JPH04212501A - Method of connecting microstrip lines - Google Patents
Method of connecting microstrip linesInfo
- Publication number
- JPH04212501A JPH04212501A JP2400543A JP40054390A JPH04212501A JP H04212501 A JPH04212501 A JP H04212501A JP 2400543 A JP2400543 A JP 2400543A JP 40054390 A JP40054390 A JP 40054390A JP H04212501 A JPH04212501 A JP H04212501A
- Authority
- JP
- Japan
- Prior art keywords
- microstrip
- microstrip lines
- conductor
- conductors
- width
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000000034 method Methods 0.000 title claims abstract description 8
- 239000004020 conductor Substances 0.000 claims abstract description 37
- 239000011888 foil Substances 0.000 claims abstract description 5
- 238000005476 soldering Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0213—Electrical arrangements not otherwise provided for
- H05K1/0237—High frequency adaptations
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/36—Assembling printed circuits with other printed circuits
Abstract
Description
【０００１】0001
【産業上の利用分野】本発明は、マイクロ波集積回路に
おける、マイクロストリップラインの接続方法に関する
。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for connecting microstrip lines in a microwave integrated circuit.
【０００２】マイクロストリップラインの接続において
は、その接続部の特性インピーダンスがマイクロストリ
ップラインの特性インピーダンスに略等しく、且つ周囲
温度の変化による膨張収縮に対して、その特性インピー
ダンスが大きく変動しないことが要望される。[0002] When connecting a microstrip line, it is desired that the characteristic impedance of the connection part is approximately equal to the characteristic impedance of the microstrip line, and that the characteristic impedance does not change significantly due to expansion and contraction due to changes in ambient temperature. be done.
【０００３】0003
【従来の技術】図３に従来の一例のマイクロストリップ
ラインの接続を示ように、２個のマイクロストリップラ
イン４，４１を、接地導体１面上に対向して近接配置し
、両端を接続するのに、接続部の特性インピーダンスを
マイクロストリップライン４，４１の特性インピーダン
スに略等しくするために、幅がマイクロストリップライ
ン４，４１のマイクロストリップ導体３，３１の幅より
も広い短冊箔の接続導体５５を用いていた。2. Description of the Related Art As shown in FIG. 3, which shows an example of a conventional microstrip line connection, two microstrip lines 4 and 41 are arranged close to each other on a surface of a ground conductor, and their ends are connected. However, in order to make the characteristic impedance of the connection part approximately equal to the characteristic impedance of the microstrip lines 4, 41, a strip of foil connection conductor whose width is wider than the width of the microstrip conductors 3, 31 of the microstrip lines 4, 41 is used. 55 was used.
【０００４】この接続導体５５の両端縁をマイクロスト
リップ導体３，３１の夫々に重置させ、重なる部分を熱
圧着又は半田付けにより固着させて接続していた。[0004] Both ends of the connecting conductor 55 are placed over each of the microstrip conductors 3 and 31, and the overlapping portions are fixed and connected by thermocompression bonding or soldering.
【０００５】[0005]
【発明が解決しようとする課題】しかしながら、■
マイクロストリップ導体３，３１の幅方向において、接
続導体５５のはみだした四隅の部分は固着されないため
、熱圧着又は半田付け時に、反り返りを起こし、誘電体
基板２，２１から浮いた状態となり、その程度は一律で
なくばらつきがあった。■ 更に周囲温度の変動に伴
い、この四隅の部分の反り返りが大きく変化した。■
そのため、接続部の特性インピーダンスがばらつき、
且つ温度変動により大きく変動する。等の問題点があっ
た。[Problem to be solved by the invention] However, ■
In the width direction of the microstrip conductors 3, 31, the protruding four corner parts of the connecting conductor 55 are not fixed, so during thermocompression bonding or soldering, they warp and become lifted from the dielectric substrates 2, 21, and the degree of was not uniform and varied. ■Furthermore, as the ambient temperature fluctuated, the warpage at the four corners changed significantly. ■
Therefore, the characteristic impedance of the connection part varies,
Moreover, it fluctuates greatly due to temperature fluctuations. There were problems such as.
【０００６】本発明は、かかる問題点に鑑みて、特性が
ばらつかず、且つ温度変動にも影響されないマイクロス
トリップラインの接続方法を提供することを目的とする
。SUMMARY OF THE INVENTION In view of these problems, it is an object of the present invention to provide a method for connecting microstrip lines in which characteristics do not vary and are not affected by temperature fluctuations.
