JPH0423342A - Semiconductor measuring apparatus - Google Patents
Semiconductor measuring apparatusInfo
- Publication number
- JPH0423342A JPH0423342A JP2123454A JP12345490A JPH0423342A JP H0423342 A JPH0423342 A JP H0423342A JP 2123454 A JP2123454 A JP 2123454A JP 12345490 A JP12345490 A JP 12345490A JP H0423342 A JPH0423342 A JP H0423342A
- Authority
- JP
- Japan
- Prior art keywords
- socket
- upper lid
- socket upper
- solenoid valve
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 38
- 239000011347 resin Substances 0.000 claims description 5
- 229920005989 resin Polymers 0.000 claims description 5
- 238000001514 detection method Methods 0.000 claims 1
- 229910052751 metal Inorganic materials 0.000 abstract description 5
- 239000002184 metal Substances 0.000 abstract description 5
- 238000000034 method Methods 0.000 abstract 1
- 238000005259 measurement Methods 0.000 description 6
- 230000000694 effects Effects 0.000 description 3
- 230000008054 signal transmission Effects 0.000 description 3
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 238000011156 evaluation Methods 0.000 description 2
- 238000007689 inspection Methods 0.000 description 2
- 238000012536 packaging technology Methods 0.000 description 2
- 238000001179 sorption measurement Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000006837 decompression Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 230000005389 magnetism Effects 0.000 description 1
- 230000003287 optical effect Effects 0.000 description 1
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、半導体装置の測定において半導体装置の着脱
を容易とする半導体測定装置に関する。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a semiconductor measuring device that facilitates attachment and detachment of a semiconductor device during measurement of the semiconductor device.
従来の技術
近年、半導体分野の技術革新には多大なものがあり、半
導体集積回路のパッケージング技術においても同様であ
る。半導体装置など電子部品の実装技術の革新にともな
い、フラットタイプなと小型のパッケージング技術が開
発されている。第３図にこれら小型パンケージングされ
た半導体装置を測定するための従来の半導体測定装置の
構成を示す。BACKGROUND OF THE INVENTION In recent years, there have been many technological innovations in the semiconductor field, including packaging technology for semiconductor integrated circuits. Along with innovations in mounting technology for electronic components such as semiconductor devices, flat type and compact packaging technologies are being developed. FIG. 3 shows the configuration of a conventional semiconductor measuring device for measuring these small pancaged semiconductor devices.
図において、２１はソケット上蓋、２２はソケット下蓋
、２３はソケット上蓋２１の固定金具、２４は電極部、
２５はソケットの上下蓋接続部である。In the figure, 21 is a socket upper lid, 22 is a socket lower lid, 23 is a fixture for fixing the socket upper lid 21, 24 is an electrode part,
Reference numeral 25 indicates the upper and lower lid connecting portions of the socket.
上記のように構成された半導体測定装置を用いて半導体
装置２６を評価・検査する場合、ピンセットや磁石等を
用いて半導体装置２６をソケットに装着したり取りはず
したりするのが一般的である。When evaluating and inspecting the semiconductor device 26 using the semiconductor measuring device configured as described above, it is common to use tweezers, magnets, or the like to attach or detach the semiconductor device 26 from a socket.
発明か解決しようとする課題
しかしながら上記従来の構成では、半導体装置を装着し
たり取はずしたりする場合、半導体装置の表面に傷をつ
けたり、リード端子を損傷したりする場合があり、特に
磁石を使用した場合には電気的特性が磁気により劣化す
るなどの課題があった。Problem to be Solved by the Invention However, with the above conventional configuration, when mounting or removing a semiconductor device, the surface of the semiconductor device may be scratched or the lead terminals may be damaged. In this case, there were problems such as deterioration of electrical characteristics due to magnetism.
本発明は上記従来の課題を解決するものであり、半導体
測定装置１２、半導体装置（以下ＩＣと呼ぶ）を着脱す
る場合、ＩＣを損傷することのない優れた半導体測定装
置を提供することを目的とする。The present invention solves the above-mentioned conventional problems, and an object of the present invention is to provide an excellent semiconductor measuring device that does not damage the semiconductor device (hereinafter referred to as an IC) when the semiconductor device (hereinafter referred to as an IC) is attached or detached. shall be.
課題を解決するための手段
本発明は上記目的を達成するために、半導体測定装置の
一部分を構成するソケットの蓋の部分に真空パイプとセ
ンサを設け、さらに電磁弁と駆動回路を備えたものであ
る。Means for Solving the Problems In order to achieve the above object, the present invention provides a vacuum pipe and a sensor in the lid of a socket that constitutes a part of a semiconductor measuring device, and further includes a solenoid valve and a drive circuit. be.
