JPH04197631A - Laminated matter of thermoplastic resin film - Google Patents
Laminated matter of thermoplastic resin filmInfo
- Publication number
- JPH04197631A JPH04197631A JP33108890A JP33108890A JPH04197631A JP H04197631 A JPH04197631 A JP H04197631A JP 33108890 A JP33108890 A JP 33108890A JP 33108890 A JP33108890 A JP 33108890A JP H04197631 A JPH04197631 A JP H04197631A
- Authority
- JP
- Japan
- Prior art keywords
- resin
- film
- group
- polyester
- parts
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229920005992 thermoplastic resin Polymers 0.000 title claims abstract description 9
- 229920005989 resin Polymers 0.000 claims abstract description 39
- 239000011347 resin Substances 0.000 claims abstract description 39
- 150000001875 compounds Chemical class 0.000 claims abstract description 29
- 125000003178 carboxy group Chemical group [H]OC(*)=O 0.000 claims abstract description 6
- 125000001174 sulfone group Chemical group 0.000 claims description 3
- -1 acrylate chemical compound Chemical class 0.000 abstract description 14
- 238000000034 method Methods 0.000 abstract description 11
- 229920000728 polyester Polymers 0.000 abstract description 9
- 239000004925 Acrylic resin Substances 0.000 abstract description 8
- 229920002635 polyurethane Polymers 0.000 abstract description 8
- 239000004814 polyurethane Substances 0.000 abstract description 8
- 229920001600 hydrophobic polymer Polymers 0.000 abstract description 7
- 229920005906 polyester polyol Polymers 0.000 abstract description 6
- 239000002994 raw material Substances 0.000 abstract description 5
- 238000003847 radiation curing Methods 0.000 abstract description 4
- 239000003822 epoxy resin Substances 0.000 abstract description 3
- 238000004519 manufacturing process Methods 0.000 abstract description 3
- 229920000647 polyepoxide Polymers 0.000 abstract description 3
- 229920000642 polymer Polymers 0.000 abstract description 3
- 229920001515 polyalkylene glycol Polymers 0.000 abstract description 2
- 230000002349 favourable effect Effects 0.000 abstract 2
- 238000010276 construction Methods 0.000 abstract 1
- 238000012856 packing Methods 0.000 abstract 1
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 18
- 238000011282 treatment Methods 0.000 description 14
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 12
- 229920006267 polyester film Polymers 0.000 description 11
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 9
- 239000002253 acid Substances 0.000 description 9
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 7
- 239000002585 base Substances 0.000 description 7
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 6
- 230000005855 radiation Effects 0.000 description 6
- 239000000243 solution Substances 0.000 description 6
- 239000000126 substance Substances 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 5
- 229920001477 hydrophilic polymer Polymers 0.000 description 5
- 238000003475 lamination Methods 0.000 description 5
- 239000007787 solid Substances 0.000 description 5
- 239000004970 Chain extender Substances 0.000 description 4
- AEMRFAOFKBGASW-UHFFFAOYSA-N Glycolic acid Chemical compound OCC(O)=O AEMRFAOFKBGASW-UHFFFAOYSA-N 0.000 description 4
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 4
- WPYMKLBDIGXBTP-UHFFFAOYSA-N benzoic acid Chemical compound OC(=O)C1=CC=CC=C1 WPYMKLBDIGXBTP-UHFFFAOYSA-N 0.000 description 4
- 238000006243 chemical reaction Methods 0.000 description 4
- 238000000576 coating method Methods 0.000 description 4
- 238000003851 corona treatment Methods 0.000 description 4
- 150000002009 diols Chemical class 0.000 description 4
- 239000002184 metal Substances 0.000 description 4
- 229910052751 metal Inorganic materials 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 239000000088 plastic resin Substances 0.000 description 4
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 3
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 3
- 150000007513 acids Chemical class 0.000 description 3
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 3
- 150000002739 metals Chemical class 0.000 description 3
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 3
- 239000012785 packaging film Substances 0.000 description 3
- 229920006280 packaging film Polymers 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 239000004417 polycarbonate Substances 0.000 description 3
- 229920000515 polycarbonate Polymers 0.000 description 3
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 3
- 239000002904 solvent Substances 0.000 description 3
- RBNPOMFGQQGHHO-UHFFFAOYSA-N -2,3-Dihydroxypropanoic acid Natural products OCC(O)C(O)=O RBNPOMFGQQGHHO-UHFFFAOYSA-N 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- 239000005711 Benzoic acid Substances 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- RBNPOMFGQQGHHO-UWTATZPHSA-N D-glyceric acid Chemical compound OC[C@@H](O)C(O)=O RBNPOMFGQQGHHO-UWTATZPHSA-N 0.000 description 2
- 239000004721 Polyphenylene oxide Chemical group 0.000 description 2
- 239000006096 absorbing agent Substances 0.000 description 2
- 125000002947 alkylene group Chemical group 0.000 description 2
- 125000000129 anionic group Chemical group 0.000 description 2
- 239000002216 antistatic agent Substances 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 235000010233 benzoic acid Nutrition 0.000 description 2
- 239000002981 blocking agent Substances 0.000 description 2
- 239000003795 chemical substances by application Substances 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 239000003431 cross linking reagent Substances 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 150000001991 dicarboxylic acids Chemical class 0.000 description 2
- WOZVHXUHUFLZGK-UHFFFAOYSA-N dimethyl terephthalate Chemical compound COC(=O)C1=CC=C(C(=O)OC)C=C1 WOZVHXUHUFLZGK-UHFFFAOYSA-N 0.000 description 2
