JPH01114437A - Laminate of resin films - Google Patents
Laminate of resin filmsInfo
- Publication number
- JPH01114437A JPH01114437A JP27393087A JP27393087A JPH01114437A JP H01114437 A JPH01114437 A JP H01114437A JP 27393087 A JP27393087 A JP 27393087A JP 27393087 A JP27393087 A JP 27393087A JP H01114437 A JPH01114437 A JP H01114437A
- Authority
- JP
- Japan
- Prior art keywords
- group
- resin
- film
- tables
- formulas
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000011347 resin Substances 0.000 title claims abstract description 69
- 229920005989 resin Polymers 0.000 title claims abstract description 69
- 239000000126 substance Substances 0.000 claims abstract description 12
- 125000002947 alkylene group Chemical group 0.000 claims abstract description 7
- 150000001340 alkali metals Chemical group 0.000 claims abstract description 6
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 claims abstract description 4
- 125000000217 alkyl group Chemical group 0.000 claims abstract description 4
- 229910052799 carbon Inorganic materials 0.000 claims abstract description 4
- 125000000524 functional group Chemical group 0.000 claims abstract description 4
- 125000001183 hydrocarbyl group Chemical group 0.000 claims abstract 3
- 150000003018 phosphorus compounds Chemical class 0.000 claims description 12
- 125000004432 carbon atom Chemical group C* 0.000 claims description 8
- 229910052783 alkali metal Inorganic materials 0.000 claims description 5
- 125000003118 aryl group Chemical group 0.000 claims description 5
- 125000004435 hydrogen atom Chemical class [H]* 0.000 claims description 5
- 125000003277 amino group Chemical group 0.000 claims description 4
- 125000000732 arylene group Chemical group 0.000 claims description 4
- 125000002993 cycloalkylene group Chemical group 0.000 claims description 4
- 125000004104 aryloxy group Chemical group 0.000 claims description 3
- 229910052739 hydrogen Inorganic materials 0.000 claims description 3
- 239000001257 hydrogen Substances 0.000 claims description 3
- 125000002887 hydroxy group Chemical group [H]O* 0.000 claims description 3
- 125000003545 alkoxy group Chemical group 0.000 claims description 2
- 125000000753 cycloalkyl group Chemical group 0.000 claims description 2
- 125000005843 halogen group Chemical group 0.000 claims description 2
- 125000000000 cycloalkoxy group Chemical group 0.000 claims 1
- 238000000034 method Methods 0.000 abstract description 24
- 229910052751 metal Inorganic materials 0.000 abstract description 12
- 239000002184 metal Substances 0.000 abstract description 12
- 229920006267 polyester film Polymers 0.000 abstract description 10
- 238000000576 coating method Methods 0.000 abstract description 9
- 238000006243 chemical reaction Methods 0.000 abstract description 8
- 239000011248 coating agent Substances 0.000 abstract description 8
- 229920001477 hydrophilic polymer Polymers 0.000 abstract description 6
- 229920001600 hydrophobic polymer Polymers 0.000 abstract description 6
- LYCAIKOWRPUZTN-UHFFFAOYSA-N Ethylene glycol Chemical compound OCCO LYCAIKOWRPUZTN-UHFFFAOYSA-N 0.000 description 20
- 229910052698 phosphorus Inorganic materials 0.000 description 20
- 239000011574 phosphorus Substances 0.000 description 18
- 150000001875 compounds Chemical class 0.000 description 15
- -1 polypropylene Polymers 0.000 description 15
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 12
- 239000010410 layer Substances 0.000 description 12
- 239000002585 base Substances 0.000 description 11
- 229920000728 polyester Polymers 0.000 description 11
- OAICVXFJPJFONN-UHFFFAOYSA-N Phosphorus Chemical compound [P] OAICVXFJPJFONN-UHFFFAOYSA-N 0.000 description 10
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 9
- 239000004814 polyurethane Substances 0.000 description 9
- 229920002635 polyurethane Polymers 0.000 description 9
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 8
- 150000002739 metals Chemical class 0.000 description 8
- 229920000642 polymer Polymers 0.000 description 8
- 239000004925 Acrylic resin Substances 0.000 description 7
- KKEYFWRCBNTPAC-UHFFFAOYSA-N Terephthalic acid Chemical compound OC(=O)C1=CC=C(C(O)=O)C=C1 KKEYFWRCBNTPAC-UHFFFAOYSA-N 0.000 description 6
- QQVIHTHCMHWDBS-UHFFFAOYSA-N isophthalic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1 QQVIHTHCMHWDBS-UHFFFAOYSA-N 0.000 description 6
- 239000002253 acid Substances 0.000 description 5
- 239000003795 chemical substances by application Substances 0.000 description 5
- 150000002009 diols Chemical class 0.000 description 5
- 238000010030 laminating Methods 0.000 description 5
- 230000005855 radiation Effects 0.000 description 5
- 239000007787 solid Substances 0.000 description 5
- 239000000243 solution Substances 0.000 description 5
- 239000004970 Chain extender Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- WNLRTRBMVRJNCN-UHFFFAOYSA-N adipic acid Chemical compound OC(=O)CCCCC(O)=O WNLRTRBMVRJNCN-UHFFFAOYSA-N 0.000 description 4
- MTHSVFCYNBDYFN-UHFFFAOYSA-N diethylene glycol Chemical compound OCCOCCO MTHSVFCYNBDYFN-UHFFFAOYSA-N 0.000 description 4
- WGCNASOHLSPBMP-UHFFFAOYSA-N hydroxyacetaldehyde Natural products OCC=O WGCNASOHLSPBMP-UHFFFAOYSA-N 0.000 description 4
- 239000000203 mixture Substances 0.000 description 4
- 229920002647 polyamide Polymers 0.000 description 4
- 239000011734 sodium Substances 0.000 description 4
- 239000002904 solvent Substances 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- 239000004952 Polyamide Substances 0.000 description 3
- 150000001252 acrylic acid derivatives Chemical class 0.000 description 3
- 239000000654 additive Substances 0.000 description 3
- 230000000052 comparative effect Effects 0.000 description 3
- 238000003851 corona treatment Methods 0.000 description 3
- 150000001991 dicarboxylic acids Chemical class 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 150000002148 esters Chemical class 0.000 description 3
- 235000013305 food Nutrition 0.000 description 3
- 229910010272 inorganic material Inorganic materials 0.000 description 3
- 239000011147 inorganic material Substances 0.000 description 3
- 238000003475 lamination Methods 0.000 description 3
- 239000002245 particle Substances 0.000 description 3
- 125000004437 phosphorous atom Chemical group 0.000 description 3
- 239000004417 polycarbonate Substances 0.000 description 3
- 229920000515 polycarbonate Polymers 0.000 description 3
- 239000004645 polyester resin Substances 0.000 description 3
