JPH0423436B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an automatic insertion device for electronic components onto a printed circuit board, which automatically inserts circuit elements such as integrated circuits, semiconductor elements, resistors, and capacitors into predetermined positions on the printed circuit board. .

As such an automatic insertion device for electronic components onto a printed circuit board, the applicant has proposed a table that places a printed circuit board on which a predetermined electronic component is to be mounted at a predetermined position and moves in the X and Y directions. A large number of cassettes loaded with various types of electronic components are installed,
A cassette loading section that selectively discharges predetermined electronic components from a predetermined cassette, and a cassette loading section that receives the electronic components supplied from the cassette loading section, corrects the shape, posture, etc. of the pins, and corrects the tip of the pins. A correction cutting section that cuts the electronic component into a V-shape, and an insertion section that receives the corrected cut electronic component, grasps its pin, and inserts it into a hole drilled at a predetermined position in the printed circuit board placed on the XY table. The position information of each insertion position is read by tracing the electronic component insertion position of the printed circuit board using the light irradiated onto the printed circuit board along the insertion axis of this insertion part, and storing this information. Information representing the type of electronic component to be inserted is stored, and during actual insertion, the stored position information is read out and the XY table is driven so that the predetermined insertion position of the printed circuit board coincides with the insertion axis of the insertion section. a control section that controls the cassette loading section by reading out information representing the type of the electronic component to be inserted, and controls the cassette loading section to selectively eject a predetermined electronic component from a cassette loaded with the predetermined electronic component; We are developing something that has the following.

This automatic insertion device ejects the pre-stored IC from the cassette loading section in the copying mode, shapes its pins at the correction cut section, and then inserts them into the printed circuit board at the insertion section.
This is done one IC at a time. That is, when the insertion of a certain IC is completed, the next IC is ejected. This device only has a correction cut section between the cassette loading section and the insertion section.
Processing capacity will not decrease much even if ICs are processed one by one, but if a processing section such as a defective reject section or a polarity detection inversion section is provided between these sections, the IC processing in these sections will be reduced. The total time will be quite long and the processing speed will be significantly reduced. On the other hand, when trying to increase the processing capacity, the residence time of ICs in each part becomes shorter, making it difficult to perform appropriate processing and resulting in a decrease in the proper insertion rate. One possible way to eliminate these drawbacks is to process ICs simultaneously in each processing section, but the processing time for each processing section is different, and if the ICs are immediately transferred to the next processing section after processing, the processing time will be long. Because the IC gets stuck in the processing part,
In this case, it is necessary to determine the timing for transporting the IC according to the processing portion that takes the longest processing time.
However, in this case, in a processing section with a short processing time, the IC needs to be held for a predetermined period of time even after the required processing of the IC has been completed, resulting in a reduction in processing capacity.

In view of the above-mentioned points, an object of the present invention is to make it possible to perform appropriate processing by making the processing time in each processing section sufficiently long, thereby increasing the appropriate insertion rate, and further improving the processing capacity. It is an object of the present invention to provide an apparatus for automatically inserting electronic components into a printed circuit board, which is suitably configured and arranged so as to improve the performance of electronic components.

The present invention corrects or cuts the pins of the electronic component so that it can be easily inserted into the hole formed in the printed circuit board while the electronic component is being transported along the transportation route. In the automatic insertion device for electronic components into printed circuit boards, which automatically inserts electronic components into holes drilled at predetermined positions, a stopper removably provided in the transport path;
A suction means is provided near the stopper and in front of the electronic component in the conveyance direction, and the suction means is intermittently operated to decelerate the electronic component sliding along the conveyance path. The device is characterized by being provided with a stopping mechanism that is brought into contact with a stopper and stopped.

Furthermore, the present invention corrects or cuts the pins of the electronic component so that it can be easily inserted into the hole drilled in the printed circuit board while the electronic component is being transported along the transport route. In an automatic insertion device for electronic components into a printed circuit board, which automatically inserts electronic components into holes drilled at predetermined positions of the printed circuit board, a stopper is provided in the transport path so as to be freely insertable and removable;
It has a suction means and an air jetting means provided near the stopper and before the electronic component in the conveyance direction,
The suction means is operated intermittently to decelerate the electronic component sliding along the conveyance path, and the air flow jetting means blows out an air flow to press the electronic component against the stopper. The device is characterized in that it is provided with a stop mechanism that positions and stops the device.

The present invention will be described in detail below with reference to the drawings.

FIG. 1 is an external view showing the configuration of an example of an apparatus for automatically inserting electronic components into a printed circuit board according to the present invention, in which FIG. 1A is a front view, FIG. 1B is a side view, and FIG.
Figure C is a plan view. The cassette loading section 1a is tilted downward toward the front, and 96 cassettes 2 can be loaded there horizontally, as shown in the side view.
It is stacked in 10 layers. As will be described later, ICs of the same type are loaded in each cassette side by side, and ten cassettes 2 containing the same ICs can be stacked vertically and stored in the cassette holder. In the bottom cassette, the IC falls toward the front due to gravity. Further, the empty cassette 2 falls downward from the cassette holder and accumulates in the cassette receiver. The ICs selectively ejected from the cassette 2 fall into the horizontal IC transport section 1b. An endless belt 3 is disposed in the conveying section 1b as shown by the dotted line in FIG. 1A, and is constantly rotating as shown by the arrow during the insertion operation. The IC that has fallen from the cassette loading section 1a is sent to the left in FIG. 1A by this belt 3 and enters the processing section 1c. As will be described later, this processing section 1c performs such operations as rejecting defective products, correcting the position and shape of the IC pin, cutting the tip into a V-shape, and reversing polarity detection. The IC processed in this manner is then sent to the insertion section 1d, where the pins of the IC are grasped by the insertion head, and the pins are lowered toward the printed circuit board and inserted into the holes in the printed circuit board. The printed circuit board is placed on the XY table 1e, clamped by a clamping device described later, and
Driven by a motor. The amount of movement in the X and Y directions is read on a linear scale. Furthermore, an operation panel 1f is provided to perform various controls such as copying control operations. This operation panel 1f is attached to a vertical shaft so that it can be rotated, so that it can be set at a position that is easy to operate.
Further, a power supply, a control circuit, a drive circuit, an air valve, etc. are housed in the desk portion 1g.

FIG. 2 is a diagram schematically showing the overall structure of the automatic insertion device shown in FIG.
1a, one cassette loading mechanism is shown in slightly more detail as a side view. Ten cassettes 2 are stacked vertically and loaded, and the ICs loaded in the lowest cassette are sequentially discharged onto the conveyor belt 3. This IC ejecting mechanism 4 will be explained in detail later. The IC ejecting mechanism 4 is provided with a cassette ejecting section 4a and an IC ejecting section 4b, and also includes a photoelectric detector 4c, which is indicated by a cross mark.
4d is provided. The belt 3 of the IC transport section 1b is stretched between rollers 5a and 5b, and a motor 5c is connected to the roller 5a. This motor is always energized during the insertion operation of the device. A rail 6a inclined at an angle of approximately 45° is provided in the IC processing section 1c, and along this rail, a defective product reject mechanism 6b, a correction mechanism 6c,
A cassette mechanism 6d, a polarity detection mechanism 6e, and a reversing mechanism 6f are provided. Furthermore, gate mechanisms 6g to 6i are provided between each processing mechanism, and
IC detectors 6j to 6n are provided. The gate mechanisms 6g to 6i are intended to compensate for differences in processing time between the processing mechanisms and to increase the transport speed between the processing mechanisms, thereby improving the processing speed.

The insertion section 1d includes a retract movement mechanism 7a above the printed circuit board, a vertical movement mechanism 7b for the insertion head that grips the IC, and a movement mechanism 7b for moving the insertion head around the insertion axis.
A rotating mechanism 7c for rotating the insertion hole by 90 degrees, a pair of light sources 7d for positioning the insertion hole, an optical path switching mechanism 7e for switching the optical paths of these light sources, and a mechanism 7f for moving the clinch table up and down below the printed circuit board. A mechanism 7g for rotating the clinch table, a mechanism 7h for bending the IC pin, a mechanism for detecting a predetermined insertion position of the IC pin on the printed circuit board and the insertion of the IC pin, etc. are arranged. XY table 1e has ball screw 8
a, 8b in the X and Y directions by an X-axis motor 8c and a Y-axis motor 8d, respectively, and an X scale 8e and a Y scale 8f are provided to detect the amount of movement thereof.
A mechanism for detachably mounting a printed circuit board 9 is also provided on the XY table 1e.

FIG. 3 is a perspective view showing the structure of an example of a cassette 2 for storing an IC, and the entire structure is a molded plastic body. A trapezoidal projection 2a is formed on the bottom, and when the IC 10 is placed on this, the pin 10a of the IC 10
enters into the groove formed between the protrusion 2a and the side wall. The upper part is narrowed to form an opening 2b through which characters, symbols, etc. written on the upper surface of the IC 10 can be seen.

Cassette Loading Section FIG. 4A is a plan view showing an example of the structure of the IC ejecting mechanism 4 of the cassette loading section 1a, FIG. 4B is a side view, and FIG. 4C is a perspective view of the rail portion.
The IC ejection mechanism 4 of this example has a thin and flat shape as a whole, so that the width does not become too large even when a large number of mechanisms are arranged.
FIG. 4A also shows the cassette 2 into which the IC 10 is inserted. That is, one end of these cassettes 2 is attached to a cassette holding frame 11 having a U-shaped cross section.
The other end is held by a similar holding frame as shown in FIG. 1B. Cassette holding frame 11
The upper end of the cassette flares outward to facilitate insertion of the cassette. An opening 11a is formed at the lower end of the cassette holding frame 11, as shown in FIG. 4B, so that the IC 10 inserted into the cassette 2 can be sent to the rail 12 of the IC ejecting mechanism 4. rail 1
2 includes a protrusion 12b in which a groove 12a is formed in the longitudinal direction, and a base 12c integral with the protrusion 12b, as shown in FIG. 4C. This rail 12 is
It is attached to the board 13 of the IC ejecting mechanism 4 with screws together with a printed circuit (not shown).

First, a mechanism for sequentially ejecting the IC cassettes 2 from the cassette holding frame 11 starting from the lowest one will be explained. A first solenoid 14 is fixed to a base plate 13, and its plunger 14a is fixed to one end of a first lever 16 rotatably arranged around a shaft 15. A projecting piece 1 is provided below the first lever 16.
Form 6a. A second lever 18 is rotatably fixed to a shaft 17 implanted in the substrate 13, and the first lever 1 is inserted into a long hole 18a formed in the second lever 18.
Pass the pin 19 planted in 6. A locking piece 18b is provided at the lower end of the second lever 18 and is bent in a direction perpendicular to the plane of FIG. 4, so that the lower surface of the cassette 2 is locked with this locking piece. A tension coil spring 22 is installed between a pin 20 fixed to the first lever 16 and a pin 21 fixed to the substrate 13, and the lever 16 is rotated around the shaft 15 in a direction opposite to the direction of the arrow shown. change. This rotation is restricted by a stopper pin 23 fixed to the substrate 13. A tension coil spring 25 is also stretched between the second lever 18 and a pin 24 provided on the base plate 13, and the second lever 18 is rotated about the shaft 17 in a direction opposite to the arrow. This rotation is also limited by the stopper pin 23.

The state shown in FIG. 4A shows a state in which the lowermost cassette 2A is locked by the locking piece 18b of the lever 18, and the IC 10 is housed in the cassette shown in cross section. After all the ICs in the cassette 2A have been ejected, the cassette 2A is dropped from the cassette holding frame 11. For this purpose, the light source 26 of the first IC detection device is placed in the middle of the rail 12.
a and the light receiver 26b are arranged. When there is no IC at the position of this detection device, the light emitted from the light source 26a passes through the hole 12d formed in the rail 12 and is directly received by the light receiver, thereby detecting the absence of the IC. When the solenoid 14 is energized by this detection output and the plunger 14a is moved in the direction of the arrow, the lever 16 rotates around the shaft 15 in the direction of the arrow, and the protrusion 16a of this lever moves to the second position from the bottom. It enters into the internal cavity of the protrusion 2a of the cassette 2B and holds the cassette 2B. At the same time, long hole 1
The lever 18 is moved to the shaft 1 by the cooperation of the pin 8a and the pin 19.
7 in the direction of the arrow, and the locking piece 18b escapes from the cassette holding frame 11. Therefore, the lowest cassette 2A falls due to gravity. When the solenoid 14 is deenergized after a predetermined period of time, the action of the springs 22 and 25 causes the levers 16 and 18 to return to the state shown in FIG. At this time, the engagement between the cassette 2B and the projecting piece 16a is disengaged, and the cassette 2B falls, but the locking piece 18b of the lever 18 enters into the cassette holding frame 11 again and is thereby locked. In this way, the cassettes 2 can be dropped from the cassette holding frame 11 in sequence starting from the lowest cassette 2. A cradle is provided below the cassette loading section 1a to receive a dropped cassette.

