JPH04255710A - New resin composition curable with energy ray - Google Patents
New resin composition curable with energy rayInfo
- Publication number
- JPH04255710A JPH04255710A JP1764891A JP1764891A JPH04255710A JP H04255710 A JPH04255710 A JP H04255710A JP 1764891 A JP1764891 A JP 1764891A JP 1764891 A JP1764891 A JP 1764891A JP H04255710 A JPH04255710 A JP H04255710A
- Authority
- JP
- Japan
- Prior art keywords
- formula
- group
- acid
- compound
- energy ray
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000011342 resin composition Substances 0.000 title claims description 14
- 150000001875 compounds Chemical class 0.000 claims abstract description 30
- 125000000466 oxiranyl group Chemical group 0.000 claims abstract description 19
- 150000007519 polyprotic acids Polymers 0.000 claims abstract description 10
- 239000007795 chemical reaction product Substances 0.000 claims abstract description 6
- 229920005989 resin Polymers 0.000 claims description 31
- 239000011347 resin Substances 0.000 claims description 31
- 125000004435 hydrogen atom Chemical group [H]* 0.000 claims description 15
- 239000002253 acid Substances 0.000 claims description 10
- 239000000126 substance Substances 0.000 claims description 9
- 150000008064 anhydrides Chemical class 0.000 claims description 6
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 claims 4
- 125000005843 halogen group Chemical group 0.000 claims 3
- 125000004093 cyano group Chemical group *C#N 0.000 claims 2
- 125000000524 functional group Chemical group 0.000 abstract description 4
- 150000008065 acid anhydrides Chemical class 0.000 abstract description 3
- 239000000853 adhesive Substances 0.000 abstract description 3
- 230000001070 adhesive effect Effects 0.000 abstract description 3
- 239000000203 mixture Substances 0.000 abstract description 3
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 abstract description 2
- 229940126062 Compound A Drugs 0.000 abstract 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 abstract 1
- NLDMNSXOCDLTTB-UHFFFAOYSA-N Heterophylliin A Natural products O1C2COC(=O)C3=CC(O)=C(O)C(O)=C3C3=C(O)C(O)=C(O)C=C3C(=O)OC2C(OC(=O)C=2C=C(O)C(O)=C(O)C=2)C(O)C1OC(=O)C1=CC(O)=C(O)C(O)=C1 NLDMNSXOCDLTTB-UHFFFAOYSA-N 0.000 abstract 1
- 125000003055 glycidyl group Chemical group C(C1CO1)* 0.000 abstract 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 abstract 1
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 16
- 239000011248 coating agent Substances 0.000 description 13
- 238000000576 coating method Methods 0.000 description 12
- 239000003973 paint Substances 0.000 description 12
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 9
- 238000011156 evaluation Methods 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 6
- -1 monocarboxylic acid compound Chemical class 0.000 description 6
- 239000002904 solvent Substances 0.000 description 6
- 238000010992 reflux Methods 0.000 description 5
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 4
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 4
- JWAZRIHNYRIHIV-UHFFFAOYSA-N 2-naphthol Chemical compound C1=CC=CC2=CC(O)=CC=C21 JWAZRIHNYRIHIV-UHFFFAOYSA-N 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 4
- 238000001723 curing Methods 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- XEKOWRVHYACXOJ-UHFFFAOYSA-N Ethyl acetate Chemical compound CCOC(C)=O XEKOWRVHYACXOJ-UHFFFAOYSA-N 0.000 description 3
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 3
- ZMXDDKWLCZADIW-UHFFFAOYSA-N N,N-Dimethylformamide Chemical compound CN(C)C=O ZMXDDKWLCZADIW-UHFFFAOYSA-N 0.000 description 3
- MUBZPKHOEPUJKR-UHFFFAOYSA-N Oxalic acid Chemical compound OC(=O)C(O)=O MUBZPKHOEPUJKR-UHFFFAOYSA-N 0.000 description 3
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 3
- OFOBLEOULBTSOW-UHFFFAOYSA-N Propanedioic acid Natural products OC(=O)CC(O)=O OFOBLEOULBTSOW-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- 239000003999 initiator Substances 0.000 description 3
- 239000000976 ink Substances 0.000 description 3
- QSHDDOUJBYECFT-UHFFFAOYSA-N mercury Chemical compound [Hg] QSHDDOUJBYECFT-UHFFFAOYSA-N 0.000 description 3
- 229910052753 mercury Inorganic materials 0.000 description 3
- VLKZOEOYAKHREP-UHFFFAOYSA-N n-Hexane Chemical compound CCCCCC VLKZOEOYAKHREP-UHFFFAOYSA-N 0.000 description 3
- 238000006116 polymerization reaction Methods 0.000 description 3
- BRTHMFXKGHIZAM-UHFFFAOYSA-N 2-hydroxy-1-phenylheptan-1-one Chemical compound CCCCCC(O)C(=O)C1=CC=CC=C1 BRTHMFXKGHIZAM-UHFFFAOYSA-N 0.000 description 2
- VVBLNCFGVYUYGU-UHFFFAOYSA-N 4,4'-Bis(dimethylamino)benzophenone Chemical compound C1=CC(N(C)C)=CC=C1C(=O)C1=CC=C(N(C)C)C=C1 VVBLNCFGVYUYGU-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-OWOJBTEDSA-N Fumaric acid Chemical compound OC(=O)\C=C\C(O)=O VZCYOOQTPOCHFL-OWOJBTEDSA-N 0.000 description 2
- LRHPLDYGYMQRHN-UHFFFAOYSA-N N-Butanol Chemical compound CCCCO LRHPLDYGYMQRHN-UHFFFAOYSA-N 0.000 description 2
- IMNFDUFMRHMDMM-UHFFFAOYSA-N N-Heptane Chemical compound CCCCCCC IMNFDUFMRHMDMM-UHFFFAOYSA-N 0.000 description 2
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- 239000004480 active ingredient Substances 0.000 description 2
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 2
- ISAOCJYIOMOJEB-UHFFFAOYSA-N benzoin Chemical compound C=1C=CC=CC=1C(O)C(=O)C1=CC=CC=C1 ISAOCJYIOMOJEB-UHFFFAOYSA-N 0.000 description 2
- JHIVVAPYMSGYDF-UHFFFAOYSA-N cyclohexanone Chemical compound O=C1CCCCC1 JHIVVAPYMSGYDF-UHFFFAOYSA-N 0.000 description 2
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical group C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 2
- 239000003085 diluting agent Substances 0.000 description 2
- 238000006471 dimerization reaction Methods 0.000 description 2
- 238000010894 electron beam technology Methods 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000001678 irradiating effect Effects 0.000 description 2
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 150000002763 monocarboxylic acids Chemical class 0.000 description 2
- TXXHDPDFNKHHGW-UHFFFAOYSA-N muconic acid Chemical compound OC(=O)C=CC=CC(O)=O TXXHDPDFNKHHGW-UHFFFAOYSA-N 0.000 description 2
- DFQICHCWIIJABH-UHFFFAOYSA-N naphthalene-2,7-diol Chemical compound C1=CC(O)=CC2=CC(O)=CC=C21 DFQICHCWIIJABH-UHFFFAOYSA-N 0.000 description 2
