JPH04202231A - Modification of conductivity of resin molding - Google Patents
Modification of conductivity of resin moldingInfo
- Publication number
- JPH04202231A JPH04202231A JP33287690A JP33287690A JPH04202231A JP H04202231 A JPH04202231 A JP H04202231A JP 33287690 A JP33287690 A JP 33287690A JP 33287690 A JP33287690 A JP 33287690A JP H04202231 A JPH04202231 A JP H04202231A
- Authority
- JP
- Japan
- Prior art keywords
- group
- complex
- alkyl
- resin molding
- formula
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005989 resin Polymers 0.000 title claims abstract description 34
- 239000011347 resin Substances 0.000 title claims abstract description 34
- 238000000465 moulding Methods 0.000 title claims abstract description 9
- 230000004048 modification Effects 0.000 title 1
- 238000012986 modification Methods 0.000 title 1
- 150000003839 salts Chemical class 0.000 claims abstract description 15
- 150000002894 organic compounds Chemical class 0.000 claims abstract description 14
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 13
- 239000003792 electrolyte Substances 0.000 claims abstract description 12
- 125000003118 aryl group Chemical group 0.000 claims abstract description 10
- 239000000203 mixture Substances 0.000 claims abstract description 10
- 150000001875 compounds Chemical class 0.000 claims abstract description 8
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 6
- 239000001257 hydrogen Substances 0.000 claims abstract description 6
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims abstract description 4
- 238000004898 kneading Methods 0.000 claims abstract description 4
- 238000000034 method Methods 0.000 claims description 15
- 125000002877 alkyl aryl group Chemical group 0.000 claims description 9
- 239000002994 raw material Substances 0.000 claims description 8
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims description 5
- 125000004432 carbon atom Chemical group C* 0.000 claims description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims description 2
- 229910052799 carbon Inorganic materials 0.000 claims description 2
- 239000000126 substance Substances 0.000 claims description 2
- 239000002904 solvent Substances 0.000 abstract description 3
- 239000012778 molding material Substances 0.000 abstract 2
- 238000002845 discoloration Methods 0.000 abstract 1
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical compound OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 30
- KWYUFKZDYYNOTN-UHFFFAOYSA-M Potassium hydroxide Chemical compound [OH-].[K+] KWYUFKZDYYNOTN-UHFFFAOYSA-M 0.000 description 18
- 229920000570 polyether Polymers 0.000 description 13
- 239000004721 Polyphenylene oxide Substances 0.000 description 12
- -1 polyethylene Polymers 0.000 description 12
- 239000003054 catalyst Substances 0.000 description 8
- 239000000243 solution Substances 0.000 description 8
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 7
- 239000004743 Polypropylene Substances 0.000 description 7
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 7
- 229920001155 polypropylene Polymers 0.000 description 7
- 238000012360 testing method Methods 0.000 description 7
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 6
- 235000011118 potassium hydroxide Nutrition 0.000 description 6
- WERYXYBDKMZEQL-UHFFFAOYSA-N butane-1,4-diol Chemical compound OCCCCO WERYXYBDKMZEQL-UHFFFAOYSA-N 0.000 description 5
- 239000012456 homogeneous solution Substances 0.000 description 5
- PEDCQBHIVMGVHV-UHFFFAOYSA-N Glycerine Chemical compound OCC(O)CO PEDCQBHIVMGVHV-UHFFFAOYSA-N 0.000 description 4
- HQABUPZFAYXKJW-UHFFFAOYSA-N butan-1-amine Chemical compound CCCCN HQABUPZFAYXKJW-UHFFFAOYSA-N 0.000 description 4
- GYZLOYUZLJXAJU-UHFFFAOYSA-N diglycidyl ether Chemical class C1OC1COCC1CO1 GYZLOYUZLJXAJU-UHFFFAOYSA-N 0.000 description 4
- 230000000704 physical effect Effects 0.000 description 4
- 239000007858 starting material Substances 0.000 description 4
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 3
- 229940126062 Compound A Drugs 0.000 description 3
- YMWUJEATGCHHMB-UHFFFAOYSA-N Dichloromethane Chemical compound ClCCl YMWUJEATGCHHMB-UHFFFAOYSA-N 0.000 description 3
- NLDMNSXOCDLTTB-UHFFFAOYSA-N Heterophylliin A Natural products O1C2COC(=O)C3=CC(O)=C(O)C(O)=C3C3=C(O)C(O)=C(O)C=C3C(=O)OC2C(OC(=O)C=2C=C(O)C(O)=C(O)C=2)C(O)C1OC(=O)C1=CC(O)=C(O)C(O)=C1 NLDMNSXOCDLTTB-UHFFFAOYSA-N 0.000 description 3
- DNIAPMSPPWPWGF-UHFFFAOYSA-N Propylene glycol Chemical compound CC(O)CO DNIAPMSPPWPWGF-UHFFFAOYSA-N 0.000 description 3
- HEMHJVSKTPXQMS-UHFFFAOYSA-M Sodium hydroxide Chemical compound [OH-].[Na+] HEMHJVSKTPXQMS-UHFFFAOYSA-M 0.000 description 3
- ZMANZCXQSJIPKH-UHFFFAOYSA-N Triethylamine Chemical compound CCN(CC)CC ZMANZCXQSJIPKH-UHFFFAOYSA-N 0.000 description 3
- 150000001768 cations Chemical class 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000007796 conventional method Methods 0.000 description 3
- 238000011033 desalting Methods 0.000 description 3
- 150000004820 halides Chemical class 0.000 description 3
- 210000003127 knee Anatomy 0.000 description 3
- 238000000746 purification Methods 0.000 description 3
- ZMBAEACKTRYRSI-UHFFFAOYSA-N 2-(oxiran-2-ylmethoxy)-2-phenylethanol Chemical compound C=1C=CC=CC=1C(CO)OCC1CO1 ZMBAEACKTRYRSI-UHFFFAOYSA-N 0.000 description 2