- 239000002994 raw material Substances 0.000 description 3
- 229920005992 thermoplastic resin Polymers 0.000 description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 3
- NIXOWILDQLNWCW-UHFFFAOYSA-N 2-Propenoic acid Natural products OC(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 2
- VTYYLEPIZMXCLO-UHFFFAOYSA-L Calcium carbonate Chemical compound [Ca+2].[O-]C([O-])=O VTYYLEPIZMXCLO-UHFFFAOYSA-L 0.000 description 2
- 229920000298 Cellophane Polymers 0.000 description 2
- LFQSCWFLJHTTHZ-UHFFFAOYSA-N Ethanol Chemical compound CCO LFQSCWFLJHTTHZ-UHFFFAOYSA-N 0.000 description 2
- 239000004695 Polyether sulfone Substances 0.000 description 2
- 239000004697 Polyetherimide Substances 0.000 description 2
- 239000004721 Polyphenylene oxide Substances 0.000 description 2
- 239000004734 Polyphenylene sulfide Substances 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 2
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 2
- 150000007513 acids Chemical class 0.000 description 2
- 239000002390 adhesive tape Substances 0.000 description 2
- 235000011037 adipic acid Nutrition 0.000 description 2
- 239000001361 adipic acid Substances 0.000 description 2
- 125000000129 anionic group Chemical group 0.000 description 2
- 239000002216 antistatic agent Substances 0.000 description 2
- TZCXTZWJZNENPQ-UHFFFAOYSA-L barium sulfate Chemical compound [Ba+2].[O-]S([O-])(=O)=O TZCXTZWJZNENPQ-UHFFFAOYSA-L 0.000 description 2
- 239000002981 blocking agent Substances 0.000 description 2
- 229920001577 copolymer Polymers 0.000 description 2
- 239000003431 cross linking reagent Substances 0.000 description 2
- 230000003247 decreasing effect Effects 0.000 description 2
- WOZVHXUHUFLZGK-UHFFFAOYSA-N dimethyl terephthalate Chemical compound COC(=O)C1=CC=C(C(=O)OC)C=C1 WOZVHXUHUFLZGK-UHFFFAOYSA-N 0.000 description 2
- WJJMNDUMQPNECX-UHFFFAOYSA-N dipicolinic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=N1 WJJMNDUMQPNECX-UHFFFAOYSA-N 0.000 description 2
- 208000028659 discharge Diseases 0.000 description 2
- 239000006185 dispersion Substances 0.000 description 2
- 239000000975 dye Substances 0.000 description 2
- 235000019441 ethanol Nutrition 0.000 description 2
- 150000002430 hydrocarbons Chemical group 0.000 description 2
- 239000003112 inhibitor Substances 0.000 description 2
- 239000010954 inorganic particle Substances 0.000 description 2
- 239000000314 lubricant Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 229910044991 metal oxide Inorganic materials 0.000 description 2
- 150000004706 metal oxides Chemical class 0.000 description 2
- 239000012299 nitrogen atmosphere Substances 0.000 description 2
- 239000011146 organic particle Substances 0.000 description 2
- 229920006280 packaging film Polymers 0.000 description 2
- 239000012785 packaging film Substances 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
- 238000001782 photodegradation Methods 0.000 description 2
- SIOXPEMLGUPBBT-UHFFFAOYSA-N picolinic acid Chemical compound OC(=O)C1=CC=CC=N1 SIOXPEMLGUPBBT-UHFFFAOYSA-N 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- 229920006289 polycarbonate film Polymers 0.000 description 2
- 229920001225 polyester resin Polymers 0.000 description 2
- 229920000570 polyether Polymers 0.000 description 2
- 229920006393 polyether sulfone Polymers 0.000 description 2
- 229920001601 polyetherimide Polymers 0.000 description 2
- 229920005862 polyol Polymers 0.000 description 2
- 150000003077 polyols Chemical class 0.000 description 2
- 229920000069 polyphenylene sulfide Polymers 0.000 description 2
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 2
- CXMXRPHRNRROMY-UHFFFAOYSA-N sebacic acid Chemical compound OC(=O)CCCCCCCCC(O)=O CXMXRPHRNRROMY-UHFFFAOYSA-N 0.000 description 2
- JHPBZFOKBAGZBL-UHFFFAOYSA-N (3-hydroxy-2,2,4-trimethylpentyl) 2-methylprop-2-enoate Chemical compound CC(C)C(O)C(C)(C)COC(=O)C(C)=C JHPBZFOKBAGZBL-UHFFFAOYSA-N 0.000 description 1
- RBNPOMFGQQGHHO-UHFFFAOYSA-N -2,3-Dihydroxypropanoic acid Natural products OCC(O)C(O)=O RBNPOMFGQQGHHO-UHFFFAOYSA-N 0.000 description 1
- PPHIIIRFJKDTLG-UHFFFAOYSA-N 1-pyridin-2-ylethanol Chemical compound CC(O)C1=CC=CC=N1 PPHIIIRFJKDTLG-UHFFFAOYSA-N 0.000 description 1
- LLTJGWVOZAZTTI-UHFFFAOYSA-N 1-pyridin-2-ylpropane-1,1-diol Chemical compound CCC(O)(O)C1=CC=CC=N1 LLTJGWVOZAZTTI-UHFFFAOYSA-N 0.000 description 1
- PTBDIHRZYDMNKB-UHFFFAOYSA-N 2,2-Bis(hydroxymethyl)propionic acid Chemical compound OCC(C)(CO)C(O)=O PTBDIHRZYDMNKB-UHFFFAOYSA-N 0.000 description 1
- KKTUQAYCCLMNOA-UHFFFAOYSA-N 2,3-diaminobenzoic acid Chemical compound NC1=CC=CC(C(O)=O)=C1N KKTUQAYCCLMNOA-UHFFFAOYSA-N 0.000 description 1
- SLJZUKLGAWYGIF-UHFFFAOYSA-N 2,5-dihydroxybenzenesulfonic acid;sodium Chemical compound [Na].OC1=CC=C(O)C(S(O)(=O)=O)=C1 SLJZUKLGAWYGIF-UHFFFAOYSA-N 0.000 description 1
- ZRPKEUVFESZUKX-UHFFFAOYSA-N 2-(2-hydroxyethoxy)benzoic acid Chemical compound OCCOC1=CC=CC=C1C(O)=O ZRPKEUVFESZUKX-UHFFFAOYSA-N 0.000 description 1
- SMZOUWXMTYCWNB-UHFFFAOYSA-N 2-(2-methoxy-5-methylphenyl)ethanamine Chemical compound COC1=CC=C(C)C=C1CCN SMZOUWXMTYCWNB-UHFFFAOYSA-N 0.000 description 1
- POAOYUHQDCAZBD-UHFFFAOYSA-N 2-butoxyethanol Chemical compound CCCCOCCO POAOYUHQDCAZBD-UHFFFAOYSA-N 0.000 description 1
- YZTJKOLMWJNVFH-UHFFFAOYSA-N 2-sulfobenzene-1,3-dicarboxylic acid Chemical compound OC(=O)C1=CC=CC(C(O)=O)=C1S(O)(=O)=O YZTJKOLMWJNVFH-UHFFFAOYSA-N 0.000 description 1
- VTSFNCCQCOEPKF-UHFFFAOYSA-N 3-amino-1h-pyridin-2-one Chemical compound NC1=CC=CN=C1O VTSFNCCQCOEPKF-UHFFFAOYSA-N 0.000 description 1
- PECYZEOJVXMISF-UHFFFAOYSA-N 3-aminoalanine Chemical compound [NH3+]CC(N)C([O-])=O PECYZEOJVXMISF-UHFFFAOYSA-N 0.000 description 1
- GZVHEAJQGPRDLQ-UHFFFAOYSA-N 6-phenyl-1,3,5-triazine-2,4-diamine Chemical compound NC1=NC(N)=NC(C=2C=CC=CC=2)=N1 GZVHEAJQGPRDLQ-UHFFFAOYSA-N 0.000 description 1
- HRPVXLWXLXDGHG-UHFFFAOYSA-N Acrylamide Chemical compound NC(=O)C=C HRPVXLWXLXDGHG-UHFFFAOYSA-N 0.000 description 1
- 229920000178 Acrylic resin Polymers 0.000 description 1
- 239000005995 Aluminium silicate Substances 0.000 description 1
- KXDHJXZQYSOELW-UHFFFAOYSA-N Carbamic acid Chemical class NC(O)=O KXDHJXZQYSOELW-UHFFFAOYSA-N 0.000 description 1
- 229920001634 Copolyester Polymers 0.000 description 1
- XDTMQSROBMDMFD-UHFFFAOYSA-N Cyclohexane Chemical compound C1CCCCC1 XDTMQSROBMDMFD-UHFFFAOYSA-N 0.000 description 1
