA-N bentoquatam Chemical compound O.O=[Si]=O.O=[Al]O[Al]=O SVPXDRXYRYOSEX-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- 150000004649 carbonic acid derivatives Chemical class 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 150000001875 compounds Chemical class 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- OXBLHERUFWYNTN-UHFFFAOYSA-M copper(I) chloride Chemical compound [Cu]Cl OXBLHERUFWYNTN-UHFFFAOYSA-M 0.000 description 1
- ARUVKPQLZAKDPS-UHFFFAOYSA-L copper(II) sulfate Chemical compound [Cu+2].[O-][S+2]([O-])([O-])[O-] ARUVKPQLZAKDPS-UHFFFAOYSA-L 0.000 description 1
- 229910000366 copper(II) sulfate Inorganic materials 0.000 description 1
- NKNDPYCGAZPOFS-UHFFFAOYSA-M copper(i) bromide Chemical compound Br[Cu] NKNDPYCGAZPOFS-UHFFFAOYSA-M 0.000 description 1
- CMRVDFLZXRTMTH-UHFFFAOYSA-L copper;2-carboxyphenolate Chemical compound [Cu+2].OC1=CC=CC=C1C([O-])=O.OC1=CC=CC=C1C([O-])=O CMRVDFLZXRTMTH-UHFFFAOYSA-L 0.000 description 1
- GBRBMTNGQBKBQE-UHFFFAOYSA-L copper;diiodide Chemical compound I[Cu]I GBRBMTNGQBKBQE-UHFFFAOYSA-L 0.000 description 1
- PEVZEFCZINKUCG-UHFFFAOYSA-L copper;octadecanoate Chemical compound [Cu+2].CCCCCCCCCCCCCCCCCC([O-])=O.CCCCCCCCCCCCCCCCCC([O-])=O PEVZEFCZINKUCG-UHFFFAOYSA-L 0.000 description 1
- 239000003431 cross linking reagent Substances 0.000 description 1
- 239000003484 crystal nucleating agent Substances 0.000 description 1
- 238000002425 crystallisation Methods 0.000 description 1
- 230000008025 crystallization Effects 0.000 description 1
- 229940076286 cupric acetate Drugs 0.000 description 1
- 229960003280 cupric chloride Drugs 0.000 description 1
- 229940045803 cuprous chloride Drugs 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- PJIFJEUHCQYNHO-UHFFFAOYSA-N diethoxy-(3-isocyanatopropyl)-methylsilane Chemical compound CCO[Si](C)(OCC)CCCN=C=O PJIFJEUHCQYNHO-UHFFFAOYSA-N 0.000 description 1
- OOISEBIWKZXNII-UHFFFAOYSA-N diethoxy-ethyl-(3-isocyanatopropyl)silane Chemical compound CCO[Si](CC)(OCC)CCCN=C=O OOISEBIWKZXNII-UHFFFAOYSA-N 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- 239000012153 distilled water Substances 0.000 description 1
- QFTYSVGGYOXFRQ-UHFFFAOYSA-N dodecane-1,12-diamine Chemical compound NCCCCCCCCCCCCN QFTYSVGGYOXFRQ-UHFFFAOYSA-N 0.000 description 1
- 239000010459 dolomite Substances 0.000 description 1
- 229910000514 dolomite Inorganic materials 0.000 description 1
- 229920006351 engineering plastic Polymers 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- WYZXIJYWXFEAFG-UHFFFAOYSA-N ethyl-(3-isocyanatopropyl)-dimethoxysilane Chemical compound CC[Si](OC)(OC)CCCN=C=O WYZXIJYWXFEAFG-UHFFFAOYSA-N 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 239000012467 final product Substances 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 238000010528 free radical solution polymerization reaction Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000010440 gypsum Substances 0.000 description 1
- 229910052602 gypsum Inorganic materials 0.000 description 1
- 239000012760 heat stabilizer Substances 0.000 description 1
- 239000012784 inorganic fiber Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 150000003951 lactams Chemical class 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- ZLNQQNXFFQJAID-UHFFFAOYSA-L magnesium carbonate Chemical compound [Mg+2].[O-]C([O-])=O ZLNQQNXFFQJAID-UHFFFAOYSA-L 0.000 description 1
- 239000001095 magnesium carbonate Substances 0.000 description 1
- 229910000021 magnesium carbonate Inorganic materials 0.000 description 1
- 239000000395 magnesium oxide Substances 0.000 description 1
- CPLXHLVBOLITMK-UHFFFAOYSA-N magnesium oxide Inorganic materials [Mg]=O CPLXHLVBOLITMK-UHFFFAOYSA-N 0.000 description 1
- AXZKOIWUVFPNLO-UHFFFAOYSA-N magnesium;oxygen(2-) Chemical compound [O-2].[Mg+2] AXZKOIWUVFPNLO-UHFFFAOYSA-N 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 150000002736 metal compounds Chemical class 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- RVTZCBVAJQQJTK-UHFFFAOYSA-N oxygen(2-);zirconium(4+) Chemical compound [O-2].[O-2].[Zr+4] RVTZCBVAJQQJTK-UHFFFAOYSA-N 0.000 description 1
- 150000002978 peroxides Chemical class 0.000 description 1
