JPH04204609A - Optical parts mounting method and optical parts device - Google Patents

Abstract

PURPOSE:To miniaturize the entire constitution of an optical parts device such as an optical pickup by directly attaching respective optical parts through a light transmissive adhesive means. CONSTITUTION:A semiconductor laser 4, three optical parts and an objective lens 5 are attached on the surface 1a of a substrate 1. The respective optical parts are constituted of a 1st collimator lens 10, a beam splitter 11 consisting of a prism, and a 2nd collimator lens 12, and the respective collimator lenses 10 and 12 and a beam splitter 11 are mutually attached through the light transmissive adhesive means 13 such as light transmissive adhesive. Thus, the respective parts are directly attached in substance and the entire form is made small.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to an optical component mounting method and an optical component device, and in particular, to an optical pick-up assembly, for example, by directly bonding each optical component through an adhesive means. This invention relates to a novel improvement for significantly downsizing the overall structure of an optical component device such as the above.

[Prior Art] As a typical example of this type of optical component mounting method and optical component device that have been used in the past, the configuration of the well-known optical beam amplifier shown in FIG. can be mentioned.

That is, what is indicated by the reference numeral 1 in FIG. 3 is a substrate, and on the surface of this substrate 1, a plurality of seats 2 for fixing optical components are formed at predetermined intervals.

A mounting recess 3 is formed between each seat 2, and a semiconductor laser 4 and an objective lens 5 are provided in installation recesses 6 and 7 formed at the outer positions of each floor 2 located at both ends. It is being

On each of the mounting recesses 3, a first collimating lens 10 is provided as an optical component. Beamsuburi Tuta-11 and 2nd
Collimating lenses 12, etc. are provided, each collimating lens 1.0.12 and beam splitter 11
, the semiconductor laser 4 and the objective lens 5 have their mounting positions and intervals determined by each floor 2.

[Problems to be Solved by the Invention] Since the conventional optical component mounting method and optical component device were configured as described above, the following problems existed.

That is, in the conventional method and apparatus described above, the optical axes of the optical beams between the optical components are aligned by arranging each optical component, etc. at a predetermined position via each floor formed on the substrate. Since the optical components are constructed and assembled in such a way that they can be easily assembled, it is necessary to create a spacing between each optical component, thereby reducing the length and overall shape of the optical component device (e.g., optical pickup). It was extremely difficult to adapt.

In addition, since each optical component is assembled by relying on the seat of the board, it is not possible to reduce the thickness of the board itself or eliminate the board, which makes it difficult to reduce the overall size. It was possible.

The present invention has been made to solve the above-mentioned problems, and in particular, by directly bonding each optical component through an adhesive means, for example, the entire optical component device such as a light... It is an object of the present invention to provide a method for joining optical components and an optical component device whose configuration is significantly reduced in size.

[Means for Solving the Problems] A method for mounting optical components according to the present invention is a method for directly bonding a plurality of optical components via a light-transmitting adhesive.

More specifically, the method involves fixing the peripheral portion of the optical component except for the light transmitting portion with a supporting material.

More specifically, the mounting surface of the substrate on which the optical component is mounted is a flat surface, and the optical component is fixed without using a seat for fixing the optical component.

Further, another invention provides an optical component device in which light is transmitted through a plurality of optical components, in which each of the optical components is directly coupled via a translucent adhesive means. It is.

More specifically, the optical component is composed of a beam splitter//ter and a lens.

More specifically, the optical component includes a beam splitter.
The structure consists of a one-wavelength filter and a lens.

More specifically, the optical component includes a first collimator lens into which a light beam from a semiconductor laser is incident;
a beam diameter correction optical element coupled to the collimating lens;
The optical pickup is composed of a beam blurr coupled to the beam diameter correction optical element and a second collimating lens for making the light beam enter the objective lens from the beam splitter.

[Function] In the optical component (g) mounting method and optical component device according to the present invention, each optical component is directly coupled via a translucent adhesive means, and at the time of coupling, the optical axis of the optical component is aligned with the optical axis of the dozer light. Since the assembly is performed while adjusting the optical axis and confirming the optical axis using a coordinate board, it is possible to directly connect each optical component much more easily than using a plurality of seats as in the conventional method.

In addition, since there is only an adhesive such as a translucent adhesive between each optical component, the distance between each optical component is a few microns, and they are virtually directly connected, and the length in the optical axis direction is The length can be significantly shortened.

[Embodiments] Hereinafter, preferred embodiments of the optical component mounting method and optical component device according to the present invention will be described in detail with reference to the drawings.

Note that the same reference numerals are used for the same or equivalent parts as in the conventional example.

1 and 2 show an optical component mounting method and an optical component device according to the present invention. FIG. 1 is a schematic configuration diagram, and FIG. 2 is an optical system configuration diagram showing optical pink-up.

First, the reference numeral 1 in FIG. 1 is a substrate that is much thinner than the substrate shown in the conventional example, and the surface 1a of this substrate 1.71 is formed into a flat surface.

A semiconductor laser 4, three optical components, and an objective lens 5 are mounted on the surface la.

Specifically, each of these optical components includes a beam stabilizer 1 consisting of a first collimating lens 10, a prism, etc.
The above-mentioned collimating lenses 10.12 and beam splitter 11 are each coupled to each other via a transparent adhesive means 13 such as a transparent adhesive. has been done.

