JPH04236291A - Production of carbide needle-like abrasive grain - Google Patents

Abstract

PURPOSE:To efficiently produce the subject abrasive grains at a low cost by subjecting a substrate to the gaseous phase growth of a thin film of diamond, CBN, etc., and subsequently flatly dividing the thin film. CONSTITUTION:A thin film containing diamond, diamond-like carbon, CBN or BN containing CBN is allowed to grow on a substrate such as copper foil, having a width of several ten mum to several ten mm by a CVP method, PVD method or IVD method. The substrate 10 is passed through a pair of press rolls 1,2 to form cracks in the thin film in the direction orthogonal to the longitudinal direction of the substrate by the press force, thereby cutting and dividing the thin film into plural needle-like abrasive grains 14 having lengths of approximately several ten mum to approximately several ten mm and widths of approximately several mum to approximately several mm.

Description

[Detailed description of the invention]

0001

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing abrasive grains used in superabrasive grindstones, that is, ultrahard acicular abrasive grains.

0002

[Prior Art] The abrasive grains used in conventional superabrasive grinding wheels are
Natural diamonds, artificial diamonds produced by high-temperature and high-pressure methods, explosive molding methods, or CBN abrasive grains have been used.

0003

[Problems to be Solved by the Invention] Since the shape of the abrasive grains is often close to a spherical shape, the abrasive grains tend to fall off from the bonding material during grinding. Also, the shape of natural diamonds cannot be controlled. In order to solve this problem, rod-shaped diamonds are used, which are made by dividing a large-diameter diamond into a plurality of flat plates, and then cutting the flat diamonds into fine pieces two-dimensionally, but this method is inefficient. Further, there was a problem that manufacturing costs were high.

0004

[Means for solving the problem] Step (A) of vapor phase growth of diamond, diamond-like carbon, CBN, or CBN-containing BN thin film, and dividing the diamond, diamond-like carbon, CBN, or CBN-containing BN thin film in a plane. Consisting of step (B), the above (A),
Produce in the order of (B).

[0005]

[Operation] A diamond, diamond-like carbon, CBN, or CBN-containing BN thin film is formed on a substrate by vapor phase synthesis, and this diamond, diamond-like carbon, CBN, or CBN-containing BN thin film is divided planarly. Since diamond or CBN is formed into a flat plate from the beginning, there is no need to divide it into flat plates, improving work efficiency and reducing manufacturing costs.

[0006]

[Embodiment] An embodiment of the present invention will be explained based on the drawings. As shown in FIG. 1, it has a width of several tens of μm to several tens of mm,
For example, the surface of the long and thin copper board 10 may be coated with CVD or PVD.
Diamond, diamond-like, CBN, or CBN with a film thickness of several nanometers to several millimeters by the method or IVD method.
A thin film 11 containing BN is formed. Next, as shown in FIG. 2, when the substrate 10 is passed between two pressure rollers 12,
Due to the pressing force of the pressure roller 12, slack is created in the thin film 11 in a direction perpendicular to the longitudinal direction of the substrate 10, and the length is several tens of microns.
It is cut, ie, divided, into a plurality of needle-shaped abrasive grains with a width of several nanometers to several tens of mm and a width of several nanometers to several millimeters. As a method for dividing the thin film 11, protrusions 13 are formed on the surface of the substrate 10 as shown in FIG.
are formed in a direction perpendicular to the longitudinal direction of the substrate 10, and the projections 1
It is also possible to form a thin film 11 on the surface of the substrate 10 on which 3 is formed, form a recess on the back surface of the thin film 11, and divide the thin film 11 at the recessed part by bending the thin film 11. Alternatively, the thin film 11 may be cut into pieces using a laser cutter. Furthermore, as shown in FIG. 4, a resist (for example, ultraviolet curing resin) is applied to the substrate 10 on the opposite side of the thin film 11, and this resist is irradiated with light (ultraviolet rays) through a mask to remove the parts 30 other than the parts cured by the light. The diagonally shaded portion 31 of the substrate 10 is melted with a corrosive agent, and when the substrate 10 is melted, the thin film 11 is bent to produce a super hard acicular abrasive grain with a substrate. By dividing in this way, the shape of the abrasive grains can be controlled freely. In either case, the abrasive grains may be used with the substrate 10 attached, or may be used with the substrate 10 removed. The removal of the substrate 10 is performed using a corrosive agent.
This is done by melting. Furthermore, in either case, since the flat thin film 11 is formed from the beginning, the dividing operation becomes easy. In addition, in the above-mentioned embodiment, an example was described in which the thin film was divided in the left-right direction using a substrate 10 that was wide in the left-right direction and narrow in the front-back direction, but as shown in FIG. By using the substrate 10 and dividing the thin film in the left-right direction and the front-back direction, a large number of ultra-hard acicular abrasive grains can be obtained.