- RBNPOMFGQQGHHO-UWTATZPHSA-N D-glyceric acid Chemical compound OC[C@@H](O)C(O)=O RBNPOMFGQQGHHO-UWTATZPHSA-N 0.000 description 1
- 239000004606 Fillers/Extenders Substances 0.000 description 1
- WSFSSNUMVMOOMR-UHFFFAOYSA-N Formaldehyde Chemical compound O=C WSFSSNUMVMOOMR-UHFFFAOYSA-N 0.000 description 1
- 108010010803 Gelatin Proteins 0.000 description 1
- DGAQECJNVWCQMB-PUAWFVPOSA-M Ilexoside XXIX Chemical compound C[C@@H]1CC[C@@]2(CC[C@@]3(C(=CC[C@H]4[C@]3(CC[C@@H]5[C@@]4(CC[C@@H](C5(C)C)OS(=O)(=O)[O-])C)C)[C@@H]2[C@]1(C)O)C)C(=O)O[C@H]6[C@@H]([C@H]([C@@H]([C@H](O6)CO)O)O)O.[Na+] DGAQECJNVWCQMB-PUAWFVPOSA-M 0.000 description 1
- 229920000877 Melamine resin Polymers 0.000 description 1
- CERQOIWHTDAKMF-UHFFFAOYSA-N Methacrylic acid Chemical compound CC(=C)C(O)=O CERQOIWHTDAKMF-UHFFFAOYSA-N 0.000 description 1
- 239000000020 Nitrocellulose Substances 0.000 description 1
- 239000004677 Nylon Substances 0.000 description 1
- 240000007594 Oryza sativa Species 0.000 description 1
- 235000007164 Oryza sativa Nutrition 0.000 description 1
- 239000004743 Polypropylene Substances 0.000 description 1
- 239000004372 Polyvinyl alcohol Substances 0.000 description 1
- JUJWROOIHBZHMG-UHFFFAOYSA-N Pyridine Chemical group C1=CC=NC=C1 JUJWROOIHBZHMG-UHFFFAOYSA-N 0.000 description 1
- 229920002125 Sokalan® Polymers 0.000 description 1
- NINIDFKCEFEMDL-UHFFFAOYSA-N Sulfur Chemical compound [S] NINIDFKCEFEMDL-UHFFFAOYSA-N 0.000 description 1
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 1
- 229920002433 Vinyl chloride-vinyl acetate copolymer Polymers 0.000 description 1
- HVVWZTWDBSEWIH-UHFFFAOYSA-N [2-(hydroxymethyl)-3-prop-2-enoyloxy-2-(prop-2-enoyloxymethyl)propyl] prop-2-enoate Chemical compound C=CC(=O)OCC(CO)(COC(=O)C=C)COC(=O)C=C HVVWZTWDBSEWIH-UHFFFAOYSA-N 0.000 description 1
- UKLDJPRMSDWDSL-UHFFFAOYSA-L [dibutyl(dodecanoyloxy)stannyl] dodecanoate Chemical compound CCCCCCCCCCCC(=O)O[Sn](CCCC)(CCCC)OC(=O)CCCCCCCCCCC UKLDJPRMSDWDSL-UHFFFAOYSA-L 0.000 description 1
- 239000006096 absorbing agent Substances 0.000 description 1
- 125000003647 acryloyl group Chemical group O=C([*])C([H])=C([H])[H] 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 239000003513 alkali Substances 0.000 description 1
- 125000004183 alkoxy alkyl group Chemical group 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 235000012211 aluminium silicate Nutrition 0.000 description 1
- 150000001408 amides Chemical class 0.000 description 1
- 150000001412 amines Chemical class 0.000 description 1
- 150000003927 aminopyridines Chemical class 0.000 description 1
- 239000003945 anionic surfactant Substances 0.000 description 1
- 125000003710 aryl alkyl group Chemical group 0.000 description 1
- 125000004045 azirinyl group Chemical group 0.000 description 1
- RWCCWEUUXYIKHB-UHFFFAOYSA-N benzophenone Chemical compound C=1C=CC=CC=1C(=O)C1=CC=CC=C1 RWCCWEUUXYIKHB-UHFFFAOYSA-N 0.000 description 1
- 239000012965 benzophenone Substances 0.000 description 1
- 229910000019 calcium carbonate Inorganic materials 0.000 description 1
- 238000003490 calendering Methods 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- BVKZGUZCCUSVTD-UHFFFAOYSA-N carbonic acid Chemical class OC(O)=O BVKZGUZCCUSVTD-UHFFFAOYSA-N 0.000 description 1
- 125000002091 cationic group Chemical group 0.000 description 1
- 239000003093 cationic surfactant Chemical group 0.000 description 1
- 229920006217 cellulose acetate butyrate Polymers 0.000 description 1
- 239000012461 cellulose resin Substances 0.000 description 1
- 239000011247 coating layer Substances 0.000 description 1
- 239000003086 colorant Substances 0.000 description 1
- 239000000470 constituent Substances 0.000 description 1
- 230000001186 cumulative effect Effects 0.000 description 1
- 238000001723 curing Methods 0.000 description 1
- 239000012975 dibutyltin dilaurate Substances 0.000 description 1
- 235000014113 dietary fatty acids Nutrition 0.000 description 1
- 238000007865 diluting Methods 0.000 description 1
- VNGOYPQMJFJDLV-UHFFFAOYSA-N dimethyl benzene-1,3-dicarboxylate Chemical compound COC(=O)C1=CC=CC(C(=O)OC)=C1 VNGOYPQMJFJDLV-UHFFFAOYSA-N 0.000 description 1
- 238000009820 dry lamination Methods 0.000 description 1
- 238000010894 electron beam technology Methods 0.000 description 1
- 125000003700 epoxy group Chemical group 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005886 esterification reaction Methods 0.000 description 1
- RTZKZFJDLAIYFH-UHFFFAOYSA-N ether Substances CCOCC RTZKZFJDLAIYFH-UHFFFAOYSA-N 0.000 description 1
- 230000001747 exhibiting effect Effects 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 239000000194 fatty acid Substances 0.000 description 1
- 229930195729 fatty acid Natural products 0.000 description 1
- 150000004665 fatty acids Chemical class 0.000 description 1
- 239000003063 flame retardant Substances 0.000 description 1
- 150000002222 fluorine compounds Chemical class 0.000 description 1
- 235000019256 formaldehyde Nutrition 0.000 description 1
- 229920000159 gelatin Polymers 0.000 description 1
- 239000008273 gelatin Substances 0.000 description 1
- 235000019322 gelatine Nutrition 0.000 description 1
- 235000011852 gelatine desserts Nutrition 0.000 description 1
- 239000008187 granular material Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012793 heat-sealing layer Substances 0.000 description 1
- 239000012943 hotmelt Substances 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 239000000976 ink Substances 0.000 description 1
- 229920000592 inorganic polymer Polymers 0.000 description 1
- 125000001261 isocyanato group Chemical group *N=C=O 0.000 description 1
- NLYAJNPCOHFWQQ-UHFFFAOYSA-N kaolin Chemical compound O.O.O=[Al]O[Si](=O)O[Si](=O)O[Al]=O NLYAJNPCOHFWQQ-UHFFFAOYSA-N 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 239000000696 magnetic material Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000006224 matting agent Substances 0.000 description 1
- JDSHMPZPIAZGSV-UHFFFAOYSA-N melamine Chemical compound NC1=NC(N)=NC(N)=N1 JDSHMPZPIAZGSV-UHFFFAOYSA-N 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- FQPSGWSUVKBHSU-UHFFFAOYSA-N methacrylamide Chemical compound CC(=C)C(N)=O FQPSGWSUVKBHSU-UHFFFAOYSA-N 0.000 description 1
- 239000002480 mineral oil Substances 0.000 description 1
- 239000011259 mixed solution Substances 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- SLCVBVWXLSEKPL-UHFFFAOYSA-N neopentyl glycol Chemical compound OCC(C)(C)CO SLCVBVWXLSEKPL-UHFFFAOYSA-N 0.000 description 1