- BDJRBEYXGGNYIS-UHFFFAOYSA-N nonanedioic acid Chemical compound OC(=O)CCCCCCCC(O)=O BDJRBEYXGGNYIS-UHFFFAOYSA-N 0.000 description 2
- NWVVVBRKAWDGAB-UHFFFAOYSA-N p-methoxyphenol Chemical compound COC1=CC=C(O)C=C1 NWVVVBRKAWDGAB-UHFFFAOYSA-N 0.000 description 2
- WXZMFSXDPGVJKK-UHFFFAOYSA-N pentaerythritol Chemical compound OCC(CO)(CO)CO WXZMFSXDPGVJKK-UHFFFAOYSA-N 0.000 description 2
- 229920002120 photoresistant polymer Polymers 0.000 description 2
- 239000003504 photosensitizing agent Substances 0.000 description 2
- CYIDZMCFTVVTJO-UHFFFAOYSA-N pyromellitic acid Chemical compound OC(=O)C1=CC(C(O)=O)=C(C(O)=O)C=C1C(O)=O CYIDZMCFTVVTJO-UHFFFAOYSA-N 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- VZCYOOQTPOCHFL-UHFFFAOYSA-N trans-butenedioic acid Natural products OC(=O)C=CC(O)=O VZCYOOQTPOCHFL-UHFFFAOYSA-N 0.000 description 2
- ARCGXLSVLAOJQL-UHFFFAOYSA-N trimellitic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(C(O)=O)=C1 ARCGXLSVLAOJQL-UHFFFAOYSA-N 0.000 description 2
- RIOQSEWOXXDEQQ-UHFFFAOYSA-N triphenylphosphine Chemical compound C1=CC=CC=C1P(C=1C=CC=CC=1)C1=CC=CC=C1 RIOQSEWOXXDEQQ-UHFFFAOYSA-N 0.000 description 2
- DTGKSKDOIYIVQL-WEDXCCLWSA-N (+)-borneol Chemical group C1C[C@@]2(C)[C@@H](O)C[C@@H]1C2(C)C DTGKSKDOIYIVQL-WEDXCCLWSA-N 0.000 description 1
- DJKGDNKYTKCJKD-BPOCMEKLSA-N (1s,4r,5s,6r)-1,2,3,4,7,7-hexachlorobicyclo[2.2.1]hept-2-ene-5,6-dicarboxylic acid Chemical compound ClC1=C(Cl)[C@]2(Cl)[C@H](C(=O)O)[C@H](C(O)=O)[C@@]1(Cl)C2(Cl)Cl DJKGDNKYTKCJKD-BPOCMEKLSA-N 0.000 description 1
- FGOSBCXOMBLILW-UHFFFAOYSA-N (2-oxo-1,2-diphenylethyl) benzoate Chemical compound C=1C=CC=CC=1C(=O)OC(C=1C=CC=CC=1)C(=O)C1=CC=CC=C1 FGOSBCXOMBLILW-UHFFFAOYSA-N 0.000 description 1
- WBYWAXJHAXSJNI-VOTSOKGWSA-M .beta-Phenylacrylic acid Natural products [O-]C(=O)\C=C\C1=CC=CC=C1 WBYWAXJHAXSJNI-VOTSOKGWSA-M 0.000 description 1
- OSSNTDFYBPYIEC-UHFFFAOYSA-N 1-ethenylimidazole Chemical compound C=CN1C=CN=C1 OSSNTDFYBPYIEC-UHFFFAOYSA-N 0.000 description 1
- RTBFRGCFXZNCOE-UHFFFAOYSA-N 1-methylsulfonylpiperidin-4-one Chemical compound CS(=O)(=O)N1CCC(=O)CC1 RTBFRGCFXZNCOE-UHFFFAOYSA-N 0.000 description 1
- HECLRDQVFMWTQS-RGOKHQFPSA-N 1755-01-7 Chemical compound C1[C@H]2[C@@H]3CC=C[C@@H]3[C@@H]1C=C2 HECLRDQVFMWTQS-RGOKHQFPSA-N 0.000 description 1
- DWFUTNJGNBYHNN-UHFFFAOYSA-N 2,2,4-trimethylhexanedioic acid Chemical compound OC(=O)CC(C)CC(C)(C)C(O)=O DWFUTNJGNBYHNN-UHFFFAOYSA-N 0.000 description 1
- CZZVAVMGKRNEAT-UHFFFAOYSA-N 2,2-dimethylpropane-1,3-diol;3-hydroxy-2,2-dimethylpropanoic acid Chemical compound OCC(C)(C)CO.OCC(C)(C)C(O)=O CZZVAVMGKRNEAT-UHFFFAOYSA-N 0.000 description 1
- FPZWZCWUIYYYBU-UHFFFAOYSA-N 2-(2-ethoxyethoxy)ethyl acetate Chemical compound CCOCCOCCOC(C)=O FPZWZCWUIYYYBU-UHFFFAOYSA-N 0.000 description 1
- JAHNSTQSQJOJLO-UHFFFAOYSA-N 2-(3-fluorophenyl)-1h-imidazole Chemical compound FC1=CC=CC(C=2NC=CN=2)=C1 JAHNSTQSQJOJLO-UHFFFAOYSA-N 0.000 description 1
- TXBCBTDQIULDIA-UHFFFAOYSA-N 2-[[3-hydroxy-2,2-bis(hydroxymethyl)propoxy]methyl]-2-(hydroxymethyl)propane-1,3-diol Chemical compound OCC(CO)(CO)COCC(CO)(CO)CO TXBCBTDQIULDIA-UHFFFAOYSA-N 0.000 description 1
- SVONRAPFKPVNKG-UHFFFAOYSA-N 2-ethoxyethyl acetate Chemical compound CCOCCOC(C)=O SVONRAPFKPVNKG-UHFFFAOYSA-N 0.000 description 1
- BQZJOQXSCSZQPS-UHFFFAOYSA-N 2-methoxy-1,2-diphenylethanone Chemical class C=1C=CC=CC=1C(OC)C(=O)C1=CC=CC=C1 BQZJOQXSCSZQPS-UHFFFAOYSA-N 0.000 description 1
- YZTJKOLMWJNVFH-UHFFFAOYSA-N 2-sulfobenzene-1,3-dicarboxylic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1S(O)(=O)=O YZTJKOLMWJNVFH-UHFFFAOYSA-N 0.000 description 1
- RAADBCJYJHQQBI-UHFFFAOYSA-N 2-sulfoterephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C(S(O)(=O)=O)=C1 RAADBCJYJHQQBI-UHFFFAOYSA-N 0.000 description 1
- XIRDTMSOGDWMOX-UHFFFAOYSA-N 3,4,5,6-tetrabromophthalic acid Chemical compound OC(=O)C1=C(Br)C(Br)=C(Br)C(Br)=C1C(O)=O XIRDTMSOGDWMOX-UHFFFAOYSA-N 0.000 description 1
- CTJFNNZDSZIGOM-UHFFFAOYSA-N 3-methylcyclohex-2-ene-1,1,2-tricarboxylic acid Chemical compound CC1=C(C(O)=O)C(C(O)=O)(C(O)=O)CCC1 CTJFNNZDSZIGOM-UHFFFAOYSA-N 0.000 description 1
- WNKQDGLSQUASME-UHFFFAOYSA-N 4-sulfophthalic acid Chemical compound OC(=O)C1=CC=C(S(O)(=O)=O)C=C1C(O)=O WNKQDGLSQUASME-UHFFFAOYSA-N 0.000 description 1
- UHOVQNZJYSORNB-UHFFFAOYSA-N Benzene Chemical compound C1=CC=CC=C1 UHOVQNZJYSORNB-UHFFFAOYSA-N 0.000 description 1
- DKPFZGUDAPQIHT-UHFFFAOYSA-N Butyl acetate Natural products CCCCOC(C)=O DKPFZGUDAPQIHT-UHFFFAOYSA-N 0.000 description 1
- ZAMOUSCENKQFHK-UHFFFAOYSA-N Chlorine atom Chemical compound [Cl] ZAMOUSCENKQFHK-UHFFFAOYSA-N 0.000 description 1
- WBYWAXJHAXSJNI-SREVYHEPSA-N Cinnamic acid Chemical compound OC(=O)\C=C/C1=CC=CC=C1 WBYWAXJHAXSJNI-SREVYHEPSA-N 0.000 description 1
- 239000004641 Diallyl-phthalate Substances 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N Diethyl ether Chemical compound CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- NTIZESTWPVYFNL-UHFFFAOYSA-N Methyl isobutyl ketone Chemical compound CC(C)CC(C)=O NTIZESTWPVYFNL-UHFFFAOYSA-N 0.000 description 1
- UIHCLUNTQKBZGK-UHFFFAOYSA-N Methyl isobutyl ketone Natural products CCC(C)C(C)=O UIHCLUNTQKBZGK-UHFFFAOYSA-N 0.000 description 1
- TXXHDPDFNKHHGW-CCAGOZQPSA-N Muconic acid Natural products OC(=O)\C=C/C=C\C(O)=O TXXHDPDFNKHHGW-CCAGOZQPSA-N 0.000 description 1
- WHNWPMSKXPGLAX-UHFFFAOYSA-N N-Vinyl-2-pyrrolidone Chemical compound C=CN1CCCC1=O WHNWPMSKXPGLAX-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- XBDQKXXYIPTUBI-UHFFFAOYSA-M Propionate Chemical compound CCC([O-])=O XBDQKXXYIPTUBI-UHFFFAOYSA-M 0.000 description 1
- 244000028419 Styrax benzoin Species 0.000 description 1
- 235000000126 Styrax benzoin Nutrition 0.000 description 1
- KDYFGRWQOYBRFD-UHFFFAOYSA-N Succinic acid Natural products OC(=O)CCC(O)=O KDYFGRWQOYBRFD-UHFFFAOYSA-N 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- 235000008411 Sumatra benzointree Nutrition 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- DAKWPKUUDNSNPN-UHFFFAOYSA-N Trimethylolpropane triacrylate Chemical compound C=CC(=O)OCC(CC)(COC(=O)C=C)COC(=O)C=C DAKWPKUUDNSNPN-UHFFFAOYSA-N 0.000 description 1
- JJLKTTCRRLHVGL-UHFFFAOYSA-L [acetyloxy(dibutyl)stannyl] acetate Chemical compound CC([O-])=O.CC([O-])=O.CCCC[Sn+2]CCCC JJLKTTCRRLHVGL-UHFFFAOYSA-L 0.000 description 1
- KXKVLQRXCPHEJC-UHFFFAOYSA-N acetic acid trimethyl ester Natural products COC(C)=O KXKVLQRXCPHEJC-UHFFFAOYSA-N 0.000 description 1