As clearly shown in FIG. 4B, a groove 11b is formed in the cassette holding frame 11. Through this groove, the tip of the actuator 27a of the micro switch 27 protrudes as shown by the chain line in FIG. The second detection is performed. When only one cassette remains in the cassette holding frame 11, the actuator 27a is driven, a detection signal is output from the micro switch 27, and the lamp 28 is thereby turned on. Therefore, the worker can replenish the cassettes by seeing the lamp 28 lit.

Next, a mechanism for ejecting ICs 10 one by one will be explained. A second solenoid 29 is fixed to the base plate 13, and the plunger 29a is connected to a lever 31 arranged so as to be rotatable about a shaft 30.
This lever 31 has a locking piece 3 extending vertically downward.
Form 1a. In the state shown in FIG. 4A, the locking piece 31
The tip of a extends into the groove 12a of the rail 12. Shaft 3 implanted on the lower surface of lever 31 and base plate 13
2 and the lever 33, and this lever 3
The left end of 3 is bent vertically downward to form a locking piece 33a, and the right end is formed into an arc shape so that it can rotate around the shaft 32. This lever 33 and pin 2
A tension coil spring 34 is stretched between the lever 31 and the shaft 32 to bias the lever 33 toward the lever 31 and the shaft 32.

In the state shown in FIG. 4A, the leading IC 10A is locked by the locking piece 31a of the lever 31. When the solenoid 29 is energized, the lever 31 rotates in the direction of the arrow around the shaft 30, and the locking piece 3 of the lever 31
1a retreats above the rail 12, and the first IC1
0A is discharged in the direction of the arrow. At the same time, the lever 33 is pushed by the right end 31b of the lever 31,
The locking piece 3 rotates about the shaft 32 in the direction of the arrow.
The tip of 3a contacts the surface of the next IC 10B and holds this IC. In this case, the lever 33 is separated from the shaft 32 in order to escape the slight rotation of the lever 31 after the tip of the locking piece 33a contacts the IC. After the ejection of the first IC 10A is detected by the light source 35a and the light receiver 35b placed in the hole 12e drilled in the rail 12, when the solenoid 29 is deenergized after a predetermined period of time has elapsed, the levers 31 and 33 are activated by the action of the spring 34. Figure 4A
The state shown in is restored, and the IC column is moved one space to the left. In reality, the rail 12 is approximately
It is installed at a 45° angle.

By selectively energizing the solenoid 14 as described above, the cassettes 2 loaded in the cassette holding frame 11 can be sequentially ejected from below. Each of the cassette holding frames 11 of this example includes
Cassette 2 loaded with all the same type of IC10
Since 10 cassettes can be loaded at a time, there is no need to change cassettes frequently, greatly improving work efficiency. Further, since the cassette holding frames 11 are arranged horizontally, and the cassettes 2 are stacked vertically within each holding frame, the overall size of the cassette loading section 1a is not very large, and the operability is improved. It's going to be very good. Furthermore, by selectively energizing the solenoid 29, IC10
The ICs 10 thus delivered from the cassette 2 are sent to the conveying section 1b, where they are placed on the belt 3 and sent to the processing section 1c.

The proper insertion rate when incorporating electronic components such as ICs, semiconductor elements, resistors, and capacitors into printed circuit boards is mainly determined by the position and quality of the pins of the components. Therefore, in order to improve the proper insertion rate, it is desirable to correct the pin before insertion, and as in the present invention, it is desirable to correct the pin before insertion.
Correcting the pin before insertion is essential in achieving a proper insertion rate of 99% or higher. Defective pin shapes include cases where the pin 10a is bent in the longitudinal direction and cases where the pin is bent in the width direction, as shown in FIGS. 5A and 5B.
These bends may occur simultaneously. Furthermore, the tips of the pins are cut into a V-shape as shown in FIG. 5C so that the tolerance between the pin position and the hole position can be as large as possible.

In this example, a defective product reject mechanism 6b is provided which removes the pin from the processing section 1c if the pin is bent by a predetermined value or more before such correction cutting is performed. By picking out defective products in advance in this way, subsequent processing can be carried out reliably, and the structure of the processing mechanism can also be made relatively simple.

6A and 6B are a plan view and a side view showing the configuration of an example of a defective product reject mechanism;
Figures C, D, and E are a longitudinal sectional view, a horizontal sectional view, and a longitudinal sectional view showing the configuration of the main parts. The main part of the reject mechanism is built into the rail 6a of the processing section 1c, and this main part includes the rail 6a.
A fixed rail portion 40 is fitted and fixed in a hole drilled in the hole so as to be flush with the rail 6a, and a pair of shafts 41a, 41b and a bearing are fitted in a long hole drilled in the fixed rail portion. 42a and 42b, the movable rail section 43 is attached to the fixed rail section 40 so as to be movable up and down, and the movable rail section 43 is mounted above the rail 6a as clearly shown in FIG. As shown in FIG. 6A, a deflector plate 44 is arranged at an angle of about 45°, and a storage box 45 is provided to store defective ICs that are thrown out of the rail by hitting the deflector plate. A block 47 is attached to the lower ends of shafts 41a and 41b screwed onto the movable rail portion 43 by nuts 46a and 46b.
The plunger 48a of the air cylinder 48 is fixed to this block with a screw 48b.
Air cylinder 48 is attached to the lower surface of stationary rail section 40 by screws 48c and 48d. The plunger 48a of the air cylinder 48 moves upward as shown by the arrow, thereby causing the movable rail portion 43 to move upward as shown by the chain line in FIG. 6E. U-shaped side plates 49a and 49b extending above the rail are fixed to both sides of the block 47 with screws.
A fixing plate 50 is fixed to the upper ends of a and 49b, and a lid 50b is rotatably attached to this fixing plate via a hinge 50a. This lid 50b is shown in FIGS. 6B and E.
By rotating in the direction shown by the arrow, you can put your hand into the movable rail part 43, and in case of an emergency,
Even if an IC gets stuck in the defective product reject section, it can be removed. Movable rail section 43 and lid 50
Since the lid 50b is connected through the side plates 49a, 49b, the block 47, and the shafts 41a, 41b, when the movable rail section moves upward, the lid 50b also moves upward as shown by the chain line in FIG. 6E.

The interval between the rows of holes drilled in the IC printed circuit board 9 is approximately 7.62
cm ³ (0.3 inch), and in the defective product reject mechanism of this example, the minimum interval Wmin of the IC lead wires 10a shown in Figure 5B is 7.24 cm ³ or less or the maximum interval
Items with a Wmax of 10.80 cm ³ or more are determined to be defective and are discharged outside the rail. A regulation plate 51a is provided on the side of the rail 6a to regulate the maximum distance.
and 51b, and the distance between the mutually opposing inner surfaces of these regulating plates is set to the maximum distance of 10.80
Let it be ^cm3 . Further, the regulation plate 51a of the fixed rail portion 40
and 51b are formed as regulating surfaces 40a and 40b, and the interval between these regulating surfaces is made equal to the minimum interval of 7.24 cm ³ . The IC introduction side parts 51c and 51d of the regulation plates 51a and 51b are bent outward, and the regulation surfaces 40a and 40b are
The IC introduction side ends 40c and 40b are tapered inward to widen the IC introduction opening.

Maximum distance Wmax and minimum distance between lead wires 10a
When a good IC10 whose Wmin falls within the above-mentioned limit values of 10.80 cm ³ and 7.24 cm ³ is conveyed to the defective reject mechanism from the right to the left as shown by the arrow, these lead wires is the regulation plate 51
Since it can pass through the gap defined by a, 51b and the regulating surfaces 40a, 40b, it passes through the reject mechanism as it is and is sent to the next gate section 6g (FIG. 2). On the other hand, a defective IC1 in which at least one of the maximum interval and minimum interval is outside the above limit value.
When 0 is introduced, the lead wire 10a comes into contact with at least one of the ends 51c, 51d of the regulating plates 51a, 51b or the ends 40c, 40d of the regulating surfaces 40a, 40b, and is retained within the reject mechanism. This IC 10 is detected by three photoelectric detection devices arranged in the IC transport direction, and when it is detected that the IC is retained in the reject mechanism for a predetermined time or more, an ejection signal is generated to drive the air cylinder 48. . As a result, the movable rail portion 43 rises, and the defective IC 10 above it also rises. The tip of the lead wire 10a of this IC is the regulation plate 51a,
51b or the regulating surfaces 40a, 40b.
The IC slides on the movable rail 43 due to gravity (actually, the rail is inclined), hits the deflection plate 44, and is stored in the storage box 45. In this way, defective ICs can be ejected from the rail,
After ejection, the air cylinder 48 is returned to its original position, the movable rail section 43 is returned to the same position as the fixed rail section 40, and preparations are made for the next IC to be transported.

The defective IC that has been moved upward together with the movable rail section 43 falls due to gravity and enters the storage box 45;
In order to increase the falling speed and ensure the fall, airflow is blown onto the IC in the discharge direction. Furthermore, the defective IC is located on the movable rail section 4.
A lid 50b is provided to prevent the IC from popping out when moving upward with 3, and this lid 50b can be opened and closed freely, so that even if the IC gets stuck in the reject mechanism, it can be easily removed by hand. It's like this. Further, the redirected IC can be reused by reinserting it into the cassette 2 after straightening the lead wire 10a.

Gate Mechanism FIG. 7 shows the configuration of an example of a gate mechanism disposed as a stop mechanism between each operating mechanism of the processing section 1c, FIG. 7A is a front view, and FIGS. 7B and C are The side view, FIG. 7D, is an enlarged sectional view.
A board 55 is attached to the rail 6a, a solenoid 56 is fixed to this board, and the plunger 56a is pivotally connected to a substantially L-shaped stop lever 58 that is rotatably arranged around a shaft 57.
is rotated as shown by the chain line in FIG. 7A. A tension coil spring 5 is attached to the stopper lever 58.
9 and pivot the lever about axis 57 in the direction opposite to the direction of the arrow shown. This rotation is limited by a stopper pin 59a. As clearly shown in FIGS. 7B and 7C, a narrow locking piece 58a is provided at the free end of the stopper lever 58, and is positioned above the rail 6a. On rail 6a
An air suction port 60 is formed in front of the IC stop position,
This is connected to a vacuum source via a pipe 60a so that air can be continuously sucked. In FIG. 7A, the IC 10 sent from the right side is decelerated by continuous air suction when passing through the air suction port 60, and then collides with the locking piece 58a of the stopper lever 58 and stops. A photoelectric detection device consisting of a light source 61a and a light receiver 61b is provided to detect whether or not the IC 10 is present in the gate mechanism.
When the solenoid 56 is energized at a predetermined timing, the stopper lever 58 rotates against the force of the spring 59, and the locking piece 58a is disengaged from the IC 10. Since the rail 6a is arranged at an angle,
IC10 begins to slide down on the rail due to the action of gravity, but in order to accelerate the IC10,
An air outlet 62 is provided above the pipe 6.
It is connected to a pressure source via 2a. Further, as shown in FIG. 7D, the locking piece 58a of the stopper lever 58
Side plates 54 are installed on both sides of the rail 6a to prevent the IC from coming off the rail 6a when the IC 10 collides with the rail 6a.
a, 54b are attached, a fixed plate 63b is fixed to the side plate 54b via a block 63a, a movable plate 63d is connected to the upper edge of this plate via a hinge 63c, and a lid 64 is fixed to this movable plate. . In this way IC10
can be prevented from falling off the rail 6a, and even if the IC 10 should become jammed in the gate mechanism, the jammed IC can be easily taken out by rotating and opening the lid 64.

