JPH04198251A - Conductive composition - Google Patents
Conductive compositionInfo
- Publication number
- JPH04198251A JPH04198251A JP32110190A JP32110190A JPH04198251A JP H04198251 A JPH04198251 A JP H04198251A JP 32110190 A JP32110190 A JP 32110190A JP 32110190 A JP32110190 A JP 32110190A JP H04198251 A JPH04198251 A JP H04198251A
- Authority
- JP
- Japan
- Prior art keywords
- formaldehyde
- amine
- resin
- solvent
- conductive composition
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000203 mixture Substances 0.000 title claims description 28
- 229920005989 resin Polymers 0.000 claims abstract description 26
- 239000011347 resin Substances 0.000 claims abstract description 26
- 229910052751 metal Inorganic materials 0.000 claims abstract description 12
- 239000002184 metal Substances 0.000 claims abstract description 12
- 239000000126 substance Substances 0.000 claims abstract description 12
- 229920001187 thermosetting polymer Polymers 0.000 claims abstract description 12
- 239000000843 powder Substances 0.000 claims abstract description 11
- 239000002904 solvent Substances 0.000 claims abstract description 11
- QGZKDVFQNNGYKY-UHFFFAOYSA-N Ammonia Chemical compound N QGZKDVFQNNGYKY-UHFFFAOYSA-N 0.000 claims description 10
- 150000003141 primary amines Chemical class 0.000 claims description 7
- 229910021529 ammonia Inorganic materials 0.000 claims description 5
- 150000003335 secondary amines Chemical class 0.000 claims description 5
- WSFSSNUMVMOOMR-NJFSPNSNSA-N methanone Chemical compound O=[14CH2] WSFSSNUMVMOOMR-NJFSPNSNSA-N 0.000 claims description 3
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 abstract description 90
- 150000001412 amines Chemical class 0.000 abstract description 9
- 239000005011 phenolic resin Substances 0.000 abstract description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 2
- -1 o-aminophenol) Chemical class 0.000 abstract description 2
- 229920001568 phenolic resin Polymers 0.000 abstract description 2
- CDAWCLOXVUBKRW-UHFFFAOYSA-N 2-aminophenol Chemical compound NC1=CC=CC=C1O CDAWCLOXVUBKRW-UHFFFAOYSA-N 0.000 abstract 2
- SBASXUCJHJRPEV-UHFFFAOYSA-N 2-(2-methoxyethoxy)ethanol Chemical compound COCCOCCO SBASXUCJHJRPEV-UHFFFAOYSA-N 0.000 abstract 1
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 abstract 1
- 239000011248 coating agent Substances 0.000 description 11
- 238000000576 coating method Methods 0.000 description 10
- 239000003973 paint Substances 0.000 description 7
- 239000007858 starting material Substances 0.000 description 7
- 229920000877 Melamine resin Polymers 0.000 description 5
- 238000001035 drying Methods 0.000 description 5
- 229920001807 Urea-formaldehyde Polymers 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 235000019645 odor Nutrition 0.000 description 4
- 239000000654 additive Substances 0.000 description 3
- 238000009835 boiling Methods 0.000 description 3
- CWLKGDAVCFYWJK-UHFFFAOYSA-N 3-aminophenol Chemical compound NC1=CC=CC(O)=C1 CWLKGDAVCFYWJK-UHFFFAOYSA-N 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 239000004640 Melamine resin Substances 0.000 description 2
- OKKJLVBELUTLKV-UHFFFAOYSA-N Methanol Chemical class OC OKKJLVBELUTLKV-UHFFFAOYSA-N 0.000 description 2
- OPKOKAMJFNKNAS-UHFFFAOYSA-N N-methylethanolamine Chemical compound CNCCO OPKOKAMJFNKNAS-UHFFFAOYSA-N 0.000 description 2
- 229910001860 alkaline earth metal hydroxide Inorganic materials 0.000 description 2
- 229910000287 alkaline earth metal oxide Inorganic materials 0.000 description 2
- 239000002518 antifoaming agent Substances 0.000 description 2
- 239000002270 dispersing agent Substances 0.000 description 2
- VKYKSIONXSXAKP-UHFFFAOYSA-N hexamethylenetetramine Chemical compound C1N(C2)CN3CN1CN2C3 VKYKSIONXSXAKP-UHFFFAOYSA-N 0.000 description 2
- 238000005259 measurement Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 230000000704 physical effect Effects 0.000 description 2
