JPH04224193A - Vapor growth device - Google Patents

Vapor growth device

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Publication number
JPH04224193A
JPH04224193A JP40776390A JP40776390A JPH04224193A JP H04224193 A JPH04224193 A JP H04224193A JP 40776390 A JP40776390 A JP 40776390A JP 40776390 A JP40776390 A JP 40776390A JP H04224193 A JPH04224193 A JP H04224193A
Authority
JP
Japan
Prior art keywords
superconductor
gas
growth
pipe
chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Withdrawn
Application number
JP40776390A
Other languages
Japanese (ja)
Inventor
Hideki Yamawaki
秀樹 山脇
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP40776390A priority Critical patent/JPH04224193A/en
Publication of JPH04224193A publication Critical patent/JPH04224193A/en
Withdrawn legal-status Critical Current

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Abstract

PURPOSE:To prevent the contamination of this vapor growth device with reaction products. CONSTITUTION:The vapor growth device is provided with a carrier gas feed pipe 21, a superconductor growth material chamber 10 communicating with the pipe 21, a chamber 15 for growing a superconductor on a substrate from the raw gas from the chamber 10 having an unreacted gas discharge hole 16 and a pipe 17 for discharging the unreacted gas from the discharge hole 16 outside the device. In this device, the inlet of the pipe 17 is furnished close to the discharge hole 16, and the discharge pipe 17 pierces a partition plate 19 provided close to the end of the growth chamber 15.

Description

【発明の詳細な説明】[Detailed description of the invention]

【0001】0001

【産業上の利用分野】本発明は気相成長装置に係り、特
に該装置でのガス排出機構に関する。気相成長で成長す
る酸化物超伝導体は液化窒素温素(77K)以上で超伝
導状態となり、将来の超高速コンピュータへの応用が期
待されている。
BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a vapor phase growth apparatus, and more particularly to a gas exhaust mechanism in the apparatus. Oxide superconductors grown by vapor phase growth become superconducting at temperatures above liquefied nitrogen (77K), and are expected to be used in future ultrahigh-speed computers.

【0002】0002

【従来の技術】Bi 系酸化物超伝導体は例えば4種の
組成元素それぞれのハロゲン化合物原料を用いてハライ
ドCVD(化学的気相成長)装置を用いて成長を行って
いた。図2は上記従来のCVD装置の一例を示す断面図
である。図2は、ハロゲン化合物原料として、Bicl
31,CuBr22,CaI23, SrI24を用い
てBi −Sr −Ca−Cu −O系超伝導体を成長
する例である。各原料はヒータ5〜8でガス化されHe
 ガスで成長室15へ運ばれ、基板12上で超伝導体を
成長させ、未反応ガスはガス排出孔16から排出され更
にガス排出管17からCVD装置外へ排出される。ガス
排出管が付けられた部分は、装置外への基板取り出し口
を兼ねるため部分的に取り外し可能になっていてOリン
グにより装置外部との気密を保っている。
BACKGROUND OF THE INVENTION Bi-based oxide superconductors have been grown using, for example, a halide CVD (chemical vapor deposition) apparatus using halogen compound raw materials of each of four compositional elements. FIG. 2 is a sectional view showing an example of the conventional CVD apparatus. Figure 2 shows Bicl as a halogen compound raw material.
This is an example of growing a Bi-Sr-Ca-Cu-O superconductor using 31, CuBr22, CaI23, and SrI24. Each raw material is gasified by heaters 5 to 8 and He
The gas is transported to the growth chamber 15 to grow a superconductor on the substrate 12, and unreacted gas is exhausted from the gas exhaust hole 16 and further exhausted from the gas exhaust pipe 17 to the outside of the CVD apparatus. The part to which the gas exhaust pipe is attached is partially removable because it also serves as an opening for taking out the substrate to the outside of the apparatus, and is kept airtight from the outside of the apparatus by an O-ring.

【0003】0003

【発明が解決しようとする課題】上記ハロゲン化合物原
料ガスが分解し、酸素と結合・固体化する一連のCVD
反応は成長領域内から装置外へ排出される迄続くため装
置内壁には超伝導体が粉状に堆積する。特に、基板取り
出し口18に堆積した粉状超伝導体は基板を装置内へセ
ットする時や、取り出す時に落下し、基板を汚染する場
合がある。また、粉状超伝導体はOリングに付着し装置
外部との気密性を低下させる場合もある。
[Problems to be Solved by the Invention] A series of CVD processes in which the above-mentioned halogen compound raw material gas is decomposed, combined with oxygen, and solidified.
Since the reaction continues until the superconductor is discharged from the growth region to the outside of the apparatus, the superconductor is deposited in powder form on the inner wall of the apparatus. In particular, the powdered superconductor deposited in the substrate take-out port 18 may fall and contaminate the substrate when the substrate is set in or taken out of the apparatus. Further, the powdered superconductor may adhere to the O-ring and reduce the airtightness with the outside of the device.

【0004】本発明は反応生成物による装置内汚染を防
止することを目的とする。
[0004] The object of the present invention is to prevent contamination of the inside of the apparatus by reaction products.

