JPH04236419A - Liquid supply equipment - Google Patents

Abstract

PURPOSE:To obtain a liquid supply equipment capable of inspecting the supply amount of treatment liquid like resist solution, by a simple method. CONSTITUTION:Firstly, an arm 20a is made to retreat from above a nozzle- awaiting block 32 without retaining a resist nozzle 18. Secondly, an inspector takes out the resist nozzle 18 for inspecting discharge amount by hand. Thirdly the inspector makes the resist nozzle 18 discharge treatment liquid by using an operation panel. By receiving the discharged treatment liquid with a measuring cylinder or the like, the discharge amount is inspected.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a liquid supply device used, for example, in a resist coating device or a developing device.

0002

2. Description of the Related Art As a resist coating apparatus for coating a semiconductor wafer with a resist solution, one using, for example, a spin coating method is known. This process involves dropping resist liquid onto the center of a semiconductor wafer using the nozzle of a liquid ejecting device installed in the equipment, then rotating the semiconductor wafer at a predetermined number of rotations, and using the centrifugal force generated at this time, the resist liquid is applied onto the semiconductor wafer. It forms a thin film.

In such a resist coating apparatus, in order to control the thickness of the resist thin film formed on the semiconductor wafer with high precision, it is necessary to control the drop of the resist liquid onto the semiconductor wafer from the nozzle of the liquid discharging apparatus. The amount needs to be precisely controlled.

[0004] For this reason, in resist coating apparatuses, the amount of resist liquid discharged is inspected as part of maintenance work for the liquid discharge apparatus.

[0005] Conventionally, as a method for inspecting the discharge amount of resist liquid, for example, a dummy dispensing mode is used to manually raise an arm with a nozzle fixed at the tip at the nozzle standby position, and then A method is known in which, for example, a measuring cylinder or the like is held by hand under the resist liquid and the resist liquid is dropped therein. Another known method is to remove the tube that supplies the resist liquid to the nozzle and measure the discharge amount by receiving the resist liquid discharged from the tube with a measuring cylinder or the like.

[0006]

[Problems to be Solved by the Invention] However, when measuring the amount of discharged resist liquid using these methods, there is a problem in that the measurement requires a very large amount of effort.

When manually raising an arm to which a nozzle is fixed, there are mechanical restrictions on how much the arm can be raised, so there are restrictions on placing a measuring cylinder or the like below the nozzle fixed to the tip of the arm. However, the workability was poor.

[0008] Even when removing the tube from the nozzle, the work of attaching and removing it is complicated, and although it is conceivable to remove the nozzle from the arm, this similarly requires a complicated work.

In particular, with the recent increase in the degree of integration of semiconductor devices, the requirements for the precision of the thickness of the resist thin film have become stricter, so it is recommended that the discharge amount of the resist solution be inspected as frequently as possible. desirable. Therefore, there is a need for a liquid ejecting device that can test the amount of resist liquid ejected with a simple operation.

In addition, in the past, it was necessary to use the dummy dispense mode to test the discharge amount, so it was only possible to test the discharge amount after stopping the discharge for a long time. There were also constraints on the timing of discharge inspection. Particularly in recent years, processing for a wide variety of products is required, so it is necessary to eject liquid in place of the nozzle for each processing. In this case, conventionally, it was necessary to test the discharge amount using the dummy dispense mode of the nozzle that was actually fixed to the arm, and it was impossible to arbitrarily test the discharge amount of the nozzle that was removed from the arm. there were.

[0011] Furthermore, this problem is not limited to liquid discharging devices used in resist coating devices, but also applies to liquid supply devices used in other devices, such as when used in developing devices used for developing semiconductor wafers. are also common.

The present invention has been made in view of the problems of the prior art, and an object of the present invention is to provide a liquid supply device that can inspect the supply amount of a coating liquid in a simple manner. .

[0013]

[Means for Solving the Problems] The liquid supply device of the present invention includes:
One or more nozzles for supplying a predetermined amount of processing liquid to the object to be processed are placed on standby in a nozzle standby means when not in use, and the nozzle holding means automatically holds a desired nozzle in standby and brings it to a processing liquid supply position. In a liquid supply device that automatically moves and supplies processing liquid, when inspecting the processing liquid supply amount of the nozzle, the nozzle holding means does not hold the nozzle, but retracts it from above the nozzle standby means, and performs the desired operation. The present invention is characterized in that means for inspecting the amount of processing liquid supplied to the nozzle is provided.

[0014]

[Operation] According to the liquid supply device of the present invention, the nozzle holding means is first retracted from above the nozzle standby means without holding the nozzle, and then the inspector takes out the nozzle by hand and drains the processing liquid from the nozzle. By discharging the treatment liquid and receiving the discharged processing liquid with a measuring cylinder or the like, it becomes possible to inspect the discharge amount.