- PAYRUJLWNCNPSJ-UHFFFAOYSA-N Aniline Chemical compound NC1=CC=CC=C1 PAYRUJLWNCNPSJ-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- WQDUMFSSJAZKTM-UHFFFAOYSA-N Sodium methoxide Chemical compound [Na+].[O-]C WQDUMFSSJAZKTM-UHFFFAOYSA-N 0.000 description 2
- WYURNTSHIVDZCO-UHFFFAOYSA-N Tetrahydrofuran Chemical compound C1CCOC1 WYURNTSHIVDZCO-UHFFFAOYSA-N 0.000 description 2
- WGQKYBSKWIADBV-UHFFFAOYSA-N benzylamine Chemical compound NCC1=CC=CC=C1 WGQKYBSKWIADBV-UHFFFAOYSA-N 0.000 description 2
- WTEOIRVLGSZEPR-UHFFFAOYSA-N boron trifluoride Chemical compound FB(F)F WTEOIRVLGSZEPR-UHFFFAOYSA-N 0.000 description 2
- GZUXJHMPEANEGY-UHFFFAOYSA-N bromomethane Chemical compound BrC GZUXJHMPEANEGY-UHFFFAOYSA-N 0.000 description 2
- 125000000484 butyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 2
- NEHMKBQYUWJMIP-UHFFFAOYSA-N chloromethane Chemical compound ClC NEHMKBQYUWJMIP-UHFFFAOYSA-N 0.000 description 2
- 235000011187 glycerol Nutrition 0.000 description 2
- NAQMVNRVTILPCV-UHFFFAOYSA-N hexane-1,6-diamine Chemical compound NCCCCCCN NAQMVNRVTILPCV-UHFFFAOYSA-N 0.000 description 2
- JHJLBTNAGRQEKS-UHFFFAOYSA-M sodium bromide Chemical compound [Na+].[Br-] JHJLBTNAGRQEKS-UHFFFAOYSA-M 0.000 description 2
- BAZAXWOYCMUHIX-UHFFFAOYSA-M sodium perchlorate Chemical compound [Na+].[O-]Cl(=O)(=O)=O BAZAXWOYCMUHIX-UHFFFAOYSA-M 0.000 description 2
- 229910001488 sodium perchlorate Inorganic materials 0.000 description 2
- 125000001424 substituent group Chemical group 0.000 description 2
- 150000005846 sugar alcohols Polymers 0.000 description 2
- GETQZCLCWQTVFV-UHFFFAOYSA-N trimethylamine Chemical compound CN(C)C GETQZCLCWQTVFV-UHFFFAOYSA-N 0.000 description 2
- GEYOCULIXLDCMW-UHFFFAOYSA-N 1,2-phenylenediamine Chemical compound NC1=CC=CC=C1N GEYOCULIXLDCMW-UHFFFAOYSA-N 0.000 description 1
- ZBTMRBYMKUEVEU-UHFFFAOYSA-N 1-bromo-4-methylbenzene Chemical compound CC1=CC=C(Br)C=C1 ZBTMRBYMKUEVEU-UHFFFAOYSA-N 0.000 description 1
- MPPPKRYCTPRNTB-UHFFFAOYSA-N 1-bromobutane Chemical compound CCCCBr MPPPKRYCTPRNTB-UHFFFAOYSA-N 0.000 description 1
- DLKQHBOKULLWDQ-UHFFFAOYSA-N 1-bromonaphthalene Chemical compound C1=CC=C2C(Br)=CC=CC2=C1 DLKQHBOKULLWDQ-UHFFFAOYSA-N 0.000 description 1
- CYNYIHKIEHGYOZ-UHFFFAOYSA-N 1-bromopropane Chemical compound CCCBr CYNYIHKIEHGYOZ-UHFFFAOYSA-N 0.000 description 1
- VFWCMGCRMGJXDK-UHFFFAOYSA-N 1-chlorobutane Chemical compound CCCCCl VFWCMGCRMGJXDK-UHFFFAOYSA-N 0.000 description 1
- JTPNRXUCIXHOKM-UHFFFAOYSA-N 1-chloronaphthalene Chemical compound C1=CC=C2C(Cl)=CC=CC2=C1 JTPNRXUCIXHOKM-UHFFFAOYSA-N 0.000 description 1
- RINOYHWVBUKAQE-UHFFFAOYSA-N 1-iodo-2-methylbenzene Chemical compound CC1=CC=CC=C1I RINOYHWVBUKAQE-UHFFFAOYSA-N 0.000 description 1
- UDHAWRUAECEBHC-UHFFFAOYSA-N 1-iodo-4-methylbenzene Chemical compound CC1=CC=C(I)C=C1 UDHAWRUAECEBHC-UHFFFAOYSA-N 0.000 description 1
- NHPPIJMARIVBGU-UHFFFAOYSA-N 1-iodonaphthalene Chemical compound C1=CC=C2C(I)=CC=CC2=C1 NHPPIJMARIVBGU-UHFFFAOYSA-N 0.000 description 1
- VILCJCGEZXAXTO-UHFFFAOYSA-N 2,2,2-tetramine Chemical compound NCCNCCNCCN VILCJCGEZXAXTO-UHFFFAOYSA-N 0.000 description 1
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 1
- CCZNLXSTNSTAPN-UHFFFAOYSA-N 2-[2-[2-(oxiran-2-ylmethoxy)hexoxy]ethoxy]ethanol Chemical compound OCCOCCOCC(CCCC)OCC1CO1 CCZNLXSTNSTAPN-UHFFFAOYSA-N 0.000 description 1
- APSMUYYLXZULMS-UHFFFAOYSA-N 2-bromonaphthalene Chemical compound C1=CC=CC2=CC(Br)=CC=C21 APSMUYYLXZULMS-UHFFFAOYSA-N 0.000 description 1
- CGYGETOMCSJHJU-UHFFFAOYSA-N 2-chloronaphthalene Chemical compound C1=CC=CC2=CC(Cl)=CC=C21 CGYGETOMCSJHJU-UHFFFAOYSA-N 0.000 description 1
- LTHNHFOGQMKPOV-UHFFFAOYSA-N 2-ethylhexan-1-amine Chemical compound CCCCC(CC)CN LTHNHFOGQMKPOV-UHFFFAOYSA-N 0.000 description 1
- ANGGPYSFTXVERY-UHFFFAOYSA-N 2-iodo-2-methylpropane Chemical compound CC(C)(C)I ANGGPYSFTXVERY-UHFFFAOYSA-N 0.000 description 1
- NPDACUSDTOMAMK-UHFFFAOYSA-N 4-Chlorotoluene Chemical compound CC1=CC=C(Cl)C=C1 NPDACUSDTOMAMK-UHFFFAOYSA-N 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000004925 Acrylic resin Substances 0.000 description 1
- 229910015900 BF3 Inorganic materials 0.000 description 1
- CPELXLSAUQHCOX-UHFFFAOYSA-M Bromide Chemical compound [Br-] CPELXLSAUQHCOX-UHFFFAOYSA-M 0.000 description 1
- OCTUBIBGWQJIIY-UHFFFAOYSA-N CCCCCCC(COCCO)OCC1CO1 Chemical compound CCCCCCC(COCCO)OCC1CO1 OCTUBIBGWQJIIY-UHFFFAOYSA-N 0.000 description 1
- FDDAZMGQUFVCLF-UHFFFAOYSA-N CCCCCCC(COCCOCCOCCOCCOCCO)OCC1CO1 Chemical compound CCCCCCC(COCCOCCOCCOCCOCCO)OCC1CO1 FDDAZMGQUFVCLF-UHFFFAOYSA-N 0.000 description 1
- 229920000049 Carbon (fiber) Polymers 0.000 description 1
- FBPFZTCFMRRESA-FSIIMWSLSA-N D-Glucitol Natural products OC[C@H](O)[C@H](O)[C@@H](O)[C@H](O)CO FBPFZTCFMRRESA-FSIIMWSLSA-N 0.000 description 1
- FBPFZTCFMRRESA-JGWLITMVSA-N D-glucitol Chemical compound OC[C@H](O)[C@@H](O)[C@H](O)[C@H](O)CO FBPFZTCFMRRESA-JGWLITMVSA-N 0.000 description 1
- RPNUMPOLZDHAAY-UHFFFAOYSA-N Diethylenetriamine Chemical compound NCCNCCN RPNUMPOLZDHAAY-UHFFFAOYSA-N 0.000 description 1
- IAYPIBMASNFSPL-UHFFFAOYSA-N Ethylene oxide Chemical compound C1CO1 IAYPIBMASNFSPL-UHFFFAOYSA-N 0.000 description 1
- PIICEJLVQHRZGT-UHFFFAOYSA-N Ethylenediamine Chemical compound NCCN PIICEJLVQHRZGT-UHFFFAOYSA-N 0.000 description 1
