JPH0420232U - - Google Patents
Info
- Publication number
- JPH0420232U JPH0420232U JP6014890U JP6014890U JPH0420232U JP H0420232 U JPH0420232 U JP H0420232U JP 6014890 U JP6014890 U JP 6014890U JP 6014890 U JP6014890 U JP 6014890U JP H0420232 U JPH0420232 U JP H0420232U
- Authority
- JP
- Japan
- Prior art keywords
- magazine
- guide means
- width
- movable
- guide
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000001514 detection method Methods 0.000 claims description 3
- 238000010586 diagram Methods 0.000 description 3
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48245—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic
- H01L2224/48247—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being metallic connecting the wire to a bond pad of the item
Landscapes
- Stacking Of Articles And Auxiliary Devices (AREA)
- Wire Bonding (AREA)
Description
第１図は本考案の一実施例であり、本考案のマ
ガジンガイド装置の構成を示す平面図、第２図は
第１図の側面を示す図、第３図は従来のフレーム
ガイド装置の構成を示す図、第４図は従来のマガ
ジンガイド装置のローダ及びアンローダの構成を
示す図、第５図ａは第４図の昇降機構の構成を示
す図、第５図ｂは第５図ａのマガジン受部及びチ
ヤツクの構成の詳細を示す図である。
１……幅検出機構、１ａ……センサ、１ｂ……
バネ、１ｃ……ストツパブロツク、１ｄ……スト
ツパ、１ｅ……アーム、１ｆ……支点、１ｇ……
円板、１ｈ……センサ検知板、２，２′……マガ
ジンガイド板、３……フレーム、４，４′……ナ
ツト、５，５′……送りねじ、６，６′……パル
スモータ、８……当板、９……マガジンプツシヤ
ー、１０……カム、３１……マガジン、４４……
昇降機構。
Figure 1 is an embodiment of the present invention, and is a plan view showing the configuration of the magazine guide device of the present invention, Figure 2 is a side view of Figure 1, and Figure 3 is the configuration of a conventional frame guide device. FIG. 4 is a diagram showing the configuration of the loader and unloader of the conventional magazine guide device, FIG. 5a is a diagram showing the configuration of the lifting mechanism in FIG. 4, and FIG. FIG. 3 is a diagram showing details of the structure of a magazine receiving part and a chuck. 1... Width detection mechanism, 1a... Sensor, 1b...
Spring, 1c...stopper block, 1d...stopper, 1e...arm, 1f...fulcrum, 1g...
Disc, 1h... Sensor detection plate, 2, 2'... Magazine guide plate, 3... Frame, 4, 4'... Nut, 5, 5'... Feed screw, 6, 6'... Pulse motor , 8...Plate, 9...Magazine pusher, 10...Cam, 31...Magazine, 44...
Lifting mechanism.
Claims (1)
マガジンを規制し、マガジン内に収納されるフレ
ームを供給若しくは、収納する方向へ移動可能に
構成されてなる第１のガイド手段と、該第１のガ
イド手段の移動方向と交叉する方向へ移動可能な
第２のガイド手段と、前記マガジンの昇降時にマ
ガジンを保持する保持手段とを備え、前記第１の
ガイド手段にマガジンの幅（若しくは長さ）を、
第２のガイド手段にマガジンの長さ（若しくは幅
）を検出する検出手段を設けるようにしたことを
特徴とするマガジンガイド装置。 a magazine capable of storing a plurality of frames; a first guide means configured to regulate the magazine and to be movable in a direction for supplying or storing frames stored in the magazine; The second guide means is movable in a direction intersecting the moving direction of the guide means, and the holding means holds the magazine when the magazine is raised and lowered, and the first guide means has a width (or length) of the magazine. of,
A magazine guide device characterized in that the second guide means is provided with a detection means for detecting the length (or width) of the magazine.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6014890U JPH085952Y2 (en) | 1990-06-08 | 1990-06-08 | Magazine guide device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP6014890U JPH085952Y2 (en) | 1990-06-08 | 1990-06-08 | Magazine guide device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0420232U true JPH0420232U (en) | 1992-02-20 |
| JPH085952Y2 JPH085952Y2 (en) | 1996-02-21 |
Family
ID=31587258
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6014890U Expired - Lifetime JPH085952Y2 (en) | 1990-06-08 | 1990-06-08 | Magazine guide device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH085952Y2 (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007043115A1 (en) * | 2005-09-30 | 2007-04-19 | Hidaka Seiki Kabushiki Kaisha | Stacker for fin plates |
-
1990
- 1990-06-08 JP JP6014890U patent/JPH085952Y2/en not_active Expired - Lifetime
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2007043115A1 (en) * | 2005-09-30 | 2007-04-19 | Hidaka Seiki Kabushiki Kaisha | Stacker for fin plates |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH085952Y2 (en) | 1996-02-21 |