- 150000008062 acetophenones Chemical class 0.000 description 1
- 239000000654 additive Substances 0.000 description 1
- 239000001361 adipic acid Substances 0.000 description 1
- 235000011037 adipic acid Nutrition 0.000 description 1
- 150000001298 alcohols Chemical class 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- 125000001931 aliphatic group Chemical group 0.000 description 1
- 150000001338 aliphatic hydrocarbons Chemical class 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 125000005907 alkyl ester group Chemical group 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- JFCQEDHGNNZCLN-UHFFFAOYSA-N anhydrous glutaric acid Natural products OC(=O)CCCC(O)=O JFCQEDHGNNZCLN-UHFFFAOYSA-N 0.000 description 1
- 150000004056 anthraquinones Chemical class 0.000 description 1
- 239000007864 aqueous solution Substances 0.000 description 1
- 150000004945 aromatic hydrocarbons Chemical class 0.000 description 1
- 125000003118 aryl group Chemical group 0.000 description 1
- 229960002130 benzoin Drugs 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- QUDWYFHPNIMBFC-UHFFFAOYSA-N bis(prop-2-enyl) benzene-1,2-dicarboxylate Chemical compound C=CCOC(=O)C1=CC=CC=C1C(=O)OCC=C QUDWYFHPNIMBFC-UHFFFAOYSA-N 0.000 description 1
- 239000001273 butane Substances 0.000 description 1
- KDYFGRWQOYBRFD-NUQCWPJISA-N butanedioic acid Chemical compound O[14C](=O)CC[14C](O)=O KDYFGRWQOYBRFD-NUQCWPJISA-N 0.000 description 1
- 235000013877 carbamide Nutrition 0.000 description 1
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 description 1
- 239000000460 chlorine Substances 0.000 description 1
- 229910052801 chlorine Inorganic materials 0.000 description 1
- 229930016911 cinnamic acid Natural products 0.000 description 1
- 235000013985 cinnamic acid Nutrition 0.000 description 1
- HNEGQIOMVPPMNR-IHWYPQMZSA-N citraconic acid Chemical compound OC(=O)C(/C)=C\C(O)=O HNEGQIOMVPPMNR-IHWYPQMZSA-N 0.000 description 1
- 229940018557 citraconic acid Drugs 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- LDHQCZJRKDOVOX-NSCUHMNNSA-N crotonic acid Chemical compound C\C=C\C(O)=O LDHQCZJRKDOVOX-NSCUHMNNSA-N 0.000 description 1
- IFDVQVHZEKPUSC-UHFFFAOYSA-N cyclohex-3-ene-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCC=CC1C(O)=O IFDVQVHZEKPUSC-UHFFFAOYSA-N 0.000 description 1
- QSAWQNUELGIYBC-UHFFFAOYSA-N cyclohexane-1,2-dicarboxylic acid Chemical compound OC(=O)C1CCCCC1C(O)=O QSAWQNUELGIYBC-UHFFFAOYSA-N 0.000 description 1
- 239000000539 dimer Substances 0.000 description 1
- 125000000118 dimethyl group Chemical group [H]C([H])([H])* 0.000 description 1
- NCTJHYCOXOYZMU-UHFFFAOYSA-L dipotassium;2-sulfoterephthalate Chemical compound [K+].[K+].OS(=O)(=O)C1=CC(C([O-])=O)=CC=C1C([O-])=O NCTJHYCOXOYZMU-UHFFFAOYSA-L 0.000 description 1
- 238000004090 dissolution Methods 0.000 description 1
- TVIDDXQYHWJXFK-UHFFFAOYSA-N dodecanedioic acid Chemical compound OC(=O)CCCCCCCCCCC(O)=O TVIDDXQYHWJXFK-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 239000001530 fumaric acid Substances 0.000 description 1
- 235000019382 gum benzoic Nutrition 0.000 description 1
- XXMIOPMDWAUFGU-UHFFFAOYSA-N hexane-1,6-diol Chemical compound OCCCCCCO XXMIOPMDWAUFGU-UHFFFAOYSA-N 0.000 description 1
- FUZZWVXGSFPDMH-UHFFFAOYSA-N hexanoic acid Chemical compound CCCCCC(O)=O FUZZWVXGSFPDMH-UHFFFAOYSA-N 0.000 description 1
- 230000005865 ionizing radiation Effects 0.000 description 1
- 150000002576 ketones Chemical class 0.000 description 1
- VZCYOOQTPOCHFL-UPHRSURJSA-N maleic acid Chemical compound OC(=O)\C=C/C(O)=O VZCYOOQTPOCHFL-UPHRSURJSA-N 0.000 description 1
- 239000011976 maleic acid Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- WBYWAXJHAXSJNI-UHFFFAOYSA-N methyl p-hydroxycinnamate Natural products OC(=O)C=CC1=CC=CC=C1 WBYWAXJHAXSJNI-UHFFFAOYSA-N 0.000 description 1
- LVHBHZANLOWSRM-UHFFFAOYSA-N methylenebutanedioic acid Natural products OC(=O)CC(=C)C(O)=O LVHBHZANLOWSRM-UHFFFAOYSA-N 0.000 description 1
- 150000002762 monocarboxylic acid derivatives Chemical class 0.000 description 1
- 150000002825 nitriles Chemical class 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 229920003986 novolac Polymers 0.000 description 1
- 239000003960 organic solvent Substances 0.000 description 1
- 235000006408 oxalic acid Nutrition 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- XNGIFLGASWRNHJ-UHFFFAOYSA-N phthalic acid Chemical compound OC(=O)C1=CC=CC=C1C(O)=O XNGIFLGASWRNHJ-UHFFFAOYSA-N 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 239000011591 potassium Substances 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
- 238000010526 radical polymerization reaction Methods 0.000 description 1
- 150000003254 radicals Chemical class 0.000 description 1
- 239000000376 reactant Substances 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 238000003786 synthesis reaction Methods 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- UFDHBDMSHIXOKF-UHFFFAOYSA-N tetrahydrophthalic acid Natural products OC(=O)C1=C(C(O)=O)CCCC1 UFDHBDMSHIXOKF-UHFFFAOYSA-N 0.000 description 1
- 239000005028 tinplate Substances 0.000 description 1
- LDHQCZJRKDOVOX-UHFFFAOYSA-N trans-crotonic acid Natural products CC=CC(O)=O LDHQCZJRKDOVOX-UHFFFAOYSA-N 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
- 150000003672 ureas Chemical class 0.000 description 1
- 229920001567 vinyl ester resin Polymers 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Landscapes
- Paints Or Removers (AREA)
- Macromonomer-Based Addition Polymer (AREA)
Abstract
Description
【0001】0001
【産業上の利用分野】本発明は新規にして有用なるエネ
ルギー線硬化型樹脂組成物に関する。さらに詳細には、
本発明は有効成分として、特定の構造のオキシラン環含
有化合物と、特定のオキシラン環含有基と反応する官能
基と不飽和二重結合とを併せ有する化合物と、多塩基酸
の無水物との反応によって得られるエネルギー線硬化型
樹脂を含んで成る、エネルギー線硬化型樹脂組成物に関
する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a new and useful energy ray curable resin composition. In more detail,
The present invention deals with the reaction of an oxirane ring-containing compound with a specific structure, a compound having both a functional group that reacts with the specific oxirane ring-containing group, and an unsaturated double bond, and an anhydride of a polybasic acid, as active ingredients. The present invention relates to an energy ray curable resin composition comprising an energy ray curable resin obtained by.