[0015]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment in which the apparatus of the present invention is applied to a resist coating apparatus for semiconductor wafers will be described below with reference to the drawings.

FIGS. 1 and 2 are diagrams schematically showing the configuration of the resist coating apparatus of this embodiment, and FIG. 1 is a side view;
FIG. 2 is a top view. Further, FIG. 3 is a schematic cross-sectional view showing the configuration of a nozzle standby block 32 as a nozzle standby means.

In the resist coating apparatus of this embodiment, as shown in FIG. 1, a semiconductor wafer 10 is mounted and fixed on a spin chuck 12 by vacuum suction or the like, and this spin chuck 12 is fixed to the output shaft of a motor 14. It is designed to rotate and drive.

The motor 14 is constructed of a high-performance motor with excellent acceleration, and has a flange 16 on its upper side, by which it is fixed at an appropriate position within the coating device. Note that the temperature of this flange 16 can be adjusted by a temperature controller (not shown), and is configured so as not to transmit heat from the motor 14 to the upper side.

An arm 20a holds the wafer 10 above the wafer 10 supported by the spin chuck 12.
A resist nozzle 18 for dropping a resist liquid from a substantially central position is held, and this resist nozzle 18 is movable by a scanner 20 serving as a moving mechanism.

As shown in FIG. 2, the resist nozzle 18 is connected to the semiconductor wafer 10 placed on the spin chuck 12.
For example, four bottles are provided so that they can be used depending on the type of resist liquid to be dropped. Each resist nozzle 1
8 constitutes a nozzle block 28 together with a pin 26 held by a chuck (not shown) of the arm 20a. Note that the arm 20a is moved up and down to grip the pin 26.

The resist liquid supply system to the resist nozzle 18 includes a resist liquid storage section 22 as shown in FIG.
, N2 pressurizing section 24 and a pipe 25 extending from the resist liquid storage section 22 to the resist nozzle 18. Note that the piping 25 is provided with an opening/closing valve V1, a suckback valve V2, and the like. The suckback valve V2 is a valve for pulling back the resist solution exposed at the tip of the resist nozzle 18 into the resist nozzle 18 due to surface tension after discharging the resist solution from the resist nozzle 18, and prevents the resist solution from solidifying. It is for the purpose of

Further, at the standby position of the registration nozzle 18, there is a nozzle standby block 32, as shown in FIG. It is arranged. The four nozzle insertion parts 30 formed in this nozzle standby block 32 are hollow inside, and are formed so that the inside is sealed when the tip of the resist nozzle 18 is inserted. These four nozzles 18 are each connected to the resist liquid storage section 22 by piping 25.

Note that the interior of the cavity may be made into an atmosphere of a solvent for the resist solution to prevent the resist solution at the tip of the nozzle 18 from solidifying.

[0024] Also, next to this nozzle insertion part 30,
Pin positioning holes 34 are formed for receiving the lower ends of the pins 26, respectively.

The operation of each component described above is controlled by the control section 40 shown in FIG. In the resist coating apparatus of this embodiment, resist coating on the semiconductor wafer 10 is performed under the control of the control section 40 as follows.

■ First, with each registration nozzle 18 inserted into the nozzle insertion part 30 of the nozzle standby block 32, that is, with the registration nozzle 18 in the standby position,
A semiconductor wafer 10 is carried in and placed and fixed on a spin chuck 12.

■ When the operator operates a switch (not shown) on the operation panel 42a to instruct the resist nozzle 18 to be selected and then instructs to start coating, these instructions are transferred to the connection board 44. is sent to the CPU 46 via. The CPU 46 moves the nozzle standby block 32 and the arm 20a according to the contents of the input instruction, and causes the arm 20a to grip the selected registration nozzle 18.

[0028] Subsequently, the CPU 46 raises the arm 20a, and further drives the scanner 20, so that the arm 20a moves the semiconductor wafer placed on the spin chuck 12 while still gripping the resist nozzle 18. 10
move it to the top.

■At this position, under the control of the CPU 46,
By pressurizing N2 gas, a predetermined amount of resist liquid is supplied, for example, dropped onto the semiconductor wafer 10 via the resist nozzle 18.

(2) Under the control of the CPU 46, the motor 14 is driven to rotate the spin chuck 12, and the centrifugal force generated by this rotation uniformly coats the entire surface of the semiconductor wafer 10 with the resist solution.

■When coating is completed, it is necessary to replace the wafer with the next wafer, so the CPU 46
The scanner 20 is driven to return the arm 20a to the standby position.

■ Lower the arm 20a, insert the tip of the resist nozzle 18 into the nozzle insertion part 30 of the nozzle standby block 32, set it in a solvent atmosphere, and then lower the arm 20a.
The holding of the resist nozzle 18 by 0a is released, and the process is completed. Note that the coating operation described above is just an example.
It goes without saying that various changes may be made.

Next, a method for inspecting the discharge amount of resist liquid in such a resist coating apparatus will be explained.