As shown in FIG. 6, acicular abrasive grains 14, a binder 15 made of phenolic resin, and an additive made of chromium oxide are mixed and formed into a billet. The billet-shaped material is rolled out into a plate shape by two rolling rollers 16 and cut into a plurality of pieces. The cut pieces are stacked together, and multiple stacked pieces are prepared and rolled repeatedly. When the abrasive grains 14 are aligned in one direction by rolling, they are cut into chips and fired at about 140 degrees to obtain the grindstone material 20.

As shown in FIG. 7, the grindstone material 20 is
The needle-shaped abrasive grains 14 are arranged in segments on the end face of the disk-shaped grindstone base 21 so that the longitudinal direction thereof is perpendicular to the grinding surface, and fixed with a bond 22 or the like. By adopting the above steps, a superabrasive grindstone in which the needle-shaped abrasive grains 14 are aligned in a direction perpendicular to the grinding surface is manufactured.

Surface grinding of a workpiece is performed while rotating the superabrasive grindstone manufactured in this manner. Although the whetstone wears in the direction perpendicular to the grinding surface, since the abrasive grains 14 are arranged so that the longitudinal direction is perpendicular to the grinding surface, the abrasive grains 14
There are many parts where the abrasive grains 14 are held by the binding material 15, and the abrasive grains 14 do not fall off easily.

0010

As described above, the present invention provides a step (A) of vapor-phase growth of diamond, diamond-like carbon, CBN, or CBN-containing BN thin film on a substrate of a carbide tip. Since the production was performed in the order of step (B) of dividing CBN or CBN-containing BN thin film into flat plates, there is no need to divide diamond, diamond-like carbon, CBN, or CBN-containing BN thin film into flat plates, improving work efficiency. . Moreover, the effect of reducing manufacturing costs can be obtained.

[Brief explanation of the drawing]

FIG. 1 is a diagram showing a state in which a diamond thin film is formed on a substrate.

FIG. 2 is a state diagram in which a diamond thin film is divided by a pressure roller.

[Figure 3] Another modification example in which a diamond thin film is divided using indentations.

FIG. 4 shows another variation in which a diamond thin film is divided using a corrosive agent.

FIG. 5 shows another modification example in which the diamond thin film is divided into left-right and front-back directions.

FIG. 6 is a process diagram for manufacturing a grindstone material.

FIG. 7 is a diagram showing a state in which the whetstone material is fixed to the whetstone base.

[Explanation of symbols]

10　Substrate 11 Diamond thin film 14 Abrasive grain 15 Binding material 20 Whetstone material 21 Whetstone base

Claims (1)

[Claims] 1. Step (A) of vapor phase growth of diamond, diamond-like carbon, CBN, or CBN-containing BN thin film on a substrate; and step (A) of planarly dividing this diamond, diamond-like carbon, CBN, or CBN-containing BN thin film. B), and the above (A)
, (B). A method for producing ultra-hard acicular abrasive grains.