- 229920001707 polybutylene terephthalate Polymers 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 239000001103 potassium chloride Substances 0.000 description 1
- 235000011164 potassium chloride Nutrition 0.000 description 1
- 239000005053 propyltrichlorosilane Substances 0.000 description 1
- 238000004064 recycling Methods 0.000 description 1
- 230000001172 regenerating effect Effects 0.000 description 1
- 238000007151 ring opening polymerisation reaction Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 150000004756 silanes Chemical class 0.000 description 1
- 150000004760 silicates Chemical class 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- FDNAPBUWERUEDA-UHFFFAOYSA-N silicon tetrachloride Chemical compound Cl[Si](Cl)(Cl)Cl FDNAPBUWERUEDA-UHFFFAOYSA-N 0.000 description 1
- 235000017281 sodium acetate Nutrition 0.000 description 1
- 229940087562 sodium acetate trihydrate Drugs 0.000 description 1
- 229910052979 sodium sulfide Inorganic materials 0.000 description 1
- GRVFOGOEDUUMBP-UHFFFAOYSA-N sodium sulfide (anhydrous) Chemical compound [Na+].[Na+].[S-2] GRVFOGOEDUUMBP-UHFFFAOYSA-N 0.000 description 1
- 239000007790 solid phase Substances 0.000 description 1
- QAOWNCQODCNURD-UHFFFAOYSA-N sulfuric acid Substances OS(O)(=O)=O QAOWNCQODCNURD-UHFFFAOYSA-N 0.000 description 1
- 150000003467 sulfuric acid derivatives Chemical class 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- OGIDPMRJRNCKJF-UHFFFAOYSA-N titanium oxide Inorganic materials [Ti]=O OGIDPMRJRNCKJF-UHFFFAOYSA-N 0.000 description 1
- DOEHJNBEOVLHGL-UHFFFAOYSA-N trichloro(propyl)silane Chemical compound CCC[Si](Cl)(Cl)Cl DOEHJNBEOVLHGL-UHFFFAOYSA-N 0.000 description 1
- FRGPKMWIYVTFIQ-UHFFFAOYSA-N triethoxy(3-isocyanatopropyl)silane Chemical compound CCO[Si](OCC)(OCC)CCCN=C=O FRGPKMWIYVTFIQ-UHFFFAOYSA-N 0.000 description 1
- JXUKBNICSRJFAP-UHFFFAOYSA-N triethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CCO[Si](OCC)(OCC)CCCOCC1CO1 JXUKBNICSRJFAP-UHFFFAOYSA-N 0.000 description 1
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 description 1
- KLNPWTHGTVSSEU-UHFFFAOYSA-N undecane-1,11-diamine Chemical compound NCCCCCCCCCCCN KLNPWTHGTVSSEU-UHFFFAOYSA-N 0.000 description 1
- 229910001928 zirconium oxide Inorganic materials 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【0001】0001
【産業上の利用分野】本発明は耐熱性、耐薬品性、およ
び強度、耐衝撃性などの機械的性質が優れ、しかも再生
材使用時の諸特性にも優れたポリフェニレンスルフィド
樹脂に関するものである。[Industrial Application Field] The present invention relates to a polyphenylene sulfide resin that has excellent heat resistance, chemical resistance, mechanical properties such as strength and impact resistance, and also has excellent properties when recycled materials are used. .
【0002】0002
【従来の技術】ポリフェニレンスルフィド(以下、PP
Sと略す)樹脂は、耐熱性、剛性、耐薬品性が優れてお
り、しかも難燃性、絶縁性も良好であるなどエンジニア
プラスチックとして好ましい性質を有しているため、射
出成形品を中心に自動車部品、電気・電子部品、一般機
器部品など応範な用途で使用されている。しかし、PP
S樹脂はナイロン樹脂やポリブチレンテレフタレート樹
脂などに比べ脆く、特に引張の伸びや曲げ歪みが小さく
、衝撃強度が低いなどの問題点があり、また高価でもあ
るためその応用には制限を受けざるを得ないのが実情で
ある。この様なPPS樹脂の欠点を補うためにPPS樹
脂とナイロン樹脂をブレンドする技術がこれまでに検討
されており、例えばPPS樹脂とナイロン樹脂を特定の
割合でブレンドする方法(特開昭53−69255号公
報、特開昭61−126172公報など)、PPS樹脂
とナイロン樹脂とさらにエポキシ樹脂を組み合わせる方
法(特開昭59−155462号公報)などが提案され
ている。[Prior art] Polyphenylene sulfide (hereinafter referred to as PP)
Resin (abbreviated as S) has favorable properties as an engineering plastic, such as excellent heat resistance, rigidity, and chemical resistance, as well as good flame retardancy and insulation properties, so it is mainly used for injection molded products. It is used in a wide variety of applications, including automobile parts, electrical/electronic parts, and general equipment parts. However, P.P.
S resin is more brittle than nylon resin, polybutylene terephthalate resin, etc., and has problems such as low tensile elongation, low bending strain, and low impact strength, and is also expensive, so its applications are limited. The reality is that you can't get it. In order to compensate for these drawbacks of PPS resin, techniques for blending PPS resin and nylon resin have been studied. JP-A-61-126172, etc.), and a method of combining PPS resin, nylon resin, and epoxy resin (JP-A-59-155462).