- 239000002994 raw material Substances 0.000 description 2
- YGSDEFSMJLZEOE-UHFFFAOYSA-N salicylic acid Chemical compound OC(=O)C1=CC=CC=C1O YGSDEFSMJLZEOE-UHFFFAOYSA-N 0.000 description 2
- 238000007650 screen-printing Methods 0.000 description 2
- LJDSTRZHPWMDPG-UHFFFAOYSA-N 2-(butylamino)ethanol Chemical compound CCCCNCCO LJDSTRZHPWMDPG-UHFFFAOYSA-N 0.000 description 1
- HZAXFHJVJLSVMW-UHFFFAOYSA-N 2-Aminoethan-1-ol Chemical compound NCCO HZAXFHJVJLSVMW-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- 229940018563 3-aminophenol Drugs 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- IDCBOTIENDVCBQ-UHFFFAOYSA-N TEPP Chemical compound CCOP(=O)(OCC)OP(=O)(OCC)OCC IDCBOTIENDVCBQ-UHFFFAOYSA-N 0.000 description 1
- 230000000996 additive effect Effects 0.000 description 1
- 230000002411 adverse Effects 0.000 description 1
- 239000000956 alloy Substances 0.000 description 1
- 229910045601 alloy Inorganic materials 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000000052 comparative effect Effects 0.000 description 1
- 238000013329 compounding Methods 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 238000001514 detection method Methods 0.000 description 1
- 238000005868 electrolysis reaction Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000013007 heat curing Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000004312 hexamethylene tetramine Substances 0.000 description 1
- 235000010299 hexamethylene tetramine Nutrition 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-M hydroxide Chemical compound [OH-] XLYOFNOQVPJJNP-UHFFFAOYSA-M 0.000 description 1
- 150000004679 hydroxides Chemical class 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 230000009965 odorless effect Effects 0.000 description 1
- 229910052763 palladium Inorganic materials 0.000 description 1
- FJKROLUGYXJWQN-UHFFFAOYSA-N papa-hydroxy-benzoic acid Natural products OC(=O)C1=CC=C(O)C=C1 FJKROLUGYXJWQN-UHFFFAOYSA-N 0.000 description 1
- 229910052697 platinum Inorganic materials 0.000 description 1
- 238000006068 polycondensation reaction Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 229920003987 resole Polymers 0.000 description 1
- 229960004889 salicylic acid Drugs 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 230000000638 stimulation Effects 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229920002803 thermoplastic polyurethane Polymers 0.000 description 1
- 238000009849 vacuum degassing Methods 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明はホルムアルデヒドを出発物質とする熱硬化性樹
脂を用いた熱硬化性導電性組成物に関し、特にホルムア
ルデヒドの刺激臭が全く無く、導電性が良好な導電性組
成物に係る。Detailed Description of the Invention [Field of Industrial Application] The present invention relates to a thermosetting conductive composition using a thermosetting resin containing formaldehyde as a starting material. The present invention relates to a conductive composition having good conductivity.
一般に導電性組成物に用いられる樹脂のなかで、熱硬化
性樹脂としては、フェノール樹脂、エポキシ樹脂、メラ
ミン樹脂、尿素樹脂、ポリエステル樹脂、ウレタン初詣
等がある。これらの中、ホルムアルデヒドを出発物質と
するものは、フェノール樹脂、メラミン樹脂、尿素樹脂
がある。Among the resins generally used in conductive compositions, thermosetting resins include phenol resins, epoxy resins, melamine resins, urea resins, polyester resins, urethane resins, and the like. Among these, those using formaldehyde as a starting material include phenol resins, melamine resins, and urea resins.
従来、これらのホルムアルデヒドを出発物質とする樹脂
を用いた導電性組成物には、樹脂中に残留ホルムアルデ
ヒ１−が残存し、導電性組成物の取扱い中にホルムアル
デヒド特有の強い刺激臭が発散され、作業者に不快感を
与えるのみならず、労働安全衛生上からも好ましいもの
ではなかった。Conventionally, in conductive compositions using resins using formaldehyde as a starting material, residual formaldehye remains in the resin, and a strong pungent odor peculiar to formaldehyde is emitted during handling of the conductive composition. This not only caused discomfort to the workers, but was also unfavorable from the standpoint of occupational safety and health.