- 229910013075 LiBF Inorganic materials 0.000 description 1
- WHXSMMKQMYFTQS-UHFFFAOYSA-N Lithium Chemical compound [Li] WHXSMMKQMYFTQS-UHFFFAOYSA-N 0.000 description 1
- 229930182556 Polyacetal Natural products 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- GOOHAUXETOMSMM-UHFFFAOYSA-N Propylene oxide Chemical compound CC1CO1 GOOHAUXETOMSMM-UHFFFAOYSA-N 0.000 description 1
- CZMRCDWAGMRECN-UGDNZRGBSA-N Sucrose Chemical compound O[C@H]1[C@H](O)[C@@H](CO)O[C@@]1(CO)O[C@@H]1[C@H](O)[C@@H](O)[C@H](O)[C@@H](CO)O1 CZMRCDWAGMRECN-UGDNZRGBSA-N 0.000 description 1
- 229930006000 Sucrose Natural products 0.000 description 1
- ZJCCRDAZUWHFQH-UHFFFAOYSA-N Trimethylolpropane Chemical compound CCC(CO)(CO)CO ZJCCRDAZUWHFQH-UHFFFAOYSA-N 0.000 description 1
- 230000002378 acidificating effect Effects 0.000 description 1
- 229920000122 acrylonitrile butadiene styrene Polymers 0.000 description 1
- 125000002947 alkylene group Chemical group 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 238000013459 approach Methods 0.000 description 1
- YCOXTKKNXUZSKD-UHFFFAOYSA-N as-o-xylenol Natural products CC1=CC=C(O)C=C1C YCOXTKKNXUZSKD-UHFFFAOYSA-N 0.000 description 1
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 description 1
- AGEZXYOZHKGVCM-UHFFFAOYSA-N benzyl bromide Chemical compound BrCC1=CC=CC=C1 AGEZXYOZHKGVCM-UHFFFAOYSA-N 0.000 description 1
- KCXMKQUNVWSEMD-UHFFFAOYSA-N benzyl chloride Chemical compound ClCC1=CC=CC=C1 KCXMKQUNVWSEMD-UHFFFAOYSA-N 0.000 description 1
- 229940073608 benzyl chloride Drugs 0.000 description 1
- 125000001797 benzyl group Chemical group [H]C1=C([H])C([H])=C(C([H])=C1[H])C([H])([H])* 0.000 description 1
- RDHPKYGYEGBMSE-UHFFFAOYSA-N bromoethane Chemical compound CCBr RDHPKYGYEGBMSE-UHFFFAOYSA-N 0.000 description 1
- KMGBZBJJOKUPIA-UHFFFAOYSA-N butyl iodide Chemical compound CCCCI KMGBZBJJOKUPIA-UHFFFAOYSA-N 0.000 description 1
- QHIWVLPBUQWDMQ-UHFFFAOYSA-N butyl prop-2-enoate;methyl 2-methylprop-2-enoate;prop-2-enoic acid Chemical compound OC(=O)C=C.COC(=O)C(C)=C.CCCCOC(=O)C=C QHIWVLPBUQWDMQ-UHFFFAOYSA-N 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 239000004917 carbon fiber Substances 0.000 description 1
- NEHMKBQYUWJMIP-NJFSPNSNSA-N chloro(114C)methane Chemical compound [14CH3]Cl NEHMKBQYUWJMIP-NJFSPNSNSA-N 0.000 description 1
- HRYZWHHZPQKTII-UHFFFAOYSA-N chloroethane Chemical compound CCCl HRYZWHHZPQKTII-UHFFFAOYSA-N 0.000 description 1
- 238000004040 coloring Methods 0.000 description 1
- 229940126543 compound 14 Drugs 0.000 description 1
- 238000000748 compression moulding Methods 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- LOTRDFXVKUDFDY-UHFFFAOYSA-N dodecyl naphthalene-1-sulfonate;potassium Chemical compound [K].C1=CC=C2C(S(=O)(=O)OCCCCCCCCCCCC)=CC=CC2=C1 LOTRDFXVKUDFDY-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 229960003750 ethyl chloride Drugs 0.000 description 1
- 125000001495 ethyl group Chemical group [H]C([H])([H])C([H])([H])* 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 150000002366 halogen compounds Chemical class 0.000 description 1
- 238000001746 injection moulding Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- SNHMUERNLJLMHN-UHFFFAOYSA-N iodobenzene Chemical compound IC1=CC=CC=C1 SNHMUERNLJLMHN-UHFFFAOYSA-N 0.000 description 1
- HVTICUPFWKNHNG-UHFFFAOYSA-N iodoethane Chemical compound CCI HVTICUPFWKNHNG-UHFFFAOYSA-N 0.000 description 1
- INQOMBQAUSQDDS-UHFFFAOYSA-N iodomethane Chemical compound IC INQOMBQAUSQDDS-UHFFFAOYSA-N 0.000 description 1
- 150000002500 ions Chemical class 0.000 description 1
- ULYZAYCEDJDHCC-UHFFFAOYSA-N isopropyl chloride Chemical compound CC(C)Cl ULYZAYCEDJDHCC-UHFFFAOYSA-N 0.000 description 1
- 125000001449 isopropyl group Chemical group [H]C([H])([H])C([H])(*)C([H])([H])[H] 0.000 description 1
- FMKOJHQHASLBPH-UHFFFAOYSA-N isopropyl iodide Chemical compound CC(C)I FMKOJHQHASLBPH-UHFFFAOYSA-N 0.000 description 1
- 229910052744 lithium Inorganic materials 0.000 description 1
- XGZVUEUWXADBQD-UHFFFAOYSA-L lithium carbonate Chemical compound [Li+].[Li+].[O-]C([O-])=O XGZVUEUWXADBQD-UHFFFAOYSA-L 0.000 description 1
- 229910052808 lithium carbonate Inorganic materials 0.000 description 1
- MHCFAGZWMAWTNR-UHFFFAOYSA-M lithium perchlorate Chemical compound [Li+].[O-]Cl(=O)(=O)=O MHCFAGZWMAWTNR-UHFFFAOYSA-M 0.000 description 1
- 229910001486 lithium perchlorate Inorganic materials 0.000 description 1
- PQAXCGVQEFIFAR-UHFFFAOYSA-M lithium;2,3-dibutylnaphthalene-1-sulfonate Chemical compound [Li+].C1=CC=C2C(S([O-])(=O)=O)=C(CCCC)C(CCCC)=CC2=C1 PQAXCGVQEFIFAR-UHFFFAOYSA-M 0.000 description 1
- NTWKDFWKALPPII-UHFFFAOYSA-M lithium;octadecane-1-sulfonate Chemical compound [Li+].CCCCCCCCCCCCCCCCCCS([O-])(=O)=O NTWKDFWKALPPII-UHFFFAOYSA-M 0.000 description 1
- ZJZXSOKJEJFHCP-UHFFFAOYSA-M lithium;thiocyanate Chemical compound [Li+].[S-]C#N ZJZXSOKJEJFHCP-UHFFFAOYSA-M 0.000 description 1
- 229910052749 magnesium Inorganic materials 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- VNWKTOKETHGBQD-UHFFFAOYSA-N methane Chemical compound C VNWKTOKETHGBQD-UHFFFAOYSA-N 0.000 description 1
- 229940102396 methyl bromide Drugs 0.000 description 1
- 229940050176 methyl chloride Drugs 0.000 description 1
- 125000002496 methyl group Chemical group [H]C([H])([H])* 0.000 description 1
- 230000011987 methylation Effects 0.000 description 1
