JPH0422007A - Wire for winding process and coil using same - Google Patents
Wire for winding process and coil using sameInfo
- Publication number
- JPH0422007A JPH0422007A JP12459790A JP12459790A JPH0422007A JP H0422007 A JPH0422007 A JP H0422007A JP 12459790 A JP12459790 A JP 12459790A JP 12459790 A JP12459790 A JP 12459790A JP H0422007 A JPH0422007 A JP H0422007A
- Authority
- JP
- Japan
- Prior art keywords
- wire
- organic material
- insulating coating
- coating layer
- layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004804 winding Methods 0.000 title claims abstract description 26
- 238000000034 method Methods 0.000 title abstract description 6
- 239000011368 organic material Substances 0.000 claims abstract description 32
- 239000000919 ceramic Substances 0.000 claims abstract description 21
- 239000004020 conductor Substances 0.000 claims abstract description 12
- ZTQSAGDEMFDKMZ-UHFFFAOYSA-N Butyraldehyde Chemical compound CCCC=O ZTQSAGDEMFDKMZ-UHFFFAOYSA-N 0.000 claims abstract description 6
- 239000004925 Acrylic resin Substances 0.000 claims abstract description 5
- 229920000178 Acrylic resin Polymers 0.000 claims abstract description 5
- 239000010445 mica Substances 0.000 claims abstract description 4
- 229910052618 mica group Inorganic materials 0.000 claims abstract description 4
- 239000010410 layer Substances 0.000 claims description 37
- 239000011247 coating layer Substances 0.000 claims description 26
- 238000010438 heat treatment Methods 0.000 claims description 6
- 229910052751 metal Inorganic materials 0.000 claims description 5
- 239000002184 metal Substances 0.000 claims description 5
- 239000000203 mixture Substances 0.000 claims description 5
- 239000002245 particle Substances 0.000 claims description 5
- 239000012700 ceramic precursor Substances 0.000 claims description 4
- 229920002050 silicone resin Polymers 0.000 claims description 4
- 150000004703 alkoxides Chemical class 0.000 claims description 3
- 150000007524 organic acids Chemical class 0.000 claims description 2
- 239000002994 raw material Substances 0.000 claims description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 abstract description 6
- 229910052593 corundum Inorganic materials 0.000 abstract description 6
- 229910001845 yogo sapphire Inorganic materials 0.000 abstract description 6
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 abstract description 4
- 229910052681 coesite Inorganic materials 0.000 abstract description 2
- 229910052906 cristobalite Inorganic materials 0.000 abstract description 2
- 239000000377 silicon dioxide Substances 0.000 abstract description 2
- 235000012239 silicon dioxide Nutrition 0.000 abstract description 2
- 229910052682 stishovite Inorganic materials 0.000 abstract description 2
- 229910052905 tridymite Inorganic materials 0.000 abstract description 2
- 238000007747 plating Methods 0.000 description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 239000011248 coating agent Substances 0.000 description 7
- 238000000576 coating method Methods 0.000 description 7
- MCMNRKCIXSYSNV-UHFFFAOYSA-N Zirconium dioxide Chemical compound O=[Zr]=O MCMNRKCIXSYSNV-UHFFFAOYSA-N 0.000 description 6
- 238000005979 thermal decomposition reaction Methods 0.000 description 5
- 230000015556 catabolic process Effects 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- 239000000463 material Substances 0.000 description 4
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 3
- 238000005336 cracking Methods 0.000 description 3
- 238000001035 drying Methods 0.000 description 3
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 230000007423 decrease Effects 0.000 description 2
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 2
- DURPTKYDGMDSBL-UHFFFAOYSA-N 1-butoxybutane Chemical compound CCCCOCCCC DURPTKYDGMDSBL-UHFFFAOYSA-N 0.000 description 1
