JPH0419986A - Manufacture of pin connector for mounting on printed wiring board - Google Patents

Manufacture of pin connector for mounting on printed wiring board

Info

Publication number
JPH0419986A
JPH0419986A JP12158390A JP12158390A JPH0419986A JP H0419986 A JPH0419986 A JP H0419986A JP 12158390 A JP12158390 A JP 12158390A JP 12158390 A JP12158390 A JP 12158390A JP H0419986 A JPH0419986 A JP H0419986A
Authority
JP
Japan
Prior art keywords
glass fiber
contact pin
pin
insulator
connector
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP12158390A
Other languages
Japanese (ja)
Other versions
JP3008443B2 (en
Inventor
Hiroshi Matsui
博 松井
Takayoshi Kishimoto
孝義 岸本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Panasonic Holdings Corp
Original Assignee
Matsushita Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Industrial Co Ltd filed Critical Matsushita Electric Industrial Co Ltd
Priority to JP2121583A priority Critical patent/JP3008443B2/en
Publication of JPH0419986A publication Critical patent/JPH0419986A/en
Application granted granted Critical
Publication of JP3008443B2 publication Critical patent/JP3008443B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

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  • Manufacturing Of Electrical Connectors (AREA)

Abstract

PURPOSE:To prevent the outer periphery of each contact pin from being shaven during the process of press-fit by initially pressing and plating each contact pin in a molded resin plate which does not contain glass fiber, and using the plate to form box housing from a molding resin material containing glass fiber by means of insert molding so as to form pin connectors. CONSTITUTION:Rectilinear contact pins 1a, 1b, 1c, 1d are pressed into the respective small holes 3a, 3b, 3c, 3d of a flat insulator 2 not containing glass fiber to as far as fixed size at almost the center of each contact pin. Next the flat insulator 2 into which each contact pin has already been pressed is put in an insert molding die and the side wall portion 6 and bottom face portion 7 of box housing 5 are formed from a molding resin containing glass fiber at every required number of connector pins. A line of serial connector pins are thus formed on the tape-shaped flat insulator 2 and then the connecting portion 4 of the tape-shaped insulator 2 is cut at a predetermined position whereby independent pin connectors are completed.

Description

【発明の詳細な説明】 産業上の利用分野 本発明は、電子機器等のプリント基板に取付けて使用さ
れるプリント基板取付用ピンコネクターの製造方法に関
するものである。
DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method of manufacturing a pin connector for attaching a printed circuit board, which is used for attaching to a printed circuit board of an electronic device or the like.

従来の技術 まず従来のプリント基板取付用ピンコネクター製造方法
について第4図および第5図とともに説明する。第4図
において、5はあらかしめ成形加工された箱形ハウジン
グであり、その底面に所定のピッチで設けられた小孔8
a、8b、8c8dに対して直線状コンタクトピン1a
、1blc、ldを圧入植設することによりピンコネク
ターを形成する(第5図)。そしてハウジング5内に突
出したコンタクトピンの上部9a、9b9c、9dがコ
ネクターソケット側との結合部となり、またハウジング
5の下部に突出したコンタクトピンノ下部10a、10
b、10c、10dかプリント基板11への接続用脚部
となる。
BACKGROUND OF THE INVENTION First, a conventional method for manufacturing a pin connector for mounting on a printed circuit board will be described with reference to FIGS. 4 and 5. In Fig. 4, numeral 5 designates a box-shaped housing that has been roughly caulked, and small holes 8 are provided at a predetermined pitch on the bottom surface of the housing.
Straight contact pin 1a for a, 8b, 8c8d
, 1blc, and ld are press-implanted to form a pin connector (FIG. 5). The upper portions 9a, 9b9c, 9d of the contact pins protruding into the housing 5 become connection parts with the connector socket side, and the lower portions 10a, 10 of the contact pins protruding into the lower part of the housing 5.
b, 10c, and 10d serve as legs for connection to the printed circuit board 11.

ここで、コンタクトピンla、1.b、lc  ldの
外径とハウジング5の底面小孔8 a、 8 b、 8
 c8dの内径は、僅かな圧入寸法差で嵌合結合されて
いる。
Here, contact pin la, 1. b, lc ld outer diameter and bottom small hole 8 a, 8 b, 8 of housing 5
The inner diameter of c8d is fitted and connected with a slight difference in press fit dimensions.