Since the transparent adhesive means 13 has a thickness of several microns, each of the collimating lenses 10.7.2 and the beam splitter 11 are integrally connected in a state in which they are substantially directly connected. and can also be bonded to the surface [a] of the substrate 1.

When the above-mentioned optical components 8 are combined and mounted, a coordinate plate (not shown) is used to connect each optical component so that the laser beam 9 emitted to the semiconductor laser 4 always enters the coordinate center of the coordinate plate. Parts! For every 9th place, the optical parts +7
) After positioning the coordinate plate on the front side and manually aligning the leading axes, each optical component 8 is glued.

Next, it is also possible to configure the optical component device 20 without the substrate 1 by cutting the substrate 1 to make it thinner or peeling it off (20f) of the optical component device described above.

FIG. 2 shows a specific example of a configuration in which an optical component device as an optical pickup is formed using the above-described optical component mounting method.

In FIG. 2, the reference numeral 4 is a semiconductor laser, which is slightly spaced apart from the semiconductor laser 4.
First collimating lens 10, beam diameter correction optical element 21
, a first beam splitter 11, a first aperture body 22 having an aperture 22a, and a second beam splitter 23 are directly coupled together via the translucent adhesive means 13, and the two second beam splitters 23 ( Ha,
λ'4g) First wavelength filter 2.4, second wavelength filter 25.411 of λ'2! it light receiving lens 26.27
．． 2B.

The S-wave and P-wave separator 30 having two translucent adhesive means 13
are directly connected together via the

Each of the photodetectors 31, 32, 33, and 34 are arranged in the respective light receiving lenses 2(,:l17, 28, 2Q) in a corresponding manner and spaced apart from each other.

The second beam splinter 23 has an enlarged beam 40
, a third beam splitter 41 and a second collimating lens 12 are integrally bonded together by the bonding means 13. The laser light 9 from the four second collimating lenses 12, which are arranged with the polarizers 42 separated from each other, is configured to reach the optical disk 44 via the second aperture body 43 and the objective lens 5. .

Therefore, after the diameter of the laser beam emitted from the semiconductor laser 1 is corrected by the diameter correction optical element 21, the diameter of the laser beam emitted from the semiconductor laser 1 is corrected by the diameter correction optical element 21. body 22 and second beam splinter 23
The direction of the light beam is changed by the polarizer 42, and the light beam enters the optical disc 4 via the second averge body 43 and the objective lens 5.

The reflected light beam from the optical disk 44 is separated into an S-polarized component and a P-polarized component by the S-wave and P-wave separator 30 via the epoch beam polarizer 42.

It should be noted that the optical component device 20 consisting of the optical pickup shown in the second section above is just one example, and it goes without saying that it can be applied to various optical component devices.

Further, the above-mentioned light-transmitting adhesive means is not limited to an adhesive having a thickness of several microns, but adhesive means such as high frequency and heat can also be used.

Further, by fixing the peripheral portions of each of the optical components except for the light transmitting portions with a supporting material such as epoxy resin, an integrated optical component device 2o can be constructed.

[Effects of the Invention] Since the optical component mounting method and optical component device according to the present invention are configured as described above, the following effects can be obtained.

In other words, since optical components such as lenses and prisms are integrally bonded via translucent adhesive means, there is no need to connect each component through a cable as in conventional configurations, and there is virtually no connection between each component. It is possible to obtain an optical component device such as a light pickup or the like, which can be directly coupled with the other components, and whose overall size is significantly reduced.

[Brief explanation of the drawing]

1 and 2 show an optical component mounting method and an optical component device according to the present invention. FIG. 1 is a schematic configuration diagram, FIG. 2 is an optical system configuration diagram showing an optical pickup, and FIG.
The figure is a schematic configuration diagram showing a conventional optical component device. 4 is a semiconductor laser, 5 is an objective lens, 9 is a laser beam, 1
0 is a first collimating lens, 11.23 is a beam splitter, 112 is a second collimating lens, 13 is a transparent adhesive means, and 24.25 is a wavelength filter.

Claims (7)

[Claims] (1) A method for mounting optical components, which comprises directly bonding a plurality of optical components via a transparent adhesive means (13). (2) The method for mounting an optical component according to claim 1, wherein a peripheral portion of the optical component other than a light transmitting portion is fixed with a supporting material. (3) The mounting surface of the substrate (1) on which the optical component is mounted is a flat surface, and the optical component is fixed without using a seat for fixing the optical component. How to mount optical components. (4) An optical component device configured to transmit light via a plurality of optical components, characterized in that each of the optical components is directly coupled via a translucent adhesive means (13). optical component equipment. (5), the optical component is a beam splitter (11);
and a collimating lens (10, 12). (6), the optical component is a beam splitter (11);
, a wavelength filter (24, 25) and a collimating lens (10, 12). (7) The optical component includes a first collimating lens (10) into which the light beam (9) from the semiconductor laser (4) is incident.
, a beam diameter correction optical element (21) coupled to the first collimating lens (10), and a beam splitter (11, 23) coupled to the beam diameter correction optical element (21).
), and a second light beam (9) for making the light beam (9) enter the objective lens (5) from the beam splitter (11, 23).
5. The optical component device according to claim 4, further comprising an optical pickup comprising a collimating lens (12).