According to the gate mechanism described above, the IC can be transported to the next stage at high speed at any desired timing, and the IC can be transported to the next stage at any desired timing.
Since the IC can be decelerated just before colliding with the locking piece 58a, the shock of collision with the locking piece 58a is small even if the conveyance speed is high as described above, and this prevents the IC from falling off the rail or being damaged. There is no fear that it will.

Correction Cutting Mechanism Good ICs that have passed through the defective reject mechanism described above are sent to correction cutting mechanisms 6c and 6d, where the leads are corrected and the ends of the lead wires are cut into a V-shape. As described above, the bending and V-shaped cutting of the lead wire have conventionally been performed using completely separate devices, but in this example, only one device is used to selectively perform the straightening and cutting or only the straightening. As a result, the entire device can be made compact, and it can perform both straightening and cutting, or just straightening, depending on the user's request, thereby preventing unnecessary wear on the cutter blade. It can be prevented. It is not possible to just cut the lead without straightening it, but this is because cutting without straightening it will put unnecessary stress on the IC at the base of the lead.

8A and 8B are views of the overall configuration of the correction cutting mechanism as viewed from the IC transport direction and a direction perpendicular thereto, respectively, and FIG. 9 is an exploded perspective view similarly showing the overall configuration. Further, detailed views of each part are shown in FIGS. 10 to 15.

First, referring mainly to FIG. 10, a configuration for vertically movably supporting the movable rail portion 70 will be described.
Long rods 71a, 71 are attached to the lower end of the movable rail part.
b, and attach these rods to the fixed blade 7.
2. Fixed blade mounting pedestal 73 and board 74
It penetrates through the hole drilled in the. Rod 71a, 71
A collar 75a is provided on the part protruding from the substrate 74 of b.
75b is fixed by screws 76a and 76b, and adjustment screws 77a and 77b are passed through the lower end of the rod to adjust the vertical stroke. Bracket 78 with each of these adjustment screws divided into two parts
a, 78b, and lock screws 78c, 78d.
to allow it to be fixed. Color 75a, 7
Compression coil springs 79a, 79b are provided between the adjustment screws 77a, 77b, respectively, and bias the rods 71a, 71b, and therefore the movable rail portion 70, upward. This upward movement (up to 6 cm ³ )
is limited by the rail portion 70 hitting the adjacent rails on both sides. When the pressing head 80 shown above the movable rail section 70 in FIG. 10 is driven downward by a mechanism to be described later, the movable rail section 70 is displaced downward together with the IC thereon. The amount of displacement is collar 75a, 75b
lower surfaces 75c, 75d and adjustment screws 77a, 77b
It is defined by the distance between the upper surfaces 77c and 77d. Therefore, after loosening the lock screws 78c and 78d and expanding the brackets 78a and 78b,
Adjust the adjusting screws 77a and 77b to adjust the upper surface 77.
The vertical movement stroke of the movable rail portion 70 can be adjusted by adjusting the heights of the movable rail portions 77d and 77d.

As shown in FIG. 10, the holes drilled in the fixed blade 72 are inserted into pins 81a and 81b planted in the pedestal 73 to position the fixed blade 72 in a horizontal plane, and further between the fixed blade 72 and the pedestal 73. Gap adjustment spacer 82 as shown in FIG.
a, 82b, and tighten the tightening screws 83a, 83b.
It is fixed to the pedestal 73 by. Further, after inserting pins 84a and 84b, which are implanted in the substrate 74, into the holes of the pedestal 73, the pedestal is fixed to the substrate with screws 84c and 84d.

FIG. 11 is a bottom view clearly showing the structure of the stroke adjustment mechanism described above. Also the first
As shown in the center of Figure 1, a rectangular hole 7 is formed in the substrate 74.
4a is drilled, and below this hole is a case 8 that stores the chips generated when cutting the lead wire.
5, its flanges 85a, 85b as frame 86a,
It is detachably provided so as to be inserted into the space between 86b and the lower surface of the substrate 74.

Next, referring mainly to FIGS. 9 and 12, the pressing head 8 is placed above the movable rail section 70.
The drive mechanism of 0 will be explained. A pair of posts 87a, 87b are vertically attached to the board 74, a U-shaped frame plate 88 is fixed to the upper ends of these posts, and an air cylinder 89 is attached to this frame plate with screws 90a, 90b.
Attach by. Further, shafts 92a and 92b are fixed to the frame plate 88 via a pair of bearings 91a and 91b, and these shafts are connected to holes 80 formed in the pressing head 80.
a and 80b to guide the press head 80 so as to be movable in the vertical direction. Further, the pressing head 80 is fixed to the plunger of the air cylinder 89 with a screw 80c. Therefore, by driving the air cylinder 89, the pressing head 80 is moved to the shafts 92a, 92.
It can be moved up and down along b. Further, according to the above-described configuration, in the event that the IC should
0 and the press head 80, the frame plate 88, the air cylinder 89 attached thereto, and the press head 80 can be removed by removing the screws 88a and 88b that fix the frame plate 88 to the posts 87a and 87b. Since the upper part can be opened, a stuck IC can be easily taken out, and maintenance and inspection can be performed very easily.

Next, a stopper mechanism for stopping an IC sliding on the rail 6a on the movable rail portion 70 will be explained. FIG. 13 is a plan view with the pressing head 80 and its associated drive mechanism removed;
As shown by the arrow on the movable rail section 70, the lead wire at the top of the IC, which is conveyed from the bottom of the drawing in FIG. 13, is brought into contact with needle-shaped stopper pins 95a and 95b and stopped. . In order to insert and remove these stopper pins into and out of the running path of the IC lead wire, one end of the stopper pins is connected to plungers 96c and 96d of solenoids 96a and 96b, respectively. As shown in FIG.
Although it is eccentric with respect to d, this is a placement problem and has no particular meaning.

As shown most clearly in FIG.
97b, 97c, and 97d are fixed, plates 98a and 98b are fixed to these arms, and solenoids 96a and 96b are attached to these plates.
Further, second plates 100a, 100b are attached to the plates 98a, 98b via spacers 99a, 99b, 99c, 99d. Plungers of solenoids 96a and 96b are holes drilled in spacers 99a and 99b, and plates 10
It protrudes through holes drilled in holes 0a and 100b, and stopper pins 95a and 95b are eccentrically attached to the ends thereof. Further, tension coil springs 102a, 102b are provided between the tips of plungers 96c, 96d and plates 101a, 101b to bias stopper pins 95a, 95b in a direction closer to the lead wire passage. Therefore, FIGS. 12 and 13 show a state in which the solenoids 96a and 96b are deenergized and the stopper pins 95a and 95b are projected into the lead wire passage by the force of the springs 102a and 102b.
When the stopper pins 95a and 95b are projected into the lead wire passage in this manner, the lead wire of the IC sliding on the rail comes into contact with the stopper pin, and the IC stops on the movable rail portion 70. During this stop
In order to prevent the IC from bouncing, an air suction deceleration device similar to that described in the gate mechanism described above is provided, but it is not shown in the drawings.

Next, the IC lead wire correction mechanism will be explained.
As mentioned above with reference to FIG. 5, the IC lead wires are bent in the vertical direction in the arrangement direction of the lead wires as shown in FIG. 5A, and in the width direction in the direction orthogonal to the arrangement direction as shown in FIG. There is. As shown in FIG. 10, a large number of approximately V-shaped grooves 72a are formed in the fixed blade 72, and by inserting the IC lead wire along these grooves, the bending in the vertical direction is mainly corrected. That's what I do. Furthermore, straightening heads 105a and 105b are movably provided to press the IC lead wires against the fixed blade. That is, plates 100a,1
Air cylinders 106a and 106b are attached to 00b, and their plungers 106c and 106d are connected to correction heads 105a and 105b. The straightening heads are slidably extended through holes drilled in the plates 101a and 101b, and the tips 105c and 105d of these straightening heads are connected to the V-shaped groove 72a of the fixed blade 72 as shown in FIG. It has a collaborative structure.

Next, a mechanism for cutting the tip of the IC lead wire into a V-shape will be explained. Shafts 107a, 107 are provided between each side of the pedestal 73 and the plates 98a, 98b.
b, 107c and 107d, and blocks 109a and 109b are connected to this shaft via a bearing 108.
is provided so that it can slide freely. These blocks are connected to the movable blade 1 via gap adjustment spacers 110.
11a and 111b are fixed. Therefore, the movable blades 111a, 111b are connected to the blocks 109a,
109b so as to be slidable on the shafts 107a to 107d. Block 109a, 1
In order to slide 09b, 109a and 109b are connected to arms 113a and 113b via rotatable and slidable bearings 112a and 112b, and these arms are fixed to U-shaped links 114a and 114b. These links are arms 115a, 115b and 115c, 115 attached to the board 74.
d with pins 116a, 116b and 116c, 1
It is rotatably supported by 16d. link 114
a, 114b to arms 117a, 117b.
and a shaft 118a at one end of 117c, 117d,
118b, 118c, and 118d, and the other ends of these arms are pivotally connected to holes bored in projecting pieces 119a, 119b integrally formed on block 119 through shafts 120a, 120b. Projecting pieces 119a and 119b of block 119 are guided by U-shaped frames 121a and 121b fixed to substrate 74 so as to be able to slide up and down. Further, a bracket 122 is fixed to the substrate 74, and an air cylinder 123 is fixed to this bracket. A plunger 123a of this air cylinder that moves up and down is fixed to the block 119 with a screw 124. Therefore, when the air cylinder 123 is driven and its plunger 123a is displaced downward, the block 1 connected thereto
19 is also displaced downward. Therefore, the shaft 120a,
120b is lowered to the position indicated by P ₄ in FIG. 12, and links 117a to 117d, 115a to
15d, the centers of the bearings 113a and 113b are also displaced to the position indicated by point _P5 . As a result, the blocks 109a, 109b and the movable blades 111a, 111b integrated therewith also move from the shaft 107a to
107d, the movable blade 111
a, 111b are separated from the fixed blade 72. As will be described later, in actual operation, this state is a standby state, and after the IC has descended together with the movable rail section 70, the air cylinder 123 is driven to displace the movable blades 111a and 111b toward the fixed blade 72. Then, the tip of the lead wire is cut into a V-shape. Therefore, the movable blade 11
V-shaped grooves are carved on the upper surfaces of 1a and 111b.

Next, the operation of the above-mentioned straightening cut mechanism will be explained with reference to FIG. 15, which shows an operation timing chart of each part. Several detectors are provided to confirm the operation of each part and to perform the next operation, but they are not shown in the drawings. As shown in FIGS. 15A and 15B, at a predetermined timing _t6 given by the central controller, the solenoid 56 (FIG. 7) of the gate mechanism 6g (FIG. 2) provided at the front stage of the straightening cut mechanism is turned on. As a result, the locking piece 58a of the stopper lever is retracted from the rail 6a, and accelerated air is injected from the nozzle 62 to send the IC held by the gate mechanism to the correction cut mechanism. A deceleration suction port is provided on the rail 6a immediately before the movable rail portion 70 of this correction cut mechanism, and as shown in FIG. 15C, air is intermittently sucked through the suction port to decelerate the IC. 15th
As shown in Figure H, the solenoids 96a and 96b of the stopper pins 95a and 95b are deenergized, and the stopper pins are in the IC passage. The lead wire of the IC from the front gate is the stopper pin 95.
Since it collides with a and 95b, it comes to stop on the movable rail part 70. When the deceleration air suction described above is completed, the pressing head 8 is moved as shown in FIG.
As shown in FIG. 15E, air is ejected from the acceleration nozzle 80d constituting the stop mechanism provided at the IC, and the IC is reliably pressed against the stopper pins 95a and 95b to be positioned and stopped. In this state, the 15th
At timing _t4 after the IC detection sensor detects the IC as shown in FIG. D, the press head air cylinder 89 is driven to lower the press head 80 as shown in FIG. 15F. When the pressing head 80 descends, it first contacts the IC and pushes the IC onto the movable rail section 70.
and lower it further downward. The detection sensor of this pressing head 80 generates an output at time _t5 when the pressing head contacts the IC, as shown in FIG. 15G, and this output energizes the stopper pin solenoids 96a and 96b. Spring 102a, 1
The stopper pins 95a, 95 resist the action of 02b.
Let b escape from the IC passage. By pushing the lead wire of the IC into the V-shaped groove 72a of the fixed blade 72 using the pressing head 80, the vertical bend in the lead wire can be corrected. Next, at timing _t7, as shown in FIG. 15I, the straightening head air cylinders 106a and 106b are driven,
Fixing the straightening heads 105a and 105b with the fixed blade 7
2, thereby correcting the bend in the width direction of the IC lead wire. Next, as shown in FIG. 15J, at timing _t8 , the movable blade air cylinder 123 is driven, and the movable blade 111
a and 111b toward the fixed blade 72, and cut the ends of the lead wires into a V-shape. At this timing _t8 , a count pulse is generated as shown in FIG. 15M to count the number of operations.