【0005】[0005]

【発明を解決するための手段】上記課題は本発明によれ
ばキャリアガス供給管(21)と、該キャリアガス供給
管(21)に連通した超伝導体成長用原料室(10)と
、該超伝導体成長用原料室(10)からの原料ガスを用
いて基板上に超伝導体を成長させ且つ未反応ガス排出孔
(16)を有する超伝導体成長室(15)と、前記未反
応ガス排出孔(16)から排出された未反応ガスを装置
外へ排出する未反応ガス排出管(17)とを具備する気
相成長装置において、前記未反応ガス排出孔(16)の
近傍に前記未反応ガス排出管(17)の入口を設け且つ
該未反応ガス排出管(17)は前記超伝導体成長室(1
5)末端近傍に設けられた仕切板(19)を介して配設
されていることを特徴とする気相成長装置によって解決
される。
Means for Solving the Invention According to the present invention, the above problem is solved by providing a carrier gas supply pipe (21), a superconductor growth raw material chamber (10) communicating with the carrier gas supply pipe (21), and a carrier gas supply pipe (21). A superconductor growth chamber (15) for growing a superconductor on a substrate using the raw material gas from the superconductor growth raw material chamber (10) and having an unreacted gas exhaust hole (16); In a vapor phase growth apparatus equipped with an unreacted gas exhaust pipe (17) for discharging unreacted gas discharged from the gas exhaust hole (16) to the outside of the apparatus, the unreacted gas exhaust pipe (17) is provided with a An inlet of an unreacted gas exhaust pipe (17) is provided, and the unreacted gas exhaust pipe (17) is connected to the superconductor growth chamber (1).
5) The problem is solved by a vapor phase growth apparatus characterized in that it is disposed through a partition plate (19) provided near the end.

【0006】本発明では前記未反応ガス排出管(17)
と前記仕切板(19)との間隙から前記超伝導体成長室
(15)へパージガスとしてのガスを供給することが好
ましい。
[0006] In the present invention, the unreacted gas discharge pipe (17)
It is preferable to supply gas as a purge gas to the superconductor growth chamber (15) from the gap between the superconductor growth chamber (15) and the partition plate (19).

【0007】[0007]

【作用】本発明によれば未反応ガスが装置の最外壁迄到
達せず、スムースに排出させるため、従来の基板汚染を
防止できる。
According to the present invention, unreacted gas does not reach the outermost wall of the device and is smoothly discharged, thereby preventing the conventional substrate contamination.

【0008】[0008]

【実施例】以下本発明のCVD装置実施例を図面に基づ
いて説明する。図1に、本発明をBi −Sr −Ca
 −Cu −O系超伝導体成長装置に適用した例を示す
。原料1〜4には例えば1:BiCl3,2:CuBr
2,3:CaI2, 4:SrI2を用い、ヒータ5〜
8で、それぞれ例えば150 ℃, 410 ℃, 7
60 ℃, 760 ℃に加熱して上記ハロゲン化合物
原料をガス化させ、キャリアガス供給管21を介してH
e ガスを成長室15へ輸送する。成長室15はヒータ
9で、例えば760 ℃に加熱されている。超伝導体を
成長させる基板12には例えば MgO基板を用い、成
長室15内で酸素供給管11で送られた酸素ガスと原料
ガスを反応させ超伝導体を成長させる。この後、未反応
の原料を含むガスは排出孔16を通り広がるが、ガス排
出管17が成長領域14から直接装置外へ排出すること
と仕切板19によって基板取り出し口18近傍への超伝
導体の堆積を防ぐことができる。また、仕切板19と基
板取り出し口と18の間の空間へは、パージガス供給管
20によって送られたHe ガスを充満させ、仕切板1
9とガス排出管17との隙間から成長領域14へと抜け
原料ガスの侵入を抑制する。
DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a CVD apparatus according to the present invention will be described below with reference to the drawings. FIG. 1 shows the present invention in Bi-Sr-Ca
An example of application to a -Cu-O based superconductor growth apparatus will be shown. Raw materials 1 to 4 include, for example, 1:BiCl3, 2:CuBr
2, 3: CaI2, 4: SrI2, heater 5~
8, respectively, for example, 150 ℃, 410 ℃, 7
The halogen compound raw material is gasified by heating to 60 °C and 760 °C, and H is supplied through the carrier gas supply pipe 21.
e. Transport the gas to the growth chamber 15. The growth chamber 15 is heated to, for example, 760° C. by a heater 9. For example, an MgO substrate is used as the substrate 12 on which the superconductor is grown, and the superconductor is grown by causing the oxygen gas sent through the oxygen supply pipe 11 to react with the source gas in the growth chamber 15. After this, the gas containing unreacted raw materials spreads through the exhaust hole 16, but the gas exhaust pipe 17 discharges the superconductor from the growth region 14 directly to the outside of the apparatus, and the partition plate 19 allows the superconductor to flow into the vicinity of the substrate outlet 18. can prevent the accumulation of In addition, the space between the partition plate 19 and the substrate outlet 18 is filled with He gas sent through the purge gas supply pipe 20, and
Intrusion of raw material gas into the growth region 14 from the gap between the gas discharge tube 9 and the gas discharge pipe 17 is suppressed.

