JPH04230060A - Cooling structure - Google Patents

Abstract

PURPOSE:To improve heat conduction between LSIs and conductive members or heat conduction between a heat dissipation block and the conductive members by a method wherein the conductive members are formed into a split type in the longitudinal direction and elastic materials to energize the conductive members in the direction of the block are respectively provided in the conductive members. CONSTITUTION:In a cooling structure consisting of a heat dissipation block 4 having conductive members (studs) 12, which are abutted on integrated circuit elements (LSIs) 2 mounted on a substrate 1 and are elastically supported, and a cold plate 3 having a refrigerant passage 8, which comes into contact with this block 4 and in which a refrigerant is fluidized, an elastic member (a spring) 12c to energize split conductive members 12a and 12b toward the outside direction is provided in the opposed surface of conductive members 12a and 12b to be formed into one by opposing to each other to the split conductive members 12a and 12b. Or an elastic member (a plate spring) 14d is inscribed in a recessed part (a groove) 14c with a conductive member (a stud) 14a having the recessed part 14c in its external surface and is energized in the outside direction so as to bring the opposite surface to a recessed part formation surface of the member 14a into contact with the block 4.

Description

[Detailed description of the invention]

0001

FIELD OF INDUSTRIAL APPLICATION The present invention relates to a cooling structure, and particularly relates to a cooling structure in which a conductive member elastically supported is brought into contact with an integrated circuit element (hereinafter referred to as LSI) mounted on a substrate, and coolant in a cold plate is cooled. This relates to a cooling structure that cools the LSI by heat exchange with the LSI.

0002

[Prior Art] Conventionally, as shown in FIG.
A heat dissipation block 23 made of a member with excellent thermal conductivity is attached to the substrate 20 on which the heat dissipation block 1 is mounted via a flange 24. A cold plate 22 having a refrigerant passage 28 through which a refrigerant flows is joined to the back surface of the heat radiation block 23. Incidentally, couplers 29a and 29b for connecting pipes are attached to both ends of the refrigerant passage 28, respectively.

A recess 23a is formed in the heat dissipation block 23 in correspondence with the mounting position of the LSI 21 on the board 20, and a stud 26 with excellent thermal conductivity is mounted in the recess 23a via a spring 27. The spring 27 is used to adjust the mounting height of the LSI 21 mounted on the board 20, and the surface of the stud 26 that comes into contact with the LSI 21 has an R curved surface to ensure reliable contact. Note that a sealing material 25 is attached between the heat dissipation block 23 and the substrate 20 to improve sealing performance.

[0004] In the above configuration, the heat during cooling is first
The heat is transmitted from the SI 21 to the stud 26 through indirect heat conduction with the spring 27 and the heat radiation block 23, and is then exchanged with the cold plate 22.

[0005]

[Problem to be Solved by the Invention] However, in the past, no matter how many springs ensured contact between the LSI and the stud, in the end the contact was only at one point, and the heat dissipation block and the stud were in direct contact. Since there were almost no parts, there was a problem of poor thermal conductivity.

[0006] Accordingly, an object of the present invention is to improve heat conduction between an LSI and a conductive member, or between a heat dissipation block and a conductive member.

[0007]

[Means for Solving the Problems] The above object is to provide a heat radiation block 4 having a conductive member 7 which is elastically supported and in contact with an integrated circuit element 2 mounted on a substrate 1;
In the cooling structure, the conductive member 7 includes a cylindrical stud 7a and a bellows 7f that elastically supports the stud 7a. and the stud 7
a, a cylindrical pipe 7b having the bellows 7f therein, and a bellows 7e elastically supporting the pipe 7b.