- 238000007069 methylation reaction Methods 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- LSHROXHEILXKHM-UHFFFAOYSA-N n'-[2-[2-[2-(2-aminoethylamino)ethylamino]ethylamino]ethyl]ethane-1,2-diamine Chemical compound NCCNCCNCCNCCNCCN LSHROXHEILXKHM-UHFFFAOYSA-N 0.000 description 1
- SNMVRZFUUCLYTO-UHFFFAOYSA-N n-propyl chloride Chemical compound CCCCl SNMVRZFUUCLYTO-UHFFFAOYSA-N 0.000 description 1
- PVWOIHVRPOBWPI-UHFFFAOYSA-N n-propyl iodide Chemical compound CCCI PVWOIHVRPOBWPI-UHFFFAOYSA-N 0.000 description 1
- 125000001624 naphthyl group Chemical group 0.000 description 1
- 125000002347 octyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 229910052760 oxygen Inorganic materials 0.000 description 1
- 239000001301 oxygen Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 125000001997 phenyl group Chemical group [H]C1=C([H])C([H])=C(*)C([H])=C1[H] 0.000 description 1
- 229920006122 polyamide resin Polymers 0.000 description 1
- 229920005668 polycarbonate resin Polymers 0.000 description 1
- 239000004431 polycarbonate resin Substances 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920005672 polyolefin resin Polymers 0.000 description 1
- 229920006324 polyoxymethylene Polymers 0.000 description 1
- 229920000915 polyvinyl chloride Polymers 0.000 description 1
- 239000004800 polyvinyl chloride Substances 0.000 description 1
- 229910052700 potassium Inorganic materials 0.000 description 1
- ZNNZYHKDIALBAK-UHFFFAOYSA-M potassium thiocyanate Chemical compound [K+].[S-]C#N ZNNZYHKDIALBAK-UHFFFAOYSA-M 0.000 description 1
- 229940116357 potassium thiocyanate Drugs 0.000 description 1
- IZHYRVRPSNAXGV-UHFFFAOYSA-M potassium;naphthalene-1-sulfonate Chemical compound [K+].C1=CC=C2C(S(=O)(=O)[O-])=CC=CC2=C1 IZHYRVRPSNAXGV-UHFFFAOYSA-M 0.000 description 1
- 238000012545 processing Methods 0.000 description 1
- 125000001436 propyl group Chemical group [H]C([*])([H])C([H])([H])C([H])([H])[H] 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
- 238000004645 scanning capacitance microscopy Methods 0.000 description 1
- 238000007493 shaping process Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 235000011121 sodium hydroxide Nutrition 0.000 description 1
- HIEHAIZHJZLEPQ-UHFFFAOYSA-M sodium;naphthalene-1-sulfonate Chemical compound [Na+].C1=CC=C2C(S(=O)(=O)[O-])=CC=CC2=C1 HIEHAIZHJZLEPQ-UHFFFAOYSA-M 0.000 description 1
- HRQDCDQDOPSGBR-UHFFFAOYSA-M sodium;octane-1-sulfonate Chemical compound [Na+].CCCCCCCCS([O-])(=O)=O HRQDCDQDOPSGBR-UHFFFAOYSA-M 0.000 description 1
- 239000000600 sorbitol Substances 0.000 description 1
- 239000005720 sucrose Substances 0.000 description 1
- 238000013068 supply chain management Methods 0.000 description 1
- RKSOPLXZQNSWAS-UHFFFAOYSA-N tert-butyl bromide Chemical compound CC(C)(C)Br RKSOPLXZQNSWAS-UHFFFAOYSA-N 0.000 description 1
- NBRKLOOSMBRFMH-UHFFFAOYSA-N tert-butyl chloride Chemical compound CC(C)(C)Cl NBRKLOOSMBRFMH-UHFFFAOYSA-N 0.000 description 1
- FAGUFWYHJQFNRV-UHFFFAOYSA-N tetraethylenepentamine Chemical compound NCCNCCNCCNCCN FAGUFWYHJQFNRV-UHFFFAOYSA-N 0.000 description 1
- YLQBMQCUIZJEEH-UHFFFAOYSA-N tetrahydrofuran Natural products C=1C=COC=1 YLQBMQCUIZJEEH-UHFFFAOYSA-N 0.000 description 1
- 125000003944 tolyl group Chemical group 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Landscapes
- Coating Of Shaped Articles Made Of Macromolecular Substances (AREA)
- Processes Of Treating Macromolecular Substances (AREA)
- Manufacture Of Macromolecular Shaped Articles (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Polyethers (AREA)
Abstract
Description
【発明の詳細な説明】
産業上の利用分野
本発明は樹脂成形体の導電性改質方法に関するものであ
る。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a method for modifying the conductivity of a resin molded article.
従来の技術
従来の樹脂成形体の導電性改質方法としては、カーボン
ブラック、カーボンファイバー、導電性マイカ等を樹脂
に練り込む方法がある。2. Description of the Related Art Conventional methods for modifying the conductivity of resin molded bodies include methods of kneading carbon black, carbon fiber, conductive mica, etc. into resin.
しかしながら、このような従来の樹脂成形体の導電性改
質方法にあっては、カーボンブランク等の導電性物質を
多量に練り込まなければ導電性の向上にはつながらない
ため、樹脂成形体の物性低下を避けることはできず、ま
た、黒色等の着色の問題もあり、その用途には限りがあ
った。However, in such conventional methods for improving the conductivity of resin molded bodies, conductivity cannot be improved unless a large amount of conductive material such as carbon blank is kneaded, resulting in a decrease in the physical properties of the resin molded body. This cannot be avoided, and there is also the problem of coloration, such as black, which limits its use.
発明の解決しようとする課題
本発明は、このような従来法の欠点を解消し、樹脂成形
体の物性を害することなく、また着色の問題を生ずるこ
となく、樹脂成形体の導電性を著しく改良しうる方法を
提供することを課題とする。Problems to be Solved by the Invention The present invention eliminates the drawbacks of such conventional methods and significantly improves the conductivity of resin molded bodies without impairing the physical properties of the resin molded bodies or causing problems with coloring. Our goal is to provide a method that enables this.
課題を解決するための手段
本発明では、樹脂成形体原料に特定のポリエーテル物質
と電解質塩の錯体を練り込み、成形することにより上記
課題を解決する。Means for Solving the Problems The present invention solves the above problems by kneading a complex of a specific polyether substance and an electrolyte salt into a raw material for a resin molded product and molding the mixture.