- 125000001971 neopentyl group Chemical group [H]C([*])([H])C(C([H])([H])[H])(C([H])([H])[H])C([H])([H])[H] 0.000 description 1
- 229920001220 nitrocellulos Polymers 0.000 description 1
- QJGQUHMNIGDVPM-UHFFFAOYSA-N nitrogen group Chemical group [N] QJGQUHMNIGDVPM-UHFFFAOYSA-N 0.000 description 1
- 239000002736 nonionic surfactant Chemical group 0.000 description 1
- 229920001778 nylon Polymers 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000013034 phenoxy resin Substances 0.000 description 1
- 229920006287 phenoxy resin Polymers 0.000 description 1
- 238000000016 photochemical curing Methods 0.000 description 1
- 239000003504 photosensitizing agent Substances 0.000 description 1
- 230000000704 physical effect Effects 0.000 description 1
- 229940081066 picolinic acid Drugs 0.000 description 1
- 229920002037 poly(vinyl butyral) polymer Polymers 0.000 description 1
- 239000004584 polyacrylic acid Substances 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920000139 polyethylene terephthalate Polymers 0.000 description 1
- 239000005020 polyethylene terephthalate Substances 0.000 description 1
- 229920001228 polyisocyanate Polymers 0.000 description 1
- 239000005056 polyisocyanate Substances 0.000 description 1
- 238000006116 polymerization reaction Methods 0.000 description 1
- 229920000193 polymethacrylate Polymers 0.000 description 1
- 229920000098 polyolefin Polymers 0.000 description 1
- 229920001155 polypropylene Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 229920002451 polyvinyl alcohol Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- BDERNNFJNOPAEC-UHFFFAOYSA-N propan-1-ol Chemical compound CCCO BDERNNFJNOPAEC-UHFFFAOYSA-N 0.000 description 1
- UBQKCCHYAOITMY-UHFFFAOYSA-N pyridin-2-ol Chemical compound OC1=CC=CC=N1 UBQKCCHYAOITMY-UHFFFAOYSA-N 0.000 description 1
- ZZYXNRREDYWPLN-UHFFFAOYSA-N pyridine-2,3-diamine Chemical compound NC1=CC=CN=C1N ZZYXNRREDYWPLN-UHFFFAOYSA-N 0.000 description 1
- GGOZGYRTNQBSSA-UHFFFAOYSA-N pyridine-2,3-diol Chemical compound OC1=CC=CN=C1O GGOZGYRTNQBSSA-UHFFFAOYSA-N 0.000 description 1
- 239000001044 red dye Substances 0.000 description 1
- 235000009566 rice Nutrition 0.000 description 1
- 150000003902 salicylic acid esters Chemical class 0.000 description 1
- 150000003839 salts Chemical class 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 239000000377 silicon dioxide Substances 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 229910052708 sodium Inorganic materials 0.000 description 1
- RTVVXRKGQRRXFJ-UHFFFAOYSA-N sodium;2-sulfobutanedioic acid Chemical compound [Na].OC(=O)CC(C(O)=O)S(O)(=O)=O RTVVXRKGQRRXFJ-UHFFFAOYSA-N 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- 229910052717 sulfur Inorganic materials 0.000 description 1
- 239000011593 sulfur Substances 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 125000005207 tetraalkylammonium group Chemical group 0.000 description 1
- 229920001169 thermoplastic Polymers 0.000 description 1
- 239000004416 thermosoftening plastic Substances 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 238000005809 transesterification reaction Methods 0.000 description 1
- 150000003852 triazoles Chemical class 0.000 description 1
- 239000006097 ultraviolet radiation absorber Substances 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Landscapes
- Laminated Bodies (AREA)
Abstract
Description
【発明の詳細な説明】
[産業上の利用分野]
本発明は接着性の改良された樹脂フィルム積層物に関し
、殊に親水性ポリマーおよび疎水性ポリマー、金属、無
機物質等のすべてに対して優れた接着性を示す樹脂フィ
ルム積層物を提供するものである。Detailed Description of the Invention [Industrial Application Field] The present invention relates to a resin film laminate with improved adhesiveness, and in particular, is excellent for all types of adhesives such as hydrophilic and hydrophobic polymers, metals, and inorganic materials. The object of the present invention is to provide a resin film laminate exhibiting excellent adhesive properties.
[従来の技術]
周知の様に樹脂フィルム、例えばポリエステル、ポリア
ミド、ポリプロピレン、ポリカーボネート、ポリエーテ
ルイミド、ポリエーテルスルホン、ポリフェニレンサル
ファイド、ポリエーテルエステル等よりなるフィルム、
特にポリエステルフィルム、とりわけポリエチレンテレ
フタレートフィルムは、機械的強度、耐熱性、耐薬品性
、透明性、寸法安定性等に優れたものであるところから
、磁気テープ用ベースフィルム、絶縁テープ、写真用フ
ィルム、トレーシングフィルム、食品包装用フィルムな
ど広範囲に亘って使用されている。しかしながらポリエ
ステルフィルムは概して接着性が低いのでインキ、電子
写真用トナー、ヒートシール性付与組成物、磁性体、感
光剤、マット剤、金属、金属酸化物、無機ポリマーなど
を積層する場合には、フィルム表面にコロナ放電処理を
施し、更にはアンカーコート剤を設けて接着性を高める
といった様な処理が必要となる。また食品の包装に用い
る場合は、印刷層やヒートシール層との接着性が弱いた
め全体のヒートシール強度も低くなる。[Prior Art] As is well known, resin films such as films made of polyester, polyamide, polypropylene, polycarbonate, polyetherimide, polyether sulfone, polyphenylene sulfide, polyether ester, etc.
In particular, polyester films, especially polyethylene terephthalate films, have excellent mechanical strength, heat resistance, chemical resistance, transparency, dimensional stability, etc., so they are used as base films for magnetic tapes, insulating tapes, photographic films, It is used in a wide range of applications, including tracing films and food packaging films. However, polyester films generally have low adhesive properties, so when laminating inks, electrophotographic toners, heat-sealable compositions, magnetic materials, photosensitizers, matting agents, metals, metal oxides, inorganic polymers, etc. It is necessary to perform corona discharge treatment on the surface and further provide an anchor coating agent to improve adhesion. Furthermore, when used for food packaging, the adhesiveness with the printed layer and the heat-sealing layer is weak, resulting in a low overall heat-sealing strength.
ところで樹脂フィルム表面の接着性を改良する方法とし
ては、コロナ放電IA理法が最も汎用されており、この
他、紫外線照射処理法、プラズマ放電処理法、火炎処理
法、窒素雰囲気下のコロナ放電処理法などの物理的処理
方法や、アルカリ処理法、ブライマー処理法などの化学
的処理方法、更には上記の方法を適宜組合せた処理方法
が知られている。しかしながら現在のところ、親水性ポ
リマーおよび疎水性ポリマー並びに無機物のすべてに対
して優れた接着性を示す様な熱可塑性樹脂フィルム、と
りわけポリエステルフィルムは知られていない。By the way, the corona discharge IA method is the most commonly used method for improving the adhesiveness of the resin film surface, and other methods include ultraviolet irradiation treatment method, plasma discharge treatment method, flame treatment method, and corona discharge treatment method under nitrogen atmosphere. Physical treatment methods such as these, chemical treatment methods such as an alkali treatment method and a brimer treatment method, and treatment methods that suitably combine the above-mentioned methods are known. However, at present, there is no known thermoplastic resin film, especially polyester film, which exhibits excellent adhesion to all hydrophilic and hydrophobic polymers and inorganic substances.
