JPH04198875A - Ic clamping apparatus - Google Patents

Abstract

PURPOSE:To keep a contact of a surface mounted IC touching an IC socket for measurement stably by arranging first and second support shafts to lower an IC socket pressing mechanism for measurement in a direction of mounting the socket centered on the second support shaft. CONSTITUTION:An IC clamping apparatus body 1 is provided with a first support shaft (p) to support rotating shafts 5 and 6 of two rollers 2 and 3 and with a second support shaft (q) at a position separated by a specified distance from the support shaft (p). The body 1 is mobile horizontally as indicated by the arrow (a) and a pressing load 9 is applied to a part 9' through a fulcrum (q). An IC clamp guide roller 4 supports the body 1 moving it horizontally with a clamp guide surface 12 being rotated. This horizontal moving action takes place when the roller 4 is in an area (c). When the roller 4 is in an area (d), the clamp guide body 11 moves horizontally as indicated by the arrow (b) thereby enabling the moving of the body 1 vertically alone.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to an IC clamping device, and in particular, the present invention relates to an IC clamping device that is used for IC measurement of a surface-mounted IC in order to measure the electrical characteristics of the surface-mounted IC by connecting it to an IC measurement tester. The present invention relates to an IC clamping device for an automatic IC handler, which automatically transports an IC to a socket for use.

[Conventional technology]

In recent years, a device has been developed that measures various electrical characteristics of a surface-mounted IC connected to the tester by mounting a surface-mounted IC in an IC socket dedicated to measuring electrical characteristics and sending a test start signal to a measuring IC tester.

This device uses an automatic IC handler that automatically transfers the surface-mounted IC to be measured to a dedicated IC socket.
This IC automatic handler uses an IC clamp device that clamps the IC for measurement.

This IC clamp device moves a predetermined distance in the horizontal direction with respect to a horizontally installed IC socket exclusively for measurement, and then moves down as a combination of horizontal and vertical movement to clamp down on the IC socket. This IC clamping device for an automatic IC handler is equipped with a mechanism that holds down the top cover of the IC socket when the top cover is closed and the top cover has been lowered a predetermined distance.

However, these conventional IC clamping devices have one roller installed in a position parallel to the measurement IC socket, and an IC socket holding mechanism that uses the rotation axis of the one roller as the supporting axis. .

[Problem to be solved by the invention]

The IC clamp device in this conventional IC automatic handler has only one roller as an IC holding mechanism, so in order to bring the connection terminal of the IC under test into contact with the contact of the socket with a stable load, it is necessary to The top lid of the socket had to be closed and the one roller pressed through the top lid.

Therefore, in order to obtain stable operation, it is necessary to change the structure of the mechanism that opens and closes the IC socket and/or the structure of the top cover that opens and closes the IC socket. There was a problem that I couldn't do it.

An object of the present invention is to provide an IC clamp device that solves these problems.

[Means to solve the problem]

The present invention provides a surface-mounted IC with the surface-mounted IC measuring I.
In order to measure the electrical characteristics of the surface mount IC by mounting it on a C socket and sending a test start signal to a measurement tester,
In an IC clamping device of an automatic IC handler that automatically transports the surface-mounted IC to the measurement IC socket, the two rollers are arranged parallel to and at a predetermined interval from the measurement IC socket installed horizontally. an IC socket holding mechanism having a first support shaft that supports the rotational axis of the IC socket; an IC socket holding mechanism that moves parallel to the measurement IC socket; and the first support shaft moves to the center of the IC socket. a second support shaft located a predetermined distance ahead of the first support shaft, and a mechanism for holding down the measurement IC socket around the second support shaft. It is characterized by having a mechanism that is lowered in the mounting direction of the socket and directly presses the top cover of the measurement IC socket or the IC.

〔Example〕

An embodiment of the IC clamping device of the present invention will be described below with reference to the drawings.

1A to 1D show an embodiment of the present invention, with FIG. 1A being a front view and FIG. 1B being a plan view. FIG. 1C is a front view showing an embodiment of an IC clamp device and a guiding clamp guide according to an embodiment of the present invention, and FIG. 1D is a side view showing the clamp guide according to an embodiment of the present invention.

In Figures 1A and 1B, 1 is the main body of the IC clamp device, 2 and 3 are horizontally installed ICs for measuring electrical characteristics.
These are two rollers for IC clamping arranged at a predetermined distance 1L1 from the C socket. 4 is IC
Guide rollers 5 and 6 guide the clamping device
A bearing part that supports the C-clamp rollers 2.3, 7 a support part that supports the entire structure of the IC clamp rollers 2 and 3 via a bracket 10 that supports the clamp rollers 2 and 3, and 8 a support part. It is a frame that supports 7.

Further, p is a support shaft that supports the guide roller, and q is a support shaft that supports the IC clamp device main body 1 on the frame 8 as a support.

In FIGS. 1C and 1D, reference numeral 11 denotes a guide body that guides the I and C clamp device body 1. 12 is a horizontal guide surface when the guide roller 4 moves horizontally, 13 is an IC
The guide roller 4 attached to the clamp device 1 is an inclined guide surface for performing a combined movement of horizontal movement and vertical movement.