- XBDQKXXYIPTUBI-UHFFFAOYSA-N dimethylselenoniopropionate Natural products CCC(O)=O XBDQKXXYIPTUBI-UHFFFAOYSA-N 0.000 description 2
- 239000000975 dye Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 150000002148 esters Chemical class 0.000 description 2
- 235000019441 ethanol Nutrition 0.000 description 2
- 235000013305 food Nutrition 0.000 description 2
- 239000003112 inhibitor Substances 0.000 description 2
- 229910010272 inorganic material Inorganic materials 0.000 description 2
- 239000011147 inorganic material Substances 0.000 description 2
- 239000010954 inorganic particle Substances 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 239000000314 lubricant Substances 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 239000012299 nitrogen atmosphere Substances 0.000 description 2
- 239000011146 organic particle Substances 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 229920002647 polyamide Polymers 0.000 description 2
- 229920000570 polyether Chemical group 0.000 description 2
- 238000005809 transesterification reaction Methods 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- JHPBZFOKBAGZBL-UHFFFAOYSA-N (3-hydroxy-2,2,4-trimethylpentyl) 2-methylprop-2-enoate Chemical compound CC(C)C(O)C(C)(C)COC(=O)C(C)=C JHPBZFOKBAGZBL-UHFFFAOYSA-N 0.000 description 1
- SLJZUKLGAWYGIF-UHFFFAOYSA-N 2,5-dihydroxybenzenesulfonic acid;sodium Chemical compound [Na].OC1=CC=C(O)C(S(O)(=O)=O)=C1 SLJZUKLGAWYGIF-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- FGHOJUJBJHVRGT-UHFFFAOYSA-N 2-(dimethylamino)-2-methylpropane-1,3-diol Chemical compound CN(C)C(C)(CO)CO FGHOJUJBJHVRGT-UHFFFAOYSA-N 0.000 description 1
- YZTJKOLMWJNVFH-UHFFFAOYSA-N 2-sulfobenzene-1,3-dicarboxylic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1S(O)(=O)=O YZTJKOLMWJNVFH-UHFFFAOYSA-N 0.000 description 1
- UPMLOUAZCHDJJD-UHFFFAOYSA-N 4,4'-Diphenylmethane Diisocyanate Chemical compound C1=CC(N=C=O)=CC=C1CC1=CC=C(N=C=O)C=C1 UPMLOUAZCHDJJD-UHFFFAOYSA-N 0.000 description 1
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- KXDHJXZQYSOELW-UHFFFAOYSA-N Carbamic acid Chemical class NC(O)=O KXDHJXZQYSOELW-UHFFFAOYSA-N 0.000 description 1
- 229920000298 Cellophane Polymers 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- BDAGIHXWWSANSR-UHFFFAOYSA-N Formic acid Chemical compound OC=O BDAGIHXWWSANSR-UHFFFAOYSA-N 0.000 description 1
- 108010010803 Gelatin Proteins 0.000 description 1
- 240000004670 Glycyrrhiza echinata Species 0.000 description 1
- 235000001453 Glycyrrhiza echinata Nutrition 0.000 description 1
- 235000006200 Glycyrrhiza glabra Nutrition 0.000 description 1
- 235000017382 Glycyrrhiza lepidota Nutrition 0.000 description 1
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- 239000000020 Nitrocellulose Substances 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 1
- 239000004696 Poly ether ether ketone Substances 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004695 Polyether sulfone Substances 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 239000004734 Polyphenylene sulfide Substances 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- BYVDYWJEGMXQHS-UHFFFAOYSA-N S(=O)(=O)(O)C1=C(C(=O)O)C=CC=C1C(=O)O.[Na].[Na].[Na].[Na].[Na] Chemical compound S(=O)(=O)(O)C1=C(C(=O)O)C=CC=C1C(=O)O.[Na].[Na].[Na].[Na].[Na] BYVDYWJEGMXQHS-UHFFFAOYSA-N 0.000 description 1
- 101100508071 Solanum lycopersicum PIIF gene Proteins 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 229920002433 Vinyl chloride-vinyl acetate copolymer Polymers 0.000 description 1
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 description 1
- FKXJWELJXMKBDI-UHFFFAOYSA-K [butyl-di(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(OC(=O)CCCCCCCCCCC)OC(=O)CCCCCCCCCCC FKXJWELJXMKBDI-UHFFFAOYSA-K 0.000 description 1
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 125000000217 alkyl group Chemical group 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 239000003945 anionic surfactant Substances 0.000 description 1
- 230000001442 anti-mosquito Effects 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 239000011230 binding agent Substances 0.000 description 1
- NTXGQCSETZTARF-UHFFFAOYSA-N buta-1,3-diene;prop-2-enenitrile Chemical compound C=CC=C.C=CC#N NTXGQCSETZTARF-UHFFFAOYSA-N 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 238000003490 calendering Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 239000003093 cationic surfactant Chemical group 0.000 description 1
- 229920006217 cellulose acetate butyrate Polymers 0.000 description 1
- 239000012461 cellulose resin Substances 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- VNGOYPQMJFJDLV-UHFFFAOYSA-N dimethyl benzene-1,3-dicarboxylate Chemical compound COC(=O)C1=CC=CC(C(=O)OC)=C1 VNGOYPQMJFJDLV-UHFFFAOYSA-N 0.000 description 1
- 208000028659 discharge Diseases 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 238000009820 dry lamination Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 238000005886 esterification reaction Methods 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 238000011156 evaluation Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 150000002222 fluorine compounds Chemical class 0.000 description 1
- 229920000159 gelatin Polymers 0.000 description 1
- 239000008273 gelatin Substances 0.000 description 1
- 235000019322 gelatine Nutrition 0.000 description 1
- 235000011852 gelatine desserts Nutrition 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 229910052739 hydrogen Inorganic materials 0.000 description 1
- 239000001257 hydrogen Substances 0.000 description 1
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 1
- 229910052500 inorganic mineral Inorganic materials 0.000 description 1
- 229920000592 inorganic polymer Polymers 0.000 description 1