【0002】そして、かかる本発明のエネルギー線硬化
型樹脂組成物は、コーティング材、印刷インキ、接着剤
ならびにフォトレジストなどの広範なる用途に適した、
極めて有用なる、紫外線や電子線などの、いわゆるエネ
ルギー線によって硬化が可能なるものである。The energy ray-curable resin composition of the present invention is suitable for a wide range of uses such as coating materials, printing inks, adhesives, and photoresists.
It can be cured using so-called energy rays, such as ultraviolet rays and electron beams, which are extremely useful.
【0003】0003
【従来の技術】エネルギー線で硬化可能なる樹脂、就中
、ラジカル重合反応により硬化する樹脂としては、不飽
和ポリエステル樹脂、ビニルエステル樹脂(エポキシ−
アクリレート)、各種オリゴアクリレートおよびジアリ
ルフタレートプレポリマーなどの各種のものがあり、そ
れぞれの用途分野で特徴が活かされ、広範なる用途に差
し向けられている。[Prior Art] Resins that can be cured by energy rays, especially resins that can be cured by radical polymerization reactions, include unsaturated polyester resins, vinyl ester resins (epoxy
acrylate), various oligoacrylates, and diallyl phthalate prepolymers, each of which has characteristics that are utilized in its application field and is being used in a wide range of applications.
【0004】しかし、近年、その用途が広がるに伴って
、益々、それぞれの用途性能に対する要求が高まってい
るが、そうした諸々の用途性能を満足させ得るような、
エネルギー線により硬化可能なる樹脂組成物は、未だに
、得られていないというのが実状である。[0004] However, in recent years, as its uses have expanded, demands for performance in each use have been increasing.
The reality is that a resin composition that can be cured by energy rays has not yet been obtained.
【0005】[0005]
【発明が解決しようとする課題】本発明者らは、前述し
たような諸情勢に鑑み、既存の樹脂では、断じて満足す
ることのできない用途であっても用いることが出来て、
耐水性、耐溶剤性、耐薬品性、耐熱性ならびに硬化性な
どに優れたラジカル硬化型樹脂の合成について、鋭意、
研究を開始した。[Problems to be Solved by the Invention] In view of the various situations described above, the present inventors have developed a method that can be used even in applications where existing resins cannot be completely satisfied.
We are actively researching the synthesis of radical-curing resins with excellent water resistance, solvent resistance, chemical resistance, heat resistance, and curability.
Started research.
【0006】すなわち、本発明が解決しようとする課題
は、一にかかって、とりわけ、耐水性、耐溶剤性、耐薬
品性、耐熱性ならびに硬化性などに優れる、極めて有用
性の高いエネルギー線硬化型樹脂組成物を提供すること
である。In other words, the problem to be solved by the present invention is to provide an extremely useful energy beam curing method that is particularly excellent in water resistance, solvent resistance, chemical resistance, heat resistance, and curing properties. An object of the present invention is to provide a mold resin composition.
【0007】[0007]
【課題を解決するための手段】そこで、本発明者らは、
上述したような発明が解決しようとする課題に照準を当
てて、鋭意、検討を重ねた結果、ここに、特定の構造を
有する多官能のオキシラン環含有化合物と、特定のオキ
シラン環含有基と反応する官能基と不飽和二重結合とを
併せ有する化合物と、多塩基酸の無水物との反応によっ
て得られるエネルギー線硬化型樹脂が、上述したような
悉くの塗膜性能を満足させることが出来ることを見い出
すに及んで、本発明を完成するに到った。[Means for solving the problem] Therefore, the present inventors
As a result of intensive studies aimed at the problems to be solved by the invention as described above, we hereby found that a polyfunctional oxirane ring-containing compound having a specific structure reacts with a specific oxirane ring-containing group. An energy ray-curable resin obtained by reacting a compound having both a functional group and an unsaturated double bond with an anhydride of a polybasic acid can satisfy all of the coating film properties described above. By discovering this, we have completed the present invention.
【0008】すなわち、本発明は基本的には、特定の構
造の多官能オキシラン環含有化合物と、このオキシラン
環含有基と反応しうる官能基と不飽和二重結合とを骨格
中に併せ有する化合物と、多塩基酸の無水物との反応に
よって得られるエネルギー線硬化型樹脂組成物を提供す
るものである。That is, the present invention basically consists of a polyfunctional oxirane ring-containing compound having a specific structure, and a compound having both a functional group capable of reacting with the oxirane ring-containing group and an unsaturated double bond in its skeleton. and an anhydride of a polybasic acid.
【0009】そして具体的には、一般式Specifically, the general formula
【0010】0010
【化9】[Chemical formula 9]
【0011】[ただし、式中のW、X、YおよびZは、
それぞれ、同一であっても異なっていてもよい水素原子
または式[However, W, X, Y and Z in the formula are
Hydrogen atoms or formulas that may be the same or different, respectively
【0012】0012
【化10】[Chemical formula 10]
【0013】で示される基を表すものとするが、W、X
、YおよびZのすべてが、悉く、水素原子である場合は
除くものとする。]
で示される、いわゆるオキシラン環含有化合物〔該化合
物中のW、X、YおよびZのそれぞれが、グリシジルエ
ーテル基または水素原子となっているような特定の構造
のもの(ただし、上記の通り、これらのW、X、Yおよ
びZのすべてが、悉く、水素原子であるような場合だけ
は、除外される。)〕と、不飽和モノカルボン酸と、多
塩基酸の無水物との反応によって得られるエネルギー線
硬化型樹脂を有効成分として含んで成る、エネルギー線
硬化型樹脂組成物を提供するものである。[0013] represents a group shown by W, X
, Y and Z are all hydrogen atoms. ] So-called oxirane ring-containing compounds [those with a specific structure in which each of W, X, Y, and Z in the compound is a glycidyl ether group or a hydrogen atom (however, as described above, The case in which all of these W, X, Y, and Z are all hydrogen atoms is excluded. The present invention provides an energy ray curable resin composition comprising the obtained energy ray curable resin as an active ingredient.