Next, the operation of the IC clamp device of this embodiment shown in FIGS. 1A to 1D will be explained. The IC clamp device main body 1 shown in FIG. 1A is movable in the horizontal direction shown by the arrow a, and a holding load 9 is applied to the q' part via the fulcrum q. Also I
The C clamp guide roller 4 supports the IC clamp device main body 1 while moving the IC clamp device main body 1 in the horizontal direction while rolling on the clamp guide surface 12. This horizontal movement operation is performed when the clamp guide roller 4 is in area C shown in FIG. 1C. Further, when the clamp guide roller 4 is located in the area d shown in FIG. 1C, the IC clamp device main body 1 is
It can only move up and down.

Next, with reference to FIGS. 2A to 2C, an embodiment of the IC clamp device of the present invention will be described when an IC socket with a top cover is used. In the figure, W corresponds to the IC socket upper cover 114 for the surface mount IC to be measured, and 15 corresponds to the IC socket upper cover I4, which is an IC socket that accommodates the surface mount IC-W.

The upper part i14 of the IC socket is connected to the IC clamp device main body 1 by a spring 16.

Next, the operation of the embodiment of the IC clamp device shown in FIGS. 2A to 2C will be described. Between the state of FIG. 2A and the state of FIG. 2B, the kite roller 4 or the IC clamp guide body 1
The IC clamp device moves in the horizontal direction while being guided by the guide surface 12 of No. 1.

Along with this horizontal movement, the IC socket top cover 14
It opens and closes via the fulcrum 17. In this way, the IC clamp device body 1 of the IC clamp device is horizontally moved for a distance L2 shown in FIG.
and stops in the state shown in FIG. 2B.

After the IC clamp device temporarily stops in the state shown in Fig. 2B after horizontal movement, the IC clamp guide 1
1 horizontally moves in the direction of the arrow shown in FIG. 2A by a distance 111 [L3 shown in FIG. 2C. At this time, the IC clamp device main body 1 is attached to the guide surface 1 of the IC clamp guide main body 11.
The IC socket 15 descends a predetermined distance while being guided by the IC socket 15.
ride on the top lid 14 of. Then, when the IC clamp guide 11 further moves a small distance in the horizontal direction, the load 9 that has been resisted by the IC clamp guide 11 until now acts as a force that continues to press the IC socket top 114 via the fulcrum q.

Next, referring to Figures 3A to 3C, the measurement I without the top cover is installed.
An embodiment of the IC clamp device of the present invention when using a C socket of 15° will be described. In the figure, 18 is a contact of the IC socket 15''.

As shown in FIGS. 2A to 2C, the IC clamp device moves horizontally in area L2, and moves vertically in area L3 by moving the clamp guide 11, thereby clamping the surface-mounted IC/W for measurement. hold the top of the At this time, the pressing load 9 is equally applied to the ICcr)W to be measured by the two clamping rollers 2 and 3 via the fulcrums p and q. Also, when a load 9 is applied to W of the IC to be measured,
Since the axis q of the IC clamping device is fixed, there is no horizontal movement of the point of application of the load to W of the IC at the moment when the load 9 is applied to W of the TC, so that the IC to be measured can be stably fixed.
The W of C can be brought into contact with the contact 18 of the IC socket 15'.

〔Effect of the invention〕

As explained above, the IC clamping device of the present invention can clamp the contacts of a surface-mounted IC to the contacts of a measurement IC socket, even when using a measurement IC socket with a top cover or a measurement IC socket without a top cover. It has the effect that it can be brought into stable contact with.

[Brief explanation of the drawing]

FIG. 1A is a front view showing an embodiment of the IC clamping device of the present invention, FIG. 1B is a plan view showing an embodiment of the IC clamping device of the present invention, and FIG. 1C and FIG. A front view and a side view of an IC clamp guide according to an embodiment of the invention, FIGS. 2A to 2C are explanatory diagrams of the operation of an embodiment of the invention when an IC socket with a top cover is used, and FIGS. 3A to 3C.
The figure is an explanatory diagram of the operation of the embodiment of the present invention when an IC socket without a top cover is used. 1. IC clamp device main body 2.3. IC clamp roller 4 Guide roller 12 Guide roller guide surface 14 IC socket top cover 15 IC socket W. ...Surface mount IC p, q...Fullin agent Yoshi Iwasa, patent attorney Nambu (Figure A b □ 1 to Figure 2A Figure 2B Home Figure 3A Figure 3B Figure 3C

Claims (1)

[Claims] (1) Mount a surface mount IC in the IC socket for measuring the surface mount IC, send a test start signal to the measurement tester, and mount the surface mount IC in the IC socket for measuring the surface mount IC. In an IC clamping device of an automatic IC handler that automatically transports an IC to a measurement IC socket, two rollers are arranged at a predetermined interval in parallel to the measurement IC socket installed horizontally, and a rotation axis of the two rollers is arranged. an IC socket holding mechanism having a first supporting shaft; an IC socket holding mechanism that moves parallel to the measurement IC socket; and a stop at a position where the first supporting shaft moves to the center of the IC socket. a second support shaft located a predetermined distance away from the first support shaft, and a mechanism for holding the measurement IC socket in the socket mounting direction with the second support shaft as the center; An IC clamping device characterized by having a mechanism for lowering the IC clamping device toward the IC socket and directly pressing the upper cover of the IC socket for measurement or the IC.