- CTQNGGLPUBDAKN-UHFFFAOYSA-N O-Xylene Chemical compound CC1=CC=CC=C1C CTQNGGLPUBDAKN-UHFFFAOYSA-N 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- 229910007277 Si3 N4 Inorganic materials 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- XXJWXESWEXIICW-UHFFFAOYSA-N diethylene glycol monoethyl ether Chemical compound CCOCCOCCO XXJWXESWEXIICW-UHFFFAOYSA-N 0.000 description 1
- 229940075557 diethylene glycol monoethyl ether Drugs 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 235000019441 ethanol Nutrition 0.000 description 1
- 238000009499 grossing Methods 0.000 description 1
- 239000002075 main ingredient Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229910003465 moissanite Inorganic materials 0.000 description 1
- 229960005235 piperonyl butoxide Drugs 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 229910010271 silicon carbide Inorganic materials 0.000 description 1
- 239000000779 smoke Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 230000001755 vocal effect Effects 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000008096 xylene Substances 0.000 description 1
Landscapes
- Inorganic Insulating Materials (AREA)
- Insulated Conductors (AREA)
Abstract
Description
【発明の詳細な説明】
［産業上の利用分野コ
この発明は、真空機器等の非ガス放出性の必要な分野に
おいて所望の形状に加工して用いるための線材や、ある
いは耐熱性コイル用巻線等に加工して用いることのでき
る巻線加工用線材およびこの線材を用いたコイルに関す
るものである。Detailed Description of the Invention [Industrial Fields of Application] This invention relates to wire rods processed into a desired shape and used in fields that require non-gassing properties such as vacuum equipment, or windings for heat-resistant coils. The present invention relates to a wire for winding that can be processed into a wire or the like, and a coil using this wire.
［従来の技術および発明が解決しようとする課題］従来
の真空機器等で用いられる巻線や耐熱性コイル用巻線と
しては、以下のようなものがある。[Prior Art and Problems to be Solved by the Invention] Examples of winding wires and heat-resistant coil windings used in conventional vacuum equipment and the like are as follows.
まず第１に、ポリイミド等の耐熱性有機材料をコーティ
ングした巻線が知られている。しかしながら、このよう
な巻線の耐熱性は高々３００℃程度までであり、ガス放
出性を有しているという欠点があった。First of all, windings coated with a heat-resistant organic material such as polyimide are known. However, the heat resistance of such a winding wire is at most about 300° C., and there is a drawback that it has gas release properties.
第２には、フッ素樹脂等の耐熱性有機材料を被覆した電
線が知られている。しかしながら、この電線も、上記の
電線と同様に耐熱性は高々３００℃程度であり、不十分
なものであった。Secondly, electric wires coated with a heat-resistant organic material such as fluororesin are known. However, like the above-mentioned electric wire, this electric wire also had an insufficient heat resistance of about 300° C. at most.
第３には・、セラミックス粒子と有機材料を混合しこれ
を被覆した電線か知られている。この電線は上記の２つ
の電線に比べると耐熱性は優れるものの、有機材料を使
用しているため、ガス放出性を有するという問題があっ
た。Thirdly, an electric wire coated with a mixture of ceramic particles and an organic material is known. Although this electric wire has better heat resistance than the above two electric wires, since it uses an organic material, there is a problem in that it has gas release properties.
第４には、上記のセラミックス粒子と有機材料を混合し
被覆した電線を、予め加熱して有機材料の部分を加熱し
て除去した電線が知られている。Fourthly, an electric wire is known in which an electric wire coated with a mixture of the above-mentioned ceramic particles and an organic material is heated in advance to heat and remove the organic material portion.
しかしなから、この電線は、可撓性が不十分であり、加
工が困難であるという問題点を有しており、さらに表面
平滑性に乏しく、この面からも問題があった。However, this electric wire has problems in that it has insufficient flexibility and is difficult to process, and also has poor surface smoothness, which also poses problems.
この発明の問題は、真空機器内の巻線コイルや高温下で
用いるコイルなどとなるように所望の形状に加工するこ
とのできる巻線加工用線材およびこの線材を用いたコイ
ルを提供することにある。The problem of this invention is to provide a wire material for winding that can be processed into a desired shape such as a winding coil in a vacuum device or a coil used under high temperatures, and a coil using this wire material. be.