- 230000005865 ionizing radiation Effects 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 229940010454 licorice Drugs 0.000 description 1
- 239000006224 matting agent Substances 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical compound CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 description 1
- 239000011707 mineral Substances 0.000 description 1
- 239000002480 mineral oil Substances 0.000 description 1
- 235000010446 mineral oil Nutrition 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 229920001220 nitrocellulos Polymers 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 239000002736 nonionic surfactant Chemical group 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000013034 phenoxy resin Substances 0.000 description 1
- 229920006287 phenoxy resin Polymers 0.000 description 1
- 229910052698 phosphorus Inorganic materials 0.000 description 1
- 239000011574 phosphorus Substances 0.000 description 1
- 239000003504 photosensitizing agent Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920006393 polyether sulfone Polymers 0.000 description 1
- 229920002530 polyetherether ketone Polymers 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920000193 polymethacrylate Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920000069 polyphenylene sulfide Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 235000019260 propionic acid Nutrition 0.000 description 1
- IUVKMZGDUIUOCP-BTNSXGMBSA-N quinbolone Chemical compound O([C@H]1CC[C@H]2[C@H]3[C@@H]([C@]4(C=CC(=O)C=C4CC3)C)CC[C@@]21C)C1=CCCC1 IUVKMZGDUIUOCP-BTNSXGMBSA-N 0.000 description 1
- 239000001044 red dye Substances 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 239000011734 sodium Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- RTVVXRKGQRRXFJ-UHFFFAOYSA-N sodium;2-sulfobutanedioic acid Chemical compound [Na].OC(=O)CC(C(O)=O)S(O)(=O)=O RTVVXRKGQRRXFJ-UHFFFAOYSA-N 0.000 description 1
- YXTFRJVQOWZDPP-UHFFFAOYSA-M sodium;3,5-dicarboxybenzenesulfonate Chemical compound [Na+].OC(=O)C1=CC(C(O)=O)=CC(S([O-])(=O)=O)=C1 YXTFRJVQOWZDPP-UHFFFAOYSA-M 0.000 description 1
- 125000000542 sulfonic acid group Chemical group 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 238000012360 testing method Methods 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 150000003852 triazoles Chemical class 0.000 description 1
- 238000009281 ultraviolet germicidal irradiation Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
Abstract
Description
【発明の詳細な説明】
(産業上の利用分野)
本発明は接着性を改良した熱ijJ塑性樹脂フィルムに
関し、その目的とするところは、親水性ポリマー及び疎
水性ポリマー及び無機物に良好な接着性を有する熱可塑
性樹脂フィルムを提供することにある。Detailed Description of the Invention (Industrial Field of Application) The present invention relates to a thermal ijJ plastic resin film with improved adhesion, the object of which is to provide good adhesion to hydrophilic and hydrophobic polymers and inorganic materials. An object of the present invention is to provide a thermoplastic resin film having the following properties.
(従来の技術)
周知の如く熱[+J塑性樹脂フィルム、例えばポリエス
テル、ポリアミド、ポリプロピレン、ポリカーボネート
ポリエーテルイミド、ポリエーテルスルホン、ポリフェ
ニレンサルファイド、ポリエーテルエーテルケトン等、
特にポリエステルフィルムとりわけポリエチレンテレフ
タレートフィルムは、機械的強度、耐熱性、耐薬品性、
透明性、・j法衣定性等か優れているので、磁気テープ
用ベースフィルム、絶縁テープ、写真フィルム、トレー
ソングフィルム、食品包装用フィルムなとの多方向で使
用されている。しかしなから 一般にポリエステルフィ
ルt・は接着性か低いため、インキ、電r写真トナー、
ヒート/−ル性付与組成物、磁性体、感光剤、マット剤
、金属、金属酸化物、無機ポリマーなとを積層する場合
には、フィルム表面にコロナ放電処理を施し、史にアン
カーコート剤を設けることか一般的である。また金品包
装に用いる場合は、印刷層やヒートンール層との接着性
か弱いため、全体のヒート/−ル強度も低下するという
欠点かある。熱可塑性樹脂フィルム表面の接着性を改良
する方法として、コロナ放電処理が一般に行なわれてお
り、この他に、紫外線照射処理、プラズマ放電処理、火
炎処理、窒素雰囲気ドのコロナ放電処理なとの物理的処
理方法や、アルカリ処理、ブライマー処理なとの化学的
処理ノJ法や、これらを併用した処理ノコ法か知られて
いる。(Prior art) As is well known, heat [+J plastic resin films, such as polyester, polyamide, polypropylene, polycarbonate polyetherimide, polyether sulfone, polyphenylene sulfide, polyether ether ketone, etc.]
In particular, polyester films, especially polyethylene terephthalate films, have excellent mechanical strength, heat resistance, chemical resistance,
Because of its excellent transparency and uniformity, it is used in a wide variety of applications, including base films for magnetic tapes, insulating tapes, photographic films, tracing film, and food packaging films. However, polyester film generally has low adhesion, so ink, electrophotographic toner, etc.
When laminating heat/heat property imparting compositions, magnetic substances, photosensitizers, matting agents, metals, metal oxides, inorganic polymers, etc., corona discharge treatment is applied to the film surface, and an anchor coating agent is applied to the film surface. It is common to have one. Furthermore, when used for packaging gold goods, the adhesiveness with the printed layer and the heat roll layer is weak, resulting in a disadvantage that the overall heat/roll strength is reduced. Corona discharge treatment is generally used as a method to improve the adhesion of thermoplastic resin film surfaces.In addition, physical treatments such as ultraviolet irradiation treatment, plasma discharge treatment, flame treatment, and corona discharge treatment in a nitrogen atmosphere are also used. Chemical treatment methods such as alkali treatment and brimer treatment, and a treatment method using a combination of these methods are known.
しかしなから、親水性ポリマー及び疎水性ポリマー及び
無機物に対して良好な接着性を有するp iif塑性樹
脂フィルムとりわけポリエステルフィルムはない。However, there are no PIIF plastic resin films, especially polyester films, which have good adhesion to hydrophilic and hydrophobic polymers and to minerals.
(発明か解決しようとする課題)
本発明者らは前記従来の技術における問題点すなわち親
水性ポリマー、疎水性ポリマーの及び無機物に対して共
に良好な接着性を付すすることの困難性を解決するため
鋭意研究、努力した結果、本発明を完成するに到ったも
のである。(Problems to be Solved by the Invention) The present inventors have solved the problems in the conventional techniques, namely, the difficulty in imparting good adhesion to both hydrophilic polymers, hydrophobic polymers, and inorganic materials. As a result of intensive research and efforts, we have completed the present invention.