作用
本発明は上記の構成により、半導体装置の測定時に半導
体装置を測定用の治具類に真空減圧による吸着力を利用
して着脱しているために半導体装置を損傷することがな
いという効果が得られる。Operation The present invention has the above-mentioned configuration, and has the effect that the semiconductor device is not damaged during measurement of the semiconductor device because the semiconductor device is attached to and detached from the measurement jig using the adsorption force due to vacuum depressurization. can get.
実施例
以下、本発明の一実施例について第１図および第２図を
参照しながら説明する。EXAMPLE Hereinafter, an example of the present invention will be described with reference to FIGS. 1 and 2.
図において、１はソケット上蓋、２はソケット下蓋、３
はソケット上蓋１の固定金具、４は電気測定のための電
極部、５はソケット上下蓋接続部、６は樹脂製リング、
７は真空パイプ（金属パイプ）、８はセンサ、９は駆動
回路、１０はパイプ取付金具、１１．１２．１３は信号
伝達コード、１４は電磁弁、１５はゴムパイプ、１１は
センサ、１７はパイプである。また、１８は半導体装置
の一つであるＩＣである。In the figure, 1 is the socket upper cover, 2 is the socket lower cover, and 3 is the socket upper cover.
is a fixing fitting for the socket top cover 1, 4 is an electrode part for electrical measurement, 5 is a socket top and bottom cover connection part, 6 is a resin ring,
7 is a vacuum pipe (metal pipe), 8 is a sensor, 9 is a drive circuit, 10 is a pipe mounting bracket, 11, 12, 13 is a signal transmission cord, 14 is a solenoid valve, 15 is a rubber pipe, 11 is a sensor, 17 is a pipe It is. Further, 18 is an IC which is one of the semiconductor devices.
次に上記実施例の動作について説明する。Next, the operation of the above embodiment will be explained.
ＩＣｌ３の装着時、ソケット上蓋１を開放し、ＩＣｌ３
をソケット下蓋２に保持し、ソケット上蓋１を閉じ、Ｉ
Ｃｌ３の特性評価、検査等の測定を行なう。測定が完了
したのちソケット上蓋１の固定金具３を外しソケット上
蓋１を開放する。この時、ソケット上蓋１に付属するセ
ンサ８がソケット上蓋１の開放を感知し、信号伝達コー
ド１１を介して駆動回路９に信号を送り、さらに信号伝
達コード１２を経由して電磁弁１４に達して電磁弁１４
を開き、パイプ１７に接続する真空ポンプ（図示せず）
によってゴムパイプ１５および鉄、アルミニウム、銅よ
りなる金属パイプ７の内部を減圧し、その吸着力によっ
て金属パイプ７の先端の開口部に設けられた空気のもれ
防止用と傷防止用の樹脂製ゴムリング６の部分でＩＣｌ
３を吸着し、第２図に示すようにＩＣｌ３はソケット上
蓋１内に収納された状態でソケット上蓋１か開放される
。When installing ICl3, open the socket top cover 1 and attach ICl3.
is held in the socket lower lid 2, the socket upper lid 1 is closed, and the I
Measurements such as Cl3 characteristic evaluation and inspection will be carried out. After the measurement is completed, the fixture 3 of the socket top cover 1 is removed and the socket top cover 1 is opened. At this time, the sensor 8 attached to the socket top cover 1 detects the opening of the socket top cover 1, sends a signal to the drive circuit 9 via the signal transmission cord 11, and further reaches the solenoid valve 14 via the signal transmission cord 12. Solenoid valve 14
a vacuum pump (not shown) connected to pipe 17
This reduces the pressure inside the rubber pipe 15 and the metal pipe 7 made of iron, aluminum, and copper, and its adsorption force causes the resin rubber provided at the opening at the tip of the metal pipe 7 to prevent air leakage and prevent scratches. ICl at ring 6
3, and as shown in FIG. 2, the socket top cover 1 is opened while the ICl 3 is housed in the socket top cover 1.
ソケット上蓋１が開放された時、センサ１６でツク゛ッ
ト上蓋１の位置を検出し、その信号が信号コード１３を
通って駆動回路９に入り、電磁弁１４が閉じて減圧を止
めＩＣｌ３を取り出すことかできる。When the socket top cover 1 is opened, the sensor 16 detects the position of the socket top cover 1, and the signal passes through the signal cord 13 and enters the drive circuit 9, and the solenoid valve 14 closes to stop the pressure reduction and take out the ICl3. can.