■ First, with each registration nozzle 18 inserted into the nozzle insertion part 30 of the nozzle standby block 32, that is, with the registration nozzle 18 in the standby position,
When the operator operates the discharge amount inspection mode switch 50 on the coat dummy dispense panel 42b (hereinafter abbreviated as panel 42b), the CPU 46 raises the arm 20a without gripping the resist nozzle 18.

[0035] Next, the CPU 46 drives the scanner 20 to move the arm 20a. Arm 20a
The position to which the arm 20a is moved only needs to be a position where the arm 20a does not get in the way when discharging the resist liquid from the resist nozzle 18 later.
As shown in , it is assumed that the cartridge is moved to a position near the intermediate position between the standby position and the discharge position, for example, to a position 52 mm away from the standby position.

■Next, the operator selects each registration nozzle 18.
From among them, insert the resist nozzle 18 whose discharge amount is to be tested from the nozzle insertion part 30 of the nozzle standby block 32.
Pull out the resist nozzle 18 by hand and support it on a graduated cylinder with the discharge port facing down. At this time, since the arm 20a has been retracted in advance to a position other than above the standby position, no hindrance occurs in the operation of extracting the registration nozzle 18. Further, since the registration nozzle 18 is removed from the arm 20a due to the original function of the device, there is no need to take the trouble of attaching and detaching the registration nozzle 18 when inspecting the discharge amount.

■Next, when the operator operates, for example, the discharge switch 52 on the panel 42b, the CPU 46
One batch of resist liquid is discharged from the extracted resist nozzle 18. The discharged resist liquid is received by a measuring cylinder, which is a measuring container, and the discharge amount can be measured.

In this embodiment, since there are four registration nozzles 18 in the nozzle standby block 32, a sensor (mechanical Alternatively, a contact sensor or a non-contact sensor such as an optical sensor may be provided, and the resist liquid may be discharged by operating the discharge switch 52 to one resist nozzle 18 from which extraction is detected. Alternatively, four discharge switches may be provided corresponding to each nozzle 18. In this case as well, an indicator supporting the switch corresponding to the extracted nozzle 18 may be displayed based on the sensor signal to prevent erroneous operation.

■The operator inserts the resist nozzle 18 that has been discharged into the nozzle insertion portion 3 of the nozzle standby block 32.
0 by hand to complete the first inspection.

■Hereinafter, regarding each resist nozzle 18,
It is also possible to test the discharge amount continuously in the same manner as in (1) to (2) above.

■Finally, the operator operates the end switch (not shown) on the panel 42b, so that the CPU 4
6 drives the scanner 20 and returns the arm 20a to the standby position.

Note that the present invention is not limited to the above-mentioned embodiments, and various modifications can be made within the scope of the gist of the present invention. For example, in this embodiment, the resist nozzle 18
Although the explanation has been given by taking a liquid ejecting device having four resist nozzles 18 as an example, the same effect can of course be obtained even when the number of resist nozzles 18 is different (eg, one).

Furthermore, the present invention is not necessarily applied to a liquid ejecting device of a resist coating device, but can be similarly applied to a liquid ejecting device of other devices such as a developing device, a magnetic paint coating device, and the like.

[0044]

As described above in detail, according to the liquid ejecting apparatus of the present invention, the amount of resist liquid ejected can be tested in a very simple manner.

[Brief explanation of the drawing]

FIG. 1 is a side view schematically showing the configuration of a resist coating apparatus according to an embodiment of the present invention.

FIG. 2 is a top view schematically showing the configuration of a resist coating apparatus according to an embodiment of the present invention.

FIG. 3 is a sectional view showing in detail the configuration of the nozzle standby block shown in FIG. 2;

4 is a block diagram showing a control circuit system of the resist coating apparatus shown in FIGS. 2 and 3. FIG.

FIG. 5 is a top view showing the retracted position of the arm when inspecting the discharge amount of resist liquid in the resist coating apparatus shown in FIGS. 2 and 3;

[Explanation of symbols]

10 Wafer 12 Spin chuck 18 Resist nozzle 20 Scanner 24 N2 Pressure part 25 Piping 26 pin 28 Nozzle block 30 Nozzle insertion part 32 Nozzle standby block 40 Control section

Claims (1)

[Claims] 1. One or more nozzles for supplying a predetermined amount of processing liquid to an object to be processed are placed on standby in a nozzle standby means when not in use, and a desired nozzle in standby is automatically held at the processing liquid supply position. In a liquid supply device that supplies a processing liquid by automatically moving the nozzle by a nozzle holding means, when inspecting the processing liquid supply amount of the nozzle, the nozzle holding means does not hold the nozzle and moves the processing liquid to the nozzle standby means. 1. A liquid supply device, comprising means for withdrawing from the nozzle and inspecting a desired amount of the processing liquid supplied from the nozzle.