即ち、本発明の方法は、樹脂成形体原料に、下記−数式
■;
Z−((A)、−Y)k ■
〔但し、Zは活性水素含有化合物残基、Yは活性水素基
、又はアルキル基、アリール基、アルキルアリール基、
mは1〜250の整数、kは1〜12の整数、Aは一数
式■ニ
ーCCHz−CH−0)−〇
JHt−0−(CHz−CHz−0−>、1R(nは0
〜25の整数、Rは炭素数1〜20のアルキル基、アリ
ール基、又はアルキルアリール基)を表わす〕で示され
る骨格を有する有機化合物とこれらに可溶性の電解質塩
との錯体を練り込み、その混合物を成形することを特徴
とする。That is, in the method of the present invention, the following formula (1); Alkyl group, aryl group, alkylaryl group,
m is an integer from 1 to 250, k is an integer from 1 to 12, and A is a numerical formula.
An integer of ~25, R represents an alkyl group, aryl group, or alkylaryl group having 1 to 20 carbon atoms] and an electrolyte salt soluble therein. Characterized by shaping the mixture.
本発明では、樹脂成形体原料として、ポリエチレン、ポ
リプロピレン等のポリオレフィン樹脂、ABS樹脂、ア
クリル樹脂、ポリアミド樹脂、ポリ塩化ビニル樹脂、ポ
リカーボふ一ト樹脂、ポリアセタール樹脂、フェノール
樹脂等の表面抵抗値の高い樹脂がいずれも使用できる。In the present invention, as raw materials for resin moldings, polyolefin resins such as polyethylene and polypropylene, ABS resins, acrylic resins, polyamide resins, polyvinyl chloride resins, polycarbonate resins, polyacetal resins, phenolic resins, etc. with high surface resistance values are used. Any resin can be used.
また、樹脂成形体原料に練り込む錯体に使用される0式
の骨格を有する有機化合物(以下、ポリエーテルと述べ
る)としては、活性水素含有化合物にグリシジルエーテ
ル類を反応させたものを使用するのが好ましい。In addition, as the organic compound having the 0-type skeleton (hereinafter referred to as polyether) used in the complex to be kneaded into the raw material for the resin molding, a compound prepared by reacting an active hydrogen-containing compound with glycidyl ethers is used. is preferred.
かかる活性水素含有化合物としては、例えば、メタノー
ル、エタノール等のモノアルコール;エチレングリコー
ル、プロピレングリコール、1,4−ブタンジオール等
のジアルコール;グリセリン、トリメチロールプロパン
、ソルビトール、シュークローズ、ポリグリセリン等の
多価アルコール;ブチルアミン、2−エチルヘキシルア
ミン、エチレンジアミン、ヘキサメチレンジアミン、ジ
エチレントリアミン、トリエチレンテトラミン、テトラ
エチレンペンタミン、ペンタエチレンへキサミン、アニ
リン、ベンジルアミン、フェニレンジアミン等のアミン
化合物;モノエタノールアミン、ジェタノールアミン等
の一分子中に異種の活性水素含有基を有する化合物等が
いずれも使用でき、中でも多価アルコールの使用が好ま
しい。Examples of such active hydrogen-containing compounds include monoalcohols such as methanol and ethanol; dialcohols such as ethylene glycol, propylene glycol, and 1,4-butanediol; and glycerin, trimethylolpropane, sorbitol, sucrose, polyglycerin, and the like. Polyhydric alcohol; amine compounds such as butylamine, 2-ethylhexylamine, ethylenediamine, hexamethylenediamine, diethylenetriamine, triethylenetetramine, tetraethylenepentamine, pentaethylenehexamine, aniline, benzylamine, phenylenediamine; monoethanolamine, Any compound having different types of active hydrogen-containing groups in one molecule such as tanolamine can be used, and among them, polyhydric alcohols are preferably used.
次に、このような活性水素含有化合物と反応させるグリ
シジルエーテル類としては、例えば、下記式で示される
アルキル−又はアリール−又はアルキルアリール−ポリ
エチレングリコールグリシジルエーテル類
O・
(但し、R及びnは一数式■と同様である)が使用でき
るが、代表的なものとしては、Rが例えばメチル基、エ
チル基、プロピル基、ブチル基等の直鎖アルキル基、イ
ソプロピル基、5ec−ブチル基、tert−ブチル基
等の分枝アルキル基、フェニル基、ナフチル基、ノニル
フェニル基、トリル基、ベンジル基等のアリール又はア
ルキルアリール基等であるものが挙げられる。中でもn
が1−15、Rの炭素数が1〜12であるものが特に好
ましく使用される。Next, the glycidyl ethers to be reacted with such an active hydrogen-containing compound include, for example, alkyl- or aryl- or alkylaryl-polyethylene glycol glycidyl ethers O represented by the following formula (wherein R and n are equal to (similar to formula (2)) can be used, but typically, R is a linear alkyl group such as a methyl group, ethyl group, propyl group, butyl group, isopropyl group, 5ec-butyl group, tert- Examples thereof include branched alkyl groups such as a butyl group, aryl or alkylaryl groups such as a phenyl group, a naphthyl group, a nonylphenyl group, a tolyl group, and a benzyl group. Among them n
is 1-15, and those in which R has 1 to 12 carbon atoms are particularly preferably used.
グリシジルエーテル類を反応させる場合に使用する触媒
としては、ソジウムメチラート、苛性ソーダ、苛性カリ
、炭酸リチウム等の塩基性触媒が一般的であるが、ボロ
ントリフルオライドのような酸性触媒や、トリメチルア
ミン、トリエチルアミンのようなアミン系触媒も有用で
ある。When reacting glycidyl ethers, basic catalysts such as sodium methylate, caustic soda, caustic potash, and lithium carbonate are generally used, but acidic catalysts such as boron trifluoride, trimethylamine, triethylamine, etc. Also useful are amine-based catalysts such as.