この対策として、従来、ホルマリン塗工剤組成物の中に
弱アルカリ性物質であるアルカリ土類金属の酸化物又は
水酸化物を添加することにより、ホルマリンの刺激臭を
除去することが特開昭６２−２６５３６３号公報に捉案
されている。しかしながら、このようなアルカリ土類金
属の酸化物又は水酸化物を添加する方法を本発明の如き
導電性組成物に応用する場合、塗膜の導電性が著しく低
下するという欠点を有し、実用には到底供し得なかった
。As a countermeasure against this problem, the pungent odor of formalin has conventionally been removed by adding an alkaline earth metal oxide or hydroxide, which is a weakly alkaline substance, to the formalin coating agent composition in JP-A-62. It is proposed in the publication No.-265363. However, when this method of adding alkaline earth metal oxides or hydroxides is applied to conductive compositions such as those of the present invention, there is a drawback that the conductivity of the coating film is significantly reduced, making it impractical for practical use. could not be provided at all.
更に、ホルムアルデヒドにサリチル酸とエタノールとを
添加し、臭気の無いホルムアルデヒドに変化させた脱臭
ホルマリンが特開昭６０−４５５０２号公報に提案され
ている。しかしながら、このような脱臭ホルマリンがは
たして導電性組成物の熱硬化性樹脂の出発物質として使
用できるか否か、あるいは導電性にどのような影響を及
ぼすか否か等については皆目わかっておらず、実際にも
導電性組成物に応用されたことは無かった・
本発明はホルムアルデヒ１へを出発物質とする熱硬化性
樹脂を用いた導電性組成物の導電性を低下せしめること
なく、ホルムアルデヒドの刺激臭を除去した組成物を提
供することを目的とするものである。Furthermore, deodorized formalin, which is obtained by adding salicylic acid and ethanol to formaldehyde and changing it into odorless formaldehyde, is proposed in Japanese Patent Application Laid-Open No. 60-45502. However, it is not entirely clear whether such deodorized formalin can actually be used as a starting material for the thermosetting resin of a conductive composition, or what effect it has on conductivity. In fact, it has never been applied to conductive compositions.The present invention can be applied to formaldehyde stimulation without reducing the conductivity of conductive compositions using thermosetting resins starting with formaldehyde 1. The object is to provide a composition free of odors.
本発明の導電性組成物は、金属粉、ホルムアルデヒドを
出発物質とする熱硬化性樹脂及び溶剤を含む導電性組成
物に、アンモニア、第１アミン及び第２アミンの群から
選ばれたいずれかの物質を添加してなるものであり、こ
の添加物質と前記導電性組成物中に残存するホルムアル
デヒドとを反応させることにより前記問題点を解決した
ものである。The conductive composition of the present invention includes a conductive composition containing a metal powder, a thermosetting resin starting from formaldehyde, and a solvent, and any one selected from the group of ammonia, a primary amine, and a secondary amine. The above problem is solved by reacting the additive substance with the formaldehyde remaining in the conductive composition.
以下、本発明をより詳細に説明する。The present invention will be explained in more detail below.
本発明において、組成物中に添加する物質としてはホル
ムアルデヒドと化学的に反応し、導電性組成物の導電性
、その他の塗膜物性に悪影響を及ぼさないものとするこ
とが必要であり、その意味からアンモニア、第１アミン
、第２アミンの群れから選ばれたいずれかの物質（以下
、Ａ物質という）とする。このように本発明では、導電
性組成物中の熱硬化性樹脂としては、ホルムアルデヒド
を出発原料とするもの、代表的にはフェノール樹脂、メ
ラミン樹脂、尿素樹脂を使用するものであり、Ａ物質と
して上記３種のいずれでも本発明の目的を達成すること
ができるが、それぞれを添加した場合の作用は以下の如
く異なる。In the present invention, the substance added to the composition must be one that chemically reacts with formaldehyde and does not have an adverse effect on the conductivity of the conductive composition or other physical properties of the coating film. (hereinafter referred to as substance A) selected from the group consisting of ammonia, primary amines, and secondary amines. As described above, in the present invention, the thermosetting resin in the conductive composition uses formaldehyde as a starting material, typically phenol resin, melamine resin, or urea resin. Although any of the above three types can achieve the object of the present invention, the effect when each is added is different as follows.