【0014】ここにおいて、まず、上記したエネルギー
線硬化型樹脂〔以下、樹脂(A)ともいう。〕とは、特
定の構造のオキシラン環含有化合物と不飽和モノカルボ
ン酸と多塩基酸の無水物とを反応させたものを指称する
。Here, first, the above-mentioned energy ray curable resin [hereinafter also referred to as resin (A)] is used. ] refers to a compound obtained by reacting an oxirane ring-containing compound with a specific structure, an unsaturated monocarboxylic acid, and an anhydride of a polybasic acid.
【0015】当該樹脂(A)としては、勿論、上述した
ような各種の化合物を反応せしめたものであれば、いず
れも使用することが出来るが、それらのうちでも特に代
表的なもののみを例示するに留めれば、まず、特定の構
造の構造のオキシラン環含有化合物〔以下、これを(a
−1)として扱うものとする。〕と、不飽和モノカルボ
ン酸化合物〔以下、これを(a−2)として扱うものと
する。〕とから、該化合物(a−1)中の少なくとも1
個以上のオキシラン環含有基とカルボキシル基とを介し
て得られる特定の反応物〔以下、これを(a−3)とし
て扱うものとする。〕に、少なくとも一つの芳香族、脂
肪族および/または脂環式多塩基酸の無水物〔以下、こ
れを(a−4)として扱うものとする。〕とを反応させ
て得られる樹脂などである。As the resin (A), of course, any resin can be used as long as it is made by reacting the various compounds mentioned above, but only the most representative ones are exemplified. First, we need to prepare an oxirane ring-containing compound with a specific structure [hereinafter referred to as (a
-1). ] and an unsaturated monocarboxylic acid compound [hereinafter, this will be treated as (a-2). ], at least one of the compounds (a-1)
A specific reactant obtained via one or more oxirane ring-containing groups and a carboxyl group [hereinafter, this will be treated as (a-3). ], at least one aromatic, aliphatic and/or alicyclic polybasic acid anhydride [hereinafter, this shall be treated as (a-4). ] and the like.
【0016】それらのうち、上記化合物(a−3)を調
製するために用いられる、前掲の一般式〔1〕で示され
る特定の構造の多官能オキシラン環含有化合物(a−1
)として特に代表的なもののみを挙げるにとどめれば、
2,7−ジヒドロキシナフタレンの単独を使用し、ある
いは、それにβ−ナフトールををも併用して、その2量
化物を経てオキシラン環含有化合物となしたものなどで
あって、一般式〔1〕で示される化合物のW、X、Yお
よびZが、それぞれ、グリシジルエーテル基または水素
原子となっているようなオキシラン環含有化合物(ただ
し、W、X、YおよびZのいずれもが、悉く、水素原子
となっている場合だけは除かれる。)などである。Among them, the polyfunctional oxirane ring-containing compound (a-1
), to mention only the most representative ones:
2,7-dihydroxynaphthalene used alone or in combination with β-naphthol to form an oxirane ring-containing compound through its dimerization, and is represented by the general formula [1]. An oxirane ring-containing compound in which W, X, Y, and Z of the compound shown are each a glycidyl ether group or a hydrogen atom (however, each of W, X, Y, and Z is a hydrogen atom) ), etc.
【0017】他方、前記オキシラン環含有基と反応する
不飽和モノカルボン酸類(a−2)として特に代表的な
もののみを例示するにとどめれば、アクリル酸、メタク
リル酸、クロトン酸または桂皮酸などであり、これらは
2種以上の混合使用によってもよいが、就中、アクリル
酸の使用が望ましい。On the other hand, typical examples of the unsaturated monocarboxylic acids (a-2) that react with the oxirane ring-containing group include acrylic acid, methacrylic acid, crotonic acid, and cinnamic acid. Although two or more of these may be used in combination, it is particularly desirable to use acrylic acid.
【0018】また、前記した多塩基酸の無水物(a−4
)のうちでも特に代表的なもののみを例示するに止めれ
ば、マレイン酸、フマル酸、イタコン酸、シトラコン酸
、テトラヒドロフタル酸、ヘット酸、ハイミック酸、ク
ロレンディック酸、ダイマー酸、アジピン酸、コハク酸
、アルケニルコハク酸、セバチン酸、アゼライン酸、2
,2,4−トリメチルアジピン酸、テレフタル酸、2−
カリウムスルホテレフタル酸、2−ナトリウムスルホテ
レフタル酸、イソフタル酸、2−カリウムスルホイソフ
タル酸、2−ナトリウムスルホイソフタル酸、ジメチル
−もしくはジエチルエステルなどに代表されるような5
−ナトリウム−スルホイソフタル酸ジ低級アルキルエス
テル、オルソフタル酸、4−スルホフタル酸、1,10
−デカメチレンジカルボン酸、ムコン酸、シュウ酸、マ
ロン酸、グルタル酸、トリメリット酸、ヘキサヒドロフ
タル酸、テトラブロムフタル酸、メチルシクロヘキセン
トリカルボン酸またはピロメリット酸の無水物などであ
る。これらは単独使用でも2種以上の併用でも良いこと
は、勿論である。[0018] Furthermore, the anhydride of the polybasic acid (a-4
) Among the most representative examples, maleic acid, fumaric acid, itaconic acid, citraconic acid, tetrahydrophthalic acid, het acid, hymic acid, chlorendic acid, dimer acid, adipic acid, Succinic acid, alkenylsuccinic acid, sebacic acid, azelaic acid, 2
, 2,4-trimethyladipic acid, terephthalic acid, 2-
5 such as potassium sulfoterephthalate, 2-sodium sulfoterephthalate, isophthalic acid, 2-potassium sulfoisophthalate, 2-sodium sulfoisophthalate, dimethyl or diethyl ester, etc.
-Sodium-sulfoisophthalic acid di-lower alkyl ester, orthophthalic acid, 4-sulfophthalic acid, 1,10
- Anhydrides of decamethylene dicarboxylic acid, muconic acid, oxalic acid, malonic acid, glutaric acid, trimellitic acid, hexahydrophthalic acid, tetrabromophthalic acid, methylcyclohexentricarboxylic acid or pyromellitic acid. Of course, these may be used alone or in combination of two or more.
【0019】かくして得られるエネルギー線硬化型樹脂
は、それ自体が高感度のものであって、硬化後において
は、耐水性、耐溶剤性、耐薬品性ならびに耐熱性などに
優れた皮膜を与えるものとなる。The energy ray-curable resin thus obtained is highly sensitive in itself, and after curing, provides a film with excellent water resistance, solvent resistance, chemical resistance, heat resistance, etc. becomes.
【0020】かくして得られるエネルギー線硬化型樹脂
を必須の成分として含んで成る、本発明のエネルギー線
硬化型樹脂組成物には、さらに必要に応じて、本発明の
目的を逸脱しない範囲内で、とりわけ、保存安定性なら
びに耐水性、耐溶剤性、耐薬品性および耐熱性などの諸
性能を保持しうる範囲内で、公知慣用の添加剤を、就中
、他のタイプの反応性希釈剤や有機溶剤などを添加せし
めることを、何ら、妨げるものではない。The energy ray curable resin composition of the present invention, which contains the energy ray curable resin thus obtained as an essential component, may further contain, if necessary, within the scope of the purpose of the present invention. In particular, known and commonly used additives, such as other types of reactive diluents and This does not preclude the addition of organic solvents or the like.