After performing the straightening cut as described above, first the movable blade air cylinder 123 is driven to retract the movable blades 111a and 111b, and then the straightening head air cylinders 106a and 106b are driven to retract the straightening heads 105a and 105b. is retracted, and then the press head air cylinder 89 is driven to raise the press head 80. During this upward movement, the pressure head detection sensor detects that the pressure head 80 is at the IC.
Detects when you leave. In response to this detection signal, air is injected from the nozzle 80d to accelerate the IC. When the IC escapes from the movable rail section 70,
When the detection sensor detects the detection, suction of deceleration air from the gate mechanism of the next stage is started as shown in FIG. 15L. On the way, the next stage gate mechanism detects the arrival of the IC, as shown in FIG. 15K. By repeating such operations, it is possible to correct and cut the IC lead wires that arrive one after another.

In the straightening cut mechanism of this example, straightening is performed by straightening head air cylinders 106a, 106b,
The cut is another movable blade air cylinder 123
Since straightening and cutting can be controlled independently, it is possible to perform only straightening,
It is possible to perform straightening and cutting, or neither straightening nor cutting, and can adopt several modes of operation depending on the user's requirements.
Furthermore, with the above-described configuration, each part can be easily disassembled. For example, by changing the thickness of the movable rail section 70, the length from the bottom surface of the IC body to the tip of the lead wire cut in a V-shape can be reduced by 3.2 mm. ~ ^4.0cm3
can be changed within the range. In addition, the straightening heads 105a, 105b and the movable blade 111
Since the parts having a and 111b can be easily removed from the main body, replacement and maintenance inspection of these parts can be easily carried out.

Polarity detection reversal mechanism This mechanism is provided to detect the polarity of the IC and allow the IC to be inserted into the printed circuit board in the specified direction. When loading ICs into IC cassette 2, if all ICs are loaded with predetermined polarity (direction), the direction of insertion into the printed circuit board can be specified by providing only an IC reversing mechanism. Become something. However, the actual IC
It is extremely troublesome to arrange all ICs in a predetermined direction during loading work. Generally, ICs have polarity marks attached to them to indicate their direction, but these marks are so small that it is extremely troublesome to work while looking at them, and the probability of incorrect loading is high. Therefore, first detect the polarity of the IC,
A mechanism for reversing the direction as necessary becomes necessary. This polarity detection and reversal mechanism is provided after the gate mechanism 6h as shown in FIG.
It is equipped with an IC stopper mechanism, a contact terminal for polarity detection, and a rotating rail section for changing the direction by 180 degrees.

16A to 16C are a partial cross-sectional view of an example of the configuration of a polarity detection/reversal mechanism as viewed from the IC transport direction, a partial cross-sectional view as viewed from a direction perpendicular thereto, and a plan view. Further, FIG. 17 is a bottom view with the lower part of FIG. 16A removed, and FIGS. 18A to 18C are a front view, a top view, and a side view showing the stopper mechanism in an enlarged manner. Parts are also shown in cross section. First, the stopper mechanism that causes the polarity reversal mechanism to stop the IC will be explained. Rotating rail section 1 that can be aligned with the rail 6a of the processing section as clearly shown in Figure 16B
30 is provided, and this is connected to the rotary actuator 13.
It is fixed to the rotating shaft 131a of No. 1. Rotating rail part 1
30 is made of insulating material. As shown in FIG. 18B, when the IC is ready to be received, the rotating rail section 130 is aligned with the rail 6a. The IC 10 slides down on the rail 6a, but its lead wire 10a protrudes below the top surface of the rail as shown in FIG. 16A. The IC 10 is stopped on the rotating rail section 130 by bringing this lead wire into contact with the stopper pins 132a and 132b.
These stopper pins 132a and 132b are connected to the shaft 1.
Lever 13 is rotatably mounted around 33.
4, and the other end of this lever 134 is attached to a plunger 135 that moves up and down of an air cylinder 135.
a. In addition, the lever 134 and the fixing member 1
A compression coil spring 137 is provided between the lever 136 and the lever 134 to bias the lever 134 to pivot about the axis 133 in the direction opposite to the direction of the arrow shown in FIG. 18A. Therefore, the lever 134 that drives the air cylinder 135 rotates in the direction of the arrow against the force of the spring 137, and the stopper pins 132a, 13
2b can be retracted to the lower side of the travel path of the IC lead wire 10a.

As described above, the stopper pins 132a, 132
After the IC 10 is stopped on the rotating rail section 130 by b, a pressing head 138 is provided for pressing the IC against the rotating rail section, and this is fixed to the lower end of the shaft 139. This shaft 139 is held slidably in the vertical direction, and a bearing 140 is attached to its upper end so that the shaft 139 and the bearing 140 move together in the vertical direction, but can rotate relative to each other. This bearing 1
40 is connected to arm 1 via pins 141a and 141b.
42, and this arm is rotatably supported by a pin 143. The other end of the arm 142 is connected to the vertically movable plunger 14 of the air cylinder 144.
Connect to 4a. The pin 143 mentioned above is the post 1
45, and connect this post to air cylinder 144.
It is also fixed on the rotating plate 146. One end of the rotating plate 146 is fixed to a shaft 147, and this shaft is rotatably held by a bearing 148. This bearing 148 is provided with a lock screw 149, and by loosening the lock screw 149, the plate 146 and the entire pressing mechanism attached thereto can be rotated in a horizontal plane and retracted from above the rotating rail portion 130. In this way, the rotating rail portion 130 can be accessed, and even if, for example, an IC should become stuck in this portion, it can be easily removed.

When the air cylinder 144 is driven to raise its plunger 144a, the lever 142 rotates around the pin 143 in the direction of the arrow shown in FIG. 16A, allowing the pressing head 138 to be lowered. As a result, as shown in Figure 16A, the IC
10 can be pressed onto the rotating rail section 130.

The rotary actuator 131 and bearing 148 described above are attached to the substrate 150,
An air cylinder 151 is also attached to this substrate 150 via a support plate 131b and a support frame 131c attached to the rotary actuator 131, and its plunger 151a is fixed to a lever 152, and rods 153a, 1
The lower end of 53b is pivotally connected. The upper ends of these rods are connected to levers 154a, 1 which appear L-shaped in FIG. 16A.
It is pivotally attached to rods 153c and 153d attached to the lever 54b, and attached to a fixed member by means of these lever shafts 155a and 155b. Therefore, air cylinder 1
By moving the plunger 151a of 51 downward, the L-shaped levers 154a and 154b are moved to the shaft 15.
It can be rotated in the direction of the arrow around 5a and 155b. L-shaped levers 154a, 154b
A tension coil spring 156 is provided between the fixed member and the fixed member.
a, 156b are provided to bias the lever in a direction opposite to that indicated by the arrow.

As shown in FIG. 19, the L-shaped lever 154a, 1
54b has one and four contact pins 1, respectively.
57a and 157b to 157e, and connect these contact pins to coaxial cables 158a to 1, respectively.
It is connected to a measurement circuit to be described later through 58e. These contact pins 157a to 157e are positioned so as to contact desired lead wires of the IC.
Although ICs have various numbers of lead wires, the polarity detection mechanism of this example can test ICs with 14 to 20 pins. That is, one L-shaped lever 154a is provided with one contact pin 157a that contacts one of the power lead wires, and the other L-shaped lever 154b is provided with four contact pins 157b to 157.
e, and in the case of a 14-pin IC, contact pin 15
7b comes into contact with the other power lead wire, and in the case of a 20-pin IC, contact pin 157
e is adapted to contact the other power lead. The contact pins 157a and 157b to 157e are brought into contact with the lead wire 10a of the IC 10 pressed onto the rotating rail section 130 in this way to check the polarity.If the direction of the IC is reversed, the air cylinder 151 to lower its plunger 151a, and the L-shaped lever 15
4a and 154b are rotated in the direction of the arrow against the force of springs 156a and 156b to move the contact pin away from the IC, and then the rotary actuator 131 is driven to rotate the rotary rail portion 130 by 180 degrees. During this rotation, the IC 10 is pressed onto the rotating rail section 130 by the pressing head 138, so that the IC will not escape from the rail section. By rotating IC10 180° in this way, rail 6
The orientation of the IC in the direction a can be set to a desired orientation. During this rotation, the stopper pin 132
A notch 130a is formed in the rotating rail portion so that the rotating rail portion 130a and 132b do not collide with the rotating rail portion 130.

In order to detect the orientation of the rotating rail portion 130, as clearly shown in FIGS. 16B and 17, the plunger 131a of the rotary actuator 131 is made to protrude downward as well, and a light shielding plate 158 is attached to the plunger 131a. Install horizontally. This light shielding plate 158
Photoelectric sensors 159a and 159b each having a light source and a light receiver that receives light from the light source are provided at positions facing each other in the diametrical direction within the rotation locus of the light source. In the state shown in FIG. 16B, the light shielding plate 158
is located within the photoelectric sensor 159b, and the other photoelectric sensor 159a receives light from a light source with a light receiver. Next, when the rotating rail section 130 is rotated 180 degrees, the light shielding plate 158 enters the photoelectric sensor 159a, and in the photoelectric sensor 159b, light from the light source directly enters the light receiver. In this way, the direction of the rotating rail section 130 can be known.

Furthermore, the 16th
As shown in FIG.
61 to the rod 153b. In the state shown in FIG. 16A, the light shielding plate 161 is in the upper photoelectric sensor 160a, and the light from the light source directly enters the light receiver in the other photoelectric sensor 160b. In such a state, the contact pin 157a
~157e is in a position where it can come into contact with the IC lead wire. Next, when the rods 153a and 153b descend, the light shielding plate 161 enters into the lower photoelectric sensor 160b, and in this state, the contact pins 157a to 157e
is located away from the IC lead wire.

Also, the stopper pins 132a and 132b are connected to the IC.
In order to detect whether the air cylinder 1 is in a position where it can come into contact with the lead wire or whether it has retreated to the lower side of the lead wire, as shown in FIGS.
A lever 162 extending in a direction perpendicular to the rail 6a is fixed to the plunger 135a of No. 35, and a light shielding plate 162a is integrally formed at the free end of the lever.
This light shielding plate 162a can be inserted into and removed from the detection area 163a of the photoelectric sensor 163. Therefore, as shown in FIG.
When the a and 132b are in contact with the IC lead wire, the light shielding plate 162a enters into the photoelectric sensor 163, but when the air cylinder 135 is driven and the plunger 135a is raised, the light shielding plate 162a enters the photoelectric sensor 163.
a escapes from the photoelectric sensor 163, and the light from the light source directly enters the light receiver. In this way, the positions of the stopper pins 132a, 132b can be detected.

FIG. 20 shows a schematic configuration of an example of a measuring circuit connected to contact pins 157a to 157e, and FIG. 21 is a circuit diagram showing a detailed configuration thereof. The measurement circuit as a whole consists of three circuit parts. That is, the power supply section 165, the analog signal processing section 166, and the logic circuit section 167
It is composed of. The contact pin 157a is connected to the analog signal processing section 16 via a coaxial cable 158a.
6 input terminal 166a, and the other contact pin 1
57b to 157e are each coaxial cable 158
Output terminal 1 of power supply unit 165 via b to 158e
65b to 165e. The power supply section 165 is provided with an oscillator 165f, which generates a signal of, for example, 50 Kcm, which is passed through an amplifier 165g and a high-pass filter 165h, so that the amplitude is ±100 mV and the duty cycle is 50 as shown in FIG. 22A. % square wave signal. These signals are transmitted to photoelectric switches 165i, 165j, 165k, and 16, respectively.
Approximately 300 m to output terminals 165b to 165e via 5 ₁
The voltage can be applied only for a period of s. These photoelectric switches have input terminals 165m, 165n, 165
o, 165p selectively conductive. In other words, in the copying mode, the number of pins of each IC is stored in the computer in advance, and the data is read out and
Depending on the number of pins on the IC, one of the photoelectric switches is made conductive. For example, if the IC to be inspected is
In the case of 14 pins, a signal is given to the input terminal 165m, which makes only the photoelectric switch 165i conductive, and the above-mentioned power supply voltage is applied to the contact pin 15 via the output terminal 165b and the coaxial cable 158b.
7b. Further, when the IC has 20 pins, the photoelectric switch ₁₆₅₁ is turned on by the signal applied to the input terminal 165p, and the power supply voltage is applied to the contact pin 157e.

