JPH0420244U - - Google Patents
Info
- Publication number
- JPH0420244U JPH0420244U JP1990060562U JP6056290U JPH0420244U JP H0420244 U JPH0420244 U JP H0420244U JP 1990060562 U JP1990060562 U JP 1990060562U JP 6056290 U JP6056290 U JP 6056290U JP H0420244 U JPH0420244 U JP H0420244U
- Authority
- JP
- Japan
- Prior art keywords
- base
- semiconductor element
- storing
- package
- mounting part
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 230000015572 biosynthetic process Effects 0.000 claims 1
- 238000000151 deposition Methods 0.000 claims 1
- 239000003989 dielectric material Substances 0.000 claims 1
- 239000007772 electrode material Substances 0.000 claims 1
- 239000000463 material Substances 0.000 claims 1
- 238000000034 method Methods 0.000 claims 1
- 239000010409 thin film Substances 0.000 claims 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49109—Connecting at different heights outside the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Die Bonding (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990060562U JPH0420244U (US20020128544A1-20020912-P00008.png) | 1990-06-07 | 1990-06-07 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1990060562U JPH0420244U (US20020128544A1-20020912-P00008.png) | 1990-06-07 | 1990-06-07 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0420244U true JPH0420244U (US20020128544A1-20020912-P00008.png) | 1992-02-20 |
Family
ID=31588034
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1990060562U Pending JPH0420244U (US20020128544A1-20020912-P00008.png) | 1990-06-07 | 1990-06-07 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0420244U (US20020128544A1-20020912-P00008.png) |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5961948A (ja) * | 1982-09-30 | 1984-04-09 | Kyocera Corp | 半導体パツケ−ジ |
| JPS61108160A (ja) * | 1984-11-01 | 1986-05-26 | Nec Corp | コンデンサ内蔵型半導体装置及びその製造方法 |
-
1990
- 1990-06-07 JP JP1990060562U patent/JPH0420244U/ja active Pending
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5961948A (ja) * | 1982-09-30 | 1984-04-09 | Kyocera Corp | 半導体パツケ−ジ |
| JPS61108160A (ja) * | 1984-11-01 | 1986-05-26 | Nec Corp | コンデンサ内蔵型半導体装置及びその製造方法 |