−て）盆（＝ユ乙（救助りり鏝−介
添加したアンモニアは樹脂の中に残留しているホルムア
ルデヒドと常温で反応し、周知のようにヘキサメチレン
テトラミン（Ｃｓ Ｉ（１２Ｎ ４ ）を生じる。この
物質はフェノール樹脂、メラミン樹脂、尿素樹脂の硬化
剤として作用し、塗膜の導電性を向上させる。余分のア
ンモニアは真空脱気して容易に取り除くことができる。The added ammonia reacts with formaldehyde remaining in the resin at room temperature, producing hexamethylenetetramine (Cs I(12N 4 )), as is well known. This substance acts as a curing agent for phenolic, melamine, and urea resins and improves the conductivity of the coating.Excess ammonia can be easily removed by vacuum degassing.
第に乙−Ｌｄｕ０Ｌレーな一裁介
添加した第１アミンはホルムアルデヒドと反応し、メチ
ロール化される。メチロール化された第１−アミンは塗
膜の乾燥工程で樹脂の重縮合反応に加わり、三次元網目
構造を形成し、塗膜の導電性を向上させる。余分の第１
アミンは液体の場合、溶剤として使用できる。この場合
。First, the primary amine added at one time reacts with formaldehyde and is converted into methylol. The methylolated primary amine participates in the polycondensation reaction of the resin during the coating film drying process, forms a three-dimensional network structure, and improves the electrical conductivity of the coating film. extra 1st
When the amine is liquid, it can be used as a solvent. in this case.
塗膜の乾燥条件に合わせて適当な沸点の第１アミンを選
択した方か良い。すなわち、沸点か乾燥温度よりもあま
り高くないような第１アミンを選択する。具体的には０
−アミノフェノール、ｍ−アミノフェノール、モノエタ
ノールアミン等が挙げられる。It is better to select a primary amine with an appropriate boiling point depending on the drying conditions of the coating film. That is, select a primary amine whose boiling point is not significantly higher than the drying temperature. Specifically 0
-aminophenol, m-aminophenol, monoethanolamine, etc.
第λタ二辷社−蓚功σ−りた資金
添加した第２アミンはホルムアルデヒドと反応し、メチ
ロール化される。メチロール化された第２アミンは塗膜
の乾燥工程でメチロール基の部分が樹脂と縮合し、樹脂
と一体となるために塗膜の導電性を低下させることがな
い。第２アミンは第１アミンと同様、塗膜の乾燥温度よ
りもあまり高くない沸、Ｗのものを選択する。具体的に
は２−メチルアミノエタノール、２−ブチルアミノエタ
ノール、ジェタノールアミン等が挙げられる。The added secondary amine reacts with formaldehyde and is methylolated. In the methylolated secondary amine, the methylol group portion condenses with the resin during the drying process of the coating film and becomes integrated with the resin, so that the conductivity of the coating film does not decrease. As with the first amine, the second amine is selected to have a boiling point of W that is not much higher than the drying temperature of the coating film. Specific examples include 2-methylaminoethanol, 2-butylaminoethanol, jetanolamine, and the like.
本発明では、金属粉、ホルムアルデヒドを出発物質とす
る樹脂、溶剤の混合物に前記Ａ物質を添加して反応させ
る。この際の反応温度は特に限定されないが、０〜１０
０℃が好ましい。In the present invention, the substance A is added to a mixture of metal powder, a resin containing formaldehyde as a starting material, and a solvent, and the mixture is reacted. The reaction temperature at this time is not particularly limited, but is 0 to 10
0°C is preferred.
また、反応時間も特に限定されないが、２４時間以内が
好ましい。The reaction time is also not particularly limited, but is preferably within 24 hours.
本発明で使用する金属粉は一般に導電性組成物に用いら
れる導電性良好な金属が使用でき、特に限定されない。The metal powder used in the present invention is not particularly limited, and may be a metal with good conductivity that is generally used in conductive compositions.