ポリエーテルの主鎖末端基Yは、活性水素基であっても
側鎖末端基Rと同様なアルキル基、アリール基又はアル
キルアリール基であっても差支えない(Yがアルキル基
、アリール基、又はアルキルアリール基である場合は、
側鎖末端基Rと同様な基が挙げられる)、主鎖末端にア
リキル基、アリール基、アルキルアリール基を導入する
には、一般にハロゲン化合物を反応させればよく、例え
ば、このような化合物としては、塩化メチル、臭化メチ
ル、ヨウ化メチル、塩化エチル、臭化エチル、ヨウ化エ
チル、塩化プロピル、臭化プロピル、ヨウ化プロピル、
塩化ブチル、臭化ブチル、ヨウ化ブチル等のような直鎖
アルキル型ハロゲン化物、イソプロピルクロライド、イ
ソブロビルブロマイド、イソプロピルアイオダイド、5
ec−ブチルクロライドs 5ec−ブチルブロマイド
、5ec−ブチルアイオダイド、ter t−ブチルク
ロライド、tert−ブチルブロマイド、tert−ブ
チルアイオダイド等のような分枝アルキル型ハロゲン化
物、クロロヘンゼン、プロモヘンゼン、アイオドベンゼ
ン、1−クロロナフタレン、2−クロロナフタレン、1
−ブロモナフタレン、2−ブロモナフタレン、1−アイ
オドナフタレン、0−クロロトルエン、−クロロトルエ
ン、p−クロロトルエン、0−ブロモトルエン、トプロ
モトルエン、p−ブロモトルエン、0−アイオドトルエ
ン、−アイオドトルエン、p−アイオドトルエン、ベン
ジルクロライド、ベンジルブロマイド等のような了り−
ルもしくはアルキルアリール型ハロゲン化物を挙げるこ
とができる。これらを単独で使用しても、2種以上併用
してもよい。The main chain terminal group Y of the polyether may be an active hydrogen group or an alkyl group, aryl group, or alkylaryl group similar to the side chain terminal group R (if Y is an alkyl group, an aryl group, or If it is an alkylaryl group,
In order to introduce an alkyl group, aryl group, or alkylaryl group to the end of the main chain (for example, a group similar to the side chain terminal group R), it is generally sufficient to react with a halogen compound. are methyl chloride, methyl bromide, methyl iodide, ethyl chloride, ethyl bromide, ethyl iodide, propyl chloride, propyl bromide, propyl iodide,
Linear alkyl type halides such as butyl chloride, butyl bromide, butyl iodide, etc., isopropyl chloride, isobrobyl bromide, isopropyl iodide, 5
ec-butyl chloride s Branched alkyl type halides such as 5ec-butyl bromide, 5ec-butyl iodide, tert-butyl chloride, tert-butyl bromide, tert-butyl iodide, etc., chlorohenzene, promohenzene, iodobenzene , 1-chloronaphthalene, 2-chloronaphthalene, 1
-bromonaphthalene, 2-bromonaphthalene, 1-iodonaphthalene, 0-chlorotoluene, -chlorotoluene, p-chlorotoluene, 0-bromotoluene, topromotoluene, p-bromotoluene, 0-iodotoluene, - Such compounds as iodotoluene, p-iodotoluene, benzyl chloride, benzyl bromide, etc.
and alkylaryl type halides. These may be used alone or in combination of two or more.
更にこのようなポリエーテルと錯体を構成する可溶性電
解質塩としては、例えば、Lil XLjCI、LiC
lO4、Li5CN 、 LiBF、 、LiAsFi
、LiCFaSOs、LiC6F 1ssJ、LiCF
:+COz、LiHgl3、Nal 、Na5CN 5
NaBr、 Kl、Cs5CN 、 AgN0* 、C
uC+tMg(CIOa)zなどの少なくともLis
Na、K % C3% Ag、Cu又はMgの1種を含
む無機イオン塩、ステアリルスルホン酸リチウム、オク
チルスルホン酸ナトリウム、ドデジルヘンゼンスルホン
酸リチウム、ナフタレンスルホン酸ナトリウム、ジブチ
ルナフタレンスルホン酸リチウム、オクチルナフタレン
スルホン酸カリウム、ドデシルナフタレンスルホン酸カ
リウム等の有機イオン塩が挙げられる。Furthermore, examples of soluble electrolyte salts forming complexes with such polyethers include Lil XLjCI, LiC
lO4, Li5CN, LiBF, , LiAsFi
, LiCFaSOs, LiC6F 1ssJ, LiCF
:+COz, LiHgl3, Nal, Na5CN 5
NaBr, Kl, Cs5CN, AgN0*, C
At least Lis such as uC+tMg(CIOa)z
Na, K% C3% Inorganic ionic salt containing one of Ag, Cu or Mg, lithium stearylsulfonate, sodium octylsulfonate, lithium dodecylhenzenesulfonate, sodium naphthalenesulfonate, lithium dibutylnaphthalenesulfonate, octyl Examples include organic ionic salts such as potassium naphthalene sulfonate and potassium dodecylnaphthalene sulfonate.
なお、このような可溶性電解質塩の添加量は、特に限定
されないが、ポリエーテルに対して、0゜5〜10ei
t%程度であるのが好ましい。The amount of such soluble electrolyte salt added is not particularly limited, but is 0.5 to 10 ei based on polyether.
It is preferable that it is about t%.
また、ポリエーテルと可溶性電解質塩との錯体の使用量
は、樹脂成形体原料に対して、1〜30wt%、特に1
〜10@t%であるのが好ましい。The amount of the complex of polyether and soluble electrolyte salt to be used is 1 to 30 wt%, especially 1 to 30 wt%, based on the raw material for the resin molded body.
It is preferably 10@t%.
次に、ポリエーテルと可溶性電解質塩との錯体を形成さ
せる方法としては、予め水、メタノール、メチルエチル
ケトン、テトラヒドロフラン、アセトン、塩化メチレン
等のポリエーテルと相溶性の高い単独又は混合溶液に可
溶性電解質塩を熔解させ、この溶液とポリエーテルを均
一に混合し、錯体溶液を調整した後、溶媒を除去し、錯
体を得る方法が好ましい。しかし、場合によっては、ポ
リエーテルと可溶性電解質塩をそれぞれ樹脂成形体原料
に練り込み、樹脂成形体原料中で錯体を形成させてもよ
い。Next, as a method for forming a complex between a polyether and a soluble electrolyte salt, a soluble electrolyte salt is added in advance to a single or mixed solution that is highly compatible with the polyether, such as water, methanol, methyl ethyl ketone, tetrahydrofuran, acetone, methylene chloride, etc. A preferred method is to melt the polyether, uniformly mix this solution and polyether to prepare a complex solution, and then remove the solvent to obtain the complex. However, in some cases, the polyether and the soluble electrolyte salt may be individually kneaded into the raw material for the resin molded body to form a complex in the raw material for the resin molded body.
ポリエーテルと可溶性電解質塩の錯体を、樹脂成形体原
料に練り込む方法としては二輪式押出し機、熱ロール式
等、−船釣に用いられる方法がいずれも使用でき、また
、樹脂成形体の成形方法としても射出成形、押出し成形
、カレンダー加工、圧縮成形、SCM法等がいずれも使
用できる。The complex of polyether and soluble electrolyte salt can be kneaded into the raw material for the resin molding by any method used for boat fishing, such as a two-wheel extruder or hot roll method. As a method, injection molding, extrusion molding, calendar processing, compression molding, SCM method, etc. can all be used.
作用
このような本発明においては、樹脂に練り込まれた上記
錯体の可溶性電解質塩のカチオンが通常のエチレンオキ
シドやプロピレンオキシド等のアルキレンオキシドを用
いたポリエーテルの場合、主鎖のら線構造(スパイラル
構造)の内部のみを移動することしかできなかったのに
対して、側鎖中にもエーテル結合酸素があるため、側鎖
を介して移動もできることに加え、カチオンが分子間を
移動するためには、通常は主鎖同士の接近(セグメント
運動にる接近)が必要であったのに対して、側鎖を介し
ての移動が可能となり、よりカチオン移動が容易となっ
たため、従来より高いイオン導電性を生し、その抵抗値
を低下させ、優れた導電性を有する品質のよい樹脂成形
体を得ることかできる。Function In the present invention, when the cation of the soluble electrolyte salt of the complex kneaded into the resin is a polyether using an ordinary alkylene oxide such as ethylene oxide or propylene oxide, the main chain has a spiral structure (spiral structure). In contrast, since there is an ether-bonded oxygen in the side chain, it is possible to move only through the side chain, and because the cation can move between molecules. Normally, it was necessary for the main chains to approach each other (approximation by segment motion), but it is now possible to move through the side chains, making cation movement easier, so it is possible to achieve higher ion rates than before. It is possible to obtain a high-quality resin molded body that exhibits conductivity and lowers its resistance value, and has excellent conductivity.
