JPH0422357B2 - - Google Patents
Info
- Publication number
- JPH0422357B2 JPH0422357B2 JP60268846A JP26884685A JPH0422357B2 JP H0422357 B2 JPH0422357 B2 JP H0422357B2 JP 60268846 A JP60268846 A JP 60268846A JP 26884685 A JP26884685 A JP 26884685A JP H0422357 B2 JPH0422357 B2 JP H0422357B2
- Authority
- JP
- Japan
- Prior art keywords
- printed wiring
- layer
- sheet
- electric circuit
- molded product
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 229920005989 resin Polymers 0.000 claims description 14
- 239000011347 resin Substances 0.000 claims description 14
- 238000002347 injection Methods 0.000 claims description 7
- 239000007924 injection Substances 0.000 claims description 7
- 238000007789 sealing Methods 0.000 claims description 5
- 229920002457 flexible plastic Polymers 0.000 claims description 2
- 238000001746 injection moulding Methods 0.000 claims description 2
- 238000000034 method Methods 0.000 claims description 2
- 238000007639 printing Methods 0.000 claims description 2
- 239000010410 layer Substances 0.000 description 25
- 239000002966 varnish Substances 0.000 description 5
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 4
- 229910052799 carbon Inorganic materials 0.000 description 4
- 239000005038 ethylene vinyl acetate Substances 0.000 description 4
- 230000003647 oxidation Effects 0.000 description 4
- 238000007254 oxidation reaction Methods 0.000 description 4
- 229920003023 plastic Polymers 0.000 description 4
- 239000004033 plastic Substances 0.000 description 4
- 229920001200 poly(ethylene-vinyl acetate) Polymers 0.000 description 4
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 3
- 239000004020 conductor Substances 0.000 description 3
- 229920000728 polyester Polymers 0.000 description 3
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- 239000004743 Polypropylene Substances 0.000 description 2
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- 230000004927 fusion Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 239000002985 plastic film Substances 0.000 description 2
- 229920006255 plastic film Polymers 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 238000007667 floating Methods 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- -1 polypropylene Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 238000012546 transfer Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Landscapes
- Injection Moulding Of Plastics Or The Like (AREA)
- Structure Of Printed Boards (AREA)
Description
【発明の詳細な説明】
(産業上の利用分野)
本発明は、表面に沿つてプリント配線を有する
成形品に関し、産業用、事務用、家庭用電子機器
の筐体や部品等に利用できる。DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a molded product having printed wiring along its surface, and can be used for cases and parts of industrial, office, and home electronic devices.
(従来技術)
従来、産業用、事務用あるいは家庭用電子機器
等の分野において、配線は、ガラス布基材エポキ
シ樹脂、紙基材エポキシ樹脂、紙基材フエノール
樹脂等の電気絶縁性基板の表面に、電気設計に基
づいた導電パターンを銀インキの導電性材料で形
成固着し回路保護の為絶縁ワニス等で被覆したプ
リント配線板や、ポリエステルフイルム、ポリイ
ミドフイルム等をベースに前記と同様の回路を形
成した、フレキシブルプリント配線シートを、筐
体内部に端部をビス止めなどして取り付けてい
た。この際プリント配線板、フレキシブルプリン
ト配線シートは、筐体内の空間中に位置し、特に
フレキシブルプリント配線シートは、柔軟である
為、筐体空間内で曲がつたり、たわんだ状態でセ
ツトされることが多かつた。(Prior art) Conventionally, in the fields of industrial, office, and household electronic equipment, wiring has been carried out on the surface of electrically insulating substrates made of glass cloth-based epoxy resin, paper-based epoxy resin, paper-based phenolic resin, etc. A circuit similar to the above is constructed using a printed circuit board with a conductive pattern based on the electrical design formed and fixed using conductive material such as silver ink and coated with insulating varnish to protect the circuit, or polyester film, polyimide film, etc. The formed flexible printed wiring sheet was attached to the inside of the casing by screwing the ends. At this time, the printed wiring board and flexible printed wiring sheet are located in the space inside the housing, and the flexible printed wiring sheet in particular is flexible, so it is set in a bent or bent state within the housing space. There were many things.