例えば、Ａｕ、Ａｇ、Ｐｔ。For example, Au, Ag, Pt.
Ｐｄ、Ｃｕ、Ｎｉ、ＡＱ等が挙げられる。また、これら
の二種あるいはそれ以上の合金、混合物も使用できる。Examples include Pd, Cu, Ni, AQ, and the like. Furthermore, alloys or mixtures of two or more of these can also be used.
さらに、これらの金属を表面に被覆した粉体も使用でき
る。その形状は樹枝状、鱗片状、粒状その他、あらゆる
形状のものが使用できる。そして、比表面積、タップ密
度、粒度分布、その他の物性も特にこれを限定されない
。Furthermore, powders whose surfaces are coated with these metals can also be used. The shape can be dendritic, scaly, granular, or any other shape. Further, the specific surface area, tap density, particle size distribution, and other physical properties are not particularly limited.
また、本発明で使用する溶剤は前記した熱硬化性樹脂の
良溶媒であればいずれも使用できる。Further, the solvent used in the present invention may be any good solvent for the above-mentioned thermosetting resin.
例えば、メチルカルピトール、ブチルセロソルブ、ブチ
ルカルピトールアセテート等が挙げられる。Examples include methylcarpitol, butylcellosolve, butylcarpitol acetate, and the like.
本発明において、必要に応じて、各種の分散剤、消泡剤
が利用できる。In the present invention, various dispersants and antifoaming agents can be used as necessary.
これら金属粉、樹脂、溶剤及びＡ物質の配合比は、金属
粉１００重量部につき、樹脂５〜６０重量部、溶剤１〜
１００重量部、Ａ物質０゜０１〜１０重量部、その他の
添加剤０．０１〜２重量部とする。樹脂の量が金属粉１
００重量部につき５重１部を下回ると導電性及び塗膜強
度が低下する。逆に、樹脂社が６０重量部を越えるとや
はり導電性が低下する。溶剤は作業性の良い塗料粘度に
調整するために適当量加えられる。実用的には上記した
範囲が適当である。The compounding ratio of these metal powders, resins, solvents, and substance A is 100 parts by weight of metal powder, 5 to 60 parts by weight of resin, and 1 to 100 parts by weight of solvent.
100 parts by weight, 0.01 to 10 parts by weight of substance A, and 0.01 to 2 parts by weight of other additives. The amount of resin is 1 metal powder
If the amount is less than 1 part by 5 parts per 00 parts by weight, the conductivity and coating film strength will decrease. On the other hand, if the amount of resin exceeds 60 parts by weight, the conductivity will decrease. An appropriate amount of solvent is added to adjust the viscosity of the paint to provide good workability. Practically speaking, the above range is appropriate.
Ａ物質の添加量は樹脂中に含有される残留ホルムアルデ
ヒド量に依存するが、実用的には上記した範囲が適当で
ある。その他の添加剤（分散剤、消泡剤）は必要に応じ
て適″Ａ＋ｉ添加されるが、実用的には上記した範囲が
適当である。The amount of substance A added depends on the amount of residual formaldehyde contained in the resin, but the above range is suitable for practical use. Other additives (dispersant, antifoaming agent) may be added in an appropriate amount as required, but the above-mentioned range is suitable for practical use.
上記のように！ｌ！ｌ製された組成物は常法に従ってス
クリーン印刷等によって塗布され、加熱硬化させること
により実用に供される。As described above! l! The prepared composition is applied by screen printing or the like according to a conventional method, and then put into practical use by being cured by heating.
以下に実施例を示す。Examples are shown below.
第１表に示されるような配合組成とした組成物を３本ロ
ールミルで混練し、試料１〜６の塗料を調製した。試料
１〜試料４が本発明実施例塗料、試料５及び６が比較例
塗料である。原料としては、金属粉として電解法により
得られた平均粒径６μｍ、比表面積Ｑ、３０ｍ”／ｇの
銅粉を、樹脂として残留ホルムアルデヒド２ｗｔ％を含
むレゾール型フェノール樹脂及び残留ホルムアルデヒド
２ｗｔ％を含むメラミン樹脂を、そしてその他の原料と
して試薬−級のものを使用した。The compositions having the compositions shown in Table 1 were kneaded in a three-roll mill to prepare paints for samples 1 to 6. Samples 1 to 4 are paints of examples of the present invention, and samples 5 and 6 are paints of comparative examples. As raw materials, copper powder with an average particle size of 6 μm, specific surface area Q, and 30 m''/g obtained by electrolysis as metal powder, and a resol type phenol resin containing 2 wt% of residual formaldehyde and 2 wt% of residual formaldehyde as resin. Melamine resin and other raw materials were of reagent grade.