［課題を解決するための手段］
この発明の巻線加工用線材は、導体と、導体の外周に設
けられるセラミックスを主体とする絶縁被覆層と、絶縁
被覆層の外周に設けられ絶縁被覆層よりも厚みの薄い易
熱分解性有機材料層とを備えている。[Means for Solving the Problems] The wire rod for winding of the present invention includes a conductor, an insulating coating layer mainly made of ceramics provided around the outer periphery of the conductor, and an insulating coating layer provided around the outer periphery of the insulating coating layer. It also has a thin layer of easily thermally decomposable organic material.
この発明において絶縁被覆層は、セラミックスを主体と
した無機絶縁層であり、たとえばセラミックス粒子とシ
リコン樹脂を混合して導体に塗布した後にこれを加熱し
てセラミックス化したり、あるいは金属アルコキシドま
たは金属有機酸を主原料とするセラミックス前駆体を前
記導体に塗布した後、これを加熱してセラミックス化す
ることにより形成することができる。In this invention, the insulating coating layer is an inorganic insulating layer mainly made of ceramics. For example, the insulating coating layer is an inorganic insulating layer mainly made of ceramics. For example, ceramic particles and silicone resin are mixed and applied to the conductor and then heated to form a ceramic, or metal alkoxide or metal organic acid is mixed. It can be formed by coating the conductor with a ceramic precursor containing as a main raw material and then heating it to form a ceramic.
このような絶縁被覆層のセラミックスは、たとえば、５
ｉ０２、Ａｌ２Ｏ３、ＳｉＣ，Ｓｉ３ Ｎ４、Ｚｒ０９
またはマイカを主成分としたものか挙げられる。The ceramic of such an insulating coating layer is, for example, 5
i02, Al2O3, SiC, Si3 N4, Zr09
Or it may be one that has mica as its main ingredient.
またこの発明において、易熱分解性有機材料層とは、容
易に熱分解する樹脂などの有機材料から形成された層を
いい、たとえば、ブチラール、ホルマール、およびアク
リル樹脂を主成分とした樹脂層として形成することがで
きる。Furthermore, in this invention, a layer of easily thermally decomposable organic material refers to a layer formed from an organic material such as a resin that easily thermally decomposes. can be formed.
また、この発明の巻線加工用線材は、所望の形状に加工
した後、加熱して易熱分解性有機材料層を熱分解させて
除去し、所望の形状のコイルとして用いることのできる
ものである。Further, the wire rod for winding of the present invention can be used as a coil in a desired shape by processing it into a desired shape and then heating it to thermally decompose and remove the easily thermally decomposable organic material layer. be.
［作用コ
この発明において絶縁被覆層は、巻線加工用線材が所望
の形状に加工され熱分解により易熱分解性有機材料層が
除去された後に、コイルを構成する線材に耐熱性および
易熱分解性を付与するものである。このような絶縁被覆
層としては、上述したような５ｉＯ９、Ａ１゜０３．５
ｉＣ１Ｓｉ３Ｎ４、ＺｒＯ２およびマイカなとのセラミ
ックスの少なくとも１種以上を主成分としたものを用い
ることかできる。[Function] In this invention, the insulating coating layer provides heat resistance and heat resistance to the wire constituting the coil after the wire for winding is processed into the desired shape and the easily heat decomposable organic material layer is removed by thermal decomposition. It imparts degradability. As such an insulating coating layer, 5iO9, A1°03.5 as mentioned above is used.
It is possible to use a material whose main component is at least one of ceramics such as iC1Si3N4, ZrO2, and mica.
この発明において、易熱分解性有機材料は、低い温度で
コイル導体の特性を損なったり、あるいは熱変形を生し
せしめることなく熱分解できるものか好ましく、上述の
ようなブチラール、ホルマール、およびアクリル樹脂等
を用いる口上かできる。これらの樹脂は、溶剤への溶解
性に優れているので、塗布しやすく、また塗膜形成後に
も表面を平滑にし、可撓性を付与するなとの優れた性質
を与える。In this invention, the thermally decomposable organic material is preferably one that can be thermally decomposed at low temperatures without impairing the properties of the coil conductor or causing thermal deformation, such as butyral, formal, and acrylic resins as described above. It is possible to use verbal methods such as These resins have excellent solubility in solvents, so they are easy to apply, and even after forming a coating, they provide excellent properties such as smoothing the surface and imparting flexibility.