【０００７】[0007]
【課題を解決するための手段】上記目的は、図１に示す
如く、接地導体１の面上に対向して近接配置された、２
個のマイクロストリップライン４，４１の端部を接続す
るのに、幅がマイクロストリップライン４，４１のマイ
クロストリップ導体３，３１の幅よりも広く、且つ四隅
を切除して成形した導体箔の接続導体５を用いて、両端
縁をマイクロストリップ導体３，３１に接続する、本発
明のマイクロストリップラインの接続方法により達成さ
れる。[Means for Solving the Problems] As shown in FIG.
In order to connect the ends of the microstrip lines 4, 41, a conductor foil whose width is wider than the width of the microstrip conductors 3, 31 of the microstrip lines 4, 41 and is formed by cutting off the four corners is used to connect the ends of the microstrip lines 4, 41. This is achieved by the microstrip line connection method of the present invention in which both ends of the conductor 5 are connected to the microstrip conductors 3 and 31.
【０００８】[0008]
【作用】即ち、接続導体５は、四隅が切除して成形して
あるので、接続部分はマイクロストリップ導体３，３１
の幅方向に徐々にはみでて行き、端部を熱圧着させても
角の部分がないので殆ど端縁の反り返りが発生せず、従
って、特性インピーダンスのばらつき及び温度変動によ
る変動が抑制される。[Operation] That is, since the connecting conductor 5 is formed by cutting off the four corners, the connecting portion is formed between the microstrip conductors 3 and 31.
It gradually protrudes in the width direction, and even if the ends are thermocompression bonded, there are no corner parts, so there is almost no warping of the edges, and therefore variations in characteristic impedance and fluctuations due to temperature fluctuations are suppressed.
【０００９】かくして、特性がばらつかず、且つ温度変
動にも影響されないマイクロストリップラインの接続方
法を提供することが可能となる。[0009] Thus, it is possible to provide a method for connecting microstrip lines in which the characteristics do not vary and are not affected by temperature fluctuations.
【００１０】0010
【実施例】以下図面に示す実施例によって本発明を具体
的に説明する。全図を通し同一符号は同一対象物を示す
。図１に本発明の一実施例の斜視図、図２に本発明の各
種接続導体を示す。DESCRIPTION OF THE PREFERRED EMBODIMENTS The present invention will be specifically explained below using examples shown in the drawings. The same reference numerals indicate the same objects throughout the figures. FIG. 1 is a perspective view of an embodiment of the present invention, and FIG. 2 shows various connection conductors of the present invention.
【００１１】図１に示すように、筐体の底面の接地導体
１の面上に、２個のマイクロ波集積回路のマイクロスト
リップライン４，４１が、対向して近接配置してあり、
その間を接続導体５の熱圧着にて接続している。As shown in FIG. 1, microstrip lines 4 and 41 of two microwave integrated circuits are arranged in close proximity to each other on the surface of the ground conductor 1 on the bottom surface of the casing.
The connection conductor 5 is connected by thermocompression bonding between them.
【００１２】この接続導体５は、マイクロストリップラ
イン４，４１のマイクロストリップ導体３，３１の幅よ
り幅広い短冊状の導体箔で、四隅を斜め直線状に切除し
、両端の幅を夫々のマイクロストリップ導体３，３１の
幅以下としてある。The connecting conductor 5 is a strip of conductive foil that is wider than the width of the microstrip conductors 3 and 31 of the microstrip lines 4 and 41, and its four corners are cut out diagonally in a straight line, and the width of both ends is set to the width of each microstrip. The width is set to be less than the width of the conductors 3 and 31.
【００１３】この接続導体５の両端を、マイクロストリ
ップ導体３，３１の端部に重ね、重なり部分を治具にて
加熱し押圧して熱圧着させるが、この際に、縁部の反り
返る変形は殆ど生じない。Both ends of the connecting conductor 5 are overlapped with the ends of the microstrip conductors 3 and 31, and the overlapping portion is heated and pressed with a jig to bond them by thermocompression. At this time, warping of the edges is avoided. Almost never occurs.
【００１４】又、この接続導体５の四隅の切除形状は、
他に図２に示すように、凸曲線状或いは凹曲線状にして
も、反り返りが殆ど発生せず、安定した特性インピーダ
ンスが得られる。[0014] Also, the shape of the four corners of this connection conductor 5 is as follows:
In addition, as shown in FIG. 2, even when a convex curve shape or a concave curve shape is used, almost no warping occurs and a stable characteristic impedance can be obtained.