(発明が解決しようとする問題点)
従来のプリント配線板は、硬い平面板であり、
従つてこの板上に設けられる導電パターンも平面
的な設計に限られていた。また、プリント配線板
は使用される筐体等にビス止めなどで取り付け、
固定しなければならず、これらのために製品の形
状は大巾に制限され、しかも不必要な空間を要
し、さらにプリント配線板の重量により、製品全
体の重量が増大してしまつていた。(Problems to be solved by the invention) Conventional printed wiring boards are hard flat boards;
Therefore, the conductive pattern provided on this board is also limited to a planar design. In addition, the printed wiring board is attached to the casing etc. in which it will be used with screws, etc.
This severely limits the shape of the product, requiring unnecessary space, and the weight of the printed wiring board increases the overall weight of the product. .
フレキシブルプリント配線シートは、基材が軽
量かつ柔軟なため、前記の重量の問題は改善さ
れ、また製品形状の制限もある程度緩和された。
しかし、筐体等に取付けられたフレキシブルプリ
ント配線シートは、端部が固定されて中間部は筐
体の空間内に浮いた状態でセツトされるために、
例えば上下に分かれた筐体の下側に取付けられた
場合、筐体の上側を取付けあるいは取りはずしし
ようと筐体上側を上下左右に移動させることはし
ばしば行なわれ、この際に筐体上側の突起や筐体
上側に取付けられた部品などがフレキシブルプリ
ント配線シートに引つかかり、配線を傷つけた
り、あるいは部品と部品の間にフレキシブルプリ
ント配線シートをはさみこんで折曲げてしまつた
りするような新たな問題点を生じた。 Since the base material of the flexible printed wiring sheet is lightweight and flexible, the above-mentioned weight problem has been alleviated, and restrictions on product shape have been alleviated to some extent.
However, a flexible printed wiring sheet attached to a casing or the like is set with its ends fixed and the middle part floating within the space of the casing.
For example, when installed on the lower side of a housing that is divided into upper and lower parts, the upper side of the housing is often moved vertically and horizontally in order to attach or remove the upper side of the housing. There are new cases where parts installed on the upper side of the case get caught on the flexible printed wiring sheet, damaging the wiring, or where the flexible printed wiring sheet is sandwiched between parts and bent. This caused a problem.
また、フレキシブルプリント配線シートを使用
する場合においても、筐体の設計時には、フレキ
シブルプリント配線シートをビス止めするための
スペースと、フレキシブルプリント配線シートを
収納する空間を予め設ける必要があり、プリント
配線板使用時と同様の不必要な空間を必要として
いた。 Furthermore, even when using a flexible printed wiring sheet, when designing the casing, it is necessary to prepare a space for screwing the flexible printed wiring sheet and a space for storing the flexible printed wiring sheet in advance. It required an unnecessary amount of space similar to when in use.
今日では、製品の小型化、軽量化という要求が
一段と大きくなり、従来のプリント配線基板やフ
レキシブルプリント配線シートでは、対応しきれ
ない状況になりつつある。 Today, the demand for smaller and lighter products has become even greater, and conventional printed wiring boards and flexible printed wiring sheets are no longer able to meet these demands.
(問題を解決するための手段)
前記問題点を解決するために、本発明によるプ
リント配線を有する立体成形品は、次に述べる構
成からなる、即ち、ポリエステル、ポリイミド等
からなる柔軟性を有するプラスチツク製基材フイ
ルムの、少なくとも片面に、印刷、蒸着、転写等
の方法によつて電気回路として形成された導電層
を設ける。前記電気回路は通常銀インキ等の金属
によりなるもので、酸化防止や異物付着等による
シヨートなどを防ぐために、その導電層の少なく
とも他の電気部品等を接続するための接点を除い
た部分は、絶縁ワニスあるいはプラスチツクフイ
ルム等の絶縁材料により被覆される。また、前記
接点も酸化防止等の目的で、導電材料例えばカー
ボンインキで被覆されることが望ましい。(Means for Solving the Problems) In order to solve the above-mentioned problems, the three-dimensional molded product having printed wiring according to the present invention has the following structure, that is, it is made of flexible plastic made of polyester, polyimide, etc. A conductive layer formed as an electric circuit by a method such as printing, vapor deposition, or transfer is provided on at least one side of the base film. The electric circuit is usually made of metal such as silver ink, and in order to prevent oxidation and to prevent shoots due to adhesion of foreign substances, at least the part of the conductive layer excluding the contacts for connecting other electric parts, etc. Covered with an insulating material such as insulating varnish or plastic film. Further, it is desirable that the contacts are also coated with a conductive material, such as carbon ink, for the purpose of preventing oxidation.