(課題を解決するための手段)
口 熱可塑性樹脂フィルムの少なくとも11面に、カル
ボキシル基および/またはスルホン基含有化合物を1種
以」ユ反応させた放射線、硬化型、樹脂が積層樹脂の少
なくとも一成分として積層されてなる事を特徴とする熱
iiJ塑性樹脂フィルム。(Means for Solving the Problems) At least one of the laminated resins is a radiation-curing type resin in which at least 11 sides of a thermoplastic resin film are reacted with one or more compounds containing a carboxyl group and/or a sulfone group. A thermal IIJ plastic resin film characterized by being laminated as components.
C00M化合物としてはポリエステルポリオール(B)
の酸成分であるポリカルボン酸、グリコール酸、グリセ
リン酸、ツメ千ロールプロピオン酸、N、N−ノエタノ
ールグリシン、ヒドロキノ工千ルオキン安息香酸等のオ
キシカルボン酸、/アミ/プロピオン酸、/アミ7安息
香酸等のアミノカルボン酸及びその誘導体。Polyester polyol (B) as C00M compound
Oxycarboxylic acids such as polycarboxylic acids, glycolic acid, glyceric acid, N,N-noethanolglycine, hydroquinoloxine benzoic acid, glycolic acid, glyceric acid, /ami/propionic acid, /ami7 Aminocarboxylic acids such as benzoic acid and their derivatives.
一803M化合物とは5−ナトリウムスルホイソフタル
酸、5−テトラブチルホスホニウム、スルホイソフタル
酸、ナトリウムスルホコハク酸、等のポリカルボン酸及
び誘導体、ナトリウムスルホハイドロキノンおよびアル
キレンオキサイド付加物、ナトリウムスルホビスフェノ
ールAおよびアルキレンオキサイド付加物等。-803M compounds are polycarboxylic acids and derivatives such as 5-sodium sulfoisophthalic acid, 5-tetrabutylphosphonium, sulfoisophthalic acid, sodium sulfosuccinic acid, sodium sulfohydroquinone and alkylene oxide adducts, sodium sulfobisphenol A and alkylene oxide. Addenda etc.
本発明の放射線硬化型樹脂は分子内にアクリル系二重結
合を少なくきも1個有し、前記C00M化合物および/
またはS(1,M化合物に示された化合物の少なくとも
1種および原子以外の親水性極性基含有化合物を反応さ
せたC00Mまたは/およびSQ、、M基金イr放射線
硬化型樹脂である。The radiation curable resin of the present invention has at least one acrylic double bond in the molecule, and has at least one acrylic double bond in the molecule, and
or S(1,M compound) is a C00M or/and SQ, M-based radiation-curable resin made by reacting at least one of the compounds shown in the compound and a compound containing a hydrophilic polar group other than an atom.
具体的にはアクリル系二重結合含有化合物(A)とウレ
タン結合、エステル結合、エーテル結合、アミド結合の
うち、少なくとも1種の結合を介して結合している樹脂
、例えばポリウレタンアクリレート樹脂、ポリエステル
アクリレート樹脂、エポキシアクリレート樹脂、種々の
アクリレート化合物等が挙げられる。Specifically, resins that are bonded to the acrylic double bond-containing compound (A) through at least one bond among urethane bonds, ester bonds, ether bonds, and amide bonds, such as polyurethane acrylate resins and polyester acrylates. Examples include resins, epoxy acrylate resins, various acrylate compounds, and the like.
本発明の結合剤に含まれるアクリル系二重結合とはアク
リル酸、アクリル酸エステル、アクリル酸アミド、メタ
クリル酸、メタクリル酸エステル、メタクリル酸アミド
等の残基(アクリロイル基又はメタクリロイル基)をい
う。The acrylic double bond contained in the binder of the present invention refers to residues (acryloyl group or methacryloyl group) of acrylic acid, acrylic ester, acrylic amide, methacrylic acid, methacrylic ester, methacrylic amide, etc.
L記の特定のカルボキシル基および/またはスルホン基
含有化合物は種々の過程を経て反応させることができる
。例えば、ポリエステルポリオール、ポリアルキレング
リコール、エポキシ樹脂等の原料樹脂を製造する際に、
その1成分として用いられることができる。特に、ポリ
エステルポリオールを製造する際、上記C00M1SO
3M化合物で表わされる化合物をポリエステルポリオー
ルの重合完結前の任意の段階で添加し、反応させること
ができる。製造時の操業1−の点からエステル交換反応
後またはエステル化反応後の段階で添加するのか好まし
い。The specific carboxyl group- and/or sulfone group-containing compound listed in L can be reacted through various processes. For example, when manufacturing raw material resins such as polyester polyols, polyalkylene glycols, and epoxy resins,
It can be used as one component thereof. In particular, when producing polyester polyol, the above C00M1SO
A compound represented by a 3M compound can be added and reacted at any stage before the completion of polymerization of the polyester polyol. From the point of view of operation 1- during production, it is preferable to add it after the transesterification reaction or after the esterification reaction.
また、これらの特定の化合物はポリウレタンアクリレー
ト樹脂、ポリエステルアクリレート樹脂、エポキシアク
リレート樹脂、アクリレート化合物等の放射線硬化型樹
脂の原料の1成分古して用いられることができる。例え
ば、ヒドロキシル基を含有する化合物は直接イソ/アネ
ート化合物、ポリエステルポリオールやアクリレート化
合物と反応させることにより、ポリウレタンアクリレー
ト樹脂を製造することかできる。Moreover, these specific compounds can be used as one of the raw materials for radiation-curable resins such as polyurethane acrylate resins, polyester acrylate resins, epoxy acrylate resins, and acrylate compounds. For example, a compound containing a hydroxyl group can be directly reacted with an iso/anate compound, a polyester polyol, or an acrylate compound to produce a polyurethane acrylate resin.