この発明において、易熱分解性有機材料層を絶縁被覆層
よりも厚みを薄くしているのは、所望の形状に加工した
後に熱分解により除去する際容易に除去できるようにす
るためである。またコイルに加工した後、易熱分解性有
機材料層を熱分解して除去すると、絶縁被覆層間にこれ
らの厚みに相当する距離の隙間か形成されるので、この
ような隙間を小さくする意味からも、易熱分解性有機材
材層を絶縁被覆層よりも薄い厚みとしている。In this invention, the easily thermally decomposable organic material layer is made thinner than the insulating coating layer so that it can be easily removed by thermal decomposition after being processed into a desired shape. In addition, when the easily thermally decomposable organic material layer is thermally decomposed and removed after being processed into a coil, a gap with a distance corresponding to the thickness of these layers will be formed between the insulation coating layers. Also, the thermally decomposable organic material layer is thinner than the insulating coating layer.
この発明の巻線加工用線材では、絶縁被覆層の外周に易
熱分解性有機材料層が設けられているため、所望の形状
に巻線加工用線材を加工する際、表面が有機材料層で覆
われているため平滑であり、また表面が有機材料層で覆
われているため可撓性が付与され、加工の際に絶縁被覆
層に割れや剥離等が発生するのを防止することができる
。In the wire for winding of the present invention, since the easily thermally decomposable organic material layer is provided on the outer periphery of the insulating coating layer, when the wire for winding is processed into the desired shape, the surface is covered with the organic material layer. Because it is covered, it is smooth, and because the surface is covered with an organic material layer, it is flexible, which prevents the insulation coating layer from cracking or peeling during processing. .
また、この発明の巻線加工用線材は、所望の形状に加工
した後に、易熱分解性有機材料層を熱分解により除去す
る。このため、真空機器中などにおいてもガス発生は少
なく、また高温に加熱されても、すでに加熱されたもの
であるので、不燃性であり、煙の発生等もなく、高い温
度で絶縁性が保持される。Moreover, after the wire rod for winding of the present invention is processed into a desired shape, the easily thermally decomposable organic material layer is removed by thermal decomposition. For this reason, there is little gas generation even in vacuum equipment, and even if it is heated to high temperatures, it is already heated, so it is nonflammable, does not generate smoke, and maintains its insulation properties at high temperatures. be done.
［実施例コ
実施例１
直径１ｍｍのＮｉめつき銅線に、テトラ５ｅｃ−ブチル
ジルコネートのエチルアルコール溶液に少量の水を加え
、混合加熱して準備したセラミックス前駆体溶液を塗布
し、６００°Ｃで焼付けた。[Example 1] A ceramic precursor solution prepared by adding a small amount of water to an ethyl alcohol solution of tetra-5ec-butyl zirconate and heating the mixture was applied to a Ni-plated copper wire with a diameter of 1 mm, and heated at 600°. Burnt with C.
この塗布と焼付を数回繰返して約５μｍの厚みのＺｒＯ
２皮膜を形成した。This coating and baking process was repeated several times to form a ZrO film with a thickness of about 5 μm.
Two films were formed.
この線材にブチラールのバラキシレン溶液を塗布して乾
燥し、この塗布および乾燥を繰り返すことによってブチ
ラール樹脂の皮膜を約２μｍの厚みとなるように形成し
た。A solution of butyral in xylene was applied to this wire and dried, and by repeating this application and drying, a butyral resin film was formed to a thickness of about 2 μm.
