JPH0425231U - - Google Patents
Info
- Publication number
- JPH0425231U JPH0425231U JP6777590U JP6777590U JPH0425231U JP H0425231 U JPH0425231 U JP H0425231U JP 6777590 U JP6777590 U JP 6777590U JP 6777590 U JP6777590 U JP 6777590U JP H0425231 U JPH0425231 U JP H0425231U
- Authority
- JP
- Japan
- Prior art keywords
- clamp claw
- wafer
- tip
- curved surface
- dry etching
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 210000000078 claw Anatomy 0.000 claims description 3
- 238000001312 dry etching Methods 0.000 claims description 2
Landscapes
- Drying Of Semiconductors (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6777590U JPH0425231U (bs) | 1990-06-25 | 1990-06-25 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6777590U JPH0425231U (bs) | 1990-06-25 | 1990-06-25 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH0425231U true JPH0425231U (bs) | 1992-02-28 |
Family
ID=31601652
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6777590U Pending JPH0425231U (bs) | 1990-06-25 | 1990-06-25 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH0425231U (bs) |
-
1990
- 1990-06-25 JP JP6777590U patent/JPH0425231U/ja active Pending