【0003】0003
【発明が解決しようとする課題】しかしながら上記従来
技術ではいずれも耐熱性や機械強度については改良効果
が認められるものの、樹脂の成形加工の際発生するスプ
ルー、ランナーなどを回収し、再生材としてしようした
場合にはその機械的性質が大幅に低下するという問題点
があった。樹脂の成型加工において、再生材の使用可否
は製品収率に直結するため経済性を大きく左右するもの
であり、再生材の大幅な特性低下は該樹脂の実用化を制
限することになる。[Problems to be Solved by the Invention] However, although the above-mentioned conventional techniques are all effective in improving heat resistance and mechanical strength, it is difficult to collect sprues, runners, etc. generated during resin molding and use them as recycled materials. When this happens, there is a problem in that the mechanical properties are significantly reduced. In the molding process of resins, the availability of recycled materials is directly linked to the product yield and therefore greatly influences the economic efficiency, and a significant deterioration in the properties of the recycled materials will limit the practical use of the resins.
【0004】そこで本発明者らはPPS樹脂およびナイ
ロン樹脂を主成分とする樹脂組成物の範ちゅうで再生剤
使用時に強度、耐熱性、耐薬品性を失わない樹脂組成物
を得ることを課題とする。[0004] Therefore, the present inventors set out to obtain a resin composition that does not lose its strength, heat resistance, and chemical resistance when using a regenerating agent in the range of resin compositions whose main components are PPS resin and nylon resin. do.
【0005】[0005]
【課題を解決するための手段】すなわち本発明は、(A
)ポリフェニレンスルフィド樹脂99〜50重量%、(
B)ポリアミド樹脂1〜50重量%、からなる樹脂組成
物100重量部に対して(C)銅化合物0.005〜5
重量部および0〜300重量部の繊維状及び/または非
繊維状の無機質充填材を配合してなるポリフェニレンス
ルフィド樹脂組成物を提供するものである。[Means for Solving the Problems] That is, the present invention provides (A
) Polyphenylene sulfide resin 99-50% by weight, (
B) 1 to 50% by weight of polyamide resin, and (C) 0.005 to 5 parts by weight of the copper compound to 100 parts by weight of the resin composition.
The object of the present invention is to provide a polyphenylene sulfide resin composition containing 0 to 300 parts by weight of a fibrous and/or non-fibrous inorganic filler.
【0006】本発明においては、PPS樹脂とポリアミ
ド樹脂の2成分の他に更に銅化合物を少量添加すること
が重要であり、それにより前記課題が一挙に解決し極め
て優れた特性を有するPPS樹脂組成物が得られるもの
である。In the present invention, it is important to add a small amount of a copper compound in addition to the two components of PPS resin and polyamide resin, thereby solving the above problems at once and creating a PPS resin composition with extremely excellent properties. It is something that can be obtained.
【0007】本発明で使用するPPS樹脂とは、下記の
構造式[0007] The PPS resin used in the present invention has the following structural formula:
【0008】[0008]
【化1】[Chemical formula 1]
【0009】で示される繰り返し単位を70モル%以上
、より好ましくは90モル%以上を含む重合体であり、
上記繰り返し単位が70モル%未満では耐熱性が損なわ
れるため好ましくない。A polymer containing 70 mol% or more, more preferably 90 mol% or more of repeating units represented by
If the content of the repeating unit is less than 70 mol%, heat resistance will be impaired, which is not preferable.
【0010】PPS樹脂は一般に特公昭45−3368
号公報で代表される製造法により得られる比較的分子量
が小さい重合体と、特公昭52−12240号公報で代
表される製造法により得られる本質的に線状で比較的高
分子量の重合体などがあり、前記特公昭45−3368
号公報記載の方法で得られた重合体においては、重合後
酸素雰囲気下において加熱することにより、あるいは過
酸化物等の架橋剤を添加して加熱することにより高重合
度化して用いることも可能である。[0010] PPS resin is generally manufactured by Japanese Patent Publication No. 45-3368.
Polymers with relatively low molecular weight obtained by the production method typified by Japanese Patent Publication No. 12240/1982, and essentially linear polymers with relatively high molecular weight obtained by the production method typified by Japanese Patent Publication No. 12240/1983. There is, and the above-mentioned Special Publication No. 45-3368
In the polymer obtained by the method described in the publication, it is also possible to increase the degree of polymerization and use it by heating in an oxygen atmosphere after polymerization, or by adding a crosslinking agent such as peroxide and heating. It is.
【0011】本発明においてはいかなる方法により得ら
れたPPS樹脂を用いる事も可能であるが、本質的に線
状で比較的高分子量がより好ましく使用される。さらに
本発明においては上記重合工程を経て得られたPPS樹
脂に最終生成組成物の機械特性を高める目的で公知の酸
処理、熱水処理、有機溶媒処理を施してもよい。[0011] In the present invention, it is possible to use PPS resin obtained by any method, but it is more preferable to use a PPS resin that is essentially linear and has a relatively high molecular weight. Furthermore, in the present invention, the PPS resin obtained through the above polymerization step may be subjected to known acid treatment, hot water treatment, or organic solvent treatment for the purpose of improving the mechanical properties of the final product composition.