When power voltage is applied to the IC's power lead in this way, current flows through the IC's circuit, but
This current also flows into contact pin 157a. This current is transferred to the coaxial cable 158a and the input terminal 16.
6a to the analog signal processing section 166.
This analog signal processing section includes an integrating circuit 166b,
A low-pass filter 166c and a comparison circuit 166d are provided. The current flowing through the IC 10 will be biased in the positive or negative direction, as shown in FIGS. 22B and 22C, depending on the polarity of the IC. Therefore, by integrating the biased current in this way, the positive and negative voltages +
Vs and −Vs will be obtained. Comparing these voltages with the positive and negative reference voltages +V _R and -V _R in the comparator circuit 166d reveals whether a large amount of current flows from the contact pin 157b to the contact pin 157a via the IC10 or vice versa. It is possible to determine whether a large amount of current flows in that direction, and from this, the polarity of the IC can be detected. This determination is made at the output terminal 1 of the analog signal processing section 166.
This can be performed based on signals supplied from input terminals 66e and 166f to input terminals 167a and 167b of logic circuit section 167. In other words, the logic circuit section 16
7 is provided with logic circuits 167c and 167d, and when the integral value is between the reference voltage +V _R and -V _R , an indiscernible signal is output to the output terminal 167e, and when the integral value is greater than the reference voltage +V _R , an undiscernible signal is output. A forward direction discrimination signal is outputted to the terminal 167f, and when the integral value is smaller than the reference voltage -V _R , a backward direction discrimination signal is outputted to the output terminal 167g. When this reverse direction discrimination signal is output, the rotary actuator 131 shown in FIG. 16 is driven to rotate the rotary rail portion 130 by 180 degrees, thereby reversing the polarity of the IC 10.

FIG. 21 is a circuit diagram showing a detailed configuration of an example of the measurement circuit. Parts corresponding to those in FIG. 20 are shown with corresponding symbols, and explanations thereof will be omitted.
The comparison circuit 166d and its related circuits will be briefly described below. The comparator circuit is provided with two comparators 166g and 166h, and the integrated voltage value from the low-pass filter 166c at the previous stage is applied to the respective negative and positive input terminals. In addition, the voltages on the input side and output side of the inverter 166i are divided by potentiometers 166j and 166k, and these divided voltages are used as reference voltages +V _R and -V _R to be applied to comparators 166g and 1.
66h to the positive and negative input terminals, respectively. Further, the logic circuit section 167 is provided with a start input terminal 167h and a layday input terminal 167i.

Next, the polarity detection described above with reference to FIG.
The operation of the reversing mechanism will be explained. First, as shown in 23A and 23B, the solenoid 56 (FIG. 7) of the front gate mechanism 6h is driven to release the lock of the IC, and at the same time air is jetted toward the IC from the nozzle 62 to accelerate the IC. This IC is connected to the rail 6 immediately before the polarity detection and reversal mechanism as shown in No. 23C by the stop mechanism.
Air is intermittently sucked from a nozzle (not shown) installed at a to decelerate the IC, and the IC moves to stopper pin 1.
32a and 132b, the accelerating air is blown out as shown in Fig. 23D, and the IC is moved to the stopper pin 1.
32a, 132b to position and stop. After the IC sensor (not shown) detects the IC as shown in FIG. 23E, the air cylinder 144 is driven to lower the pressing head 138 at a predetermined timing _t4 shown in FIG. 23F. At timing _t5 when the pressing head sensor (not shown) detects that the pressing head 138 comes into contact with the IC 10 as shown in FIG. 23G, the stopper pin air cylinder 135 is driven as shown in FIG. 23H. Then, separate the stopper pins 132a and 132b from the IC. As shown in FIG. 23I, after the stopper pin sensor 163 confirms that the stopper pin has escaped from the IC passage, the air cylinder 151 is driven at timing _t7 as shown in FIG. 23J, and the L-shaped lever 1
Contact pin 157a by rotating 54a and 154b.
~157e is brought into contact with a predetermined lead wire of the IC.
In response to this, photoelectric switches 160a and 160b
The output changes as shown in FIG. 23 K and L. During the period when the contact pins are in contact with the IC leads, apply 300 power pulses of 50Kcm as described above.
ms is applied and the polarity of the IC is detected. At timing _t8 after detection, the air cylinder 151 is driven,
The contact pins 157a to 157e can be moved away from the IC lead wires. When polarity reversal is required, the rotary actuator 131 is energized as shown in FIG. 23M at timing tl after confirming that the contact pin has been retracted, and the rotary rail section 130 is rotated 180 degrees to change the IC direction. . At a subsequent timing t ⁿ , the air cylinder 144 is driven to raise the pressing head 138 and free the IC 10 on the rotating rail section 130 . Here, as shown in FIG. 23D, accelerating air is blown out to send the IC to the next stage gate mechanism 6i while accelerating it. As shown in FIG. 23N, this next-stage gate mechanism intermittently sucks air to decelerate the IC.
In addition, as shown in FIG. 23H, after the IC is ejected from the polarity detection and reversal mechanism, the air cylinder 135 is driven, and the stopper pins 132a and 132b are moved again.
It enters the IC passageway and prepares for the next IC to arrive.

The IC 10 whose polarity has been detected as described above and which has been reversed as required falls on the rail 6a as shown in FIG. It is sent to 1d. Next, the detailed configuration of this insertion section will be shown.

Insertion Section As shown in FIG. 2, the insertion section 1d is provided with various mechanisms, but first, the insertion head vertical movement mechanism 7d and the insertion head rotation mechanism 7c will be explained.

Insertion Head FIGS. 24A to 24D are a partial cross-sectional view, a partially removed front view, and a transverse cross-sectional view of an exemplary configuration of the insertion head. A substrate 180 is provided,
An air cylinder 181 is attached to this. The plunger 181a of this air cylinder 181 moves up and down.
The distal end thereof is connected to a substantially L-shaped slide substrate 183 via a floating joint 182 whose cross-sectional view is shown in FIG. This floating joint 182 includes a fixed part 182a screwed onto the plunger 181a, a flange 182b screwed onto this fixed part, a screw 182c that locks these fixed parts and the flange, and a screw 182c between the fixed part and the flange. The plunger 181a of the air cylinder 181 is composed of a bearing 182d held between, a ball portion 182e rotatably supported within the bearing, and a shaft portion 182f connected to the ball portion.
The shaft portion 182f and the shaft portion 182f can rotate relative to each other about the center P of the ball portion 182e, thereby absorbing mechanical play.

Shaft portion 182 of floating joint 182
The slide board 183 connected to f has a shape as shown in FIG.
There is a hole 183a that passes through, and both side plates 183b,
Each of the holes 183c has a pair of holes through which screws for attaching a movable block of a slide rail, which will be described later, pass through. The slide rail fixing block 185 is fixed to the board 180,
This fixing block provides a pair of fixing rails 184.
a, 184b are retained. This fixed block 18
5 consists of two blocks attached together. The movable block 187 of the slide rail is connected to the side plates 183b and 183 of the slide base plate 183 as described above.
The movable block 187 holds a pair of movable rails 188a and 188b that cooperate with fixed rails 184a and 184b.
In this way, the movable block 187 can be slid vertically relative to the fixed block 185. Further, the protruding piece 18 fixed to the upper part of the board 180
8 and a pin 189 implanted in the slide substrate 183, a tension coil spring 190 is provided to bias the slide substrate upward.

The movable block 187 has screws 191a to 191.
d fix the bearing housing 192,
A shaft 193 is rotatably disposed within this bearing housing. Axis 19 as shown in Figure 24D
A link 194 is fixed to 3, and a pin 195 is implanted in this link. In addition, the movable block 187 of the slide rail has arms 196a and 196b.
Attach the elongated air cylinder 197 via the .
Both ends of the plunger 197a of this air cylinder 197 are made to protrude from the cylinder, and the slider 1 is inserted here.
Fix both ends of 98. A projecting piece 198a is integrally formed approximately in the center of the slider 198, and a long hole 198b is formed in this projecting piece.
A pin 195 fixed to 94 is passed through. Therefore, the air cylinder 197 is driven to move the slider 1.
When the slider 98 is moved, the link 194 is moved to the shaft 19.
It will rotate around 3. In this example, this rotation angle is limited to 90°. For this purpose, stoppers 199a and 199b are provided. In FIG. 24D, only one stopper 199a is shown for clarity, but in FIG. 27F, both stoppers 199a are shown.
9a and 199b are shown. These stoppers position the link 194 by coming into contact with the movable block 187. Figure 27 A~
F is a diagram almost corresponding to FIGS. 24A to D,
It mainly shows the arrangement of photoelectric sensors, and some parts are removed to make the drawing clearer. Further, in FIG. 27, the movable block 187 of the slide rail is shown lowered to the lowest position, and is positioned by stoppers 200a and 200b.

An insertion head 201 equipped with a double air cylinder is connected to the lower end of a shaft 193 rotatably supported within a bearing housing 192 that moves up and down together with the slide board 183. The structure of this insertion head is shown in FIG. The insertion head 201 is a processing section 1c.
It has the function of grasping the processed IC with its claws and pushing the lead wires into the holes drilled in the printed circuit board. The insertion head 201 is provided with a double air cylinder 202, and a first piston 203 is slidably disposed inside the cylindrical cylinder housing 202a via an O-ring 203a. The upper end of a piston rod 204 is fixed to this first piston 203. Further, a second piston 205 is provided so as to be slidable relative to the piston rod. This second piston 205 has a piston portion 2
05a and the piston rod portion 205b are integrally provided. A pair of guide plates 206a and 206b are attached below the cylinder housing 202a in parallel with each other, and guide grooves 206c and 206d extending in the vertical direction are formed on the inner surfaces of these guide plates, respectively. These guide grooves 206c, 20
6d, protrusions 207a, 207 formed on both sides of the pusher 207 that presses the IC onto the printed circuit board.
b are slidably fitted into each other. This pusher 207 has a shape as shown in FIG. 29, and has the above-mentioned protrusions 207a and 207b formed on both sides and a hole 207c passing through it along the axis.
and a tapered portion 20 formed along the side edges of both surfaces.
7d to 207g and concave portions 20 continuous thereto
7h to 207k, and a lock screw 2 for connecting the pusher 207 to the lower end of the piston rod 204.
A notch ₂₀₇₁ for inserting the 08 from the side is formed. Pusher 2 is tightened by lock screw 208.
07 to the lower end of the piston rod 204, insert the screw 208 from the side into the notch ₂₀₇₁ , and then insert a screwdriver into the hole 20 from the bottom of the pusher.
7c, and screw the screw 208 into the piston rod 20.
Screw into the screw hole formed on the bottom surface of 4. In this case, the screw 208 can be offset with respect to the pusher axis so that the misalignment of the axes between the piston rod 204 and the pusher 207 can be absorbed.

A pair of chucks 209a and 209b are further rotatably attached to the lower end of the cylinder housing 202a by shafts 210a and 210b, respectively.
The structure of chuck 209a is shown in FIG. Furthermore, claws 211a and 211b for gripping the lead wires of the IC are fixed to the tip of the chuck. As shown in FIG. 28C, V-shaped grooves are formed at the tips of these claws 211a and 211b so that the IC lead wire can be gripped securely. Check 20
9a and 209b each have a pair of rollers 212.
a, 212b and 212c, 212d as the axis 21
3a and 213b, and these rollers are formed on both sides of the pusher 207.
~207k.