【0021】かかる反応性希釈剤としては、単官能性の
ものから多官能性のものまでが広く用いられるが、それ
らのうちでも特に代表的なもののみを例示するに留めれ
ば、2−ヒドロキシエチル(メタ)アクリレート、2−
ヒドロキシプロピル(メタ)アクリレート、2−エチル
ヘキシル(メタ)アクリレート、N−ビニルピロリドン
、1−ビニルイミダゾール、イソボルニル(メタ)アク
リレート、テトラヒドロフルフィリル(メタ)アクリレ
ート、カルビトール(メタ)アクリレート、フェノキシ
エチル(メタ)アクリレート、ジシクロペンタジエン(
メタ)アクリレート、1,3−ブタンジ(メタ)アクリ
レート、1,6−ヘキサンジオールジ(メタ)アクリレ
ート、ポリエチレングリコールジ(メタ)アクリレート
、ヒドロキシピバリン酸エステルネオペンチルグリコー
ルジ(メタ)アクリレート、トリメチロールプロパント
リ(メタ)アクリレート、ペンタエリスリトールトリ(
メタ)アクリレート、ペンタエリスリトールテトラ(メ
タ)アクリレートまたはジペンタエリスリトールヘキサ
(メタ)アクリレートなどである。[0021] As such reactive diluents, a wide range of monofunctional to polyfunctional ones are used, but among them, only the most representative ones are exemplified. Ethyl (meth)acrylate, 2-
Hydroxypropyl (meth)acrylate, 2-ethylhexyl (meth)acrylate, N-vinylpyrrolidone, 1-vinylimidazole, isobornyl (meth)acrylate, tetrahydrofurphyryl (meth)acrylate, carbitol (meth)acrylate, phenoxyethyl ( meth)acrylate, dicyclopentadiene (
meth)acrylate, 1,3-butane di(meth)acrylate, 1,6-hexanediol di(meth)acrylate, polyethylene glycol di(meth)acrylate, hydroxypivalate neopentyl glycol di(meth)acrylate, trimethylolpropane Tri(meth)acrylate, pentaerythritol tri(
meth)acrylate, pentaerythritol tetra(meth)acrylate or dipentaerythritol hexa(meth)acrylate.
【0022】また、溶剤として特に代表的なもののみを
例示するにとどめれば、トルエンもしくはキシレンの如
き芳香族炭化水素類;メチルエチルケトン、メチルイソ
ブチルケトンもしくはシクロヘキサノンの如きケトン類
;酢酸メチル、酢酸エチルもしくは酢酸ブチルの如きエ
ステル類;メタノール、エタノール、プロパノールもし
くはブタノールの如きアルコール類;ヘキサン、ヘプタ
ンの如き脂肪族炭化水素類をはじめ、セロソルブアセテ
ート、カルビトールアセテート、ジメチルホルムアミド
、またはテトラヒドロフランなどである。[0022] Further, to exemplify only typical solvents, aromatic hydrocarbons such as toluene or xylene; ketones such as methyl ethyl ketone, methyl isobutyl ketone, or cyclohexanone; methyl acetate, ethyl acetate, or Esters such as butyl acetate; alcohols such as methanol, ethanol, propanol or butanol; aliphatic hydrocarbons such as hexane, heptane, as well as cellosolve acetate, carbitol acetate, dimethylformamide, or tetrahydrofuran.
【0023】本発明でいう前記エネルギー線とは、電子
線、α線、β線、γ線、X線、中性子線、または紫外線
の如き、電離性放射線や光などを総称するものである。
本発明において、かかるエネルギー線として紫外線を用
いて、本発明樹脂組成物を硬化させる場合には、波長が
1,000〜8,000オングストロームなる紫外線に
よって解離してラジカルを発生するような光(重合)開
始剤を使用すべきである。[0023] The energy ray as used in the present invention is a general term for ionizing radiation and light such as electron beams, α rays, β rays, γ rays, X rays, neutron beams, and ultraviolet rays. In the present invention, when the resin composition of the present invention is cured using ultraviolet rays as energy rays, it is preferable to use ultraviolet rays with a wavelength of 1,000 to 8,000 angstroms to dissociate and generate radicals (polymerization ) an initiator should be used.
【0024】こうした光(重合)開始剤としては、勿論
、公知慣用のものが、いずれも使用できるが、それらの
うちでも特に代表的な例を挙げるにとどめれば、アセト
フェノン類、ベンゾフェノン、ミヒラーズケトン、ベン
ジン、ベンゾイン・ベンゾエート、ベンゾイン、ベンゾ
インメチルエーテル類、ベンジル・ジメチルケタール、
α−アシロキシムエステル、チオキサントン類、アンス
ラキノン類およびそれらの各種誘導体などである。As such photo (polymerization) initiators, of course, any known and commonly used ones can be used, but among them, representative examples include acetophenones, benzophenone, Michler's ketone, Benzine, benzoin benzoate, benzoin, benzoin methyl ethers, benzyl dimethyl ketal,
These include α-acyloxime esters, thioxanthones, anthraquinones, and various derivatives thereof.
【0025】また、こうした光(重合)開始剤には、公
知慣用の光増感剤をも併用することができるが、かかる
光増感剤として特に代表的なもののみを例示するに留め
れば、アミン類、尿素類、含硫黄化合物、含燐化合物、
含塩素化合物またはニトリル類もしくはその他の含窒素
化合物などである。[0025] In addition, a known and commonly used photosensitizer can also be used in combination with such a photo(polymerization) initiator, but only typical examples of such photosensitizers are listed below. , amines, ureas, sulfur-containing compounds, phosphorus-containing compounds,
These include chlorine-containing compounds, nitriles, and other nitrogen-containing compounds.
【0026】本発明のエネルギー線硬化型樹脂含有樹脂
組成物は、通常は、そのまま、上掲された如き各種のエ
ネルギー源を用いることにより、放射線ないしは活性エ
ネルギー線を照射させて硬化せしめればよい。The energy ray curable resin-containing resin composition of the present invention can usually be cured as it is by irradiating it with radiation or active energy rays using the various energy sources listed above. .
【0027】[0027]
【実施例】次に、本発明を実施例および応用例により、
一層、具体的に説明する。以下において、部および%は
特に断りの無い限り、すべて重量基準であるものとする
。[Examples] Next, the present invention will be explained by examples and application examples.
This will be explained in more detail. In the following, all parts and percentages are based on weight unless otherwise specified.
【0028】実施例1
温度計、攪拌機および還流冷却管を備えたフラスコに、
2,7−ジヒドロキシナフタレンを単独で使用して、あ
るいは、それにβ−ナフトールをも併用して、その2量
化物を経て得られた4官能エポキシ化合物の556gと
、ハイドロキノンモノメチルエーテルの1.3gとを仕
込み、さらに、アクリル酸の288gおよびトリフェニ
ルフォスフィンの12.8gをも加えて、エポキシ当量
が15000以上となるまで、110℃の温度で反応せ
しめて、反応物(a−3−1)を得た。Example 1 In a flask equipped with a thermometer, a stirrer and a reflux condenser,
556 g of a tetrafunctional epoxy compound obtained through dimerization using 2,7-dihydroxynaphthalene alone or in combination with β-naphthol, and 1.3 g of hydroquinone monomethyl ether. Further, 288 g of acrylic acid and 12.8 g of triphenylphosphine were added, and the reaction was carried out at a temperature of 110° C. until the epoxy equivalent became 15,000 or more. I got it.
【0029】さらに、ここにテトラヒドロ無水フタル酸
の152gを加えて、酸価が57となるまで110℃で
反応せしめ、目的とする反応物を得た。以下、これを樹
脂(A−1)と略記する。Further, 152 g of tetrahydrophthalic anhydride was added thereto, and the mixture was reacted at 110° C. until the acid value reached 57 to obtain the desired reaction product. Hereinafter, this will be abbreviated as resin (A-1).
【0030】実施例2
温度計、攪拌機および還流冷却管を備えたフラスコに、
実施例1で得られた(a−3−1)の844gおよびテ
トラヒドロ無水フタル酸の304gを仕込んで、酸価が
98となるまで、110℃で反応を行って反応物を得た
。以下、これを樹脂(A−2)と略記する。Example 2 In a flask equipped with a thermometer, a stirrer and a reflux condenser,
844 g of (a-3-1) obtained in Example 1 and 304 g of tetrahydrophthalic anhydride were charged, and the reaction was carried out at 110° C. until the acid value reached 98 to obtain a reaction product. Hereinafter, this will be abbreviated as resin (A-2).