実施例1
エチレングリコール30gを出発物質として触媒に水酸
化カリウム7gを用いて、下記式に示すn−ブチルトリ
エチレングリコールグリシジルエーテル2390gを反
応させて、脱塩精製を行ない、0式(但し、置換基等は
下記の通り)で示される、分子量475B (水酸基価
より算出)の有機化合物1738gを得た。Example 1 Using 30 g of ethylene glycol as a starting material and 7 g of potassium hydroxide as a catalyst, 2390 g of n-butyltriethylene glycol glycidyl ether shown in the following formula was reacted to perform desalting and purification. 1738 g of an organic compound having a molecular weight of 475B (calculated from the hydroxyl value) and having a molecular weight of 475B (calculated from the hydroxyl value) was obtained.
Z: ct+z−o−
CH,−0−
A: −CH2−CH−0−
□
CHz−0−(CHz−CHz−0) 3−CHz−C
Hz−CHz−CLY:H
m: 9
に二2
上記有機化合物500g中に、チオシアン酸リチウム2
5gをメタノール100gに溶解した溶液を加え、撹拌
して均一な溶液とした後、該溶液中のメタノールを減圧
トッピングし、錯体を得た。Z: ct+z-o- CH,-0- A: -CH2-CH-0- □ CHz-0-(CHz-CHz-0) 3-CHz-C
Hz-CHz-CLY: H m: 9 to 22 Lithium thiocyanate 2 to 500 g of the above organic compound
A solution of 5 g dissolved in 100 g of methanol was added and stirred to obtain a homogeneous solution, and the methanol in the solution was then topped under reduced pressure to obtain a complex.
この錯体30.とポリプロピレン樹脂IKgを二軸押出
し機で180 ℃、10分間混練し、この混練物を同温
度で2分間、50Kg/cm”の加圧による熱プレス法
で、成形(230mm X 230mm X 3 mm
) L、、テストピースを作成した。This complex 30. and Ikg of polypropylene resin were kneaded in a twin-screw extruder at 180°C for 10 minutes, and this kneaded product was molded (230mm x 230mm x 3mm
) L., a test piece was created.
実施例2
グリセリン20gを出発物質とし、触媒に水酸化カリウ
ム6gを用いて、まず下記式に示すn−ヘキシルジエチ
レングリコールグリシジルエーテル2160gを反応さ
せて脱塩精製を行ない、0式(但し、置換基等は下記の
通り)で示される、分子量9443 (水酸基価より算
出)の有機化合物1861gを得た。Example 2 Using 20 g of glycerin as a starting material and using 6 g of potassium hydroxide as a catalyst, 2160 g of n-hexyldiethylene glycol glycidyl ether shown in the following formula was first reacted for desalting and purification. 1,861 g of an organic compound with a molecular weight of 9,443 (calculated from the hydroxyl value) was obtained.
A ニーCHz−CH−0−
CHzO(CHzCHJ) 2CH2CH,C)1.C
H2CH2CH。A knee CHz-CH-0- CHzO(CHzCHJ) 2CH2CH,C)1. C
H2CH2CH.
Y:H
m:13
に:3
上記有機化合物500g中にチオシアン酸カリウム25
gをアセトン200gに溶解した溶液を加え、撹拌して
均一な溶液とした後、アセトンを減圧トッピングし、錯
体を得た。Y:H m:13 to:3 Potassium thiocyanate 25% in 500g of the above organic compound
A solution of 200 g of acetone was added thereto, stirred to obtain a homogeneous solution, and then topped with acetone under reduced pressure to obtain a complex.
この錯体50g とポリプロピレン樹脂IKgを二軸押
出し機で180℃、10分間混練し、この混練物を同温
度で2分間、50Kg/cm”の加圧による熱プレス法
で成形(230請剛 X 230m蒙X3mm)L、テ
ストピースを得た。50g of this complex and Ikg of polypropylene resin were kneaded in a twin-screw extruder at 180°C for 10 minutes, and the kneaded product was molded at the same temperature for 2 minutes using a hot press method under a pressure of 50kg/cm (230cm x 230m). A test piece was obtained.
実施例3
1.4−ブタンジオール20gを出発物質とし、触媒に
水酸化カリウム5gを用いて、下記式に示すυ
フェニルエチレングリコールグリシジルエーテル180
0gを反応させて、脱塩精製を行ない、0式(但し、置
換基等は下記の通り)で示される、分子量7190 (
水酸基価より算出)の有機化合物1461gを得た。Example 3 Using 20 g of 1,4-butanediol as a starting material and using 5 g of potassium hydroxide as a catalyst, υ phenylethylene glycol glycidyl ether 180 as shown in the following formula was prepared.
0g was reacted and desalted and purified to obtain a product with a molecular weight of 7190 (
1461 g of an organic compound (calculated from the hydroxyl value) was obtained.
Y: ■
m:19
に:3
上記有機化合物500.中に過塩素酸ナトリウム25g
をメタノール100gに溶解した溶液を加え、攪拌して
均一な溶液とした後、メタノールを減圧トッピングして
錯体を得た。Y: ■ m: 19 to: 3 above organic compound 500. 25g of sodium perchlorate inside
A solution prepared by dissolving 100 g of methanol was added thereto, stirred to obtain a homogeneous solution, and then methanol was added to the mixture under reduced pressure to obtain a complex.
この錯体50g とポリプロピレン樹脂IKgを二軸押
出し機で180 ℃、10分間混練し、この混練物を同
温度で2分間、50Kg/cm2の加圧による熱プレス
法で成形(230+wm x 230m+a x 3
mm) シ、テストピースを作成した。50g of this complex and Ikg of polypropylene resin were kneaded in a twin-screw extruder at 180°C for 10 minutes, and the kneaded product was molded at the same temperature for 2 minutes using a hot press method under pressure of 50kg/cm2 (230+wm x 230m+a x 3).
mm) A test piece was prepared.
実施例4
ブチルアミン15gを出発′!#質とし、触媒に水酸化
カリウム9gを用いて、次に下記式に示すn−へキシル
ヘキサエチレングリコールグリシジルエーテル3100
gを反応させて、脱塩精製を行ない、0式(但し、置換
基等は下記の通り)で示される、分子量14,360
(水酸基価より算出)の有機化合物2497gを得た。Example 4 Starting with 15 g of butylamine! # quality, using 9 g of potassium hydroxide as a catalyst, then n-hexylhexaethylene glycol glycidyl ether 3100 as shown in the following formula.
g was reacted and desalted and purified to obtain a product with a molecular weight of 14,360, which is represented by formula 0 (however, the substituents etc. are as follows).
2497 g of an organic compound (calculated from hydroxyl value) was obtained.