また、前記シートの片面(電気回路のない側ま
たは電気回路の設けられていない部分には、射出
樹脂層との密着性を十分なものとするための、ポ
リウレタン、エチレン−酢酸ビニル共重合体
(EVA)、塩素化ポリプロピレン(塩素化PP)の
ような熱融着樹脂層を形成する。 In addition, one side of the sheet (the side without an electric circuit or a part without an electric circuit) is coated with polyurethane, ethylene-vinyl acetate copolymer ( EVA), chlorinated polypropylene (chlorinated PP) to form a heat-sealing resin layer.
このようにして得られた配線シートの上記熱融
着樹脂層側に、射出樹脂層を立体形状、例えば筐
体状に射出成形により形成し、本発明が完成す
る。 An injection resin layer is formed into a three-dimensional shape, for example, a housing shape, by injection molding on the heat-sealable resin layer side of the wiring sheet thus obtained, thereby completing the present invention.
(作用)
本発明によるプリント配線を有する立体成形品
の構成において、基材フイルム上に設けられた導
電層には、製品に必要な電気回路が収納される。
導電層上の絶縁ワニスあるいはプラスチツクフイ
ルムの被覆膜は、導電層の電気回路の酸化等によ
る劣化や他部品との接触による損傷を防ぎ、かつ
異物付着によるシヨート等を防ぐ。また、接点
は、電気部品を接続するのに必要であり、さらに
接点上に導電材料例えばカーボンインキの層を設
けた場合は、接点部分の酸化による劣化等を防
ぎ、かつ接点としての機能を損うことはない。(Function) In the structure of the three-dimensional molded product having printed wiring according to the present invention, an electrical circuit necessary for the product is housed in the conductive layer provided on the base film.
A coating of insulating varnish or plastic film on the conductive layer prevents deterioration of the conductive layer's electrical circuits due to oxidation, damage caused by contact with other parts, and prevents shoots due to adhesion of foreign matter. Contacts are necessary to connect electrical parts, and if a layer of conductive material, such as carbon ink, is provided on the contacts, it can prevent deterioration of the contact parts due to oxidation and impair their function as contacts. There's nothing wrong with that.
熱融着樹脂層は、電気回路を形成した配線シー
トと射出樹脂層(すなわちプラスチツク成形品)
とを強固に密着させる。 The heat-sealing resin layer consists of a wiring sheet with an electric circuit formed thereon and an injection resin layer (i.e., a plastic molded product).
and firmly adhere to each other.
(実施例)
次に、図面を参照して本発明の一実施例を説明
する。第1図は本発明の実施例を部分的に示す断
面図であり、説明のため、平面状に簡略化して示
している。(Example) Next, an example of the present invention will be described with reference to the drawings. FIG. 1 is a sectional view partially showing an embodiment of the present invention, and is shown in a simplified plan view for the sake of explanation.