【0031】実施例3
温度計、攪拌機および還流冷却管を備えたフラスコに、
実施例1で得られた(a−3−1)の844gと、テト
ラヒドロ無水フタル酸の608gとを仕込んで、酸価が
155となるまで、110℃で反応を行って反応物を得
た。以下、これを樹脂(A−3)と略記する。Example 3 In a flask equipped with a thermometer, stirrer and reflux condenser,
844 g of (a-3-1) obtained in Example 1 and 608 g of tetrahydrophthalic anhydride were charged, and the reaction was carried out at 110° C. until the acid value reached 155 to obtain a reaction product. Hereinafter, this will be abbreviated as resin (A-3).
【0032】応用例1
実施例1で得られた樹脂(A−1)に対して、下記され
る如き各種の成分を配合せしめ、充分に混合し、攪拌し
て塗料を調製した。Application Example 1 Various components as described below were added to the resin (A-1) obtained in Example 1, thoroughly mixed, and stirred to prepare a paint.
【0033】
樹脂(A−1)
100部
1−ヒドロキシヘキシルフェニルケトン
3部次いで、かくして得られた上記塗料を、水
研ぎしたブリキ板に、20μmの厚さで塗布した。Resin (A-1)
100 copies
1-hydroxyhexylphenyl ketone
Three parts of the above paint thus obtained were then applied to a thickness of 20 μm on a wet-sanded tin plate.
【0034】しかるのち、これを80Wの高圧水銀灯で
、15cmの高さから、60秒間のあいだ紫外線を照射
し硬化させた。それぞれの被覆板について行った諸性能
の評価試験の結果を、第1表に示す。Thereafter, this was cured by irradiating it with ultraviolet rays for 60 seconds from a height of 15 cm using an 80 W high pressure mercury lamp. Table 1 shows the results of various performance evaluation tests conducted on each coated plate.
【0035】応用例2
樹脂(A−1)に替えるに、実施例2で得られた樹脂(
A−2)の同量を用いるように変更した以外は、応用例
1と同様にして、塗料を得、塗布し、硬化させた。Application Example 2 Instead of resin (A-1), the resin (A-1) obtained in Example 2 was used.
A paint was obtained, applied, and cured in the same manner as in Application Example 1, except that the same amount of A-2) was used.
【0036】その被覆板についても同様の性能評価を行
った処、第1表に示されるような結果が得られた。
応用例3
樹脂(A−1)に替えるに、実施例3で得られた樹脂(
A−3)の同量を用いるように変更した以外は、応用例
1と同様にして、塗料を得、塗布し、硬化させた。Similar performance evaluations were conducted for the coated plates, and the results shown in Table 1 were obtained. Application example 3 Instead of resin (A-1), resin (A-1) obtained in Example 3 was used.
A paint was obtained, applied, and cured in the same manner as in Application Example 1, except that the same amount of A-3) was used.
【0037】その被覆板についても同様の性能評価を行
った処、第1表に示されるような結果が得られた。
応用例4
実施例3で得られた樹脂(A−3)に対して、下記され
る如き各種の成分を配合せしめ、充分に混合し、攪拌し
て塗料を調製した。Similar performance evaluations were conducted for the coated plates, and the results shown in Table 1 were obtained. Application Example 4 Various components as described below were added to the resin (A-3) obtained in Example 3, thoroughly mixed, and stirred to prepare a paint.
【0038】
樹脂(A−3)
100部
1−ヒドロキシヘキシルフェニルケトン
3部 トリメチロールプロパン
トリアクリレート 20部以後も、応用例1と同
様にして、塗料を得、塗布し、硬化させた。Resin (A-3)
100 copies
1-hydroxyhexylphenyl ketone
3 parts trimethylolpropane triacrylate After 20 parts, a coating material was obtained, applied, and cured in the same manner as in Application Example 1.
【0039】その被覆板についても同様の性能評価を行
った処、第1表に示されるような結果が得られた。
比較例1
温度計、攪拌機および還流冷却管を備えたフラスコに、
エポキシ当量が213なる「エピクロン N−695
」〔大日本インキ化学工業(株)製のクレゾール・ノボ
ラック型エポキシ化合物〕の426gとハイドロキノン
モノメチルエーテルの1.3gとを仕込み、さらに、ア
クリル酸の144gをも加えて、酸価が3以下となるま
で、110℃の温度で反応せしめ、反応物(c−3−1
)を得た。Similar performance evaluations were conducted for the coated plates, and the results shown in Table 1 were obtained. Comparative Example 1 In a flask equipped with a thermometer, a stirrer, and a reflux condenser,
"Epicron N-695" with an epoxy equivalent of 213
426 g of ``cresol novolak type epoxy compound manufactured by Dainippon Ink & Chemicals Co., Ltd.'' and 1.3 g of hydroquinone monomethyl ether were added, and 144 g of acrylic acid was also added to make the acid value 3 or less. The reaction was carried out at a temperature of 110°C until the reaction product (c-3-1
) was obtained.
【0040】次いで、新たに温度計、攪拌機および還流
冷却管を備えたフラスコに、(c−3−1)の570g
と、テトラヒドロ無水フタル酸の152gを仕込んで、
さらに、ジ−n−ブチル錫ジアセテートの0.5gをも
加えて、酸価が50になるまで、110℃の温度で反応
を行って、対照用のエネルギー線硬化樹脂を得た。以下
、これを樹脂(C−1)と略記する。Next, 570 g of (c-3-1) was added to a flask newly equipped with a thermometer, stirrer, and reflux condenser.
and charged 152g of tetrahydrophthalic anhydride.
Furthermore, 0.5 g of di-n-butyltin diacetate was also added, and the reaction was carried out at a temperature of 110° C. until the acid value reached 50, to obtain a control energy ray-cured resin. Hereinafter, this will be abbreviated as resin (C-1).
【0041】比較応用例1
樹脂(A−1)の使用に替えるに、比較例1で得られた
樹脂(C−1)の同量を用いるように変更した以外は、
応用例1と同様にして、塗料を得、塗布し、硬化させた
。Comparative Application Example 1 Except for using the same amount of resin (C-1) obtained in Comparative Example 1 instead of using resin (A-1),
A paint was obtained, applied, and cured in the same manner as in Application Example 1.
【0042】その被覆板についても同様の性能評価を行
った処、第1表に示されるような結果が得られた。なお
、各性能の評価は、次のような要領で行ったものである
。Similar performance evaluations were conducted for the coated plates, and the results shown in Table 1 were obtained. Note that the evaluation of each performance was performed in the following manner.
【0043】硬化性………………塗布した塗膜を、80
℃の温風中で15分乾燥させたのちに、80W/cm2
なる強度の高圧水銀ランプの下、15cmなる位置を
50m/分なる速度で通過せしめ、硬化するまでの回数
を測定した。[0043] Curability: The applied coating film is cured at 80%
80W/cm2 after drying in warm air at ℃ for 15 minutes.
The sample was passed through a 15 cm position at a speed of 50 m/min under a high-pressure mercury lamp with an intensity of 15 cm, and the number of times it took to harden was measured.
【0044】耐水性………………ガーゼにイオン交換水
を浸して、硬化塗膜を40回擦ったのちの膜厚の減少程
度を測定する。
◎:5μm未満
○:5μm以上で、かつ、10μm未満△:10μm以
上で、かつ、15μm未満×:15μm以上
耐溶剤性……………ガーゼにアセトンを浸して、硬化塗
膜を40回擦ったのちの膜厚の減少程度を測定する。評
価基準は耐水性と同じ。Water resistance: Gauze is soaked in ion-exchanged water and the cured coating is rubbed 40 times, after which the degree of decrease in film thickness is measured. ◎: Less than 5 μm ○: 5 μm or more and less than 10 μm △: 10 μm or more and less than 15 μm The degree of decrease in film thickness is then measured. The evaluation criteria are the same as for water resistance.