【００１５】[0015]
【発明の効果】以上の如く、本発明の接続導体を用いる
ことにより、接続時の角部の反り返りが殆ど無く、接続
部における特性インピーダンスの不連続性が小さく、ば
らつきが抑えられ、且つ温度変動にも影響されないマイ
クロストリップラインの接続が、容易に得られ、その実
用的効果は大きく、又マイクロ波集積回路の特性改善に
大きく寄与することができる。[Effects of the Invention] As described above, by using the connecting conductor of the present invention, there is almost no bending of the corner portion during connection, the discontinuity of characteristic impedance at the connection portion is small, variation is suppressed, and temperature fluctuation is suppressed. A microstrip line connection that is not affected by this can be easily obtained, has great practical effects, and can greatly contribute to improving the characteristics of microwave integrated circuits.
【図１】 本発明の一実施例の斜視図である。FIG. 1 is a perspective view of an embodiment of the present invention.
【図２】 本発明の各種接続導体である。FIG. 2 shows various connection conductors of the present invention.
【図３】 従来の一例のマイクロストリップラインの
接続である。FIG. 3 is an example of a conventional microstrip line connection.
１ は接地導体、
２，２１ は誘電体基板、３，３１ はマ
イクロストリップ導体、 ４，４１ はマイク
ロストリップライン、５，５５ は接続導体である。1 is the ground conductor,
2 and 21 are dielectric substrates, 3 and 31 are microstrip conductors, 4 and 41 are microstrip lines, and 5 and 55 are connection conductors.
Claims (1)
接配置された、２個のマイクロストリップライン（４）
（４１） の端部を接続するのに、幅が該マイクロスト
リップライン（４）（４１） のマイクロストリップ導
体（３）（３１） の幅よりも広く、且つ四隅を切除し
て成形した導体箔の接続導体（５） を用いて、両端縁
を該マイクロストリップ導体（３）（３１）に接続する
ことを特徴とするマイクロストリップラインの接続方法
。[Claim 1] Two microstrip lines (4) arranged in close proximity to each other on the surface of a ground conductor (1).
(41) To connect the ends of the microstrip lines (4) and (41), use a conductor foil that is wider than the width of the microstrip conductors (3) and (31) of the microstrip lines (41) and is formed by cutting off the four corners. A method for connecting a microstrip line, characterized in that both ends of the connecting conductor (5) are connected to the microstrip conductor (3) (31).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2400543A JPH04212501A (en) | 1990-12-06 | 1990-12-06 | Method of connecting microstrip lines |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2400543A JPH04212501A (en) | 1990-12-06 | 1990-12-06 | Method of connecting microstrip lines |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04212501A true JPH04212501A (en) | 1992-08-04 |
Family
ID=18510441
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2400543A Pending JPH04212501A (en) | 1990-12-06 | 1990-12-06 | Method of connecting microstrip lines |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04212501A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6331806B1 (en) * | 1996-04-24 | 2001-12-18 | Honda Giken Kogyo Kabushiki Kaisha | Microwave circuit package and edge conductor structure |
| JP2002368507A (en) * | 2001-06-06 | 2002-12-20 | Murata Mfg Co Ltd | Laminated transmission line cross chip |
| JP2006013202A (en) * | 2004-06-28 | 2006-01-12 | Mitsubishi Electric Corp | Optical module |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59145123A (en) * | 1983-02-09 | 1984-08-20 | Toppan Printing Co Ltd | Preparation of expanded decorative material |
| JPS60182002A (en) * | 1984-02-29 | 1985-09-17 | Canon Electronics Inc | Magnetic head |
-
1990
- 1990-12-06 JP JP2400543A patent/JPH04212501A/en active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59145123A (en) * | 1983-02-09 | 1984-08-20 | Toppan Printing Co Ltd | Preparation of expanded decorative material |
| JPS60182002A (en) * | 1984-02-29 | 1985-09-17 | Canon Electronics Inc | Magnetic head |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6331806B1 (en) * | 1996-04-24 | 2001-12-18 | Honda Giken Kogyo Kabushiki Kaisha | Microwave circuit package and edge conductor structure |
| JP2002368507A (en) * | 2001-06-06 | 2002-12-20 | Murata Mfg Co Ltd | Laminated transmission line cross chip |
| JP2006013202A (en) * | 2004-06-28 | 2006-01-12 | Mitsubishi Electric Corp | Optical module |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A02 | Decision of refusal |
Free format text: JAPANESE INTERMEDIATE CODE: A02 Effective date: 19980331 |