JPH0425236U - - Google Patents

Info

Publication number
JPH0425236U
JPH0425236U JP6666090U JP6666090U JPH0425236U JP H0425236 U JPH0425236 U JP H0425236U JP 6666090 U JP6666090 U JP 6666090U JP 6666090 U JP6666090 U JP 6666090U JP H0425236 U JPH0425236 U JP H0425236U
Authority
JP
Japan
Prior art keywords
die bonding
arm
fluid
heating rail
lead frame
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP6666090U
Other languages
English (en)
Japanese (ja)
Other versions
JP2536957Y2 (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1990066660U priority Critical patent/JP2536957Y2/ja
Publication of JPH0425236U publication Critical patent/JPH0425236U/ja
Application granted granted Critical
Publication of JP2536957Y2 publication Critical patent/JP2536957Y2/ja
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Landscapes

  • Die Bonding (AREA)
JP1990066660U 1990-06-22 1990-06-22 ダイボンディング装置 Expired - Fee Related JP2536957Y2 (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1990066660U JP2536957Y2 (ja) 1990-06-22 1990-06-22 ダイボンディング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1990066660U JP2536957Y2 (ja) 1990-06-22 1990-06-22 ダイボンディング装置

Publications (2)

Publication Number Publication Date
JPH0425236U true JPH0425236U (OSRAM) 1992-02-28
JP2536957Y2 JP2536957Y2 (ja) 1997-05-28

Family

ID=31599557

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1990066660U Expired - Fee Related JP2536957Y2 (ja) 1990-06-22 1990-06-22 ダイボンディング装置

Country Status (1)

Country Link
JP (1) JP2536957Y2 (OSRAM)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS574129A (en) * 1980-06-09 1982-01-09 Mitsubishi Electric Corp Die-bonding device for semiconductor element

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS574129A (en) * 1980-06-09 1982-01-09 Mitsubishi Electric Corp Die-bonding device for semiconductor element

Also Published As

Publication number Publication date
JP2536957Y2 (ja) 1997-05-28

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Legal Events

Date Code Title Description
LAPS Cancellation because of no payment of annual fees