Piston rod portion 205 of second piston 205
At the lower end of b, one end of links 214a to 214d is rotatably supported by shafts 215a and 215b,
The other ends of these links are pivotally connected to chucks 209a, 209b by shafts 216a, 216b. Therefore, when the second piston 205 is displaced downward from the state shown in FIG. 28A with the piston rod 204 stopped, the chucks 209a, 209
b can be rotated outward to widen the claws 211a and 211b. On the other hand, the second piston 2
05 in the state shown in FIG.
will descend, pushing the IC through the cushion 207m fixed to the tip of the pusher 207. As this pushing progresses, the check 209
Since the rollers 212a to 212d of the rollers 212a to 212d of the pushers 207a and 209b overcome the tapered portions 207d to 207g of the pusher 207, the claws 211a and 211b are slightly opened. In this way, the IC can be released and the lead wire can be inserted into the hole in the printed circuit board at the same time.

FIG. 31 shows the pusher 20 in various states.
7. The positional relationship of the chucks 209a, 209b and the piston rod portion 205b of the second piston is shown, but a detailed explanation of each will be given later when the operation of the entire insertion section is explained. In addition, since various photoelectric sensors are provided to control the operation of each part, the 27th
This will be explained with reference to the figures. First, slide board 18
In order to detect the vertical movement position of 3, a light shielding plate 2 is attached to the slide substrate 183 as clearly shown in FIG. 27B.
17, and photoelectric switches 218a to 218c are provided on the substrate 180 along the travel path of the light shielding plate. The photoelectric switch 218a detects the uppermost position, the photoelectric switch 218c detects the lowermost position, and the photoelectric switch 218b detects a position slightly above the lowermost position. As shown in FIG. 27F, light shielding plates 219a and 219b are fixed to a link 194 that rotates around a shaft 193 at positions shifted by 90 degrees from each other, and the movable block 18
At 7, photoelectric switches 220a and 220b are attached which respectively cooperate with these light shielding plates. Figure 27F
In the state shown in FIG.
The light shielding plate 219b is inserted between the light source 0a and the light receiver, but the other light shielding plate 219b is separated from the photoelectric sensor 220b, and this state is the reference state, that is, the 0° state. , while air cylinder 1
97 and rotates the link 194 by 90 degrees,
The light shielding plate 219b enters the photoelectric sensor 220b,
The light shielding plate 219a is removed from the photoelectric sensor 220a. This state is the state rotated 90 degrees.

Retract mechanism Next, the IC sent from the processing section 1c is stopped at the insertion head position mentioned above, and the claws 211a of the chucks 209a, 209b of the insertion head are removed.
A retract mechanism for catching the IC lead wire at 211b and retracting it from the insertion head lowering passage will be described.

FIGS. 32A to 32D are a front view, a bottom view, a partially enlarged view of the bottom view, and a side view showing the configuration of an example of the retract table. The retract table includes a rail portion 230 continuous to the rail 6a, which is connected to the shaft 23.
Connect to 1. A press plate 232 is provided above the rail portion 230 so as to be movable up and down by a pair of pins 233a, 233b and compression coil springs 234a, 234b. This presser plate 232 is the rail part 2
The pusher of the insertion head is designed to prevent the IC from falling off from the slider 30, and to press the IC against the rail portion via this holding plate. Stopper 235 that contacts the IC lead wire on both sides of the tip of the rail
a and 235b are provided to be rotatable by shafts 236a and 236b, respectively, and a compression coil spring 237 is provided between both stoppers to rotationally bias them outward. This rotation is caused by stopper pins 238a and 238b.
limited by. Further, the cover 239 is fixed with screws 240 in order to prevent the spring 237 housed in the groove formed on the lower surface of the rail portion 230 from falling off. Further, a plate 241 is fixed to the lower surface of the lever portion 230, and first and second mirrors 242a and 242b forming part of a positioning optical system are attached to this plate.

FIG. 33 shows the drive mechanism of the retract table described above, in which a shaft 231 connected to a rail portion 230 is slidably held by a bearing 243, and the other end of this shaft protrudes from the bearing and is connected thereto. A metal fitting 244 is connected, and this metal fitting is connected to a plunger 245a of an air cylinder 245.
A stopper pin 231a is fixed to the shaft 231, and the bearing 243 is provided with stoppers 243a and 243b that define the stroke of the shaft 231. These bearings 243 and air cylinder 24
5 is attached to a common substrate 180 with the insertion head, as shown clearly in FIG. 33C. Air cylinder 24
A lever 246a and an arm 246b are further provided at the left end of the shaft 231 that slides left and right by the lever 246a and the arm 246b.
A light shielding plate 247 is fixed through the light shielding plate, and photoelectric sensors 248a and 248b are arranged in the movement path of this light shielding plate. Furthermore, as clearly shown in FIGS. 33B and 33D, the first and second projectors 249a, 249b are connected to mutually perpendicular axes 250a, 250b and 25.
1a and 251b so as to be two-dimensionally rotatable. By appropriately adjusting the position of the projector, each light beam is directed to the first and second mirrors 242a and 242a.
42b. The mirror is arranged to reflect this light beam vertically downward. A shaft 25 is provided in front of these projectors 249a and 249b.
A shutter 253 is provided to be rotatable about 2, and a plunger 254a of an air cylinder 254 is pivotally connected to this shutter by a pin 255. The shutter 253 is integrally formed with light shielding plates 253a and 253b so that these light shielding plates can be detected by photoelectric sensors 256a and 256b, respectively.
b to position it in contact with it. The insertion head 20 is provided with two optical systems in this way.
This is because the position of the positioning lead wire insertion hole changes due to the rotation of the positioning lead wire insertion hole. In other words, as shown in Figure 34, whether the IC is inserted at an angle of 0° in the horizontal direction or at an angle of 90° in the vertical direction, positioning must be done from the direction of transport of the IC to the insertion head. The lead wire corresponding to the first pin on the left side is inserted into the hole positions Pa and Pb, but since these positions are offset from the rotation center 0 of the insertion head, The first and second mirrors 242a and 242b are provided offset so as to correspond to these positions Pa and Pb.
Therefore, when inserting at an angle of 0°, the emitter 2
The light beam emitted from the first mirror 24
2a, and the light beam from the other projector 249b is blocked by a shutter 253.

Clinch table mechanism Next, in cooperation with the insertion head 201 mentioned above,
The clinch table mechanism for inserting 10 into the printed circuit board 9 will be explained. This mechanism has the function of bringing the clinch table into contact with the bottom surface of the printed circuit board 9, the function of supporting the detection end consisting of four fibers that receive the light beam from the above-mentioned projector, and the function of attaching the IC lead wire to the hole of the printed circuit board. It has the function of detecting whether or not it is inserted correctly, and the function of bending some lead wires slightly inward. Figure 35 A~
As shown in D, a bearing 261 is fixed to a substrate 260, a shaft 262 is rotatably supported by this bearing, and an air cylinder 264 is attached to the lower end of the bearing 261 via a cylinder stand 314.
The plunger 264a of this air cylinder 264 and the lower end of the shaft 262 are connected through a floating joint 263 within the cylinder stand 314, so that the shaft 262 can be moved up and down. A rod-shaped detent 315 is fixed to the input side of the floating joint 263, and this detent 315
Both ends of the cylinder base 314 are engaged with guide grooves 316a and 316b formed along the moving direction of the floating joint 263, and the displacement amount of the detent 315, that is, the shaft 26
The vertical movement stroke of 2 is prevented from rotating by stoppers 317a and 317b provided on the cylinder base 314.
15 to be brought into contact with each other. In addition, in order to detect the vertical movement of the shaft 262, a light shielding plate 318 is provided at one end of the detent 315.
is attached, and a photoelectric sensor 319 is attached to the cylinder stand 314 so as to be located in the travel path of this light shielding plate 318. The board 260 further includes an arm 265a,
Fix the air cylinder 266 via 265b,
The plunger 266a of this air cylinder is made to protrude from both ends and is fixed to both ends of the lever 267. As shown in FIG. 35B, this lever 267 is integrally formed with a protrusion 267a, in which a long hole 267b is formed. Further, as shown in FIGS. 35B and 35C, a deformed circular plate 268 is fixed to the shaft 262, and an air cylinder 269 is fixed thereto.
Further, a lever 271 is rotatably supported on a post 270 erected on a plate 268, one end of this lever is connected to a plunger 269a of an air cylinder 269, and the other end is formed into a sleeve 272 attached concentrically to the shaft 262. The pins 273a and 273b fit into the ring-shaped groove 272a. This sleeve 272 is moved up and down together with the shaft 262 by an air cylinder 264.
62 in the axial direction. As shown in FIG. 35B, a pin 273 is implanted in the plate 268, and this pin is inserted into an elongated hole 267b formed in the protrusion 267a of the lever 267. Therefore, by driving the air cylinder 266, the plate 268 and the shaft 26
2 can be rotated. In order to limit this rotation to 90 degrees, stoppers 274a and 274b that come into contact with the plate 268 are fixed to the base plate 260. In addition, in order to detect this rotation, a lever 26
Light shielding plates 275a and 275b are attached to both ends of the light shielding plate 7, and a photoelectric sensor 276 is attached to the travel path of these light shielding plates.
Place a and 276b.

A sleeve 277 having a flange at the upper end is fixed to the upper end of the shaft 262 with a screw, and a block 278 is fixed to the flange of this sleeve.
A clinch stand 279 is fixed to this block. The structure of this part is shown in enlarged form in FIG. 36A. At the lower end of the block 278 are guide pins 280a, 28.
0b and pass these pins through holes 272b and 272c drilled in the sleeve 272. The upper end of this sleeve 272 has plates 281a and 2 on both sides.
81b, and a pair of pins 282a, 282b, 282c, and 282d are respectively fixed to this plate as shown in FIG. 36B and FIG. 37A. Further, the block 278 has shafts 283a, 2
The claws 284a and 284b are rotatably pivotally connected by 83b. As shown in FIG. 37B, the claw 284a,
Three protrusions are provided at each tip of 284b,
This allows the lead wire 10a of the IC 10 to be bent inward. For this reason, groove-like notches are formed on both side walls of the claws 284a and 284b (two notches 285a and 285b are shown in FIG. 36C, and only one notch 285 is shown in FIG. 37A). , and pins 282a to 282d are attached to this.
mating with each other. That is, when the air cylinder 269 shown in FIG. 35C is driven, the lever 271 is rotated, and the sleeve 272 is lowered, the pin 28
2a to 282d also descend, resulting in Fig. 37A.
Claws 284a, 284b as shown by arrows in
With the lead wire 1 of IC10 rotated outward,
After inserting the IC into the hole of the printed circuit board 9, the air cylinder 269 is driven to raise the sleeve 272, and the claws 284a and 284b are rotated to bend some of the lead wires so that the IC does not fall off the printed circuit board. Do it like this. In this case, it is possible to bend all the lead wires, but if you do so, the IC will easily come off the printed circuit board, so it is better to bend only a few lead wires.

Lead Wire Insertion Detection Mechanism In this example, a mechanism is provided to detect whether the IC lead wire is correctly inserted into the hole of the printed circuit board. That is, as shown in FIG. 36A, output ends 286a to 286j and input ends 287a of optical fibers are provided on each side of the clinch table 279.
~287j are embedded. All output ends are optical fiber bundles 289 as shown in FIG. 38A.
are all optically connected to a light source 290, and the incident end is optically connected to each light receiving element of a light receiving device 292 via an optical fiber bundle 291. The light from the light source 290 passes through the optical fiber bundle 289 to the output end 286a~
286j and lead wire 10 of IC10.
make it incident on a. When the lead wire is inserted correctly, this light is reflected by the lead wire and enters the input end 2.
87a to 287j, the fiber bundle 291
The light is then incident on the 20 light receiving elements of the light receiving device 292. Therefore, by detecting the output signals of these light receiving elements, it is possible to detect whether the lead wire has been inserted correctly. For example, if it is detected that a lead wire is not inserted correctly, a mark can be placed on the IC, for example, with colored paint. However, even in this case, the claw 28
4a and 284b are driven to bend the lead wires.
This is to prevent the IC from slipping out from the printed circuit board, and is marked like this.
Check the IC later and re-insert the leads correctly or insert a new IC.