[
Alternatively, a heat dissipation block 4 having an elastically supported conductive member 12 in contact with the integrated circuit element 2 mounted on the substrate 1, and a refrigerant passageway in contact with the heat dissipation block 4 through which a refrigerant flows. Cold plate 3 with 8
In the cooling structure, the conductive members 12a, 12b are formed into one by facing each other, and the divided conductive members 12a, 12b are arranged in an outward direction on the opposing surfaces of the divided conductive members 12a, 12b. A cooling structure characterized by having an elastic member 12c biased toward the

0009
] Alternatively, a heat dissipation block 4 having a conductive member 14a which is in contact with the integrated circuit element 2 mounted on the substrate 1 and supported elastically, and a refrigerant passage 8 which is in contact with the heat dissipation block 4 and in which a refrigerant flows. A cooling structure consisting of a cold plate 3 having a recess 1 on an arbitrary part of its outer surface.
4c; an elastic body 14d that is inscribed in the recess 14c and biases the surface of the conductive member 14a opposite to the recess formation surface outwardly so as to contact the heat radiation block 4; A cooling structure characterized by comprising:

Alternatively, a heat dissipation block 4 having a conductive member 15 which is in contact with the integrated circuit element 2 mounted on the substrate 1 and supported elastically, and a refrigerant in which the refrigerant is in contact with the heat dissipation block 4 and flows therein. In a cooling structure consisting of a cold plate 3 having a passage 8, the elastic supporting surface of the conductive member 15 is sliced at a predetermined slope, and the conductive member 15 is eccentrically supported by sliding on the sloped surface onto the sliced surface. At the same time, this can be achieved by a cooling structure characterized by providing an auxiliary conductive member 16 that is elastically supported.

[0011]

[Operation] That is, in the present invention, by making the conductive member split in the longitudinal direction, the contact between the conductive member and the LSI can be made into multi-point contact, and the conductive member is By providing an elastic member that urges the member toward the heat radiation block, the conductive member can be brought into direct contact with the heat radiation block.

0012

[Embodiment] A preferred embodiment of the present invention will be described below with reference to FIG.
This will be explained in detail using FIGS. 14 to 14.

FIG. 1 is a diagram showing a first embodiment of the present invention, FIG. 2 is an exploded view of the stud, FIG. 3 is a diagram showing a state of heat conduction, and FIG. 4 is a diagram showing a second embodiment of the present invention. 5 is an exploded view of the stud (part 1), FIG. 6 is an exploded view of the stud (part 2), and FIG. 7 is a diagram showing the heat conduction state (part 1), Figure 8 is a diagram showing the state of heat conduction (
2), FIG. 9 is a diagram showing the third embodiment of the present invention, FIG. 10 is an exploded view of the stud (part 1), FIG. 11 is an exploded view of the stud (part 2), and FIG. 12 is a diagram showing a heat conduction state, FIG. 13 is a diagram showing a fourth embodiment of the present invention, and FIG. 14 is a diagram showing a heat conduction state.

1 to 14, 1 is a substrate, 2 is an LSI, 3 is a cold plate, 4 is a heat dissipation block, 4
a is a recess, 5 is a flange, 6 is a sealing material, 7 is a stud, 7a and 7b are pipes, 7c is a stud, 7d to 7f are bellows, 8 is a refrigerant passage, 9a and 9b are couplers, 10 is a bolt, 11 is Bumps, 12 are conductive members, 12a and 12
b, 12i and 12j are split studs, 12c is a spring, 1
2d and 12e are spring mounting holes, 12f is a groove, 12g is a leaf spring, 12h is a screw, 13 is a spring, 14a and 14b
is a stud, 14c groove, 14d is a plate spring, 14e is a screw, 14f is a recess, 14g is a spring, 14h is a ball, 1
4i is a screw hole, 15a to 15d are studs, 16a and 1
6b represents a sub-stud, and 17 represents a ball.

In FIGS. 1 to 14, the same reference numerals indicate the same objects.

First, FIGS. 1 to 3 regarding the first embodiment
This will be explained in detail using . As shown in Figure 1, LSI2
A heat dissipation block 4 made of a member with excellent thermal conductivity is attached to the board 1 on which the heat dissipation block 4 is mounted via a flange 5. In order to improve the sealing performance between the substrate 1 and the heat dissipation block 4, a sealing material 6 is provided at the joint point thereof. On the other hand, a cold plate 3 having a refrigerant passage 8 in which a refrigerant flows is brought into contact with the back surface of the heat dissipation block 4 .