【0012】また、PPS樹脂はその繰り返し単位の3
0モル%未満を下記の構造式を有する繰り返し単位など
で構成する事が可能である。[0012] PPS resin also has 3 repeating units.
Less than 0 mol% can be composed of repeating units having the following structural formula.
【0013】[0013]
【化2】[Case 2]
【0014】次に、本発明でPPS樹脂に配合するため
に用いるポリアミドとは、ε−カプロラクタム、ω−ド
デカラクタムなどのラクタム類の開環重合によって得ら
れるポリアミド、6−アミノカプロン酸、11−アミノ
ウンデカン酸、12−アミノドデカン酸などのアミノ酸
から導かれるポリアミド、エチレンジアミン、テトラメ
チレンジアミン、ヘキサメチレンジアミン、ウンデカメ
チレンジアミン、ドデカメチレンジアミン、2,2,4
−/2,4,4−トリメチルヘキサメチレンジアミン、
1,3−および1,4−ビス(アミノメチル)シクロヘ
キサン、ビス(4,4−アミノシクロヘキシル)メタン
、メタおよびパラキシリレンジアミンなどの脂肪族、脂
環族、芳香族ジアミンとアジピン酸、スベリン酸、セバ
シン酸、ドデカン二酸、1,3−および1,4−シクロ
ヘキサンジカルボン酸、イソフタル酸、テレフタル酸、
ダイマー酸などの脂肪族、脂環族、芳香族ジカルボン酸
または酸ハロゲン化物などの酸誘導体とから導かれるポ
リアミドおよびこれらの共重合ポリアミド、混合ポリア
ミドであり、これらのうちでも通常はポリカプロアミド
(ナイロン6)、ポリウンデカンアミド(ナイロン11
)、ポリドデカンアミド(ナイロン12)、ポリヘキサ
メチレンアジパミド(ナイロン66)ポリヘキサメチレ
ンセバカミド(ナイロン610)、ポリヘキサメチレン
テレフタルアミド(ナイロン6T)およびこれらを主成
分とする共重合ポリアミドが有用である。これらポリア
ミドの重合方法は通常公知の溶融重合、固相重合、溶液
重合およびこれらを組み合わせた方法を採用することが
できる。Next, the polyamide used for blending in the PPS resin in the present invention includes polyamide obtained by ring-opening polymerization of lactams such as ε-caprolactam and ω-dodecalactam, 6-aminocaproic acid, and 11-aminocaproic acid. Polyamides derived from amino acids such as undecanoic acid and 12-aminododecanoic acid, ethylenediamine, tetramethylenediamine, hexamethylenediamine, undecamethylenediamine, dodecamethylenediamine, 2,2,4
-/2,4,4-trimethylhexamethylenediamine,
Aliphatic, cycloaliphatic, aromatic diamines such as 1,3- and 1,4-bis(aminomethyl)cyclohexane, bis(4,4-aminocyclohexyl)methane, meta- and para-xylylene diamine and adipic acid, suberin acids, sebacic acid, dodecanedioic acid, 1,3- and 1,4-cyclohexanedicarboxylic acid, isophthalic acid, terephthalic acid,
Polyamides derived from aliphatic, alicyclic, aromatic dicarboxylic acids such as dimer acids or acid derivatives such as acid halides, copolyamides and mixed polyamides of these, and among these, polycaproamide ( nylon 6), polyundecaneamide (nylon 11)
), polydodecanamide (nylon 12), polyhexamethylene adipamide (nylon 66), polyhexamethylene sebacamide (nylon 610), polyhexamethylene terephthalamide (nylon 6T), and copolyamides containing these as main components is useful. As a polymerization method for these polyamides, commonly known melt polymerization, solid phase polymerization, solution polymerization, and a combination of these methods can be employed.
【0015】また、ポリアミドの重合度には特に制限が
なく、相対粘度(ポリマ1gを98%濃硫酸100ml
に溶解し、25℃で測定)が2.0〜5.0の範囲内に
あるポリアミドを目的に応じて任意に選択できる。There is no particular limit to the degree of polymerization of polyamide, and relative viscosity (1 g of polymer is mixed with 100 ml of 98% concentrated sulfuric acid)
Depending on the purpose, polyamides having a melting point of 2.0 to 5.0 (measured at 25° C.) can be arbitrarily selected.