Positioning mechanism It is necessary to correctly position the printed circuit board loaded on the XY table with respect to the insertion head. This is done based on the lead wire holes Pa and Pb of the pin. For example, in the case of 0° insertion, the projector 24
The light beam from 9a is made incident on the first mirror 242a and made incident on the lead wire hole Pa. The light beam passing through this hole is transmitted to the incident ends 293a to 29 of four optical fibers embedded in the upper surface of the clinch table 279.
Make sure to receive light in 3D. The position of this input end is the hole Pa where the lead wire of the first pin of the IC is inserted.
corresponds to the position of

FIG. 39 is a perspective view showing the configuration of the position detection device, in which a parallel light beam is irradiated through an insertion hole Pa made in the printed circuit board 9, and the parallel light beam is transmitted to four incident ends 293a.
Received at ~293d. These incident ends 293a~
293d is arranged in alignment with the X and Y moving directions of the XY table on which the substrate 9 is mounted. The light received at these incident ends is passed through the optical fiber bundle 294 (FIG. 38A) to the light receiving device 29.
2 (the light receiving device 292 has a total of 24 light receiving elements). Therefore, these light-receiving elements output electrical signals proportional to the amount of incident light at the respective incident ends 293a to 293d.

FIG. 40 shows the above-mentioned light receiving elements 292a to 292.
This figure shows an example of a control circuit for driving the XY table in response to the output signal of d to align the hole of the printed circuit board 9 with the insertion axis. Since the X-direction position detection circuit and the Y-direction position detection circuit have exactly the same configuration and operation, only the circuit for the X direction is shown. The amount of movement of the XY table in the X direction is detected by a linear scale 295, and the position information in the X direction is detected by a counter 296. On the other hand, the hole Pa of the printed circuit board 9 measured in advance during scanning
The position information is read from the memory 297 and supplied to the comparator 299 as a target value via the register 298. This comparator 299 has a counter 296 to
Current position information in the direction is also supplied, these pieces of information are compared, the difference is converted into an analog signal by the D/A converter 300, and this is supplied to the servo motor drive circuit 302 in the X direction via the analog switch 301. The output drives the servo motor 8c for driving in the X direction.
to move the table toward the target value. When the current position information matches the target position information, the comparator 299 outputs no more, and the D/A converter 300 does not supply an output signal. If the printed circuit board 9 is ideal and is correctly positioned and placed on the Board 9
Due to manufacturing errors and slight variations in the position on the table, the center of the hole Pa does not perfectly align with the insertion axis P, and there is usually a relatively large deviation, which makes it difficult to achieve the correct insertion rate. The reality was that it was declining.

The position detection device of this example eliminates the deviation that occurs when the position information stored in advance by copying matches the current position information. For this purpose, light receiving elements 29 arranged in the X direction
After the outputs of 2a and 292b are amplified by operational amplifiers 304a and 304b, respectively, they are supplied to a differential amplifier 305 and a comparator 306a.
and 306b, and the outputs of these comparators are supplied to an AND gate 307, which drives an analog switch 301, and when an output is generated from the AND gate 307, the output of the differential amplifier 305 is passed through the analog switch 301. The signal is supplied to the servo motor drive circuit 302. Now, the center ray of the parallel light beam projected along the insertion axis P is directed to the hole of the printed circuit board 9 in the X direction.
Assuming that the light is transmitted through the hole Pa although it is shifted from the center of the hole Pa, both the light receiving elements 292a and 2
92b receives light, the output of AND gate 307 goes to a high logic level, and analog switch 301 switches to the opposite position from that shown in FIG.
At this time, since there is a difference between the outputs of both light receiving elements 292a and 292b, a signal having a polarity according to the direction of deviation between the light flux and the hole Pa and an amplitude proportional to the size of the deviation is transmitted to the differential amplifier. The light is supplied from 305 to the servo motor drive circuit 302 via the analog switch 301, and the table is driven so that the center of the hole Pa approaches the insertion axis P, which is the center of the parallel light beam. When the center of the hole Pa coincides with the insertion axis P of the center of the parallel light beam, the light receiving elements 292a and 292
The outputs of b become equal, the output of the differential amplifier 305 disappears, the X-direction drive motor 8c stops, and the table also stops. With such a position detection device, when the insertion axis P and the center of the hole Pa deviate by more than 50 μm, for example, the table can be slightly moved to make the deviation between the insertion axis P and the center of the hole Pa 20 μm or less. I can do it.

FIG. 41 shows a modification of the light receiving section,
In this example, one end of the fiber bundle 308 is arranged in a circle, and this is divided into four fan-shaped parts 308a to 308d along a line inclined at 45 degrees with respect to the X and Y directions, and the fiber bundle of each part is Each end is arranged to face a separate light-receiving element.

As described above, in the present invention, before inserting the IC pin into the printed circuit board, the pins are corrected and cut, and the holes in the printed circuit board are positioned with extremely high precision relative to the insertion axis, so the printed circuit board is placed on an XY table. There is no need to drill a pair of positioning holes in the printed circuit board and insert them into pins provided on the XY table for positioning. It is only necessary to line up the printed circuit boards on one side and place them on the board, which greatly simplifies the work and also makes it easy to automatically attach and detach the printed circuit boards to and from the XY table.

FIGS. 38A and 38B show the above-mentioned optical fiber bundles 289, 291 and 294 installed. Since the upper ends of these fiber bundles are attached to a block 278 that moves up and down and rotates, their lower ends are also attached to a member that moves up and down and rotates to prevent undue stress from being applied to the fiber bundles and causing them to break. Therefore, the bearing 26 of the substrate 260
An arcuate hole 260a is made in the mounting portion of the floating joint 263, and a plate 310 with enlarged ends is fixed to the output shaft of the floating joint 263. A rod 312 is connected between this plate and a block 311 fixed to the sleeve 272. Then, this rod is passed through the arc-shaped hole 260a described above. Optical fiber bundles 289, 291, 294 extend along this rod 312. These fiber bundles are further passed through holes 310a drilled in plate 310. The plate 310 moves up and down and also rotates. A frame 313 is fixed to the plate 310, and the input end 2 of the fiber bundle 289 is attached to this frame.
89a and the light receiving device 292 are also fixed. Therefore, optical fiber bundles 289, 291,
Since both ends of the fiber bundle 294 always move up and down and rotate together, no unreasonable force is applied to the fiber bundle.

Next, the time chart shown in Figure 42 and the third
The operation of the insertion section will be explained with reference to FIG. Fourth
As shown in Figure 2A and B, the front gate mechanism 6i
The solenoid (see Figure 2) is energized to retract the locking piece and blow out accelerating air to send the IC into the insertion section. In this way, the IC rests on the movable rail section 230 of the insertion section retract. this
When the IC is detected as shown in Figure 42C, the fourth
As shown in Figure 2D, air is blown out to press the IC lead wires against the stoppers 235a and 235b. When receiving the IC in this way, push down the second piston 205 and release the chucks 209a and 209b.
Leave it wide open on both sides. This state is shown in FIG. 31A.

Next, at timing _t4 , the second piston 205 is raised, the chucks 209a and 209b are closed, and the claws 211a and 211
Grip the IC lead wire with b. The state in which the lead wire is gripped in this manner is shown in FIG. 31B. In this state, as shown in FIG. 42F, the first piston 203 is driven for a short time to lower the pusher 207. This allows the IC to be held in place by the claws 211a, 2.
11b allows for a correct grip.
Figures 42G and 42H show the XY table drive and fine adjustment period, in which the XY table is driven as described above, and the first pin hole Pa (for 0° insertion) or Pb (for 90° insertion) align the center with the insertion axis P. This operation is completed by timing _t4 . Whether this is a 0° insertion or a 90° insertion is stored in memory in advance in the copying mode, and this information is read out in the insertion mode. 33
) is driven, and as shown in FIG. 42I, the shutter 253 is switched to a desired optical path in the initial state of the insertion cycle. Now let's assume that we are inserting it at 90 degrees.

Next, as shown in FIG. 42J, at timing _t5 , the air cylinder 245 is driven to retract the rail 230 of the retract table. At the same time, the fourth
As shown in FIG. 2K, the air cylinder 264 of the clinch mechanism is driven to raise the shaft 262,
The clinch head 279 is raised and brought into contact with the lower surface of the printed circuit board 9. This is detected by a photoelectric sensor 319 as shown in FIG. 42L. Then the fourth
As shown in FIG. 2M, at timing _t7 , the air cylinder 197 (FIG. 24) is driven to rotate the insertion head 201 by 90 degrees. On the other hand, the clinch head 279 has input ends 293a to 293 for positioning.
d is installed and positioning is performed using this, so before the fine adjustment period shown in Figure 42H,
It must be rotated 90 degrees. That is, the fourth
As shown in Figure 2N, air cylinder 266 (35th
The clinch head is rotated by driving the clinch head. At timing _t8 during the rotation of the insertion head 201, the air cylinder 18 is activated as shown in FIG.
1 (FIG. 24) to lower the insertion head 201. This lowering of the insertion head is shown in Figure 42P.
As shown in Q and R, photoelectric sensors 218a and 218
b, 218c are sequentially detected. While the insertion head 201 is lowering, the lead wires of the IC are inserted into the holes of the printed circuit board 9. When the photoelectric sensor 218c detects the lowest position of the insertion head 201, insertion of the lead wire is detected as shown in FIG. 42S. When it is detected through this detection that all the lead wires have been correctly inserted, the air cylinder 2 is inserted at timing tl as shown in FIG.
69, the claws 284a and 284b are rotated, and some of the lead wires are bent. At the same time, as shown in FIG. 42F, the first piston 203 is lowered again, and the pusher 207 is lowered. During this descent of the pusher 207, as shown in FIG.
207g to expand the chucks 209a, 209b outward, remove the claws 211a, 211b from the lead wires, and then use the pusher 207 to further push the IC. In this way, the leads of the IC can be inserted deeply into the holes of the printed circuit board, and some of the leads can be bent inward. As can be seen from FIGS. 42O and 42R, the insertion head air cylinder 181 is activated at timing tl, and the insertion head 201 begins to rise as shown in FIG. 31D. clinch nails 2
The rotating air cylinders 269 of 84a and 284b are driven again to rotate the claws outward, and the clinch head vertical movement air cylinder 264 is driven to lower the clinch head.

By sequentially repeating the above-described operations, the ICs that are sent to the insertion section one after another can be inserted one after another into predetermined positions on the printed circuit board.

XY table FIG. 43 shows the configuration of an example of the XY table 1e on which the printed circuit board 9 is placed. and E represent cross-sectional views taken along lines I--I' and -', respectively, in FIG. 43A. The XY table 1e includes a frame-shaped X table 401 and a Y table 402. The Y-table 402 is screwed into a ball screw 8b extending in the Y-axis direction on the fixed table 403 and rotatably supported by bearings 404 and 405 via a female threaded portion 406. A pair of extended Y-axis guide rails 407, 4
08 so as to be movable in the Y-axis direction. In addition, the X table 401 has a Y table on the Y table 402.
A bearing 40 extends in the X-axis direction perpendicular to the axial direction.
A pair of X
It is disposed so as to be movable in the X-axis direction along axis guide rails 412 and 413.

An X-axis motor 8c for driving the X-table 401 is attached to the Y-table 402, and a pulley 414 is fixed to the output shaft of this X-axis motor 8c. A pulley 415 is also fixed to one end of the ball screw 8a, and an endless belt 416 is wound between this pulley 415 and a pulley 414 fixed to the output shaft of the X-axis motor 8c. Driven by pulley 414 and endless belt 416
The ball screw 8a is rotated via the pulley 415, thereby moving the X table 401 in the X-axis direction. On the other hand, Y table 40
A Y-axis motor 8d for driving the Y-axis motor 8d is attached to a fixed table 403, and as in the case of the X-axis motor 8c described above, the pulley 417 fixed to the output shaft of the Y-axis motor 8d and this The ball screw 8b is rotated via an endless belt 419 wound between the pulley 417 and a pulley 418 fixed to one end of the ball screw 8d, thereby moving the Y table 402 to the X table 4.
It is configured to move in the Y-axis direction together with 01.

In addition, an X scale 8e and a Y scale are also provided for detecting the amount of movement of the XY table 1e in the
The scale 8f is provided extending in the X and Y axis directions on the Y table 402 and the fixed table 403, respectively.
Detection heads 421 and 42 respectively provided at
2, so that the respective movement amounts can be detected by optical detection.

In this example, a clamp device is provided on the X table 401, and the printed circuit board 9 is detachably mounted on the XY table 1e by this clamp device.