[発明が解決しようとする問題点]
本発明は前述の様な従来技術の問題点に鑑みてなされて
ものであって、その目的は親水性ポリマーおよび疎水性
ポリマー、金属並びに無機物のすべてに対して共に優れ
た接着性を発揮し得る様な樹脂フィルム積層物を提供し
ようとするものである。[Problems to be Solved by the Invention] The present invention has been made in view of the problems of the prior art as described above, and its purpose is to solve the problems of all hydrophilic and hydrophobic polymers, metals, and inorganic materials. The object of the present invention is to provide a resin film laminate that can exhibit excellent adhesive properties in both cases.
[問題点を解決するための手段]
本発明に係る樹脂フィルム積層物の構成は、樹脂フィル
ムの少なくとも片面に、下記一般式(I)〜(V)で示
される燐化合物の少なくとも1 flを反応せしめてな
る光硬化型樹脂を含む樹脂層を形成したものであるとこ
ろに要旨を有するものである。[Means for Solving the Problems] The structure of the resin film laminate according to the present invention is such that at least one fl of a phosphorus compound represented by the following general formulas (I) to (V) is reacted on at least one side of the resin film. The gist is that a resin layer containing a photocurable resin is formed.
GM ’ GM
OM OM
[式中X、Yはエステル形成性官能基、R1は炭素数3
〜10の3価の炭化水素基、R2は炭素数1〜12のア
ルキル基、シクロアルキル基、アリール基、炭素数1〜
12のアルコキシ基、シクロアルコキシ基またはアリー
ルオキシ基を示す、アリール基およびアリールオキシ基
はハロゲン原子、ヒドロキシ基、−〇M’ (M’
はアルカリ金属を示す)またはアミノ基が置換したもの
でも良い。R3゜R4は、炭素数1〜12のアルキレン
基、シクロアルキレン基、アリーレン基、式
+c H20Rsす1で表される基(RISは炭素数1
〜12のアルキレン基、シクロアルキレン基、アリーレ
ン基を示す。mは1〜4の任意の数値をとることができ
る。)、Mはアルカリ金属原子、水素、1価の炭化水素
基、またはアミノ基を示す]
[作用]
本発明で使用される前記式(I)〜(V)で示される燐
化合物の具体例としては、たとえば下記の化合物が挙げ
られる。GM' GM OM OM [In the formula, X and Y are ester-forming functional groups, R1 has 3 carbon atoms
-10 trivalent hydrocarbon group, R2 is an alkyl group having 1 to 12 carbon atoms, cycloalkyl group, aryl group, 1 to 10 carbon atoms
Aryl and aryloxy groups are halogen atoms, hydroxy groups, -〇M'(M'
represents an alkali metal) or substituted with an amino group. R3゜R4 is an alkylene group having 1 to 12 carbon atoms, a cycloalkylene group, an arylene group, a group represented by the formula +c H20Rs1 (RIS is a group having 1 carbon number
~12 alkylene groups, cycloalkylene groups, and arylene groups are shown. m can take any value from 1 to 4. ), M represents an alkali metal atom, hydrogen, a monovalent hydrocarbon group, or an amino group] [Function] Specific examples of the phosphorus compounds represented by the above formulas (I) to (V) used in the present invention Examples include the following compounds.
NaOOHKU utI
CH2O)12 Cl5
H8P−CLCH(HhOH(3) P−CH2
O)ICH20H(4)NaOOHHO0)I
C)13
P−CH,−CHCooCH,CH,OH(li)l
Na0 CH2C00CH2CH20HC,HS
Na0CllzCOOCHzCHzOH籾」」ローΔ側
C6)18C6H5
I lNa0
0HKO0H
Na0 0HNaO0H
ONa CH2−C0OHNaOCH2−C00C
H2C1(20HONa
0KOLI ONa
OHOに OH0Na
OK 0LIP (C
H2CHzCH2C)I20H) x (24)■
Na
Na
Na
Na
HOCH2CH20CH2−P−CH20CH2CH2
0H(27)0に 0
NaOK OLIP (
C)lzcJcH20H) 2 (37)Li
P (CI2ChCHtChOH) a (38)N
a
P (CH2CH2CH2CH20)1) 2 (3
9)K
P(ChChOH) 2 (40)OH
OHOH
P (CH2CH2CH2CH20H) x (43
)l
H
NaO
■
HOCH2Ch−P−ChCOOCHzClhOH(4
4)籠
Na
HOCH2CHz−P−C)l*cHzcOO1((4
5)Na
■
l0C)I2CHzOCH2−P−ChOCHzCHz
OH(4B)Na
)100cc82c)1*ChOC1b−P−CH20
CH2C1hCOOH(413)HOCH2CH20C
Hi−P−CHzOCHzClhOH(49)c2os
HOCH2CH20CH2−P−CH20CH2CH2
0H(5G)履
NaONa0
NaONa0
NaOにO
2HsO
0−P−CHaCHiOH(57)
IO
−cans
■
0−P−CH2ChCOOCHs (58)NaO
本発明に係る積層物における積層樹脂層の主成分を構成
する光硬化型樹脂は、分子内に少なくとも1つの光官能
基を有し、且つ前記式(I)〜(V)に示した燐化合物
の少なくとも1種を反応せしめてなる燐含有光硬化型樹
脂であり、ベース樹脂の具体例としては(A)アクリル
系二重結合含有化合物と(B)ウレタン結合、エステル
結合、エーテル結合、アミド結合のうち、少なくとも1
種の結合を介して結合している樹脂、例えばポリウレタ
ン・アクリレート樹脂、ポリエステル・アクリレート樹
脂、エポキシ・アクリレート樹脂等が挙げられる。尚ア
クリル系二重結合とはアクリル酸、アクリル酸エステル
、アクリル酸アミド、メタクリル酸、メタクリル酸エス
テル、メタクリル酸アミド等の残基(アクリロイル基又
はメタクリロイル基)をいう。NaOOHKU utI CH2O)12 Cl5
H8P-CLCH(HhOH(3) P-CH2
O) ICH20H (4) NaOOHHO0) I C) 13 P-CH, -CHCooCH, CH, OH (li)l Na0 CH2C00CH2CH20HC, HS Na0CllzCOOCHzCHzOH Rice" Low Δ side C6) 18C6H5 I lN a0
0HKO0H Na0 0HNaO0H ONa CH2-C0OHNaOCH2-C00C
H2C1 (20HONa
0KOLI ONa
OHO to OH0Na OK 0LIP (C
H2CHzCH2C)I20H) x (24)■ Na Na Na Na HOCH2CH20CH2-P-CH20CH2CH2
0H (27) 0 to 0
NaOK OLIP (
C) lzcJcH20H) 2 (37) Li P (CI2ChCHtChOH) a (38) N
a P (CH2CH2CH2CH20)1) 2 (3
9) K P (ChChOH) 2 (40) OH OHOH P (CH2CH2CH2CH20H) x (43
)l H NaO ■ HOCH2Ch-P-ChCOOCHzClhOH(4
4) Basket Na HOCH2CHz-P-C)l*cHzcOO1((4
5) Na ■ l0C) I2CHzOCH2-P-ChOCHzCHz
OH(4B)Na)100cc82c)1*ChOC1b-P-CH20
CH2C1hCOOH(413)HOCH2CH20C
Hi-P-CHzOCHzClhOH(49)c2os HOCH2CH20CH2-P-CH20CH2CH2
0H (5G) NaONa0 NaONa0 NaO to O 2HsO 0-P-CHaCHiOH (57) IO -cans ■ 0-P-CH2ChCOOCHs (58) NaO Photocuring that constitutes the main component of the laminated resin layer in the laminate according to the present invention The type resin is a phosphorus-containing photocurable resin that has at least one photofunctional group in the molecule and is reacted with at least one of the phosphorus compounds shown in the formulas (I) to (V), Specific examples of the base resin include (A) an acrylic double bond-containing compound and (B) at least one of urethane bonds, ester bonds, ether bonds, and amide bonds.