発明が解決しようとする課題 そしてこのプリント基板取付用ピンコネクターは、第6
図に示すように、プリント基板11に各コンタクトピン
la、lb、lc、ldの下部10a  10b、10
c、10dを半田付けして12a  12b、12c、
12dして接続されるが、この状態において、コネクタ
ーハウジング5とプリント基板11との間に温度変化に
よる寸法変動に差があると、コンタクトピンの下部10
a  10b、10c、10dおよび半田付は部分12
a、12b、12c、12dに歪を生し、変形、破断等
の障害が生じるという課題があった。
The problem to be solved by the invention and this pin connector for mounting on a printed circuit board are as follows:
As shown in the figure, the lower parts 10a, 10b, 10 of each contact pin la, lb, lc, ld are attached to the printed circuit board 11.
Solder c, 10d and 12a 12b, 12c,
12d, but in this state, if there is a difference in dimensional variation due to temperature changes between the connector housing 5 and the printed circuit board 11, the lower part 10 of the contact pin
a 10b, 10c, 10d and soldering are part 12
A, 12b, 12c, and 12d are strained, causing problems such as deformation and breakage.

このためミコネクターハウジング5の熱膨張係数をプリ
ント基板11の熱膨張係数に近づけるために、コネクタ
ーハウジング5の材料として、般にガラス繊維入成形樹
脂を使用する。
Therefore, in order to bring the coefficient of thermal expansion of the connector housing 5 close to that of the printed circuit board 11, molded resin containing glass fiber is generally used as the material for the connector housing 5.

しかし、上記従来のピンコネクター形成技術によると、
ハウジング5の底面小孔8a、8b、8c。
However, according to the conventional pin connector forming technology mentioned above,
Bottom small holes 8a, 8b, 8c of housing 5.

8dにコンタクトピンla、lb、lc、ldを圧入植
設する際(、特に小形代品においては、)・ウジング内
側からのコンタクトピンの圧入が困難なため、ハウジン
グ外側から圧入することになる)、コンタクトピンla
、lb、lc、ldの挿入部外周か小孔8a、8b、8
c、8dの内周壁でこすられ、ハウジング5の成形樹脂
の中に含まれているガラス繊維によってコンタクトピン
外周か削られて、メツキ剥れや表面肌荒れを生し、ソケ
ット側コネクターとの結合部分の劣化および長期間使用
時の環境劣化による接触不安定の原因となるという課題
があった。
When press-fitting the contact pins la, lb, lc, and ld into the 8d (especially for small substitutes), it is difficult to press-fit the contact pins from the inside of the housing, so they must be press-fitted from the outside of the housing.) , contact pin la
, lb, lc, ld insertion part outer periphery or small holes 8a, 8b, 8
c and 8d, and the outer periphery of the contact pin is scraped by the glass fibers contained in the molded resin of the housing 5, causing peeling of the plating and roughening of the surface, and the joint part with the socket side connector. There was a problem that contact instability was caused by deterioration of the contact and environmental deterioration during long-term use.

本発明はこれらの課題を解決するものであり、温度変化
にあっても変形や破断を生ずることかなく、ハウジング
成形樹脂中のガラス繊維によってコンタクトピン外周が
削られて障害となるようなことのない優れたプリント基
板取付用ピンコネクターの製造方法を提供することを目
的とするものである。
The present invention solves these problems, and does not cause deformation or breakage even under temperature changes, and prevents the outer periphery of the contact pin from being scraped by the glass fibers in the housing molding resin, which can cause problems. The purpose of this invention is to provide a method of manufacturing a pin connector for mounting on a printed circuit board that is superior to the conventional method.

課題を解決するための手段 本発明は上記課題を解決するために、あらかしめコンタ
クトピンをガラス繊維を含まない成形樹脂板に圧入植設
しておき、これを用いてインサート成形によりガラス繊
維入成形樹脂材料で箱形ノ・ウンングを形成することに
よりピンコネクターを形成するようにしたものである。
Means for Solving the Problems In order to solve the above-mentioned problems, the present invention press-embeds pre-warmed contact pins into a molded resin plate that does not contain glass fibers, and uses this to mold glass fibers by insert molding. The pin connector is formed by forming a box-shaped hole using a resin material.

作用 したかって本発明によれば、ガラス繊維を含まない成形
樹脂板の孔にコンタクトピンを圧入植設するので、圧入
時にコンタクトピンの外周が削られることは殆どなく、
また底面を含むコネクター全体かプリント基板構成材料
と近似した線膨張係数を有するガラス繊維入成形樹脂製
ハウジングに囲まれているので、プリント基板取付後の
温度変化による歪も生じ難い。
According to the present invention, contact pins are press-fitted into holes in a molded resin plate that does not contain glass fibers, so the outer periphery of the contact pins is hardly scraped during press-fitting.
Furthermore, since the entire connector including the bottom surface is surrounded by a glass fiber-containing molded resin housing having a linear expansion coefficient similar to that of the printed circuit board constituent material, distortion due to temperature changes after the printed circuit board is attached is unlikely to occur.