【0016】本発明で用いられる銅化合物の例としては
、塩化第一銅、塩化第二銅、臭化第一銅、臭化第二銅、
ヨウ化第一銅、ヨウ化第二銅、硫酸第二銅、硝酸第二銅
、燐酸銅、酢酸第一銅、酢酸第二銅、サリチル酸第二銅
、ステアリン酸第二銅、安息香酸第二銅および前記の無
機ハロゲン化銅とキシレンジアミン、2−メルカプトベ
ンズイミダゾール、ベンズイミダゾールなどとの錯化合
物などが挙げられる。なかでも、ヨウ化第一銅、酢酸第
一銅が好ましい。銅化合物の使用量はPPS樹脂とナイ
ロン樹脂の総量100重量部に対し0.005〜5重量
部、より好ましくは0.01〜1重量部が適当である。
銅添加量が0.005重量部に満たないと再生材の強度
改善効果が小さく、一方銅化合物を5重量部を越えて用
いると成形時に銅金属の遊離を起こし、着色により商品
価値を低下させるので好ましくない。本発明では銅化合
物と併用する形でハロゲン化アルカリを添加することも
可能である。このハロゲン化アルカリ化合物の例を挙げ
ると塩化リチウム、臭化リチウム、ヨウ化リチウム、塩
化カリウム、臭化カリウム、ヨウ化カリウム、臭化ナト
リウム、およびヨウ化ナトリウムなどである。なかでも
、ヨウ化カリウム、ヨウ化ナトリウムが好ましい。Examples of copper compounds used in the present invention include cuprous chloride, cupric chloride, cuprous bromide, cupric bromide,
Cuprous iodide, cupric iodide, cupric sulfate, cupric nitrate, copper phosphate, cuprous acetate, cupric acetate, cupric salicylate, cupric stearate, dibenzoate Examples include complex compounds of copper and the above-mentioned inorganic copper halides with xylene diamine, 2-mercaptobenzimidazole, benzimidazole, and the like. Among these, cuprous iodide and cuprous acetate are preferred. The appropriate amount of the copper compound to be used is 0.005 to 5 parts by weight, more preferably 0.01 to 1 part by weight, based on 100 parts by weight of the total amount of PPS resin and nylon resin. If the amount of copper added is less than 0.005 parts by weight, the effect of improving the strength of the recycled material will be small, while if the copper compound is used in excess of 5 parts by weight, copper metal will be liberated during molding and the product value will decrease due to coloring. So I don't like it. In the present invention, it is also possible to add an alkali halide in combination with the copper compound. Examples of the alkali halide compounds include lithium chloride, lithium bromide, lithium iodide, potassium chloride, potassium bromide, potassium iodide, sodium bromide, and sodium iodide. Among these, potassium iodide and sodium iodide are preferred.
【0017】本発明において、繊維状および/または非
繊維状の無機質充填材は必須成分ではないが、必要に応
じて本発明のPPS樹脂とポリアミド樹脂の合計100
重量部に対し300重量部を越えない範囲で配合するこ
とが可能であり、通常10〜250重量部の範囲で配合
することにより強度、剛性、耐熱性、寸法安定性などの
向上を計ることが可能である。[0017] In the present invention, fibrous and/or non-fibrous inorganic fillers are not essential components, but if necessary, a total of 100% of the PPS resin and polyamide resin of the present invention may be added.
It can be blended in an amount not exceeding 300 parts by weight, and it is usually blended in a range of 10 to 250 parts by weight to improve strength, rigidity, heat resistance, dimensional stability, etc. It is possible.
【0018】かかる繊維状無機充填材としては、ガラス
繊維、アルミナ繊維、炭化珪素繊維、セラミック繊維、
アスベスト繊維、石コウ繊維、および金属繊維などの無
機繊維および炭素繊維などがあげられる。Examples of such fibrous inorganic fillers include glass fibers, alumina fibers, silicon carbide fibers, ceramic fibers,
Examples include inorganic fibers such as asbestos fibers, gypsum fibers, and metal fibers, and carbon fibers.
【0019】また非繊維状の無機充填材としては、ワラ
ステナイト、セリサイト、カオリン、マイカ、クレー、
ベントナイト、アスベスト、タルク、アルミナシリケー
ト、などの珪酸塩、アルミナ、塩化珪素、酸化マグネシ
ウム、酸化ジルコニウム、酸化チタンなどの金属化合物
、炭酸カルシウム、炭酸マグネシウム、ドロマイトなど
の炭酸塩、硫酸カルシウム、硫酸バリウムなどの硫酸塩
、ガラス・ビ−ズ、窒化ホウ素、炭化珪素およびシリカ
などが挙げられ、これらは中空であってもよい。これら
の強化材は2種以上を併用することが可能である。Examples of non-fibrous inorganic fillers include wollastenite, sericite, kaolin, mica, clay,
Silicates such as bentonite, asbestos, talc, alumina silicate, metal compounds such as alumina, silicon chloride, magnesium oxide, zirconium oxide, titanium oxide, carbonates such as calcium carbonate, magnesium carbonate, dolomite, calcium sulfate, barium sulfate, etc. sulfates, glass beads, boron nitride, silicon carbide, and silica, which may be hollow. Two or more types of these reinforcing materials can be used in combination.
【0020】本発明の樹脂組成物の調製方法は特に制限
なく、PPS樹脂、ポリアミド樹脂、銅化合物、および
必要に応じて充填剤をドライブレンドした混合物をニー
ダー、バンバリミキサー、ミキシングロール、単軸また
は2軸の押出機を用いて、270℃〜380℃の温度で
溶融混練する方法を例として挙げることができ、中でも
十分な混練力をもつ単軸または2軸の押出機を用いて溶
融混練をする方法が代表的であり、効率的である。[0020] The method for preparing the resin composition of the present invention is not particularly limited. An example of this is a method of melt-kneading using a twin-screw extruder at a temperature of 270°C to 380°C. Among these methods, melt-kneading is carried out using a single-screw or twin-screw extruder with sufficient kneading power. This method is representative and efficient.