さらに本発明の特定の化合物のうちジオールをポリウレ
タンアクリレート樹脂の鎖延長剤として、ジカルボン酸
をエポキシアクリレート樹脂の鎖延長剤として、ジオー
ル、ジカルボン酸をポリエステルアクリレート樹脂の鎖
延長剤として使用してもよい。またこれらの特定の化合
物のうち、ジオールのモノ(メタ)アクリレートをポリ
ウレタンアクリレート樹脂の鎖延長剤として、/カルボ
ン酸のモノエチルオキ/(メタ)アクリレートをエボキ
ンアクリレート樹脂の末端停市剤として使用してもよい
。さらに特定の化合物のポリ(メタ)アクリレートをア
クリル系化合物として使用してもよい。Furthermore, among the specific compounds of the present invention, diols may be used as chain extenders for polyurethane acrylate resins, dicarboxylic acids may be used as chain extenders for epoxy acrylate resins, and diols and dicarboxylic acids may be used as chain extenders for polyester acrylate resins. . Among these specific compounds, diol mono(meth)acrylate is used as a chain extender for polyurethane acrylate resin, and carboxylic acid monoethyl oxy/(meth)acrylate is used as a terminal stopper for Evoquin acrylate resin. Good too. Furthermore, a specific compound poly(meth)acrylate may be used as the acrylic compound.
本発明の放射線硬化型樹脂は公知の方法により、アクリ
ル系二、重結合含有化合物と特定の化合物および/また
は特定の化合物と反応させた原料樹脂などを含む原料と
を溶剤中、または無溶剤中で反応させることにより得ら
れる。得られる樹脂の分子隘は500〜100,000
であることが望ましい。The radiation-curable resin of the present invention is produced by mixing an acrylic di- or double-bond-containing compound and a raw material containing a specific compound and/or a raw material resin reacted with a specific compound in a solvent or without a solvent. It can be obtained by reacting with The molecular weight of the resulting resin is 500 to 100,000.
It is desirable that
上記C00Mまたは/およびSO3M化合物で示される
化合物は、樹脂中に化合物として0.5〜30モル%含
まれるように使用するのが適当であり、上記範囲より小
さくなればポリマー及び無機物に対する接着性が低下し
、一方、上記範囲より大きくなれば吸湿性の増大、物理
的特性の低下、熱可塑性樹脂フィルムに対する密着性の
低下τを生し、実用性か少な(なる。It is appropriate to use the above-mentioned C00M or/and SO3M compound in a proportion of 0.5 to 30 mol% as a compound in the resin. On the other hand, if it exceeds the above range, it will result in an increase in hygroscopicity, a decrease in physical properties, and a decrease in adhesion to the thermoplastic resin film τ, making it less practical.
本発明の積層フィルムは、史に積層前及び積層後に、空
気又は窒素雰囲気ドでのコロナ放電処理、紫外線照射処
理なとを行なうことによって更に接着性を向1.させる
ことかできる。The laminated film of the present invention can be further improved in adhesion by performing corona discharge treatment in air or nitrogen atmosphere, ultraviolet irradiation treatment, etc. before and after lamination. I can do it.
1−記の方法によって製造された積層フィルムは、情報
記録用フィルム、包装用フィルム、電気用フィルムその
他の用途のフィルムに使用される。The laminated film produced by the method described in 1- is used as an information recording film, a packaging film, an electrical film, and other films.
とりわけポリエステルフィルムは、磁気記録用ベースフ
ィルム、印写用ベースフィルム、コンデンサー用ベース
フィルム、食品などの包装用フィルム、蒸着用ベースフ
ィルムなどその他の用途に使用される。In particular, polyester films are used for other purposes such as magnetic recording base films, printing base films, capacitor base films, packaging films for foods, etc., and vapor deposition base films.
更にこれらのフィルムに用いられる場合、放射線硬化型
樹脂層には着色剤、制電剤、架橋剤、耐ブロッキング剤
、無機又は有機粒子等の滑剤、紫外線吸収剤、劣化防止
剤その他のものが、本発明の効果を損わない程度に添加
されていてもよい。Furthermore, when used in these films, the radiation-curable resin layer contains colorants, antistatic agents, crosslinking agents, anti-blocking agents, lubricants such as inorganic or organic particles, ultraviolet absorbers, deterioration inhibitors, and other substances. It may be added to an extent that does not impair the effects of the present invention.
着色剤としては水溶性、有機溶剤可溶性及び油溶性染料
、顔料と不溶性染料、顔料か含まれる。Coloring agents include water-soluble, organic solvent-soluble and oil-soluble dyes, pigments and insoluble dyes and pigments.
制電剤としてはアニオン系、ノニオン系、カチオン系の
界面活性剤ポリエーテル基、アニオン基カチオン基な自
ポリマー、金属又は仝属酸化物なとからなる導電性粒子
なとか含まれる架橋剤としてはアクロイル基、アルキカ
ール基、イソ7アナート基、エポキン基、アジリキル基
、(メタ)アクロイル基、アルフキ/アルキル基、なと
活性水素と反応しうる反応基を2側辺1.含す」゛する
化合物が含まれる。Antistatic agents include anionic, nonionic, and cationic surfactants, polyether groups, self-polymers with anionic and cationic groups, and conductive particles made of metals or metal oxides.Crosslinking agents include: Acroyl group, alkical group, iso7anato group, epoquine group, azilkyl group, (meth)acroyl group, alfkyl/alkyl group, etc., and a reactive group that can react with active hydrogen on two sides 1. Includes compounds that contain.