実施例 以下、本発明の一実施例について、図面を参照しながら
説明する。
EXAMPLE Hereinafter, an example of the present invention will be described with reference to the drawings.

第1図〜第3図は、本発明によるプリント基板取付用ピ
ンコネクターの製造方法の実施例を示すものであり、第
1図において、la、lb、1c1dは一定径のワイヤ
ー等から加工された直線状コンタクトピンであり、2は
ガラス繊維を含まない成形樹脂製のテープ状に連続した
平板絶縁体で、そのほぼ中央部にはコンタクトピンla
、1blc  ldを軽く圧入できる寸法に設定された
小孔3a、3b、3c、3dか一定のピンチであけられ
ている。
1 to 3 show an embodiment of the method for manufacturing a pin connector for mounting on a printed circuit board according to the present invention. In FIG. 2 is a straight contact pin, and 2 is a tape-like continuous flat insulator made of molded resin that does not contain glass fiber, and the contact pin la is located approximately in the center of the insulator.
The small holes 3a, 3b, 3c, and 3d are opened with a certain pinch so that the small holes 3a, 3b, 3c, and 3d can be lightly press-fitted.

そしてコンタクトピンla、lb、lc、ldを平板絶
縁体2の小孔3a、3b、3c、3dに、第2図に示す
ようにコンタクトピンのほぼ中間の一定寸法まで圧入植
設する。
Then, the contact pins la, lb, lc, and ld are press-fitted into the small holes 3a, 3b, 3c, and 3d of the flat plate insulator 2 to a certain size approximately in the middle of the contact pins, as shown in FIG.

次に第3図に示すように、このコンタクトピン圧入済の
平板絶縁体2をインサート成形用金型内に装着し、所要
のコネクタービン数毎に箱形ハウジング5の側壁部6お
よび底面部7をガラス繊維入の成形樹脂で形成する。
Next, as shown in FIG. 3, the flat plate insulator 2 with the contact pins press-fitted therein is installed in an insert mold, and the side wall portion 6 and bottom portion 7 of the box-shaped housing 5 are inserted into the side wall portion 6 and the bottom portion 7 of the box-shaped housing 5 for each required number of connector bins. is made of molded resin containing glass fiber.

このようにして、テープ状の平板絶縁体2上に一連のコ
ネクターピン列が形成されると、所定の位置でテープ状
の絶縁体2の結合部4を切断することによって個別のピ
ンコネクターとして完成する。
Once a series of connector pin rows are formed on the tape-shaped flat insulator 2 in this way, individual pin connectors are completed by cutting the joints 4 of the tape-shaped insulator 2 at predetermined positions. do.

発明の効果 本発明は、上記実施例より明らかなように、以下に示す
効果を有する。
Effects of the Invention As is clear from the above examples, the present invention has the following effects.

(1)  コンタクトピンを圧入植設する平板絶縁体は
、ガラス繊維を含まない樹脂製であるので、圧入時にコ
ンタクトピンの外周が削られることは殆どない。
(1) Since the flat insulator into which the contact pin is press-fitted is made of resin that does not contain glass fiber, the outer periphery of the contact pin is hardly scraped during press-fitting.

(2)  コネクター全体がガラス繊維入成形樹脂製ノ
\ウジングに囲まれているので、プリント基板材料との
熱膨張係数が近似しており、プリント基板取付後の温度
変化による歪も生じ難い。
(2) Since the entire connector is surrounded by a molded resin housing containing glass fiber, the coefficient of thermal expansion is similar to that of the printed circuit board material, and distortion due to temperature changes after the printed circuit board is attached is unlikely to occur.

(3)  コンタクトピンがノ\ウジング底面のガラス
繊維入樹脂にインサート固着されているので、コンタク
トピン下部をプリント基板に半田付は接続する際に、半
田フラックスがコネクター内部へ侵入する可能性は、従
来のものに比べて非常に少ない。
(3) Since the contact pin is inserted and fixed in the glass fiber-containing resin on the bottom of the housing, there is no possibility of solder flux entering the inside of the connector when the bottom of the contact pin is soldered to the printed circuit board. Very few compared to conventional ones.