【0021】本発明の樹脂組成物には本発明の効果を損
なわない範囲で、酸化防止剤、熱安定剤、滑剤、結晶核
剤、紫外線防止剤、着色剤、難燃剤などの通常の添加剤
及び少量の他種ポリマを添加することができ、さらに、
PPSの架強度を制御する目的で、通常の過酸化剤及び
、特開昭59−131650号公報に記載されているチ
オフォスフィン酸金属塩などの架橋促進剤または特開昭
58−204045号公報、特開昭58−204046
号公報などに記載されているジアルキル錫ジカルボキシ
レ−ト、アミノトリアゾ−ルなどの架橋防止剤を配合す
ることも可能である。The resin composition of the present invention may contain conventional additives such as antioxidants, heat stabilizers, lubricants, crystal nucleating agents, ultraviolet inhibitors, colorants, flame retardants, etc., to the extent that the effects of the present invention are not impaired. and small amounts of other polymers can be added, and further,
For the purpose of controlling the crosslinking strength of PPS, ordinary peroxidants and crosslinking accelerators such as thiophosphinate metal salts described in JP-A-59-131650 or JP-A-58-204045 are used. , Japanese Patent Publication No. 58-204046
It is also possible to incorporate crosslinking inhibitors such as dialkyltin dicarboxylate and aminotriazole described in the above publications.
【0022】本発明の樹脂組成物には本発明の効果を損
なわはない範囲で、機械的強度およびバリなどの成形性
などの改良を目的として、γ−グリシドキシプロピルト
リメトキシシラン、γ−グリシドキシプロピルトリエト
キシシラン、β−(3,4−エポキシシクロヘキシル)
エチルトリメトキシシラン,γ−メルカプトプロピルト
リメトキシシラン、γ−メルカプトプロピルトリエトキ
シシラン、γ−ウレイドプロピルトリエトキシシラン、
γ−ウレイドプロピルトリメトキシシランおよびγ−(
2−ウレイドメチル)アミノプロピルトリメトキシシラ
ン、γ−イソシアナトプロピルトリエトキシシラン、γ
−イソシアナトプロピルトリメトキシシラン、γ−イソ
シアナトプロピルメチルジメトキシシラン、γ−イソシ
アナトプロピルメチルジエトキシシラン、γ−イソシア
ナトプロピルエチルジメトキシシラン、γ−イソシアナ
トプロピルエチルジエトキシシラン、γ−イソシアナト
プロピルトリクロロシランなどの有機シラン化合物を添
加することができる。The resin composition of the present invention contains γ-glycidoxypropyltrimethoxysilane, γ-glycidoxypropyltrimethoxysilane, etc. for the purpose of improving mechanical strength and moldability such as burrs, to the extent that the effects of the present invention are not impaired. Glycidoxypropyltriethoxysilane, β-(3,4-epoxycyclohexyl)
Ethyltrimethoxysilane, γ-mercaptopropyltrimethoxysilane, γ-mercaptopropyltriethoxysilane, γ-ureidopropyltriethoxysilane,
γ-ureidopropyltrimethoxysilane and γ-(
2-ureidomethyl)aminopropyltrimethoxysilane, γ-isocyanatopropyltriethoxysilane, γ
-isocyanatopropyltrimethoxysilane, γ-isocyanatopropylmethyldimethoxysilane, γ-isocyanatopropylmethyldiethoxysilane, γ-isocyanatopropylethyldimethoxysilane, γ-isocyanatopropylethyldiethoxysilane, γ-isocyanato Organic silane compounds such as propyltrichlorosilane can be added.
【0023】[0023]
【実施例】以下に実施例を挙げて本発明をさらに詳しく
説明する。実施例および比較例中の引張り特性、曲げ特
性、衝撃特性、熱変形温度などの諸特性は、引張り特性
:ASTM−D638
曲げ特性 :ASTM−D790
衝撃特性 :ASTM−D256
熱変形温度:ASTM−D648(18.6kg/cm
2 )
で測定した。[Examples] The present invention will be explained in more detail with reference to Examples below. Various properties such as tensile properties, bending properties, impact properties, and heat distortion temperatures in Examples and Comparative Examples are as follows: Tensile properties: ASTM-D638 Bending properties: ASTM-D790 Impact properties: ASTM-D256 Heat distortion temperatures: ASTM-D648 (18.6kg/cm
2).