【0045】耐アルカリ性………ガーゼに10%水酸化
ナトリウム水溶液を浸し、硬化塗膜を40回擦ったのち
の膜厚の減少程度を測定する。評価基準は耐水性の場合
と同じ。Alkali resistance: Gauze is immersed in a 10% aqueous sodium hydroxide solution and the cured coating is rubbed 40 times, after which the degree of decrease in film thickness is measured. The evaluation criteria are the same as for water resistance.
【0046】耐熱性………………塗布した塗膜を、80
℃の温風中で15分乾燥させたのちに、80W/cm2
なる強度の高圧水銀ランプの下、15cmなる位置を
50m/分なる速度で10回通過せしめた硬化塗膜を、
200℃の加熱炉中に40秒間置いてから直ちに塗膜面
にガーゼを圧着させて、冷却後にガーゼを剥がして塗膜
の変化を目視により判定した。[0046] Heat resistance......The applied coating film was
80W/cm2 after drying in warm air at ℃ for 15 minutes.
The cured coating was passed through a 15 cm position 10 times at a speed of 50 m/min under a high-pressure mercury lamp with an intensity of
Immediately after placing in a heating oven at 200° C. for 40 seconds, gauze was pressed onto the coated film surface, and after cooling, the gauze was peeled off and changes in the coated film were visually determined.
【0047】◎:全く変化が認められないもの○:表面
にガーゼの跡が少々つくもの
×:塗膜が溶融してしまい、ガーゼと共に剥がれるもの
アルカリ溶解性……塗布した塗膜を、80℃の温風内で
15分乾燥させたのちに、未硬化塗膜を1/10N水酸
化カリウム水溶液を浸したガーゼで30回擦って、塗膜
の溶解具合いを観る。◎: No change observed at all ○: Some traces of gauze on the surface ×: The coating film melts and peels off together with the gauze Alkali-soluble...The applied coating film was heated at 80°C. After drying in hot air for 15 minutes, rub the uncured paint film 30 times with gauze soaked in 1/10N potassium hydroxide aqueous solution to observe the degree of dissolution of the paint film.
【0048】◎:塗膜が全く残っていないもの○:塗膜
がほとんど残っていないもの
△:塗膜が若干のこるもの
×:塗膜が残っているもの◎: No paint film left at all ○: Hardly any paint film left △: Some paint film remains ×: Some paint film remains
【0049】[0049]
【表1】[Table 1]
【0050】第1表の結果からも明らかなように、本発
明のエネルギー線硬化型樹脂組成物は、常温で、あるい
は、加熱下で、自由にエネルギー線硬化させることが出
来、特定のオキシラン環含有化合物からの構造に基ずい
て得られる諸性能により、とりわけ、硬化性にも優れる
し、得られる硬化塗膜が耐水、耐溶剤ならびに耐薬品性
をも有するし、かつ、耐熱性にも優れるものであって、
各種用途に極めて有用なものである。As is clear from the results in Table 1, the energy ray-curable resin composition of the present invention can be freely cured with energy rays at room temperature or under heating. Due to the various properties obtained based on the structure of the contained compounds, it has excellent curability, and the resulting cured coating film has water resistance, solvent resistance, and chemical resistance, and is also excellent in heat resistance. It is a thing,
It is extremely useful for various uses.
【0051】[0051]
【発明の効果】本発明のエネルギー線硬化型樹脂組成物
は、それ自体が高感度のものであり、しかも、硬化塗膜
は耐水性、耐溶剤性、耐薬品性ならびに耐熱性などにす
ぐれている処から、とりわけ、コーティング剤、印刷イ
ンキ、フォトレジストならびに接着剤などとして、広範
なる用途において、極めて有用なものである。Effects of the Invention: The energy ray-curable resin composition of the present invention itself is highly sensitive, and the cured coating film has excellent water resistance, solvent resistance, chemical resistance, and heat resistance. This makes them extremely useful in a wide range of applications, including as coating agents, printing inks, photoresists, and adhesives, among others.
Claims (2)
一であっても異なっていてもよい水素原子または式【化
2】 で示される基を表すものとするが、W、X、YおよびZ
のすべてが、悉く、水素原子である場合は除くものとす
る。] で示される化合物と、該化合物の少なくとも一つのオキ
シラン環含有基と反応しうる基と不飽和二重結合とを併
せ有する化合物との反応物と、多塩基酸の無水物との反
応によって得られる樹脂を含有することを特徴とする、
エネルギー線硬化型樹脂組成物。Claim 1: General formula [Formula 1] [However, W, X, Y and Z in the formula are each a hydrogen atom or a group represented by the formula [Formula 2], which may be the same or different. , where W, X, Y and Z
shall be excluded if all of them are hydrogen atoms. ] A reaction product of a compound represented by the above, a compound having both a group capable of reacting with at least one oxirane ring-containing group and an unsaturated double bond, and an anhydride of a polybasic acid. characterized by containing a resin that
Energy ray curable resin composition.
素原子または式 【化4】 で示される基を表すものとするが、W、X、YおよびZ
のすべてが、悉く、水素原子である場合は除くものとす
る。] で示される化合物の少なくとも一つのオキシラン環含有
基が、一般式 【化5】 [ただし、式中のR1 は水素原子またはメチル基を表
すものとし、R2 は水素原子、メチル基、シアノ基お
よび/またはハロゲン原子を表すものとし、B1は多
塩基酸の残基を表すものとする。] で示される基で置換されており、その余のオキシラン環
含有基が、水素原子または式 【化6】 で示される基、あるいは一般式 【化7】 [ただし、式中のR1 は水素原子またはメチル基を表
すものとし、R2 は水素原子、メチル基、シアノ基お
よび/またはハロゲン原子を表すものとし、B1 は多
塩基酸の残基を表すものとする。] で示される基および/または一般式 【化8】 [ただし、式中のR1 は水素原子またはメチル基を、
R2 は水素原子、メチル基、シアノ基および/または
ハロゲン原子を表すものとする。] で示される基で置換されているものである、請求項1に
記載のエネルギー線硬化型樹脂組成物。[Claim 2] General formula [Formula 3] [However, W, X, Y and Z in the formula each represent a hydrogen atom or a group represented by the formula [Formula 4], but W, , Y and Z
shall be excluded if all of them are hydrogen atoms. ] At least one oxirane ring-containing group of the compound represented by the general formula: / or represents a halogen atom, and B1 is
It represents the residue of a basic acid. ], and the remaining oxirane ring-containing group is a hydrogen atom or a group represented by the formula [Chemical formula 6], or a group represented by the general formula [Chemical formula 7] [However, R1 in the formula is a hydrogen atom or a methyl group, R2 represents a hydrogen atom, a methyl group, a cyano group and/or a halogen atom, and B1 represents a residue of a polybasic acid. ] and/or a group represented by the general formula [Formula 8] [However, R1 in the formula represents a hydrogen atom or a methyl group,
R2 represents a hydrogen atom, a methyl group, a cyano group and/or a halogen atom. ] The energy ray-curable resin composition according to claim 1, which is substituted with a group represented by the following.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3017648A JP3019429B2 (en) | 1991-02-08 | 1991-02-08 | Manufacturing method of new energy ray-curable resin |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3017648A JP3019429B2 (en) | 1991-02-08 | 1991-02-08 | Manufacturing method of new energy ray-curable resin |
Publications (2)
Publication Number | Publication Date |
---|---|
JPH04255710A true JPH04255710A (en) | 1992-09-10 |
JP3019429B2 JP3019429B2 (en) | 2000-03-13 |
Family
ID=11949677
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JP3017648A Expired - Fee Related JP3019429B2 (en) | 1991-02-08 | 1991-02-08 | Manufacturing method of new energy ray-curable resin |
Country Status (1)
Country | Link |
---|---|
JP (1) | JP3019429B2 (en) |
-
1991
- 1991-02-08 JP JP3017648A patent/JP3019429B2/en not_active Expired - Fee Related
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