実施例２
アルミニウム テトラ−１−ブトキシド２５ｇをジエチ
レングリコールモノエチルエーテル１０Ｑｍｌに溶解し
、その後１５０°Ｃて１時間加熱攪拌した後、室温まで
放冷して金属アルコキシドを含むセラミックス前駆体溶
液を調製した。この溶液を、実施例１と同様の直径１ｍ
ｍのＮｉめつき銅線に塗布し、５００℃で焼付けた。こ
の塗布および焼付を数回繰返して、約８μｍの厚みのＡ
ｌ２Ｏ３皮膜を形成させた。Example 2 25 g of aluminum tetra-1-butoxide was dissolved in 10 Qml of diethylene glycol monoethyl ether, heated and stirred at 150°C for 1 hour, and then allowed to cool to room temperature to prepare a ceramic precursor solution containing metal alkoxide. This solution was applied to a tube with a diameter of 1 m as in Example 1.
It was applied to a Ni-plated copper wire of 500 m in diameter and baked at 500°C. This coating and baking process was repeated several times to form an A with a thickness of about 8 μm.
A l2O3 film was formed.
この線材にホルマール樹脂のジブチルエーテル溶液を塗
布して乾燥し、この塗布および乾燥を数回繰返すことに
よって約３μｍの厚みのホルマール皮膜を形成した。A dibutyl ether solution of formal resin was applied to this wire and dried, and this application and drying were repeated several times to form a formal film with a thickness of about 3 μm.
実施例３
シリコン樹脂溶液中にＡｌ２Ｏ３粒子を混合して調製し
た塗布溶液を、実施例１と同様の直径１ｍｍのＮｉめっ
き銅線上に塗布して３００°Ｃで焼付け、この塗布およ
び焼付けを数回繰返して、最後に約６００°Ｃで加熱し
シリコン樹脂をセラミックス化して約２０μｍの厚みの
Ａｌ２Ｏ３・ＳｉＯ２皮膜を形成させた。Example 3 A coating solution prepared by mixing Al2O3 particles in a silicone resin solution was coated on the same Ni-plated copper wire with a diameter of 1 mm as in Example 1 and baked at 300°C. This coating and baking were repeated several times. Finally, the silicone resin was heated to about 600° C. to form a ceramic, forming an Al2O3.SiO2 film with a thickness of about 20 μm.
この線材の上に、アクリル樹脂溶液を塗布して乾燥し、
この塗布および乾燥を数回繰返して約５μｍの厚みのア
クリル皮膜を形成させた。An acrylic resin solution is applied onto this wire and dried.
This coating and drying process was repeated several times to form an acrylic film with a thickness of about 5 μm.
第１図は、実施例１て得られる線材を示す断面図であり
、銅線１にはＮｉめっき層２か形成されており、このＮ
１めっき層２の外周にＺｒＯ２皮膜３か形成され、さら
にその外周にブチラール皮膜４が形成されている。FIG. 1 is a cross-sectional view showing the wire rod obtained in Example 1, in which a Ni plating layer 2 is formed on the copper wire 1, and this N
A ZrO2 film 3 is formed on the outer periphery of the first plating layer 2, and a butyral film 4 is further formed on the outer periphery.
第２図は、実施例２て得られた線材を示す断面図である
。銅線５のまわりにはＮｉめっき層６か形成され、この
Ｎ１めっき層６の外周にＡｌ、２０３皮膜７か形成され
ている。このＡｌ２Ｏ３皮膜７のまわりにホルマール皮
膜８か形成されている。FIG. 2 is a sectional view showing the wire rod obtained in Example 2. A Ni plating layer 6 is formed around the copper wire 5, and an Al, 203 film 7 is formed around the outer periphery of the N1 plating layer 6. A formal film 8 is formed around this Al2O3 film 7.
第３図は、実施例３て得られた線材を示す断面図である
。銅線９にはＮ］めっき層１０か形成され、このＮｉめ
っき層１０のまわりにＡＩ。０３・Ｓｉ○２皮膜１１か
形成されている。この皮膜のまわりにアクリル皮膜１２
か形成されている。FIG. 3 is a sectional view showing the wire rod obtained in Example 3. A Ni plating layer 10 is formed on the copper wire 9, and an AI plating layer 10 is formed around the Ni plating layer 10. 03.Si○2 film 11 is formed. An acrylic film 12 is placed around this film.
or is formed.