On the other hand, a recess 4a is formed in the heat dissipation block 4 corresponding to the LSI mounting position, and a stud 7 shown in FIG. 2 is formed in the recess 4a. This stud 7 is
A cylindrical pipe 7b that surrounds the cylindrical stud 7a located at the center and a cylindrical pipe 7c that also covers the cylindrical pipe 7b are provided, and the stud 7a and the two pipe 7b, 7
Elastic bodies of bellows 7d to 7f are attached to c. Incidentally, it is desirable that the inner side of the recess 4a has a stepped shape due to problems during installation.

FIG. 3 is a diagram showing the state of heat conduction in the first embodiment, and shows a case where variations occur in the mounting height of the LSI mounted on the substrate due to the bonding state of the bumps. In this embodiment, the stud that comes into contact with the heat dissipation surface of the LSI has no irregularities on the heat dissipation surface of the LSI, so the stud 7c and the two pipes 7a and 7b that make up the stud always make three-point contact (indicated by ■ to ■ in the figure). Guaranteed. In this example, if there is sufficient distance between the diameter of the recess of the heat dissipation block and the diameter of the stud, one point contact and two circular line contacts can be obtained, improving the thermal conductivity from the LSI to the stud. be able to.

Next, a second embodiment will be explained in detail using FIGS. 4 to 8. As shown in FIG. 4, a heat dissipation block 4 made of a member with excellent thermal conductivity is attached to a substrate 1 on which an LSI 2 is mounted via a flange 5. In order to improve the sealing performance between the substrate 1 and the heat dissipation block 4, a sealing material 6 is provided at the joint point thereof. On the other hand, a cold plate 3 having a refrigerant passage 8 in which a refrigerant flows is brought into contact with the back surface of the heat dissipation block 4 .

On the other hand, in the heat dissipation block 4, a recess 4a is formed corresponding to the LSI mounting position, and a stud 12 shown in FIG. 5 is formed in the recess 4a. This stud 12
is divided into two equal parts in the longitudinal direction, and each of the divided studs 12a and 12b has two spring mounting holes 12d.
is formed. A spring 12c is attached to the spring attachment hole 12d to bias the spring 12c in the vertical direction in the drawing.

FIG. 6 shows a modification of the split stud, in which one of the split studs 12i and 12j, which are split into two in the longitudinal direction in the same manner as above, has a
A groove 12f is formed in the longitudinal direction, and a screw hole is bored in the center of the groove 12f. A plate spring 12g having a V-shaped spring property when viewed from the side is fastened to this groove 12f with a screw 12h. This leaf spring 12g has a spring property that biases it in the vertical direction in the drawing.

[0022] Such a stud 12 is used as a heat dissipation block 4.
It is attached by a spring 13 to adjust the variation in the height direction of the LSI 2 mounted on the board 1.

7 and 8 are diagrams showing the state of heat conduction in the second embodiment, and FIG. 7 is a side view thereof. In FIG. 7, a stud 12 is brought into contact with the heat radiation surface of an LSI 2 mounted on a substrate 1. The contact points between the LSI 2 and the stud 12 can realize two-point contact as shown in a, and the split studs 12a, 12
The spring 12c provided in b allows line contact with the heat dissipation block 4 in the longitudinal direction as shown in b and c (see the top view of FIG. 8). In addition, the split studs 12i and 1
In the case of 2j, the action and effect are the same, except that the spring 12c is replaced by the leaf spring 12g. Therefore, in this example, the thermal conductivity of the LSI 2 and the stud 12 is improved, and
The thermal conductivity between the stud 12 and the heat radiation block 4 can also be improved.