Examples of resins that are bonded via seed bonds include polyurethane acrylate resins, polyester acrylate resins, and epoxy acrylate resins. Note that the acrylic double bond refers to residues (acryloyl group or methacryloyl group) of acrylic acid, acrylic ester, acrylic amide, methacrylic acid, methacrylic ester, methacrylic amide, etc.
上記の特定の燐化合物を含む燐含有光硬化型樹脂は種々
の過程を経て製造することができる0例えば、ポリエス
テル・ポリオール、ポリアルキレングリコール、エポキ
シ樹脂等の原料樹脂を製造する際に、その1成分として
前記(I)〜(V)式に示した燐化合物を反応させるこ
とによって得ることができる。特に、ポリエステル・ポ
リオールな製造する際には、上記式(I)〜(V)で表
わされる燐化合物を、ポリエステル・ポリオールの重合
完結前の任意の段階で添加して反応させればよい、この
場合における燐化合物の添加時期は、製造時の操業上の
点からエステル交換反応後またはエステル化反応後の段
階が好ましい。The phosphorus-containing photocurable resin containing the above-mentioned specific phosphorus compound can be manufactured through various processes. It can be obtained by reacting the phosphorus compounds shown in formulas (I) to (V) above as components. In particular, when producing polyester/polyol, the phosphorus compounds represented by the above formulas (I) to (V) may be added at any stage before the completion of polymerization of the polyester/polyol to cause the reaction. In this case, the phosphorus compound is preferably added after the transesterification reaction or after the esterification reaction from the operational point of view during production.
また上記特定の燐化合物は、ポリウレタン・アクリレー
ト樹脂、ポリエステル・アクリレート樹脂、エポキシ・
アクリレート樹脂、アクリレート化合物等の光硬化型樹
脂原料の一成分として使用することができる0例えば、
ヒドロキシ基を含有する燐化合物の場合は、イソシアネ
ート化合物、ポリエステル・ポリオール、アクリレート
化合物等と直接反応させることにより、ポリウレタン・
アクリレート樹脂を製造することができる。In addition, the above specific phosphorus compounds include polyurethane/acrylate resin, polyester/acrylate resin, epoxy/
For example, it can be used as a component of photocurable resin raw materials such as acrylate resins and acrylate compounds.
In the case of phosphorus compounds containing hydroxy groups, polyurethane and
Acrylate resins can be produced.
さらに上記特定の燐化合物のうち、ジオールについては
ポリウレタン・アクリレート樹脂の鎖延長剤として、ま
たジカルボン酸についてはエポキシ・アクリレート樹脂
の鎖延長剤として、更にジオール・ジカルボン酸につい
てはポリエステル・アクリレート樹脂の鎖延長剤として
、夫々使用してもよい、その他これら特定の燐化合物の
うち、ジオールのモノ(メタ)アクリレートはポリウレ
タン・アクリレート樹脂の鎖延長剤として、またジカル
ボン酸のモノエチルオキシ(メタ)アクリレートはエポ
キシ・アクリレート樹脂の末端停止剤として使用しても
よく、さらに特定の燐化合物のポリ(メタ)アクリレー
トはアクリル系化合物として使用することもできる。Furthermore, among the above-mentioned specific phosphorus compounds, diols are used as chain extenders for polyurethane/acrylate resins, dicarboxylic acids are used as chain extenders for epoxy/acrylate resins, and diols/dicarboxylic acids are used as chain extenders for polyester/acrylate resins. Among these other specific phosphorus compounds, mono(meth)acrylates of diols may be used as chain extenders for polyurethane acrylate resins, and monoethyloxy(meth)acrylates of dicarboxylic acids may be used as extenders. It may be used as a terminal capping agent for epoxy acrylate resins, and poly(meth)acrylates of specific phosphorus compounds can also be used as acrylic compounds.
本発明に係る光硬化型樹脂は、アクリル系二重結合含有
化合物と特定の燐化合物および/または特定の燐化合物
と反応させた原料樹脂などを含む原料とを、公知の方法
により溶剤中または無溶剤中で反応させることにより得
られる。得られる樹脂の好ましい分子量は500〜10
0,000である。The photocurable resin according to the present invention is produced by mixing an acrylic double bond-containing compound and a raw material containing a specific phosphorus compound and/or a raw material resin reacted with a specific phosphorus compound in a solvent or without using a known method. Obtained by reaction in a solvent. The preferred molecular weight of the resulting resin is 500 to 10
It is 0,000.
上記−数式(り〜(V)で示される燐化合物は、全樹脂
中に燐原子として1100pp〜50000ppm含ま
れるように使用するのが適当であり、上記範囲より少な
い場合はポリマー及び無機物に対する接着性が不足気味
となり、一方上記範囲を超えると、吸湿性の増大、物理
的特性の低下、熱可塑性樹脂フィルムに対する密着性の
低下等の問題が生じてくる。It is appropriate to use the phosphorus compound represented by the above-mentioned formula (V) in such a way that the total resin contains 1,100 ppm to 50,000 ppm of phosphorus atoms; On the other hand, if it exceeds the above range, problems such as increased hygroscopicity, decreased physical properties, and decreased adhesion to thermoplastic resin films will occur.
尚上記光硬化型樹脂を製造するに当たっては、式CI)
〜(V)の燐化合物以外に下記の様な親水性極性基含有
化合物を共重合させてもよく、あるいは上記化合物の別
の共重合体として混合してもよい。In addition, in manufacturing the above photocurable resin, the formula CI)
In addition to the phosphorus compounds (V), the following hydrophilic polar group-containing compounds may be copolymerized, or the above compounds may be mixed as another copolymer.
燐原子以外の親水性極性基化合物が有する親−N” −
Rs 、−Ca Ha Rt 、−3OI M (式中
Mは水素原子、アルカリ金属、テトラアルキルアンモニ
ウム、テトラアルキルホスニウムを表わし、R1〜Rs
は水素原子、炭素数1〜8のアルキル基、アリール基、
アラルキル基を表わす)を挙げることがで台る。Parent group -N''- possessed by a hydrophilic polar group compound other than a phosphorus atom
Rs , -Ca Ha Rt , -3OI M (wherein M represents a hydrogen atom, an alkali metal, a tetraalkylammonium, a tetraalkylphosnium, and R1 to Rs
is a hydrogen atom, an alkyl group having 1 to 8 carbon atoms, an aryl group,
) representing an aralkyl group.
これらの親水性極性基を含有する具体的な化合物を例示
すると次の通りである。Specific examples of compounds containing these hydrophilic polar groups are as follows.
(I)−COOM
ポリカルボン酸、グリセリン酸、ジメチロールプロピオ
ン酸、N、N−ジェタノールグリシン、ヒドロキシエチ
ルオキシ安息香酸等のオキシカルボン酸、ジアミノプロ
ピオン酸、ジアミノ安息香酸等のアミノカルボン酸およ
びその誘導体等。(I)-COOM Polycarboxylic acids, glyceric acid, dimethylolpropionic acid, N,N-jetanolglycine, hydroxycarboxylic acids such as hydroxyethyloxybenzoic acid, aminocarboxylic acids such as diaminopropionic acid, diaminobenzoic acid, and their like. derivatives etc.