ポリエステル50μからなる基材フイルム5に、
表面抵抗0.05Ω/口の銀インキを用いて電気回路
3をシルクスクリーン印刷で多い部分で4本/mm
のピツチで設ける。その際、電気回路層の厚さは
5〜10μとなるように調製する。接点1となる部
分に、表面抵抗50Ω/口のカーボンインキを用い
て、シルクスクリーン印刷により、被覆層を10〜
15μの厚さで設ける。さらに、電気回路の接点と
なる部分を除いた部分を被覆するように絶縁ワニ
ス層4を10〜15μの厚さで設ける。また、前記電
気回路層を持つ面と反対側のポリエステル基材フ
イルム面には、エチレン−酢酸ビニル共重合体
(EVA)からなる熱融着樹脂層6を乾燥後5g/
m2になるように塗布する。以上のようにしてでき
た配線シートを、所定の寸法に打抜いた後、電話
分配機筐体の射出成形用金型の希望する位置に配
線シートの電気回路層側を金型に接するようにセ
ツトし、その後、溶融ABS樹脂を射出、成形す
る。このシートのセツトに際し、シートはシート
搬送手段、金型等に接触するが、プリント配線部
分は絶縁層により被覆されているので、配線が傷
つけられて断線したり、汚れが付着してシヨート
したりすることがない。そして、熱融着樹脂は、
溶融ABS樹脂の熱により溶融し、成形品の冷却
と共に固化し、射出樹脂層(プラスチツク成形
品)7に密着した状態となつて一体化され、本発
明による表面に沿つてプリント配線を有する立体
成形品が形成された。 A base film 5 made of 50μ polyester,
Surface resistance: 0.05Ω/mm Electric circuit 3 is silk screen printed using silver ink, 4 lines/mm in most areas.
Provided at the pitch of At that time, the thickness of the electric circuit layer is adjusted to 5 to 10 microns. Apply a coating layer of 10 to 10cm to the part that will become contact 1 by silk screen printing using carbon ink with a surface resistance of 50Ω/mouth.
Provided with a thickness of 15μ. Furthermore, an insulating varnish layer 4 with a thickness of 10 to 15 microns is provided so as to cover the parts other than the parts that will become the contacts of the electric circuit. Further, on the surface of the polyester base film opposite to the surface having the electric circuit layer, a heat-sealing resin layer 6 made of ethylene-vinyl acetate copolymer (EVA) was applied after drying at a rate of 5 g/min.
Apply to make 2 m2. After punching out the wiring sheet made in the above manner to a predetermined size, place the wiring sheet at the desired position in the injection mold for the telephone distribution machine housing so that the electrical circuit layer side of the wiring sheet is in contact with the mold. After that, molten ABS resin is injected and molded. When setting the sheet, the sheet comes into contact with the sheet conveyance means, the mold, etc., but since the printed wiring part is covered with an insulating layer, there is no chance that the wiring will be damaged and disconnected, or that it will get dirty and be shot. There's nothing to do. And the heat fusion resin is
Three-dimensional molding that is melted by the heat of the molten ABS resin, solidified as the molded product cools, and is integrated with the injection resin layer (plastic molded product) 7 in close contact with it, and has printed wiring along the surface according to the present invention. product was formed.
(発明の効果)
本発明によるプリント配線を有する立体成形品
は、電気回路を形成した配線シートと射出樹脂層
(プラスチツク成形品;例えば筐体)が密着して
おり、見かけ上は電気回路が筐体の表面あるいは
内表面の立体形状に沿つて設けられている。この
ため、従来のプリント配線板やフレキシブルプリ
ント配線シートを使用した場合に生じた不必要な
空間が全くなくなり、また、従来、大きな制約を
受けていた製品の形状を自由に設計することが可
能になつた。また、フレキシブルプリント配線シ
ートを用いた場合に問題となつた筐体の突起や他
部品とシートの引つかかり等による電気回路の損
傷も、心配する必要がなくなつた。さらに、シー
トを成形品の成形と同時に密着させるため、シー
トを金型内にセツトする際にも、プリント配線部
分が絶縁層に被覆されているので、断線やシヨー
トの恐れがない。重量に関する問題も、基材に軽
量のフイルムを用いるので、重量が増大すること
はない。(Effects of the Invention) In the three-dimensional molded product having printed wiring according to the present invention, the wiring sheet on which the electrical circuit is formed and the injection resin layer (plastic molded product; for example, the casing) are in close contact with each other, and it appears that the electrical circuit is in the casing. It is provided along the three-dimensional shape of the surface or inner surface of the body. This eliminates the unnecessary space that occurs when conventional printed wiring boards and flexible printed wiring sheets are used, and also makes it possible to freely design the shape of products, which was previously subject to major restrictions. Summer. Additionally, there is no need to worry about damage to the electrical circuits caused by protrusions on the casing or the sheet getting caught on other parts, which was a problem when using flexible printed wiring sheets. Furthermore, since the sheet is brought into close contact with the molded product at the same time as the molding, the printed wiring portion is covered with an insulating layer even when the sheet is set in the mold, so there is no risk of disconnection or shorting. Regarding the problem of weight, since a lightweight film is used as the base material, the weight does not increase.