Next, regarding the third embodiment, FIGS. 9 to 12
This will be explained in detail using . As shown in FIG. 9, LSI2
A heat dissipation block 4 made of a member with excellent thermal conductivity is attached to the board 1 on which the heat dissipation block 4 is mounted via a flange 5. In order to improve the sealing performance between the substrate 1 and the heat dissipation block 4, a sealing material 6 is provided at the joint point thereof. On the other hand, a cold plate 3 having a refrigerant passage 8 in which a refrigerant flows is brought into contact with the back surface of the heat dissipation block 4 .

On the other hand, in the heat dissipation block 4, a recess 4a is formed corresponding to the LSI mounting position, and a stud 14a shown in FIG. 10 is formed in the recess 4a. This stud 14a is formed with a groove 14c having a predetermined length in the longitudinal direction, and a screw hole 14i is bored in the groove 14c. A plate spring 14d is fastened to this screw hole 14i by a screw 14e. This leaf spring 14d has a spring property that biases it upward in the drawing.

FIG. 11 shows a modified example of the stud, in which a recess 14f is formed at an arbitrary part of the stud 14b, and a spring 14g biased in the vertical direction in the figure is inserted into the recess 14f. be touched. A ball 14h is attached to the tip of the spring 14g.

These studs 14a and 14b are attached to the heat radiation block 4 by springs 13, and are adapted to adjust variations in the height direction of the LSI 2 mounted on the board 1.

FIG. 12 is a diagram showing the state of heat conduction in the third embodiment. In FIG. 12, the stud 14a is brought into contact with the heat dissipation surface of the LSI 2 mounted on the substrate 1. In FIG. At this time, due to the plate spring 14d provided in the slit 14a, the surface opposite to the plate spring 14d can be in line contact with the heat radiation block as shown in d. Note that heat can also be conducted at the portion where the plate spring 14d is in contact with the heat dissipation block 4. Therefore, in this example, it is possible to improve the heat conduction between the stud 14a and the four turns of the heat dissipation block. still,
Even in the case of the slid 14b, the plate spring 14d only replaces the ball 14h, and the operation and effect are the same as those of the stud 14a.

Finally, the fourth embodiment will be explained in detail using FIGS. 13 and 14. As shown in Figure 13,
A heat dissipation block 4 made of a material with excellent thermal conductivity is attached to a substrate 1 on which an LSI 2 is mounted via a flange 5. In order to improve the sealing performance between the substrate 1 and the heat dissipation block 4, a sealing material 6 is provided at the joint point thereof. On the other hand, a cold plate 3 having a refrigerant passage 8 in which a refrigerant flows is brought into contact with the back surface of the heat dissipation block 4 .

On the other hand, in the heat dissipation block 4, a recess 4a is formed corresponding to the LSI mounting position, and a stud is formed in the recess 4a, but the stud 14a is sliced diagonally at a predetermined angle. A ball 17 is provided on the sliced surface, and a spring 13 is provided on the ball 17 to adjust variations in mounting of the LSI 2. As another example of the portion of the stud 15b that comes into contact with the sliced surface, a sub-stud 16b having an R-curved surface is provided on the sliced surface. Furthermore, as another example of the portion of the studs 15c, 15d that comes into contact with the sliced surfaces, a sub-stud 16a is provided on the sliced surface thereof, the opposing surface having an angle similar to the above-mentioned predetermined angle. A spring 13 is attached to these sub-studs 16a, 16b to adjust variations in mounting of the LSI 2.

FIG. 14 is a diagram showing the state of heat conduction in the fourth embodiment, in which a stud 15c having a sliced surface is brought into contact with an LSI 2 mounted on a substrate 1. Then, the substat 16b comes into contact with this sliced surface, but at this time, the biasing of the spring 13 and the substat 1
Due to the weight of 6b, the force acts in the direction of the substrate and in the direction parallel to the substrate. Then, the sub-stud 16b comes into line contact with the heat radiation block 4, and the tip portion of the stud 15c on the sub-stud side comes into line contact with the heat radiation block 4. If there is some margin between the heat radiation block 4 and the stud, the LSI side end portion of the stud 15c will also come into line contact with the heat radiation block 4. This also applies to the case of the ball 17, where the sub stud 16 has an R curved surface at the tip.
The operation and effect are the same in case a (however, when the ball 17 is used, the contact with the heat radiation block 4 is a point contact). Therefore, in this example, studs 15a to 1
5d and the heat radiation block 4 can be improved.