(4)  コンタクトピンをあらかじめテープ状の平板
絶縁体に圧入画定後にインサート成形加工するので、コ
ンタクトピンを単品の状態でインサート成形加工する場
合に比較して、連続成形加工か容易で、不良発生の可能
性も非常に少ない。
(4) Since contact pins are press-fitted into tape-shaped flat insulators and then insert molded, continuous molding is easier and less likely to cause defects compared to insert molding of contact pins individually. The possibility is also very small.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図〜第3図は本発明のプリント基板取付用ピンコネ
クターの製造方法を説明するための図で、第1図はコン
タクトピンと平板絶縁体との圧入前の斜視図、第2図は
平板絶縁体にコンタクトピンを圧入した後の正面図、第
3図は平板絶縁体にコンタクトピンを圧入後のインサー
ト成形した状態の斜視図、第4図および第5図は従来の
コネクターを示す図で、第4図は組立前の斜視図、第5
図は同組立後の正面図、第6図はコネクターをプリント
基板へ実装し半田付けした後の部分断面正面図である。 la、lb、lc、ld・・・・・・コンタクトピン、
2・・・・・・平板絶縁体、3a、3b、3c、3d・
・・・・・平板絶縁体の小孔、4・・・・・・平板絶縁
体の結合部(切断箇所)、5・・・・・・箱形ハウジン
グ、6・・・・・・ハウジングの側壁部、7・・・・・
・ハウジングの底面部。 代理人の氏名 弁理士 粟野重孝 はか18第 ・) 図 1m、 1に、 It、 Itt  コンタクトピン2
  畢盾A!414峯 l ハウジング1山4!郁 り ハウジング゛eJi面靜 第 図 〃a 屑 /17.− ad
Figures 1 to 3 are diagrams for explaining the manufacturing method of the pin connector for mounting on a printed circuit board according to the present invention. Figure 1 is a perspective view of the contact pin and flat plate insulator before press fitting, and Figure 2 is a flat plate insulator. Figure 3 is a front view after press-fitting the contact pin into the insulator, Figure 3 is a perspective view of the insert molded state after the contact pin is press-fitted into the flat plate insulator, Figures 4 and 5 are views showing a conventional connector. , Figure 4 is a perspective view before assembly, Figure 5
The figure is a front view after assembly, and FIG. 6 is a partially sectional front view after the connector has been mounted and soldered on a printed circuit board. la, lb, lc, ld...contact pin,
2... Flat plate insulator, 3a, 3b, 3c, 3d.
...Small hole in the flat plate insulator, 4...Connection part (cutting point) of the flat plate insulator, 5...Box-shaped housing, 6... Side wall part, 7...
・Bottom part of the housing. Name of agent: Patent attorney Shigetaka Awano (No. 18) Figure 1m, 1, It, Itt Contact pin 2
Bidan A! 414 ridges 1 housing 4! Ikuri Housing゛eJi surface diagram〃a Scrap/17. - ad

Claims (1)

【特許請求の範囲】[Claims] ガラス繊維を含まない樹脂よりなるテープ状に連続した
平板絶縁体に一定のピッチで直線状コンタクトピンをそ
の中間部まで圧入植設し、これに所定のコネクターピン
数毎にガラス繊維入樹脂でインサート成形を施して外周
側壁部と平板絶縁体に接する底面部とからなる箱形ハウ
ジング列を形成し、そのハウジング内部および下部に前
記コンタクトピンの上部と下部が突出する状態にした後
、平板絶縁体の連結部を切断して個別ピンコネクター毎
に分離するプリント基板取付用ピンコネクターの製造方
法。
Linear contact pins are press-fitted at a constant pitch to the middle of a tape-like continuous flat insulator made of resin that does not contain glass fibers, and glass fiber-containing resin is inserted into this for each predetermined number of connector pins. After forming a row of box-shaped housings consisting of an outer peripheral side wall and a bottom surface in contact with the flat plate insulator, and making the upper and lower parts of the contact pins protrude inside and below the housing, the flat plate insulator is molded. A method of manufacturing a pin connector for mounting on a printed circuit board, in which the connecting part of the pin connector is cut and separated into individual pin connectors.
JP2121583A 1990-05-11 1990-05-11 Manufacturing method of printed circuit board mounting pin connector Expired - Fee Related JP3008443B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2121583A JP3008443B2 (en) 1990-05-11 1990-05-11 Manufacturing method of printed circuit board mounting pin connector

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2121583A JP3008443B2 (en) 1990-05-11 1990-05-11 Manufacturing method of printed circuit board mounting pin connector

Publications (2)

Publication Number Publication Date
JPH0419986A true JPH0419986A (en) 1992-01-23
JP3008443B2 JP3008443B2 (en) 2000-02-14

Family

ID=14814837

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2121583A Expired - Fee Related JP3008443B2 (en) 1990-05-11 1990-05-11 Manufacturing method of printed circuit board mounting pin connector

Country Status (1)

Country Link
JP (1) JP3008443B2 (en)

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN100408705C (en) * 2003-04-30 2008-08-06 中国科学院青海盐湖研究所 Nano-filtration method for separating magnesium and enriching lithium from salt lake brine
CN102512983B (en) * 2011-12-28 2014-01-15 河北工业大学 Lithium ion sieve membrane and preparation method thereof

Also Published As

Publication number Publication date
JP3008443B2 (en) 2000-02-14

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