上記の実施例１．２および３のそれぞれの線材を２Ｑｍ
ｍｄに巻線加工してコイル状にしたところ、いずれの線
材においても絶縁破壊電圧か低下することな（、またク
ラックか生したりすることなく高速巻線加工することか
できた。2Qm of each of the wire rods of Examples 1.2 and 3 above
When winding wires into md and making them into coils, high-speed winding was possible without any drop in dielectric breakdown voltage (and without cracking) for any of the wires.
これに対し、実施例１．２および３においてそれぞれ易
熱分解性有機材料層を塗布していない、絶縁被覆層のみ
の線材を高速巻線加工したところ、絶縁破壊電圧が低下
し、またクラックを生じた。On the other hand, in Examples 1.2 and 3, when wire rods with only an insulating coating layer and no thermally decomposable organic material layer were subjected to high-speed winding, the dielectric breakdown voltage decreased and cracks did not occur. occured.
実施例３のものでは、絶縁被覆層が剥離した。In the case of Example 3, the insulating coating layer peeled off.
以上の結果から明らかなように、この巻線加工用線材は
、巻線加工した際、絶縁被覆層の上に設けられた易熱分
解性有機材料層により、絶縁破壊電圧の低下やクラック
の発生、あるいは絶縁被覆層の剥離などを防止すること
ができる。As is clear from the above results, when this wire material for wire winding is processed, the dielectric breakdown voltage decreases and cracks occur due to the easily thermally decomposable organic material layer provided on the insulating coating layer. Alternatively, peeling of the insulating coating layer can be prevented.
上記の実施例１〜３の線材を巻線加工しコイルにしたも
のを、４００°Ｃに加熱し、それぞれの易熱分解性有機
材料層、すなわちブチラール樹脂層、ホルマール樹脂層
、およびアクリル樹脂層の皮膜を熱分解させて除去した
。このように熱分解して有機材料層を除去したコイルを
真空中で使用したところ、セラミックス被覆のみの線材
によるコイルとほとんど変わらない程度に少ないガス放
出量であった。The wire rods of Examples 1 to 3 described above were wound into coils and heated to 400°C, and each of the easily decomposable organic material layers, that is, the butyral resin layer, the formal resin layer, and the acrylic resin layer, was heated to 400°C. The film was removed by thermal decomposition. When a coil from which the organic material layer was removed by thermal decomposition was used in a vacuum, the amount of gas released was almost the same as that of a coil made of a wire coated only with ceramics.
［発明の効果］
以上説明したように、この発明の巻線加工用線材は、絶
縁被覆層のまわりに易熱分解性有機材料層が設けられて
いるため、所望の形状に加工する際に、絶縁被覆層にク
ラックか生じたり、あるいは剥離したりすることを有効
に防止することができ、絶縁破壊電圧の低下を防止する
ことかできる。[Effects of the Invention] As explained above, since the wire rod for winding of the present invention is provided with the easily thermally decomposable organic material layer around the insulating coating layer, when it is processed into a desired shape, It is possible to effectively prevent cracking or peeling of the insulating coating layer, and it is also possible to prevent a decrease in dielectric breakdown voltage.
また所望の形状のコイルに加工した後は、易熱分解性有
機材料層を加熱して除去することがてきるので、真空中
においてもガス放出量の少ないコイルとすることかでき
、また高温下においても高い絶縁性が保持される。In addition, after processing the coil into the desired shape, the easily thermally decomposable organic material layer can be heated and removed, making it possible to create a coil that releases less gas even in a vacuum, and can also be used at high temperatures. High insulation properties are maintained even at low temperatures.