【0009】[0009]

【発明の効果】以上説明したように本発明によれば、基
板取り出し口近傍への超伝導体の堆積を無くすことがで
きるため、基板を装置内へセットする時と取り出す時に
粉状超伝導体が落下して基板を汚染することが無くなる
[Effects of the Invention] As explained above, according to the present invention, it is possible to eliminate the accumulation of superconductor in the vicinity of the substrate take-out port, so that the powdered superconductor is removed when the substrate is set in and taken out of the apparatus. No more falling and contaminating the board.

【図面の簡単な説明】[Brief explanation of the drawing]

【図1】本発明の実施例を示す図である。FIG. 1 is a diagram showing an embodiment of the present invention.

【図2】従来例を示す図である。FIG. 2 is a diagram showing a conventional example.

【符号の説明】[Explanation of symbols]

1…BiCl3  2…CuBr2  3…CaI2 4…SrI2 5〜9…ヒーター 10…原料室 11…酸素導入管 12…MgO 基板 13…Bi 系酸化物超伝導体 14…成長領域 15…成長室 16…ガス排出孔 17…ガス排出管 18…基板取り出し口 19…仕切板 20…パージガス供給管 21…キャリアガス供給管 1...BiCl3 2...CuBr2 3...CaI2 4...SrI2 5-9...Heater 10...Raw material room 11...Oxygen introduction tube 12...MgO substrate 13...Bi-based oxide superconductor 14...Growth area 15...Growth room 16...Gas exhaust hole 17...Gas exhaust pipe 18... Board removal port 19...Partition plate 20...Purge gas supply pipe 21...Carrier gas supply pipe

Claims (4)

【特許請求の範囲】[Claims] 【請求項1】  キャリアガス供給管(21)と、該キ
ャリアガス供給管(21)に連通した超伝導体成長用原
料室(10)と、該超伝導体成長用原料室(10)から
の原料ガスを用いて基板上に超伝導体を成長させ且つ未
反応ガス排出孔(16)を有する超伝導体成長室(15
)と、前記未反応ガス排出孔(16)から排出された未
反応ガスを装置外へ排出する未反応ガス排出管(17)
とを具備する気相成長装置において、前記未反応ガス排
出孔(16)の近傍に前記未反応ガス排出管(17)の
入口を設け且つ該未反応ガス排出管(17)は前記超伝
導体成長室(15)末端近傍に設けられた仕切板(19
)を介して配設されていることを特徴とする気相成長装
置。
Claim 1: A carrier gas supply pipe (21), a superconductor growth raw material chamber (10) communicating with the carrier gas supply pipe (21), and a superconductor growth raw material chamber (10) connected to the carrier gas supply pipe (21); A superconductor growth chamber (15) that grows a superconductor on a substrate using source gas and has an unreacted gas exhaust hole (16).
), and an unreacted gas discharge pipe (17) for discharging the unreacted gas discharged from the unreacted gas discharge hole (16) to the outside of the apparatus.
In the vapor phase growth apparatus, the inlet of the unreacted gas exhaust pipe (17) is provided near the unreacted gas exhaust hole (16), and the unreacted gas exhaust pipe (17) is connected to the superconductor. A partition plate (19) provided near the end of the growth chamber (15)
).) A vapor phase growth apparatus.
【請求項2】  前記未反応ガス排出管(17)と前記
仕切板(19)との間隙から前記超伝導体成長室(15
)へガスを供給することを特徴とする請求項1記載の装
置。
2. The superconductor growth chamber (15) is discharged from the gap between the unreacted gas exhaust pipe (17) and the partition plate (19).
2. Device according to claim 1, characterized in that it supplies gas to ).
【請求項3】  前記超伝導体成長室(15)へ供給す
るガスがHe ガスであることを特徴とする請求項2記
載の装置。
3. The apparatus according to claim 2, wherein the gas supplied to the superconductor growth chamber (15) is He 2 gas.
【請求項4】  前記超伝導体がBi 系酸化物超伝導
体であることを特徴とする請求項1記載の装置。
4. The device according to claim 1, wherein the superconductor is a Bi 2 -based oxide superconductor.
JP40776390A 1990-12-27 1990-12-27 Vapor growth device Withdrawn JPH04224193A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP40776390A JPH04224193A (en) 1990-12-27 1990-12-27 Vapor growth device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP40776390A JPH04224193A (en) 1990-12-27 1990-12-27 Vapor growth device

Publications (1)

Publication Number Publication Date
JPH04224193A true JPH04224193A (en) 1992-08-13

Family

ID=18517316

Family Applications (1)

Application Number Title Priority Date Filing Date
JP40776390A Withdrawn JPH04224193A (en) 1990-12-27 1990-12-27 Vapor growth device

Country Status (1)

Country Link
JP (1) JPH04224193A (en)

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Date Code Title Description
A300 Application deemed to be withdrawn because no request for examination was validly filed

Free format text: JAPANESE INTERMEDIATE CODE: A300

Effective date: 19980312