N−メチルジェタノールアミン、2−メチル−2−ジメ
チルアミノメチル−1,3−プロパツール、2−メチル
−2−ジメチルアミノ−1,3−ブロバンジオール等の
含窒素アルコールおよびその誘導体等。Nitrogen-containing alcohols and derivatives thereof, such as N-methylgetanolamine, 2-methyl-2-dimethylaminomethyl-1,3-propanol, and 2-methyl-2-dimethylamino-1,3-brobanediol.
(3) 二亙工Jユニ」b。(3) 2nd grade engineering J-uni” b.
ピコリン酸、ジピコリン酸、アミノピリジン、ジアミノ
ピリジン、ヒドロキシピリジン、ジヒドロキシピリジン
、アミノヒドロキシピリジン、ピリジニルジメタツール
、ピリジニルプロパンジオール、ピリジニルエタノール
等のピリジン環含有化合物およびその誘導体等。Pyridine ring-containing compounds such as picolinic acid, dipicolinic acid, aminopyridine, diaminopyridine, hydroxypyridine, dihydroxypyridine, aminohydroxypyridine, pyridinyldimethator, pyridinylpropanediol, pyridinylethanol, and derivatives thereof.
(4)二1立り旦
5−ナトリウムスルホイソフタル酸、5−テトラブチル
スルホニウム、スルホイソフタル酸、ナトリウムスルホ
こはく酸等のポリカルボン酸およびそれらの誘導体、ナ
トリウムスルホハイドロキノンおよびそのアルキレンオ
キサイド付加物、ナトリウムスルホビスフェノールAお
よびそのアルキレンオキサイド付加物等。(4) Polycarboxylic acids and derivatives thereof such as 5-sodium sulfoisophthalic acid, 5-tetrabutylsulfonium, sulfoisophthalic acid, sodium sulfosuccinic acid, sodium sulfohydroquinone and its alkylene oxide adduct, sodium Sulfobisphenol A and its alkylene oxide adducts, etc.
次に上記燐化合物変性光硬化型樹脂が積層される樹脂フ
ィルム(ベースフィルム)としては、ポリエステルフィ
ルム、ポリアミドフィルム、ポリカーボネートフィルム
、ポリフェニレンサルファイドフィルム、ポリエーテル
イミドフィルム、ポリエーテルスルホンフィルム等が挙
げられ、最終のフィルム積層物の用途および要求特性に
応じてその都度最適のものが選択使用されるが、最も一
般的なのはポリエステルフィルム、ポリアミドフィルム
、ポリカーボネートフィルム等である。Next, examples of the resin film (base film) on which the phosphorus compound-modified photocurable resin is laminated include polyester film, polyamide film, polycarbonate film, polyphenylene sulfide film, polyetherimide film, polyether sulfone film, etc. The most suitable one is selected and used each time depending on the intended use and required characteristics of the final film laminate, but the most common are polyester film, polyamide film, polycarbonate film, etc.
前記−数式(I)〜(V)の燐化合物を反応させた光硬
化型樹脂を上記熱可塑性のベースフィルムに積層する方
法としては、共押出しコート法、押出しラミネート法、
コーティング法、ドライラミネート法、ホットメルト接
着法等があり、いずれの方法を採用してもよい、また必
要によっては積層前あるいは積層後に延伸あるいは熱処
理を行なうことも勿論可能である。積層される燐化合物
変性光硬化型樹脂(以下単に変性光硬化型樹脂というこ
とがある)の厚みは任意であるが、接着性付与という観
点からすればできるだけ薄い方が好ましい、尚、該変性
光硬化型樹脂は耐炎性を有しているが燐原子の含有量が
10,000ppm以上になるとその効果が顕著に表わ
れるので、場合によっては変性光硬化型樹脂層をベース
フィルム層よりも厚くして耐炎性を高めることも有効で
ある。Methods for laminating the photocurable resin reacted with the phosphorus compounds of formulas (I) to (V) on the thermoplastic base film include a coextrusion coating method, an extrusion lamination method,
There are coating methods, dry lamination methods, hot melt adhesion methods, etc., and any method may be used. It is of course possible to perform stretching or heat treatment before or after lamination, if necessary. The thickness of the phosphorus compound-modified photocurable resin (hereinafter simply referred to as "modified photocurable resin") to be laminated is arbitrary, but from the viewpoint of providing adhesiveness, it is preferable to be as thin as possible. Curable resin has flame resistance, but this effect becomes noticeable when the phosphorus atom content exceeds 10,000 ppm, so in some cases, the modified photocurable resin layer may be made thicker than the base film layer. It is also effective to improve flame resistance.
本発明のフィルム積層物を製造するに当たっては、積層
前及び積層後に、空気または窒素雰囲気下でのコロナ放
電処理や紫外線照射処理などを行なうことにより接着性
を更に高めることもできる。In producing the film laminate of the present invention, adhesion can be further improved by performing corona discharge treatment or ultraviolet irradiation treatment in an air or nitrogen atmosphere before and after lamination.
この様にして得られるフィルム積層物は、情報記録用フ
ィルム、包装用フィルム、電気用フィルムその他の用途
のフィルムに使用される。とりわけポリエステル系樹脂
をベースフィルムの構成材として含むフィルム積層物は
、磁気記録用ベースフィルム、印刷用ベースフィルム、
コンデンサー用ベースフィルム、食品などの包装用フィ
ルム、蒸着用ベースフィルムなどとして幅広く活用する
ことができる。The film laminate thus obtained is used as an information recording film, a packaging film, an electrical film, and other films. In particular, film laminates containing polyester resin as a constituent material of the base film can be used as base films for magnetic recording, base films for printing,
It can be widely used as a base film for capacitors, a film for food packaging, a base film for vapor deposition, etc.
上記の様な用途に使用する場合、必要によっては変性光
硬化型樹脂層に他の重合体、着色剤、制電剤、架橋剤、
耐ブロッキング剤、無機又は有機粒子等の滑剤、紫外線
吸収剤、光劣化防止剤その他の添加剤を、本発明の効果
が損われない程度で添加することもできる。When used in the above applications, if necessary, other polymers, colorants, antistatic agents, crosslinking agents, etc. may be added to the modified photocurable resin layer.
Anti-blocking agents, lubricants such as inorganic or organic particles, ultraviolet absorbers, photodegradation inhibitors, and other additives may be added to the extent that the effects of the present invention are not impaired.
尚添加剤としては、水溶性、有機溶剤可溶性あるいは油
溶性の染料や顔料および不溶性の染料や顔料が含まれる
。The additives include water-soluble, organic solvent-soluble or oil-soluble dyes and pigments, and insoluble dyes and pigments.
制電剤としては、アニオン系、ノニオン系、カチオン等
の界面活性剤、ポリエーテル基、アニオン基あるいはカ
チオン基を含有するポリマー、金属または金属酸化物な
どからなる導電性粒子などが含まれる。Examples of the antistatic agent include anionic, nonionic, and cationic surfactants, polyether groups, polymers containing anionic or cationic groups, and conductive particles made of metals or metal oxides.
架橋剤と゛しては、アルコキシ基、アルキロール基、イ
ソシアナト基、エポキシ基、アジリニル基(メタ)アク
ロイル基、アルコキシアルキル基、などの如く活性水素
と反応し得る官能基を2個以上含有する化合物が含まれ
る。As a crosslinking agent, a compound containing two or more functional groups capable of reacting with active hydrogen, such as an alkoxy group, an alkylol group, an isocyanato group, an epoxy group, an azirinyl group, a (meth)acroyl group, an alkoxyalkyl group, etc. is included.