第１図は、この発明の一実施例を示す断面図である。
第２図は、この発明の他の実施例を示す断面図である。
第３図は、この発明のさらに他の実施例を示す断面図で
ある。
図において、１，５．９は銅線、２． ６． １０はＮ
ｉめっき層、３はＺｒＯ２皮膜、４はブチラール皮膜、
７はＡｌ２Ｏ３皮膜、８はホルマール皮膜、１１はＡｌ
２Ｏ３・５ｉ０２皮膜、１２はアクリル皮膜を示す。
特許出願人 住友電気工業株式会社
代理人弁理士深見久部・、メート
ゝし＝−°−
（ばか２名） −FIG. 1 is a sectional view showing an embodiment of the present invention. FIG. 2 is a sectional view showing another embodiment of the invention. FIG. 3 is a sectional view showing still another embodiment of the invention. In the figure, 1, 5.9 are copper wires, 2. 6. 10 is N
i plating layer, 3 is ZrO2 film, 4 is butyral film,
7 is Al2O3 film, 8 is formal film, 11 is Al
2O3.5i02 film, 12 represents an acrylic film. Patent applicant Sumitomo Electric Industries, Ltd. Patent attorney Kube Fukami, Mate = −°− (2 idiots) −
Claims (6)
る絶縁被覆層と、 前記絶縁被覆層の外周に設けられ、前記絶縁被覆層より
も厚みの薄い易熱分解性有機材料層とを備える、巻線加
工用線材。(1) A conductor, an insulating coating layer mainly made of ceramics provided around the outer periphery of the conductor, and a thermally decomposable organic material layer provided around the outer periphery of the insulating coating layer and having a thickness thinner than the insulating coating layer. A wire rod for winding processing, comprising:
脂を混合して前記導体に塗布した後、これを加熱してセ
ラミックス化した層である、請求項１に記載の巻線加工
用線材。(2) The wire rod for winding according to claim 1, wherein the insulating coating layer is a layer obtained by applying a mixture of ceramic particles and silicone resin to the conductor and then heating the mixture to form a ceramic.
有機酸を主原料とするセラミックス前駆体を前記導体に
塗布した後、これを加熱してセラミックス化した層であ
る、請求項１に記載の巻線加工用線材。(3) The volume according to claim 1, wherein the insulating coating layer is a layer obtained by applying a ceramic precursor containing a metal alkoxide or a metal organic acid as a main raw material to the conductor and then heating it to form a ceramic. Wire rod for wire processing.
ｌ＿２Ｏ＿３、ＳｉＣ、Ｓｉ＿３Ｎ＿４、ＺｒＯ＿２ま
たはマイカを主成分とする、請求項１に記載の巻線加工
用線材。(4) The ceramic of the insulating coating layer is SiO_2, A
The wire rod for winding according to claim 1, which has l_2O_3, SiC, Si_3N_4, ZrO_2, or mica as a main component.
マール、またはアクリル樹脂を主成分としている、請求
項１に記載の巻線加工用線材。(5) The wire rod for winding according to claim 1, wherein the thermally decomposable organic material layer contains butyral, formal, or acrylic resin as a main component.
加工した後、加熱して前記易熱分解性有機材料層を熱分
解させて除去しセラミックスを主体とする前記絶縁被覆
層で絶縁させたことを特徴とする、コイル。(6) After processing the wire rod for winding processing according to claim 1 into a desired shape, heating is performed to thermally decompose and remove the easily thermally decomposable organic material layer, and the insulating coating layer mainly consists of ceramics. A coil characterized by being insulated with.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12459790A JPH0422007A (en) | 1990-05-15 | 1990-05-15 | Wire for winding process and coil using same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP12459790A JPH0422007A (en) | 1990-05-15 | 1990-05-15 | Wire for winding process and coil using same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0422007A true JPH0422007A (en) | 1992-01-27 |
Family
ID=14889392
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP12459790A Pending JPH0422007A (en) | 1990-05-15 | 1990-05-15 | Wire for winding process and coil using same |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0422007A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004061871A1 (en) * | 2002-12-27 | 2004-07-22 | Yazaki Corporation | Electrical wire coating method |
| WO2004061870A1 (en) * | 2002-12-27 | 2004-07-22 | Yazaki Corporation | Electric wire coating device and electric wire |
-
1990
- 1990-05-15 JP JP12459790A patent/JPH0422007A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004061871A1 (en) * | 2002-12-27 | 2004-07-22 | Yazaki Corporation | Electrical wire coating method |
| WO2004061870A1 (en) * | 2002-12-27 | 2004-07-22 | Yazaki Corporation | Electric wire coating device and electric wire |
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