このように、本発明によるプリント配線を有す
る立体成形品は、従来の諸問題を解決し、製品の
小型化・軽量化という要求を満足させるものであ
る。 In this way, the three-dimensional molded product having printed wiring according to the present invention solves the conventional problems and satisfies the demand for smaller and lighter products.
図面は、本発明による一実施例の部分断面を示
す説明図である。
1:接点、2:カーボンインキ層、3:電気回
路(導電層)、4:絶縁ワニス層、5:基材フイ
ルム、6:熱融着樹脂層、7:射出樹脂層(プラ
スチツク成形品)。
The drawing is an explanatory diagram showing a partial cross section of an embodiment according to the present invention. 1: Contact, 2: Carbon ink layer, 3: Electric circuit (conductive layer), 4: Insulating varnish layer, 5: Base film, 6: Heat fusion resin layer, 7: Injection resin layer (plastic molded product).
Claims (1)
の少なくとも片面に、印刷等の方法により電気回
路として形成された導電層を設け、その導電層の
少なくとも他の電気部品等を接続するための接点
を除いた部分の上に絶縁層を設けることによつて
電気回路を形成するとともに、熱融着樹脂層を基
材フイルムの片面に有した、予め作られた配線シ
ートと、該配線シートの熱融着樹脂層側に射出成
形により形成された、立体形状の射出樹脂層とか
らなる、表面にプリント配線を設けた立体成形
品。1 A conductive layer formed as an electric circuit by a method such as printing is provided on at least one side of a flexible plastic base film, and at least contacts for connecting other electric parts, etc. of the conductive layer are excluded. A prefabricated wiring sheet in which an electric circuit is formed by providing an insulating layer on the portion and a heat-sealing resin layer on one side of a base film, and a heat-sealing resin of the wiring sheet. A three-dimensional molded product with printed wiring on the surface, consisting of a three-dimensional injection resin layer formed by injection molding on the layer side.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP26884685A JPS62128591A (en) | 1985-11-29 | 1985-11-29 | Solid molded product which has printed wiring on the surface |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP26884685A JPS62128591A (en) | 1985-11-29 | 1985-11-29 | Solid molded product which has printed wiring on the surface |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS62128591A JPS62128591A (en) | 1987-06-10 |
JPH0422357B2 true JPH0422357B2 (en) | 1992-04-16 |
Family
ID=17464080
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP26884685A Granted JPS62128591A (en) | 1985-11-29 | 1985-11-29 | Solid molded product which has printed wiring on the surface |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS62128591A (en) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
FR2619984B1 (en) * | 1987-08-24 | 1996-03-01 | Aerospatiale | METHOD FOR PRODUCING PRINTED CIRCUITS HAVING NON-DEVELOPABLE PRIORITY COMPLEX SURFACES |
JPH031139A (en) * | 1989-05-29 | 1991-01-07 | Satosen Co Ltd | Production of mask film for three-dimensional printed wiring board |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5595390A (en) * | 1979-01-12 | 1980-07-19 | Matsushita Electric Works Ltd | Method of forming molded article having printed circuit portion |
-
1985
- 1985-11-29 JP JP26884685A patent/JPS62128591A/en active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5595390A (en) * | 1979-01-12 | 1980-07-19 | Matsushita Electric Works Ltd | Method of forming molded article having printed circuit portion |
Also Published As
Publication number | Publication date |
---|---|
JPS62128591A (en) | 1987-06-10 |
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