【0024】参考例1
オ−トクレ−ブに硫化ナトリウム3.36kg(25モ
ル、結晶水40%を含む)、水酸化ナトリウム4g、酢
酸ナトリウム三水和物1.36kg(約10モル)およ
びN−メチル−2−ピロリドン(以下NMPと略称する
)7.9kgを仕込み、攪拌しながら徐々に205℃ま
で昇温し、水1.36kgを含む留出水約1.5リット
ルを除去した。残留混合物に1,4−ジクロルベンゼン
3.75kg(25.5モル)およびNMP2kgを加
え、265℃で4時間加熱した。反応生成物を70℃の
温水で5回洗浄し、80℃で24時間減圧乾燥して、溶
融粘度約1500ポアズ(320℃、剪断速度10s−
1)の粉末状PPS(A−1)約2kgを得た。Reference Example 1 In an autoclave, 3.36 kg of sodium sulfide (25 moles, containing 40% water of crystallization), 4 g of sodium hydroxide, 1.36 kg of sodium acetate trihydrate (approximately 10 moles) and N 7.9 kg of -methyl-2-pyrrolidone (hereinafter abbreviated as NMP) was charged, and the temperature was gradually raised to 205° C. while stirring, and about 1.5 liters of distilled water containing 1.36 kg of water was removed. 3.75 kg (25.5 mol) of 1,4-dichlorobenzene and 2 kg of NMP were added to the residual mixture, and the mixture was heated at 265° C. for 4 hours. The reaction product was washed 5 times with hot water at 70°C and dried under reduced pressure at 80°C for 24 hours to give a melt viscosity of about 1500 poise (320°C, shear rate 10 s).
About 2 kg of powdered PPS (A-1) of 1) was obtained.
【0025】同様の操作を繰り返し、以下に記載の実施
例に供した。[0025] The same operation was repeated and used in the examples described below.
【0026】参考例2
参考例1で得られたPPS粉末をpH4に調整した酢酸
水溶液にて80℃で30分間攪拌した後、70℃のイオ
ン交換水で3回洗浄し、80℃24時間真空乾燥してP
PS原末(A−2)を得て、以下の実施例に供給した。Reference Example 2 The PPS powder obtained in Reference Example 1 was stirred at 80°C for 30 minutes in an acetic acid aqueous solution adjusted to pH 4, washed three times with ion-exchanged water at 70°C, and vacuumed at 80°C for 24 hours. Dry and P
A PS bulk powder (A-2) was obtained and supplied to the following examples.
【0027】参考例3
参考例1で得られたPPS粉末およびイオン交換水をオ
ートクレーブ中に仕込み、攪拌下に150℃に昇温し、
この温度で30分間保持した後冷却し、さらに70℃の
イオン交換水で1回洗浄し、80℃で24時間真空乾燥
してPPS粉末(A−3)を得て、以下の実施例に供し
た。Reference Example 3 The PPS powder obtained in Reference Example 1 and ion-exchanged water were placed in an autoclave, and the temperature was raised to 150°C while stirring.
After being maintained at this temperature for 30 minutes, it was cooled, further washed once with ion-exchanged water at 70°C, and vacuum dried at 80°C for 24 hours to obtain PPS powder (A-3), which was used in the following examples. did.
【0028】実施例1
参考例1で得られたPPS(A−1)70重量部、相対
粘度2.7のナイロン66を30重量部、ヨウ化第一銅
0.01重量部および直径13μmのガラス繊維65重
量部をヘンシェルミキサ−を用いてドライブレンドした
後、40mmφ単軸押出機を用いてシリンダー温度31
0℃、スクリュー回転数80rpmの条件で混練を行い
ペレット化した。このペレットを100℃/16h真空
乾燥後シリンダー温度310℃、金型温度150℃の条
件で射出成型し、いずれも外観良好な成型片を得た。さ
らに、得られた成型片を粉砕機により粉砕ペレット化し
、150℃/4hr熱風乾燥後上記と同様の条件で射出
成型した。前記リサイクル工程を3回繰り返しいずれも
外観良好な成型片を得た。ここで得られた成型品の諸特
性は表1に示す通りであり、再生材使用時の機械強度お
よび熱変形温度の保持率が高く実用価値の高いものであ
ることが判明した。Example 1 70 parts by weight of PPS (A-1) obtained in Reference Example 1, 30 parts by weight of nylon 66 with a relative viscosity of 2.7, 0.01 part by weight of cuprous iodide, and 13 μm in diameter. After dry-blending 65 parts by weight of glass fibers using a Henschel mixer, the cylinder temperature was 31°C using a 40mmφ single-screw extruder.
Kneading was carried out under the conditions of 0° C. and screw rotation speed of 80 rpm to form pellets. The pellets were vacuum dried at 100° C. for 16 hours and then injection molded at a cylinder temperature of 310° C. and a mold temperature of 150° C. to obtain molded pieces with good appearance. Furthermore, the obtained molded piece was crushed into pellets using a crusher, dried with hot air at 150° C. for 4 hours, and then injection molded under the same conditions as above. The above recycling process was repeated three times to obtain molded pieces with good appearance. The properties of the molded product obtained here are as shown in Table 1, and it was found that the molded product has high mechanical strength and high retention rate of heat distortion temperature when recycled materials are used, and has high practical value.
【0029】比較例1
ヨウ化第一銅を用いなかった以外は実施例1と全く同様
にPPS、ナイロン66およびガラス繊維の溶融混練、
射出成形を実施し、得られた成型品の特性を表1に記し
た。このものは、再生材使用時の機械強度および熱変形
温度の低下が著しく不満足なものであった。Comparative Example 1 PPS, nylon 66 and glass fiber were melt-kneaded in the same manner as in Example 1 except that cuprous iodide was not used.