これら各塗料につき、比抵抗及びホルムアルデヒド濃度
を測定した。The specific resistance and formaldehyde concentration of each of these paints were measured.
比抵抗測定は各試料塗料を紙フエノール基板上に２００
メツシユテトロンスクリーンにてスクリーン印刷した後
、１６０℃のエアオーブン中にて３０分間加熱硬化後、
抵抗を測定し、比抵抗に換算した。For specific resistance measurements, each sample paint was placed on a paper phenol substrate at a temperature of 200 nm.
After screen printing with a mesh tetron screen, heat curing in an air oven at 160°C for 30 minutes,
The resistance was measured and converted into specific resistance.
ホルムアルデヒド濃度測定は、調製した塗料５０ｇを１
００ｃｃのビーカーに入れ、パラフィルムでシールし、
２５℃、２４時間保存後、揮散したホルムアルデヒド濃
度を検知管法で測定した。For formaldehyde concentration measurement, 50g of the prepared paint was
Place it in a 00cc beaker and seal it with parafilm.
After storage at 25° C. for 24 hours, the concentration of volatilized formaldehyde was measured using a detection tube method.
それらの結果を第１表中に併記する。The results are also listed in Table 1.
以上のような本発明によれば、ホルムアルデヒドを出発
物質とする熱硬化性樹脂を用いてもホルムアルデヒドの
刺激臭が全く無く、しかも高い導電性を有する導電性組
成物が得られる。According to the present invention as described above, even if a thermosetting resin containing formaldehyde as a starting material is used, a conductive composition having no irritating odor of formaldehyde and having high conductivity can be obtained.
Claims (1)
性樹脂及び溶剤を含む導電性組成物に、アンモニア、第
１アミン及び第２アミンの群から選ばれたいずれかの物
質を添加してなる導電性組成物。1. A conductive composition obtained by adding any substance selected from the group of ammonia, primary amines, and secondary amines to a conductive composition containing metal powder, a thermosetting resin starting from formaldehyde, and a solvent. thing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32110190A JPH04198251A (en) | 1990-11-27 | 1990-11-27 | Conductive composition |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32110190A JPH04198251A (en) | 1990-11-27 | 1990-11-27 | Conductive composition |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04198251A true JPH04198251A (en) | 1992-07-17 |
Family
ID=18128832
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP32110190A Pending JPH04198251A (en) | 1990-11-27 | 1990-11-27 | Conductive composition |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04198251A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9741836B2 (en) | 2015-09-10 | 2017-08-22 | Kabushiki Kaisha Toshiba | Semiconductor device and method for driving same |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62145602A (en) * | 1985-12-19 | 1987-06-29 | 住友ベークライト株式会社 | Conductive resin paste |
| JPH0216172A (en) * | 1988-07-05 | 1990-01-19 | Tatsuta Electric Wire & Cable Co Ltd | Solderable conductive paint |
| JPH0377202A (en) * | 1989-08-18 | 1991-04-02 | Daido Steel Co Ltd | Conductive composite |
-
1990
- 1990-11-27 JP JP32110190A patent/JPH04198251A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62145602A (en) * | 1985-12-19 | 1987-06-29 | 住友ベークライト株式会社 | Conductive resin paste |
| JPH0216172A (en) * | 1988-07-05 | 1990-01-19 | Tatsuta Electric Wire & Cable Co Ltd | Solderable conductive paint |
| JPH0377202A (en) * | 1989-08-18 | 1991-04-02 | Daido Steel Co Ltd | Conductive composite |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US9741836B2 (en) | 2015-09-10 | 2017-08-22 | Kabushiki Kaisha Toshiba | Semiconductor device and method for driving same |
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