JPH0420257U - - Google Patents
Info
- Publication number
- JPH0420257U JPH0420257U JP6046190U JP6046190U JPH0420257U JP H0420257 U JPH0420257 U JP H0420257U JP 6046190 U JP6046190 U JP 6046190U JP 6046190 U JP6046190 U JP 6046190U JP H0420257 U JPH0420257 U JP H0420257U
- Authority
- JP
- Japan
- Prior art keywords
- rigid multilayer
- wiring board
- circuit wiring
- flexibility
- utility
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
Landscapes
- Structure Of Printed Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6046190U JPH0420257U (it) | 1990-06-07 | 1990-06-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6046190U JPH0420257U (it) | 1990-06-07 | 1990-06-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0420257U true JPH0420257U (it) | 1992-02-20 |
Family
ID=31587845
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6046190U Pending JPH0420257U (it) | 1990-06-07 | 1990-06-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0420257U (it) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004064468A1 (ja) * | 2003-01-09 | 2004-07-29 | Sony Chemicals Corp. | 基板素片とその基板素片を用いた複合配線板及び開閉型機器 |
-
1990
- 1990-06-07 JP JP6046190U patent/JPH0420257U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2004064468A1 (ja) * | 2003-01-09 | 2004-07-29 | Sony Chemicals Corp. | 基板素片とその基板素片を用いた複合配線板及び開閉型機器 |