この実施例ではソケット上蓋１の開閉を検知するセンサ
８および１６として実際はリレーを使用したが、光セン
サ等を用いても同様の効果が得られる。また、ソケット
上蓋１の開閉を検出するセンサ８および１６を設ける位
置はソケット上蓋１に限らずソケット下蓋２に設けて開
閉を検出することもできる。In this embodiment, relays are actually used as the sensors 8 and 16 for detecting the opening and closing of the socket top cover 1, but the same effect can be obtained by using an optical sensor or the like. Furthermore, the sensors 8 and 16 for detecting the opening and closing of the socket upper lid 1 are not limited to the socket upper lid 1, but may be provided on the socket lower lid 2 to detect opening and closing.
このように実施例によればＩＣの評価・検査等において
、ＩＣの電気特性を劣化させたり、リードを曲げるなと
の事故を防止することかでき、作業性の向上をはかるこ
とかできる。As described above, according to the embodiment, it is possible to prevent accidents such as deterioration of the electric characteristics of the IC or bending of the leads during evaluation and inspection of the IC, and it is possible to improve work efficiency.
発明の効果
以上の実施例から明らかなように本発明によれば、半導
体装置の特性の評価・検査等の測定時に半導体装置を真
空減圧による吸着力によって測定治具類に着脱し、かつ
半導体装置に接する先端部に樹脂製リングを設けている
ために半導体装置を損傷することなく電気的緒特性を測
定することかでき、半導体装置の信頼性向上に役立つ半
導体測定装置を提供できる。Effects of the Invention As is clear from the above embodiments, according to the present invention, when measuring the characteristics of a semiconductor device, testing, etc., the semiconductor device can be attached to and detached from a measuring jig by the suction force due to vacuum decompression, and the semiconductor device Since the resin ring is provided at the tip in contact with the semiconductor device, the electrical characteristics can be measured without damaging the semiconductor device, and a semiconductor measuring device that is useful for improving the reliability of the semiconductor device can be provided.
第１図は本発明の一実施例における半導体測定装置の部
分断面正面図、第２図は同装置の動作時の部分断面正面
図、第３図は従来の半導体測定装置の要部断面正面図で
ある。
１・・・・・・ソケット下蓋、２・・・・・・ソケット
下蓋、４・・・・・・電極部、６・・・・・・樹脂製リ
ング、７・・・・・・真空パイプ、８・・・・・・セン
サ、９・・・駆動回路、１４・・・・・・電磁弁、１６
・・・・・・センサ、１８・・・・・・Ｉ Ｃ’（半導
体装置）。FIG. 1 is a partially sectional front view of a semiconductor measuring device according to an embodiment of the present invention, FIG. 2 is a partially sectional front view of the same device during operation, and FIG. 3 is a sectional front view of essential parts of a conventional semiconductor measuring device. It is. 1... Socket bottom cover, 2... Socket bottom cover, 4... Electrode section, 6... Resin ring, 7...... Vacuum pipe, 8...Sensor, 9...Drive circuit, 14...Solenoid valve, 16
...Sensor, 18...IC' (semiconductor device).
Claims (1)
有する真空パイプと、前記ソケット上蓋またはソケット
下蓋に取り付けられた前記ソケット上蓋の開閉を検知す
るセンサと、そのセンサの検知信号を処理する駆動回路
と、前記真空パイプ内の圧力を調整する電磁弁と、半導
体装置のリード部と電気的に接続する電極部とを備えた
半導体測定装置。A vacuum pipe having a resin ring at the tip attached to the socket upper cover, a sensor attached to the socket upper cover or the socket lower cover to detect opening/closing of the socket upper cover, and a drive circuit processing the detection signal of the sensor. , a semiconductor measuring device comprising: a solenoid valve that adjusts the pressure within the vacuum pipe; and an electrode portion electrically connected to a lead portion of the semiconductor device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2123454A JPH0423342A (en) | 1990-05-14 | 1990-05-14 | Semiconductor measuring apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2123454A JPH0423342A (en) | 1990-05-14 | 1990-05-14 | Semiconductor measuring apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0423342A true JPH0423342A (en) | 1992-01-27 |
Family
ID=14861016
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2123454A Pending JPH0423342A (en) | 1990-05-14 | 1990-05-14 | Semiconductor measuring apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0423342A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000108998A (en) * | 1998-10-05 | 2000-04-18 | Nec Eng Ltd | Alignment measuring jig |
-
1990
- 1990-05-14 JP JP2123454A patent/JPH0423342A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000108998A (en) * | 1998-10-05 | 2000-04-18 | Nec Eng Ltd | Alignment measuring jig |
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