耐ブロッキング剤としては高級脂肪酸、及びその塩、エ
ステルアミド、アミン、鉱油、ンリコーン及びフッ素化
合物なとが含まれる無機又は有機粒子等の滑剤はノリ力
系、炭酸カルシウム系、カオリン系、硫酸バリウム系、
チタン系、タルク系、ベルゾグアナミン、ポリオレフィ
ン系、メラミン系、ポリアクリル酸エステル系、ポリミ
アミド系、ポリエテル系、ポリカーボネート系など含ま
れる。Anti-blocking agents include higher fatty acids and their salts, ester amides, amines, mineral oil, licorice, and fluorine compounds.Lubricants such as inorganic or organic particles include glue-based, calcium carbonate-based, kaolin-based, and barium sulfate-based. ,
Includes titanium-based, talc-based, bersoguanamine, polyolefin-based, melamine-based, polyacrylic ester-based, polyamide-based, polyether-based, polycarbonate-based, etc.
これらは表面処理がなされててもよい粒径は用途により
任意に選択すればよい。These may be surface-treated, and the particle size may be arbitrarily selected depending on the intended use.
紫外線の吸収剤としては、ベンゾフェノン系、サリフル
酸エステル系、トリアゾール系、その他か含まれる。Ultraviolet absorbers include benzophenone, saliflic acid ester, triazole, and others.
劣化防止剤としてはフェノール系、エボキ/系、含硫黄
系、含燐系、含窒素系、及び含金属系、共役結合含有系
、なとか含まれる。Deterioration inhibitors include phenolic, epoxy, sulfur-containing, phosphorus-containing, nitrogen-containing, metal-containing, conjugated bond-containing, and the like.
防・カ剤、難燃剤なとその他のものか含まれる。Contains anti-mosquito agents, flame retardants, and other substances.
特に有機チタネート、自゛機シラン化合物か含イ1され
ると膜強度が向■、するとともに接着性も向上する。In particular, when an organic titanate or an autosilane compound is included, the film strength and adhesion are improved.
史に本発明の樹脂と相溶性のある樹脂としては、塩化ビ
ニル系樹脂、ポリエステル系樹脂、セルロース系樹脂、
アクリル系樹脂、エポキシ樹脂、フェノキシ樹脂、ポリ
ビニルブチラール、アクリロニトリル−ブタジェン八重
合体等が挙げられる。Examples of resins that are compatible with the resin of the present invention include vinyl chloride resins, polyester resins, cellulose resins,
Examples include acrylic resin, epoxy resin, phenoxy resin, polyvinyl butyral, acrylonitrile-butadiene octapolymer, and the like.
しかし、目的によっては」−2以外の樹脂を併用しても
よい。′
川に積層フィルムの放射線硬化型樹脂側に、上記した用
途に使用する前に他の樹脂を積層又はアンカーフートし
て用いてもよい。However, depending on the purpose, resins other than "-2" may be used in combination. ' Other resins may be laminated or anchored onto the radiation-curable resin side of the laminated film before use for the above-mentioned purposes.
−・数式CI)の化合物を共重合した放射線硬化型樹脂
をベースフィルムに積層する方法は、共押出しコート法
、押出しラミネート法、コーティング法、ドライラミネ
ート法、ホットメルト接着法などがあるが、いずれの方
法でも積層する事かできる。もちろん積層前あるいは積
層後に延伸あるいは熱処理しても良いことは明らかであ
る。Methods for laminating a radiation-curable resin copolymerized with the compound of formula CI) on a base film include coextrusion coating, extrusion lamination, coating, dry lamination, and hot melt adhesion. It can also be laminated using the following method. Of course, it is clear that stretching or heat treatment may be performed before or after lamination.
積層する厚みは任意であるが、接着外付tjにはできる
たけ薄い方が好ましいが限定されるものではない。The thickness of the lamination is arbitrary, but is not limited, although it is preferable for the external adhesive tj to be as thin as possible.
また熱可塑性樹脂フィルム上に常法に従って積層後、そ
の積層物を必要によりカレンダー処理してから放射線処
理する。放射線処理後にカレンダー処理することもてき
る。特に、照射する放射線としては、電子線のほかに中
性子線、γ線なとの電離性放射線が使用でき、その照射
量は約1〜10 Mradがよく、特に約2〜8 Mr
adであることが好ましい。After lamination on a thermoplastic resin film according to a conventional method, the laminate is calendered if necessary and then subjected to radiation treatment. Calendar treatment can also be performed after radiation treatment. In particular, as the radiation to be irradiated, in addition to electron beams, ionizing radiation such as neutron beams and gamma rays can be used, and the irradiation dose is preferably about 1 to 10 Mrad, particularly about 2 to 8 Mrad.
It is preferable that it is ad.
(作用)
本発明ではカルボキシル基および/またはスルホン酸基
を含有する化合物を反応させた放射線硬化型樹脂を積層
樹脂の少なくとも ・成分として用いることにより親水
性ポリマー、疎水性ポリマー及び無機物に対して共に良
好な接着性を付りする事かできる。(Function) In the present invention, by using a radiation-curable resin reacted with a compound containing a carboxyl group and/or a sulfonic acid group as at least one component of the laminated resin, it is possible to cure both hydrophilic polymers, hydrophobic polymers, and inorganic substances. It can provide good adhesion.
(実施例)
以ド、本発明を実施例によって具体的に説明する実施例
中型に部とあるのは小川部を示す。(Example) Hereinafter, the present invention will be explained in detail with reference to Examples.
実施例1
温度計、撹拌機を具備したオートクレーブ中に、ジメチ
ルテレフタレート485部、/メチルイソフタレート4
85部、エチレングリコール409部、ネオペンチルグ
リコール485部およびテトラブトキシチタネート0.
68部を仕込み、150〜230℃で120分間加熱し
エステル交換を行い、次いで5スルホイソフタル酸ナト
リウム50.1部を仕込み、220〜230℃で川に1
時間反応を行った。次いて反応系を30分間で250℃
までW温し、系の圧力を徐々に減し45分後に10mm
1gとし、この条件で更に60分間反応を続けた。得ら
れたポリエステルフィルム分−f−量は2500であっ
た。Example 1 In an autoclave equipped with a thermometer and a stirrer, 485 parts of dimethyl terephthalate and 4 parts of methyl isophthalate were added.