Clamp Device FIG. 44 shows the configuration of an example of a clamp device for removably mounting the printed circuit board 9 on the XY table 1e.
FIG. 44C and D are enlarged sectional views taken along the line I--I' of FIG. 44A. As described above, this clamping device 430 is installed on the frame-shaped X table 401.
Clamp mounting plates 4 extending in the X-axis direction and fixed to frames facing in the Y-axis direction of the table 401
31, 432, and beam guides 43 extending in the Y-axis direction and fixed to frames facing each other in the X-axis direction.
3,434. Clamp mounting plate 431,
Opposite ends of 432 and beam guide 43
3,434 are provided with steps 431a and 431a for supporting the ends of the printed circuit board 9, respectively.
432a, 433a, and 434a are formed.

Each of the clamp mounting plates 431 and 432 has an X
A shaft 435, 436 is provided extending in the axial direction. One end of these rods 435, 436 is pivotally connected to the rotary tips of links 439, 440 which are rotatably connected to the X table 401 via link pins 437, 438, and the other ends of the rods are pivotally connected to the X table 401, respectively. 4
01 via link pins 441, 442 so as to be rotatable. The other ends of the links 443 and 444 are attached to mounting brackets 445 and 446 fixed to the X table 401 and beam guide 434, respectively, with pins 447 and 4.
Air cylinder 4 rotatably connected via 48
Links 439, 443; 440, 44 are pivotally connected to plungers 449a, 450a of 49, 450, respectively, and are driven by air cylinders 449, 450.
Link pins 435 and 436 via 4
7,441; 438, 442 so as to be able to move in parallel in directions approaching each other. In addition, a pair of pins 451a, 451b; 452a, 45 are attached to these rods 435, 436, respectively.
2b, and a pair of escape holes 453a,
453b; 454a, 454b are formed.

Driving plates 455 and 456 are provided on the rods 435 and 436, respectively, extending in the X-axis direction. The opposing ends of these driving plates 455, 456 are formed with rising portions 455a, 456a extending in the X-axis direction and engaged with pushers to be described later. In addition, the drive plate 4
55, 456 have pins 451a, 451b implanted in the rods 435, 436, respectively; 452a, 45
Guide holes 457a, 457b that engage with 2b; 4
58a, 458b extending in the X-axis direction, and relief holes 453a, 453b formed in the rods 435, 436, respectively; 454a, 4
Guide holes 459a, 459b; 460a, 4 extend in the Y-axis direction at positions corresponding to 54b, respectively.
60b, and these guide holes 459a, 45
9b; 460a, 460b and escape hole 453
a, 453b; 454a, 454b to implant guide pins 461a, 461b; 462a, 462b into the clamp mounting plates 431, 432, respectively. Therefore, the driving plates 455, 456 are driven by the air cylinders 449, 450 to move the rod 43.
Y approaches each other by 5,436 parallel movements
Move in the axial direction.

Furthermore, rails 463 and 464 are provided on the clamp mounting plates 431 and 432, respectively, extending in the X-axis direction, and two rails are provided on these rails 463 and 464, respectively.
clamp members 465a, 465b; 466
a and 466b are slidably provided. The clamp member 466a includes a clamp body 467 that slides on the rail 464 as shown in FIGS.
The pusher 469 is provided so as to be slidable in the Y-axis direction by being guided by. One end of the pusher 469 is slidably engaged with the rising portion 456a of the drive plate 456 in the X-axis direction, and a clamper 470 for holding the printed circuit board 9 is rotatably mounted on the other end. An elastic member 471 made of polyurethane rubber or the like is provided at a portion of the clamper 470 that holds the printed circuit board 9. In addition, the clamp body 467 has a clamper 4.
A pin 472 that engages 70 is implanted. In this example, when the air cylinder 450 is deenergized, the clamper 470 is retreated from the step 432a of the clamper mounting plate 432 as shown in FIG. Pusher 469 via drive plate 456 as shown in D
As the clamper 47 moves in the Y-axis direction,
0 in the Y-axis direction and rotate its tip downward via the pin 472.
72 and a protrusion 47 provided at the rear end of the clamper 470
0a, thereby clamp mounting plate 4
The end of the printed circuit board 9 placed on the step 432a of 32 is connected to the clamper 47 via the elastic member 471.
Press and hold by setting 0. Note that the clamp member 46
5a, 465b and 466b are also clamp members 4
66a, and includes clamp members 465a,
Pusher 473 of 465b; 474 is drive plate 45
The pusher 475 of the clamp member 466b is engaged with the rising portion 456a of the drive member 456.

As described above, in the clamp device 430 of this example, when the air cylinders 449, 450 are deenergized, the clamp members 465a, 465b, 4
The clampers 66a and 466b are attached to the steps 431a and 432a of the clamp mounting plates 431 and 432, respectively.
Since I made it retreat from the printed circuit board 9
The clamper does not interfere with the mounting of the printed circuit board 9 on the clamp mounting plates 431, 432 and the beam guides 433, 434 at each step 431.
a, 432a, 433a, 434a. Therefore, using the printed circuit board autoloader and autounloader, the printed circuit board can be easily and reliably automatically inserted into and removed from the XY table 1e, and the insertion efficiency can be further improved.

According to the IC automatic insertion device of the present invention described above,
A stopping mechanism having a stopper and a suction means is provided on the IC transport route, and the IC being transported along the transport route is decelerated by intermittent suction by the suction means and brought into contact with the stopper and stopped. Therefore, the IC can be reliably stopped at the stopper position without any damage to the IC.

Therefore, by providing this gate mechanism at an appropriate position on the IC transport route, it is possible to accurately regulate the position of electronic components to be processed in each processing mechanism provided along the IC transport route. In addition, by controlling the opening and closing of the stopper according to the progress of other processing mechanisms, differences in processing time in each processing mechanism can be compensated for, allowing each processing mechanism to efficiently process ICs. In addition to being able to further improve processing capacity,
The processing time of each processing mechanism can be made uniform without being restricted by other processing times, thereby increasing the appropriate insertion rate.

In addition, by adding an airflow jetting means to jet airflow, the intermittent suction of the suction means
Even if the IC stops before the stopper,
In addition, even if the IC bounces off the stopper and stops in front of you, the IC can be firmly brought into contact with the stopper and stopped while preventing it from bouncing back, improving the accuracy of IC positioning for each processing mechanism. Transport of ICs on the IC transport route can be controlled more reliably.

[Brief explanation of drawings]

1A, B, and C are a front view, a side view, and a plan view showing the overall appearance of an example of the automatic insertion device of the present invention; FIG. 2 is a diagram showing the general configuration of each part; The figure shows the configuration of an example of an IC cassette.
A partially cutaway perspective view; FIGS. 4A, B, and C are views showing the configuration of an example of a cassette loading section; FIG.
Figures A, B and C are diagrams showing the condition of the IC lead wires,
FIGS. 6A to 6E are diagrams showing the configuration of an example of a defective product reject mechanism, FIGS. 7A to D are diagrams showing the configuration of an example of a gate mechanism, and FIGS. 8A and B are views of an example of the corrective cut mechanism. Side view and front view showing the 9th
The figure is an exploded perspective view showing the configuration of each part, FIG. 10 is a front view mainly showing the mechanism that supports the movable rail part so that it can move up and down, FIG. 11 is a view seen from the bottom, and FIG. FIG. 13 is a view showing the structure of the pressing head, movable straightening head and movable blade as seen from the side; FIG. 13 is a view of the movable straightening head and movable blade mechanism seen from above; FIG. 14 is a front view showing a portion of the mechanism; 1st
Figure 5 is a diagram showing the operation timing of each part of the corrective cutting mechanism, Figures 16A to 16C are views of the configuration of an example of the polarity detection and reversal mechanism as seen from the side, front, and top, respectively, and Figure 17 is 18A to 18C are a front view, a top view and a side view showing the stopper mechanism enlarged, and FIG. 19 is a perspective view showing the contact pin. 20 is an overall configuration diagram of the measurement circuit, FIG. 21 is a circuit diagram showing a detailed configuration of an example of the measurement circuit, and FIGS. 22A to 22D are signal waveform diagrams for explaining the operation of the measurement circuit. Figure 23 A-N
24 is a diagram showing a timing chart showing the operation of each part of the polarity detection and reversing mechanism, FIGS. 24A to 24D are diagrams showing the configuration of an example of the vertical movement mechanism and rotation mechanism of the insertion head of the insertion section, and FIG. Similarly, a cross-sectional view showing the structure of the floating joint, No. 26
The figure is a perspective view showing the structure of the slide board, FIGS. 27A to 27F are views showing the vertical movement mechanism and rotation mechanism of the insertion head similarly to FIG. 24, and FIG.
Figures A to F are views showing the detailed structure of an example of the insertion head, Figure 29 is a perspective view showing the shape of the pusher, Figure 30 is a perspective view showing the shape of the chuck, and Figure 31 is the insertion head. Diagrams for explaining the operation of the head, FIGS. 32A to 32D are diagrams showing the configuration of an example of a retracting table, FIGS. 33A to E are diagrams showing the configuration of an example of the retracting mechanism, and FIG. Diagram showing the position of the reference hole for ゜ insertion and 90゜ insertion,
35A to 35D are views showing the configuration of an example of the clinch mechanism, FIGS. 36A to C are enlarged views of the configuration of the clinch head portion, and FIGS. 37A and B are views of the clinch head portion. Figures 38A and 38B are diagrams showing the installed state of the optical fiber bundle, Figure 39 is a diagram showing the optical system of the positioning mechanism, Figure 40 is a diagram showing the circuit configuration of the positioning mechanism, and Figure 41 is a diagram showing the configuration. The figure shows another example of the detection head of the positioning mechanism, and FIGS. 42A to 42T show timing charts for explaining the operation of the insertion section.
43A to 43E are diagrams showing the configuration of an example of an XY table, and FIGS. 44A to 44D are diagrams showing the configuration of an example of a clamping mechanism for a printed circuit board. 1a...Cassette loading section, 1b...IC transport section,
1c...processing section, 1d...insertion section, 1e...XY
Table, 1f...Operation panel, 2...Cassette, 4
...IC ejection mechanism, 6a...rail, 6b...defective product reject mechanism, 6c...correction mechanism, 6d...
...Cut mechanism, 6e...Polarity detection mechanism, 6f...
Polarity reversal mechanism, 6g, 6h, 6i...gate mechanism, 7a...retract mechanism, 7b...insertion head vertical movement mechanism, 7c...insertion head rotation mechanism, 7
f...Clinch table vertical movement mechanism, 7g...Clinch table rotation mechanism, 7h...Clinch claw drive mechanism, 9...
...Printed circuit board, 10...IC, 10a...lead wire, 54a, 54b...side plate, 55...board,
56... Solenoid, 57... Shaft, 58... Stopper lever, 58a... Locking piece, 59... Tension coil spring, 59a... Stopper pin, 60...
Air suction port, 60a...pipe, 61a...light source, 61b...light receiver, 62...air jet port, 6
2a...Pipe, 63a...Block, 63b...
...fixing plate, 63c...hinge, 63d...
Movable plate, 64...lid.

Claims (1)

[Claims] 1. To facilitate insertion of electronic components into holes drilled in a printed circuit board while transporting them along a transport route,
In the automatic insertion device for an electronic component into a printed circuit board, the device automatically inserts the pin of the electronic component into a hole drilled at a predetermined position of the printed circuit board by correcting or cutting the pin, and A stopper that can be inserted and removed freely in the route,
A suction means is provided near the stopper and in front of the electronic component in the conveyance direction, and the suction means is intermittently operated to decelerate the electronic component sliding along the conveyance path. An automatic insertion device for electronic components onto a printed circuit board, characterized by being provided with a stopping mechanism that stops the electronic components by bringing them into contact with a stopper. 2. While transporting the electronic components along the transport path, it is easy to insert them into the holes drilled in the printed circuit board.
In the automatic insertion device for an electronic component into a printed circuit board, the device automatically inserts the pin of the electronic component into a hole drilled at a predetermined position of the printed circuit board by correcting or cutting the pin, and A stopper that can be inserted and removed freely in the route,
It has a suction means and an air jetting means provided near the stopper and before the electronic component in the conveying direction,
The suction means is operated intermittently to decelerate the electronic component sliding along the conveyance path, and the air flow jetting means blows out an air flow to press the electronic component against the stopper. An automatic insertion device for electronic components onto a printed circuit board, characterized in that a stop mechanism is provided for positioning and stopping the electronic components.