[0032]

As explained above, according to the present invention, it is possible to improve the thermal conductivity between the stud and the LSI, and between the stud and the heat dissipation block, thereby improving the cooling capacity.

[Brief explanation of the drawing]

FIG. 1 is a diagram showing a first embodiment of the present invention.

FIG. 2 is an exploded view of the stud.

FIG. 3 is a diagram showing a state of heat conduction.

FIG. 4 is a diagram showing a second embodiment of the present invention.

FIG. 5 is an exploded view of the stud (Part 1).

FIG. 6 is an exploded view of the stud (Part 2).

FIG. 7 is a diagram showing a state of heat conduction (part 1).

FIG. 8 is a diagram showing a heat conduction state (part 2).

FIG. 9 is a diagram showing a third embodiment of the present invention.

FIG. 10 is an exploded view of the stud (part 1).

FIG. 11 is an exploded view of the stud (part 2).

FIG. 12 is a diagram showing a state of heat conduction.

FIG. 13 is a diagram showing a fourth embodiment of the present invention.

FIG. 14 is a diagram showing a state of heat conduction.

FIG. 15 is a diagram showing a conventional example.

[Explanation of symbols]

1: Substrate
2: LSI (integrated circuit element) 3: Cold plate 4
: Heat dissipation block 7, 12, 14a, 14b, 15: Stud (conductive member) 7a, 7b: Pipe
7e, 7f: Bellows 8: Refrigerant passage
12c: Spring (elastic member) 14c: Groove (recess) 1
4d: Leaf spring (elastic body)

Claims (4)

[Claims] 1. A heat dissipation block (4) having an elastically supported conductive member (7) in contact with an integrated circuit element (2) mounted on a substrate (1), and in contact with the heat dissipation block (4). In the cooling structure, the conductive member (7) includes a cylindrical stud (7a) and a cold plate (3) having a refrigerant passage (8) in which a refrigerant flows. Bellows (7
f), the stud (7a) and the bellows (7f)
A cooling structure comprising: a cylindrical pipe (7b) having a cylindrical pipe (7b) therein; and a bellows (7e) elastically supporting the pipe (7b). 2. A heat dissipation block (4) having an elastically supported conductive member (12) in contact with the integrated circuit element (2) mounted on the substrate (1), and in contact with the heat dissipation block (4). In a cooling structure consisting of a cold plate (3) having a refrigerant passage (8) in which a refrigerant flows, the conductive members (1) are formed into one body by facing each other.
2a, 12b, 12i, 12j) and an elastic member (12c) that biases the divided conductive members (12a, 12b) toward the outside on the opposing surfaces of the divided conductive members (12a, 12b). A cooling structure characterized by the provision of a cooling structure. 3. A conductive member (14a) in contact with and elastically supported by the integrated circuit element (2) mounted on the substrate (1).
a heat dissipation block (4) having a heat dissipation block (4);
and a cold plate (3) having a refrigerant passage (8) in which the refrigerant flows, the conductive member (14a) having a recess (14c) in any part of its outer surface; , an elastic body (14d) that is inscribed in the recess (14c) and biases the surface of the conductive member (14a) opposite to the recess forming surface in an outward direction so as to contact the heat radiation block (4); A cooling structure characterized by comprising: 4. A heat dissipation block (4) having an elastically supported conductive member (15) in contact with the integrated circuit element (2) mounted on the substrate (1), and in contact with the heat dissipation block (4). In a cooling structure consisting of a cold plate (3) having a refrigerant passage (8) in which a refrigerant flows, the elastic supporting surface of the conductive member (15) is sliced at a predetermined slope, and the sliced A cooling structure characterized in that an auxiliary conductive member (16) is provided which slides on the inclined surface to eccentrically support the conductive member (15) and is elastically supported.