Injection molding was performed, and the properties of the molded product obtained are shown in Table 1. This product was extremely unsatisfactory in terms of mechanical strength and reduction in heat distortion temperature when recycled material was used.
【0030】[0030]
【表1】[Table 1]
【0031】実施例2〜3
PPS、ポリアミド、銅化合物および無機強化材の種類
と配合量を変えて実施例1と同様の手順で溶融混練、射
出成形を行いいずれの場合も外観良好な成形品を得た。
これらの諸特性は表2にまとめて示す通りであり、いず
れも再生品使用の機械強度および熱変形温度の保持率が
高く実用価値の高いものであることが判明した。Examples 2 to 3 Melt-kneading and injection molding were carried out in the same manner as in Example 1, with different types and amounts of PPS, polyamide, copper compound, and inorganic reinforcing material. Molded products with good appearance were obtained in all cases. I got it. These properties are summarized in Table 2, and it has been found that all of the recycled products have high mechanical strength and retention of heat distortion temperature, and are of high practical value.
【0032】[0032]
【表2】[Table 2]
【0033】[0033]
【発明の効果】本発明の目的は、再生材使用時にも本来
有する耐熱性、耐薬品性、機械的強度などの優れた特性
を失わないPPS樹脂組成物を得ることであった。上記
目的はPPS、ナイロン、銅化合物の3者を組み合わせ
ることにより達成され、実用価値の高いPPS樹脂組成
物を得ることができた。INDUSTRIAL APPLICABILITY The object of the present invention was to obtain a PPS resin composition that does not lose its inherent excellent properties such as heat resistance, chemical resistance, and mechanical strength even when recycled materials are used. The above object was achieved by combining PPS, nylon, and a copper compound, and a PPS resin composition with high practical value could be obtained.
Claims (1)
〜50重量%、(B)ポリアミド樹脂1〜50重量%、
からなる樹脂組成物100重量部に対して(C)銅化合
物0.005〜5重量部および0〜300重量部の繊維
状及び/または非繊維状の無機質充填材を配合してなる
ポリフェニレンスルフィド樹脂組成物。Claim 1: (A) Polyphenylene sulfide resin 99
~50% by weight, (B) polyamide resin 1~50% by weight,
A polyphenylene sulfide resin prepared by blending 0.005 to 5 parts by weight of a copper compound (C) and 0 to 300 parts by weight of a fibrous and/or non-fibrous inorganic filler with respect to 100 parts by weight of a resin composition consisting of Composition.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1788691A JP3200855B2 (en) | 1991-02-08 | 1991-02-08 | Polyphenylene sulfide resin composition |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1788691A JP3200855B2 (en) | 1991-02-08 | 1991-02-08 | Polyphenylene sulfide resin composition |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH04255757A true JPH04255757A (en) | 1992-09-10 |
JP3200855B2 JP3200855B2 (en) | 2001-08-20 |
Family
ID=11956191
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1788691A Expired - Lifetime JP3200855B2 (en) | 1991-02-08 | 1991-02-08 | Polyphenylene sulfide resin composition |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3200855B2 (en) |
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06207103A (en) * | 1992-09-25 | 1994-07-26 | Polyplastics Co | Heat-resistant polyarylene sulfide resin composition |
JPH10212408A (en) * | 1997-01-29 | 1998-08-11 | Tosoh Corp | Polyphenylene sulfide resin composition |
JP2005042107A (en) * | 2003-07-09 | 2005-02-17 | Toray Ind Inc | Resin composition, tablet, molded product, and chassis or enclosure |
JP2010116428A (en) * | 2008-11-11 | 2010-05-27 | Tosoh Corp | Method for producing regenerated fibrous filler-reinforced polyphenylene sulfide granule |
WO2023068186A1 (en) * | 2021-10-19 | 2023-04-27 | 東ソー株式会社 | Polyarylene sulfide composition and method for producing same |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR102057537B1 (en) * | 2018-06-21 | 2019-12-20 | 배삼훈 | Hand-held roll tape cutters attached to telescopic coils |
-
1991
- 1991-02-08 JP JP1788691A patent/JP3200855B2/en not_active Expired - Lifetime
Cited By (5)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH06207103A (en) * | 1992-09-25 | 1994-07-26 | Polyplastics Co | Heat-resistant polyarylene sulfide resin composition |
JPH10212408A (en) * | 1997-01-29 | 1998-08-11 | Tosoh Corp | Polyphenylene sulfide resin composition |
JP2005042107A (en) * | 2003-07-09 | 2005-02-17 | Toray Ind Inc | Resin composition, tablet, molded product, and chassis or enclosure |
JP2010116428A (en) * | 2008-11-11 | 2010-05-27 | Tosoh Corp | Method for producing regenerated fibrous filler-reinforced polyphenylene sulfide granule |
WO2023068186A1 (en) * | 2021-10-19 | 2023-04-27 | 東ソー株式会社 | Polyarylene sulfide composition and method for producing same |
Also Published As
Publication number | Publication date |
---|---|
JP3200855B2 (en) | 2001-08-20 |
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