85 parts, 409 parts of ethylene glycol, 485 parts of neopentyl glycol, and 0.85 parts of tetrabutoxy titanate.
68 parts were charged and heated at 150 to 230°C for 120 minutes to perform transesterification, then 50.1 parts of sodium 5-sulfoisophthalate was charged, and 1 part was heated at 220 to 230°C to a river.
A time reaction was performed. The reaction system was then heated to 250°C for 30 minutes.
The pressure of the system was gradually reduced to 10 mm after 45 minutes.
The reaction was continued under these conditions for an additional 60 minutes. The amount of the obtained polyester film was 2,500.
史にトルエン72部、メチルエチルケト772部、ポリ
エステルジオールA100部を溶解後、4.4′−ジフ
ェニルメタンジイソ7アネート21部およびノブチル錫
ンラウレート0.05部を仕込み、70〜80℃で3時
間反応させた。After dissolving 72 parts of toluene, 772 parts of methyl ethyl ketone, and 100 parts of polyester diol A in a solution, 21 parts of 4,4'-diphenylmethane diiso7anate and 0.05 parts of butyltin laurate were added, and the mixture was reacted at 70 to 80°C for 3 hours. Ta.
更にペンタエリスリトールトリアクリレート15部を加
え、70〜80℃で2時間反応させ、さらに2−メチル
−2ジメチルアミノ−1,3−プロパンジオール7.1
部を加え、さらに5時間反応させ固形分濃度40重量%
のポリウレタンアクリレート樹脂溶液を得た。ポリウレ
タンアクリレート樹脂Aの分子量は15000であった
。Furthermore, 15 parts of pentaerythritol triacrylate was added, and the reaction was carried out at 70 to 80°C for 2 hours, and further 7.1 parts of 2-methyl-2dimethylamino-1,3-propanediol was added.
20% by weight and further reacted for 5 hours until the solid content concentration was 40% by weight.
A polyurethane acrylate resin solution was obtained. The molecular weight of polyurethane acrylate resin A was 15,000.
更に、トルエン/メチルエチルケトン(50150)の
混合溶液で希釈して固形分濃度5重量%とし、エアーナ
イフ方式でポリエステルフィルムに塗布し120℃で乾
燥したコート@0.3g/I/のコーティングポリエス
テルフィルムを、5Mradの放射線処理を行なった。Further, a coated polyester film of 0.3 g/I/ was diluted with a mixed solution of toluene/methyl ethyl ketone (50150) to give a solid content concentration of 5% by weight, applied to a polyester film using an air knife method, and dried at 120°C. , 5 Mrad radiation treatment was performed.
ホIJマーの接着性は■のポリビニルアルコール、■ポ
リカーボネート、■アルコールtiJ溶性ナイロン、■
ゼラチン、■セルロースアセテートブチレートに相溶性
の良い赤色染料を添加したものを厚み3μになるように
塗4」シ、ニチノ・/製セロテープを貼付しハクリ角度
か180°になるようにして剥離した。全くハクリのな
いものをlO1半分ハクリしたものを5、全曲ハクリし
たものを1としてランク付した。The adhesive properties of HoIJmer are ■Polyvinyl alcohol, ■Polycarbonate, ■Alcohol tiJ-soluble nylon, ■
Gelatin, ■Cellulose acetate butyrate with a red dye that is highly compatible, was applied to a thickness of 3 μm.Nichino Co., Ltd. sellotape was applied and peeled off at a peeling angle of 180°. . Those with no peeling at all were ranked as 5, those with half of 1O1 peeled off, and those with all peeled off as 1.
金属の接着性は、これらのフィルムにアルミニウムを蒸
着したものを100℃で30分間浸漬したのち取り出し
、この蒸着面にに記テープを圧着し急速に剥離するテス
トを10回繰返し行ない1−記と同様の評価をした。The adhesion of metals was tested by immersing these films with aluminum vapor-deposited at 100°C for 30 minutes, taking them out, pressing the tape shown on the vapor-deposited surface, and rapidly peeling off the film 10 times. I gave a similar evaluation.
磁性剤の接着性はγ−Fe20:I微分末粒−r250
部、ジオクチルスルホネート2部、共重合ポリエステル
(テレフタル1!45モル%、イソフタル酸20モル%
、セパ77M32.5モル%、5ナトリウムスルホイソ
フタル酸2.5モル%、エチレングリコール50モル%
、ネオペンチルグリコール50モル%)48部およびセ
ロツルブアセテ−トロ00部をボールミルを用いて約2
4時間混合した。この混合物400部に共重合ポリエス
テル4!脂100 部、ニトロセルロース30部、塩化
ビニル−酢酸ビニル共重合体70部、ボリイソンアネー
ト30部およびメチルエチルケトン400部、ンクロヘ
キサン400 ffi<を加え再びボールミルを用いて
約70時間混合したものを磁性層厚み2μになるように
1−1記フイルムにコートした。The adhesiveness of the magnetic agent is γ-Fe20:I differential powder-r250
part, 2 parts of dioctyl sulfonate, copolymerized polyester (terephthal 1!45 mol%, isophthalic acid 20 mol%
, Sepa 77M 32.5 mol%, pentasodium sulfoisophthalic acid 2.5 mol%, ethylene glycol 50 mol%
, 48 parts of neopentyl glycol (50 mol%) and 00 parts of cellotrub acetate were mixed using a ball mill to about 2
Mixed for 4 hours. Copolymerized polyester 4! to 400 parts of this mixture! 100 parts of fat, 30 parts of nitrocellulose, 70 parts of vinyl chloride-vinyl acetate copolymer, 30 parts of voriison anate, 400 parts of methyl ethyl ketone, and 400 parts of nclohexane were added and mixed again using a ball mill for about 70 hours. The film described in 1-1 was coated to a layer thickness of 2 μm.