Z : CHx−CHz−CHx−CHt−!1−A
ニーCH2−CH−0−
CIIzO(CHzCHzO) 、C)12cH2cH
2cH2cH2cH3Y:H
m: 17
に:2
上記有機化合物500g中に、過塩素酸リチウム25g
をメタノール100gに溶解した溶液を加え、攪拌して
均一な溶液とした後、メタノールを減圧トッピングして
錯体を得た。Z: CHx-CHz-CHx-CHt-! 1-A
Knee CH2-CH-0- CIIzO (CHzCHzO), C) 12cH2cH
2cH2cH2cH3Y:H m: 17:2 In 500g of the above organic compound, 25g of lithium perchlorate
A solution prepared by dissolving 100 g of methanol was added thereto, stirred to obtain a homogeneous solution, and then methanol was added to the mixture under reduced pressure to obtain a complex.
この錯体70g とポリプロピレン樹脂IKgを二軸押
出し機で180 ℃、10分間混練し、この混線物を同
温度で2分間、50Kg7cm”の加圧による熱プレス
法で成形(230■剛x 230mmX 31111)
L/、テストピースを得た。70g of this complex and Ikg of polypropylene resin were kneaded in a twin-screw extruder at 180°C for 10 minutes, and the mixed material was molded at the same temperature for 2 minutes using a hot press method using a pressure of 50kg and 7cm (230cm rigid x 230mm x 31111).
L/, a test piece was obtained.
実施例5
1.4−ブタンジオール20gを出発物質とし、触媒に
水酸化カリウム5gを用いて、下記式に示すフェニルエ
チレングリコールグリシジルエーテル1800gを反応
させた後、塩化メチルを水酸基に対して1.2当量用い
て反応させ、末端メチル化してから、脱塩精製を行ない
、0式(但し、置換基等は下記の通り)で示される、分
子量7190 (水酸基価より算出)の有機化合物14
61gを得た。Example 5 Using 20 g of 1.4-butanediol as a starting material and using 5 g of potassium hydroxide as a catalyst, 1,800 g of phenylethylene glycol glycidyl ether shown in the following formula was reacted, and then methyl chloride was added to the hydroxyl group in an amount of 1. After reacting with 2 equivalents and terminal methylation, desalting and purification are performed to obtain an organic compound 14 with a molecular weight of 7190 (calculated from the hydroxyl value) represented by formula 0 (however, the substituents etc. are as follows).
61g was obtained.
Y: −CI(3
m:19
に:3
上記有機化合物500g中に過塩素酸ナトリウム25g
をメタノール100gに溶解した溶液を加え、攪拌して
均一な溶液とした後、メタノールを減圧トラピックして
錯体を得た。Y: -CI (3 m:19:3 25 g of sodium perchlorate in 500 g of the above organic compound
A solution prepared by dissolving 100 g of methanol was added thereto, stirred to obtain a homogeneous solution, and then the methanol was trapped under reduced pressure to obtain a complex.
この錯体50g とポリプロピレン樹脂IKgを二軸押
出し機で180℃、10分間混練し、この混練物を同温
度で2分間、50Kg/cs+”の加圧による熱プレス
法で成形(23(1+s x 230mm x 3 +
++a) L、テストピースを作成した。50 g of this complex and I kg of polypropylene resin were kneaded at 180°C for 10 minutes using a twin-screw extruder, and the kneaded product was molded (23 (1+s x 230 mm x 3 +
++a) L. A test piece was created.
比較例
ポリプロピレン樹脂IKgを、二軸押出し機で180℃
10分間練り、同温度で2分間、50Kg/am2の加
圧による熱プレス法で成形(230mm X 230m
印×311Im)L、テストピースを作成した。Comparative Example: Ikg of polypropylene resin was heated to 180°C using a twin-screw extruder.
Knead for 10 minutes, then mold at the same temperature for 2 minutes using a hot press method with a pressure of 50 kg/am2 (230 mm x 230 m
Mark × 311 Im) L, a test piece was created.
結果
実施例1〜5及び比較例で得たテストピースはいずれも
物性及び外観において大差なく、その表面抵抗値及び引
張降伏強さについて測定した結果は次の通りであった。Results The test pieces obtained in Examples 1 to 5 and Comparative Example had no significant difference in physical properties and appearance, and the results of measuring their surface resistance and tensile yield strength were as follows.
引張降伏強さ
(Ω) −Ja王ニー
実施例1 1.2X1014313
実施例2 1.5X1014320
実施例3 1.3X10” 323実施例4
8.I X 10” 310実施例5
1.5 X 10目 326比較例 2
XIO”以上 330〔表面抵抗値の測定方法〕
YHP(横河ヒユーレットパフカード)社製の超絶縁抵
抗計4329A型を用いて印加電圧500vで電圧をか
けてから30秒後の表面抵抗を測定した。Tensile yield strength (Ω) -Ja King knee Example 1 1.2X1014313 Example 2 1.5X1014320 Example 3 1.3X10" 323 Example 4
8. I X 10” 310 Example 5
1.5 x 10 eyes 326 comparative example 2
XIO" or more 330 [Method for measuring surface resistance value] Measure the surface resistance 30 seconds after applying a voltage of 500 V using a super insulation resistance meter 4329A manufactured by YHP (Yokogawa Heuret Puff Card). did.
発明の効果
本発明では、従来it性に問題があるとされた樹脂を使
用して、その樹脂の物性及び色相を実質的に害すること
なく、著しく導電性を改良した成形体を得ることができ
る。Effects of the Invention According to the present invention, a molded article with significantly improved conductivity can be obtained by using a resin that has been thought to have a problem with IT properties without substantially impairing the physical properties and hue of the resin. .
Claims (1)
又は炭素数1〜20のアルキル基、アリール基又はアル
キルアリール基、mは1〜250の整数、kは1〜12
の整数、Aは下記一般式▲数式、化学式、表等がありま
す▼(2) (nは0〜25の整数、Rは炭素数1〜20のアルキル
基、アリール基、又はアルキルアリール基)を表わす〕
で示される骨格を有する有機化合物とこれらに可溶性の
電解質塩との錯体を練り込み、その混合物を成形するこ
とを特徴とする樹脂成形体の導電性改質方法。[Scope of Claims] The following general formula Z-[(A)_m-Y]_k(1) is used as a raw material for a resin molded body [where Z is an active hydrogen-containing compound residue, and Y is an active hydrogen group or a carbon number of 1] ~20 alkyl, aryl, or alkylaryl groups, m is an integer of 1 to 250, k is 1 to 12
An integer, A is the following general formula ▲ Numerical formula, chemical formula, table, etc. ▼ (2) (n is an integer of 0 to 25, R is an alkyl group, aryl group, or alkylaryl group having 1 to 20 carbon atoms) ]
1. A method for modifying the conductivity of a resin molded article, which comprises kneading a complex of an organic compound having a skeleton represented by the formula and an electrolyte salt soluble therein, and molding the mixture.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP33287690A JPH04202231A (en) | 1990-11-28 | 1990-11-28 | Modification of conductivity of resin molding |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP33287690A JPH04202231A (en) | 1990-11-28 | 1990-11-28 | Modification of conductivity of resin molding |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH04202231A true JPH04202231A (en) | 1992-07-23 |
Family
ID=18259795
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP33287690A Pending JPH04202231A (en) | 1990-11-28 | 1990-11-28 | Modification of conductivity of resin molding |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH04202231A (en) |
-
1990
- 1990-11-28 JP JP33287690A patent/JPH04202231A/en active Pending
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