JPH0423193U - - Google Patents
Info
- Publication number
- JPH0423193U JPH0423193U JP6389890U JP6389890U JPH0423193U JP H0423193 U JPH0423193 U JP H0423193U JP 6389890 U JP6389890 U JP 6389890U JP 6389890 U JP6389890 U JP 6389890U JP H0423193 U JPH0423193 U JP H0423193U
- Authority
- JP
- Japan
- Prior art keywords
- shield case
- shield
- legs
- shield plate
- plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Landscapes
- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6389890U JPH0423193U (zh) | 1990-06-15 | 1990-06-15 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6389890U JPH0423193U (zh) | 1990-06-15 | 1990-06-15 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0423193U true JPH0423193U (zh) | 1992-02-26 |
Family
ID=31594359
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6389890U Pending JPH0423193U (zh) | 1990-06-15 | 1990-06-15 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0423193U (zh) |
-
1990
- 1990-06-15 JP JP6389890U patent/JPH0423193U/ja active Pending