更に、100個にクロスカプトした磁性層の表面に粘着
テープを貼りつけ、全面に均一に接着させたのち瞬間的
に5回繰返し引き剥がした時の状態を観察した。数値は
残存個数を示す。Further, an adhesive tape was attached to the surface of the 100 cross-captured magnetic layer, and after uniformly adhering to the entire surface, the state was observed when it was instantly peeled off five times. The numerical value indicates the remaining number.
比較例1
′実施例1において放射線硬化型樹脂中のポリエステル
共重合体組成分か酸成分としてテレフタル酸35モル%
、イソフタル酸35モル%、アンピン酸30モル%、グ
リコール成分としてエチレングリコール50モル%、ネ
オペンチルグリコール50モル%にしてトルエン/メチ
ルエチルケトン(50vt%150vt%)に溶解した
以外は、実施例1と同様にしてコーティングポリエステ
ルフィルムを得た。Comparative Example 1 'In Example 1, 35 mol% of terephthalic acid was used as the acid component in the polyester copolymer composition in the radiation-curable resin.
Same as Example 1 except that 35 mol% of isophthalic acid, 30 mol% of ampic acid, 50 mol% of ethylene glycol and 50 mol% of neopentyl glycol as glycol components were dissolved in toluene/methyl ethyl ketone (50 vt%, 150 vt%). A coated polyester film was obtained.
比較例2 未コーティ/グポリエステルフィルムを供した。Comparative example 2 An uncoated/uncoated polyester film was provided.
表−1
本発明は比較例に比べて良好な接着性を有している事が
わかる。Table 1 It can be seen that the present invention has better adhesiveness than the comparative example.
実施例2
酸成分として、テレフタル酸70モル%、イソフタル酸
25モル%、アジピノ酸5モル%、グリコール成分トし
てエチレングリコール70モル%、ンエ千レンゲリコー
ル26モル%、ノアミノプロピオン酸4モル%よりなる
ポリエステル共重合体を実施例1と同様にして、放射線
硬化型樹脂溶液を作成型に溶剤を溜去し、該樹脂の粒状
を得た。Example 2 Acid components include 70 mol% of terephthalic acid, 25 mol% of isophthalic acid, 5 mol% of adipine acid, and glycol components include 70 mol% of ethylene glycol, 26 mol% of glycol, and 4 mol of noaminopropionic acid. A radiation-curable resin solution was prepared in the same manner as in Example 1, and the solvent was distilled off in a mold to obtain particles of the resin.
ト記重合体300部と11−ブチルセロ゛ノルブ140
部とを容器中で150〜170℃、約3時間撹拌して、
均・にして粘稠な溶融液を得、この溶融液に水560部
を徐々に添加し約1時間後に均一な淡白色の固形分濃度
30%の水分散液を得た。300 parts of the above polymer and 140 parts of 11-butylcellonorb
part and stirred in a container at 150-170°C for about 3 hours,
A homogeneous and viscous melt was obtained, and 560 parts of water was gradually added to this melt, and after about 1 hour, a uniform pale white aqueous dispersion having a solid content concentration of 30% was obtained.
史に水4500部エチルアルコール4500部を加えて
希釈し、固形分濃度3%の塗布液を得た。The solution was diluted by adding 4,500 parts of water and 4,500 parts of ethyl alcohol to obtain a coating solution with a solid content concentration of 3%.
この塗布液を、未延伸ポリエステルフィルムに固形分厚
み1 g / tn’になる様に塗布し、縦方向に90
℃で3.5倍延伸し、引継いて120℃で横方向に3.
4倍延伸し、210℃で熱処理し、コート厚みO,1g
/m’ベース層50μのポリエステルフィルムを5 M
radの放射線処理を行なった。This coating solution was applied to an unstretched polyester film to a solid content thickness of 1 g/tn',
It was stretched 3.5 times at 120°C, and then stretched 3.5 times in the transverse direction at 120°C.
Stretched 4 times, heat treated at 210℃, coat thickness O, 1g
/m' base layer 50μ polyester film 5M
rad radiation treatment was performed.
つづいてA−1キユアKK赤(永瀬スクリーン社製)を
印刷厚みlO〜l 511になるようにスクリーン印刷
しUV照射装置を用い積算照射エネルギー1500aJ
/c+1tで照射を什なった。Next, screen printed A-1 Kyua KK Red (manufactured by Nagase Screen Co., Ltd.) to a printing thickness of 10 to 511 cm, and used a UV irradiation device with an integrated irradiation energy of 1500 aJ.
Irradiation was completed at /c+1t.
この印刷面にlOOケのゴバント1をつけ、セロテープ
剥離テストを行なった結果、全く剥離しなかった。When Govant 1 of 100 grams was applied to this printed surface and a cellophane tape peeling test was performed, no peeling occurred.
(発明の効果)
本発明は、親水性ポリマー及び疎水性ポリマーとの接綺
性か良好であり、包装用及び工業用として有用なフィル
ムであることかわかる。(Effects of the Invention) It can be seen that the film of the present invention has good adhesive properties with hydrophilic polymers and hydrophobic polymers, and is useful for packaging and industrial purposes.
Claims (1)
キシル基および/またはスルホン基含有化合物を1種以
上反応させた放射線硬化型樹脂が、積層樹脂の少なくと
も一成分として積層されてなる熱可塑性樹脂フィルム積
層物。1) A thermoplastic resin film laminate in which a radiation-curable resin made by reacting one or more carboxyl group- and/or sulfone group-containing compounds on at least one side of a thermoplastic resin film is laminated as at least one component of the laminate resin. .
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP33108890A JPH04197631A (en) | 1990-11-28 | 1990-11-28 | Laminated matter of thermoplastic resin film |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP33108890A JPH04197631A (en) | 1990-11-28 | 1990-11-28 | Laminated matter of thermoplastic resin film |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH04197631A true JPH04197631A (en) | 1992-07-17 |
Family
ID=18239721
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP33108890A Pending JPH04197631A (en) | 1990-11-28 | 1990-11-28 | Laminated matter of thermoplastic resin film |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH04197631A (en) |
-
1990
- 1990-11-28 JP JP33108890A patent/JPH04197631A/en active Pending
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