耐ブロッキング剤としては、高級脂肪酸およびその塩、
エステル、アミド、アミン、鉱油、シリコーン、ふっ素
化合物などが含まれる。As anti-blocking agents, higher fatty acids and their salts,
Includes esters, amides, amines, mineral oils, silicones, fluorine compounds, etc.
無機または有機粒子等の滑剤としては、シリカ系、炭酸
カルシウム系、カオリン系、硫酸バリウム系、チタン系
、タルク系、ベンゾグアナミン、ポリオレフィン系、メ
ラミン系、ポリアクリル酸エステル系、ポリアミド系、
ポリエステル系、ポリカーボネート系などが含まれ、こ
れらは表面処理がなされていてもよい、尚粒径は用途に
応じて任意に選定すればよい。Examples of lubricants such as inorganic or organic particles include silica-based, calcium carbonate-based, kaolin-based, barium sulfate-based, titanium-based, talc-based, benzoguanamine, polyolefin-based, melamine-based, polyacrylic acid ester-based, polyamide-based,
These include polyester-based, polycarbonate-based, etc., and these may be surface-treated, and the particle size may be arbitrarily selected depending on the application.
紫外線吸収剤としては、ベンゾフェノン系、サリチル酸
エステル系、トリアゾール系などが含まれる。Examples of the ultraviolet absorber include benzophenone, salicylic acid ester, and triazole.
光劣化防止剤としては、フェノール系、エポキシ系、含
硫黄系、含燐系、含窒素系、および含金属系、共役二重
結合含有系などの様々の化合物が含まれる。Photodegradation inhibitors include various compounds such as phenolic, epoxy, sulfur-containing, phosphorus-containing, nitrogen-containing, metal-containing, and conjugated double bond-containing compounds.
上記以外の添加剤としては防曇剤、難燃剤などが含まれ
る。Additives other than those mentioned above include antifogging agents, flame retardants, and the like.
また本発明では、必要により前記変性光硬化型樹脂樹脂
と共に、該樹脂と相溶性を有する他の樹脂、たとえば塩
化ビニル系樹脂、ポリエステル系樹脂、セルロース系樹
脂、アクリル系樹脂、エポキシ樹脂、フェノキシ樹脂、
ポリビニルブチラール、アクリロニトリル−ブタジェン
共重合体等を併用したり、更に他の樹脂と併用すること
も可能である。また本発明のフィルム積層物を前述の様
な用途に適用するに先立って、該積層物の変性光硬化型
樹脂側に他の樹脂を積層もしくはアンカーコートして所
望のフィルム特性を付与することも可能である。Further, in the present invention, if necessary, in addition to the modified photocurable resin, other resins having compatibility with the resin, such as vinyl chloride resin, polyester resin, cellulose resin, acrylic resin, epoxy resin, phenoxy resin, may be used. ,
It is also possible to use polyvinyl butyral, acrylonitrile-butadiene copolymer, etc. together, or to use other resins together. Furthermore, before applying the film laminate of the present invention to the above-mentioned uses, desired film properties may be imparted by laminating or anchor coating another resin on the modified photocurable resin side of the laminate. It is possible.
本発明のフィルム積層物は、前述の様にして熱可塑性樹
脂フィルム上に上注に従って光硬化型樹脂(必要によっ
ては更に他の樹脂)を積層した後、その積層物を必要に
よりカレンダー処理してから放射線処理することもでき
る。光硬化型樹脂層を硬化させるために照射される光と
しては、電子線のほかに中性子線、γ線等の放射線或は
可視〜紫外線を使用することができ、紫外線の照射量は
約1〜10 Mradがよく、特に約2〜8Mradで
あることが好ましい。The film laminate of the present invention is produced by laminating a photocurable resin (and other resins as necessary) on a thermoplastic resin film as described above, and then calendering the laminate as necessary. It can also be treated with radiation. As the light irradiated to cure the photocurable resin layer, in addition to electron beams, radiation such as neutron beams and γ rays, or visible to ultraviolet rays can be used, and the irradiation amount of ultraviolet rays is about 1 to 10 Mrad is preferred, particularly about 2 to 8 Mrad.
本発明に係るフィルム積層物は、前述の如く燐を含有す
る化合物によって変性された光硬化型樹脂を積層樹脂の
少なくとも一成分として構成することにより、光照射後
のフィルム積層物は親木性ポリマー、疎水性ポリマー、
金属および無機物のいずれに対しても優れた接着性を示
すものとなり、その特徴を生かして様々の分計で幅広く
活用することができる。The film laminate according to the present invention comprises a photocurable resin modified with a phosphorus-containing compound as at least one component of the laminate resin, as described above, so that the film laminate after light irradiation is made of a wood-philic polymer. , hydrophobic polymer,
It exhibits excellent adhesion to both metals and inorganic materials, and by taking advantage of this feature, it can be used in a wide range of applications.
[実施例]
次に実施例によって本発明を具体的に説明する。尚実施
例中車に部とあるのは重量部を示す。[Example] Next, the present invention will be specifically explained with reference to Examples. In the examples, "parts" indicate parts by weight.
実施例1
温度計および攪拌機を備えたオートクレーブ中に、ジメ
チルテレフタレート485部、ジメチルイソフタレート
485部、エチレングリコール409部、ネオペンチル
グリコール485部およびテトラブトキシチタネート0
.68部を仕込み、150〜230℃で120分間加熱
してエステル交換を行なった0次いで前記式(B)とし
て示した燐化合物50.1部を仕込み、220〜230
℃で更に1時間反応を行なった。次いで反応系を30分
間で250℃まで昇温し、系の圧力を徐々に低下させて
45分後に10mmHgとし、この条件で更に60分間
反応を続けた。得られたポリエステルジオールAの分子
量は2500、燐含有率は1600ppmであった。Example 1 In an autoclave equipped with a thermometer and a stirrer, 485 parts of dimethyl terephthalate, 485 parts of dimethyl isophthalate, 409 parts of ethylene glycol, 485 parts of neopentyl glycol and 0 parts of tetrabutoxy titanate were added.
.. Then, 50.1 parts of the phosphorus compound shown as the above formula (B) was charged, and 220 to 230
The reaction was carried out for an additional hour at ℃. Next, the temperature of the reaction system was raised to 250° C. over 30 minutes, and the pressure of the system was gradually lowered to 10 mmHg after 45 minutes, and the reaction was continued under these conditions for an additional 60 minutes. The obtained polyester diol A had a molecular weight of 2500 and a phosphorus content of 1600 ppm.
このポリエステルジオールA100部をトルエン72部
およびメチルエチルケトン72部に溶解した後、4.4
’−ジフェニルメタンジイソシアネート21部およびジ
ブチル錫ジラウレート0.05部を加えて70〜80℃
で3時間反応させた。この反応液にペンタエリスリトー
ルトリアクリレート15部を加えて70〜80℃で2時
間反応させ、さらに2−メチル−2ジメチルアミノ−1
゜3−プロパンジオール7.1部を加え、さらに5時間
反応させて固形分濃度40!i量%のポリウレタン・ア
クリレート樹脂溶液を得た。得られたポリウレタン・ア
クリレート樹脂Aの分子量は1500Gであり、燐含有
量は1l100ppであった。After dissolving 100 parts of this polyester diol A in 72 parts of toluene and 72 parts of methyl ethyl ketone, 4.4
Add 21 parts of '-diphenylmethane diisocyanate and 0.05 part of dibutyltin dilaurate to 70-80°C.
The mixture was allowed to react for 3 hours. 15 parts of pentaerythritol triacrylate was added to this reaction solution and reacted at 70 to 80°C for 2 hours, and then 2-methyl-2dimethylamino-1
゜7.1 parts of 3-propanediol was added and reacted for another 5 hours until the solid content concentration was 40! A polyurethane acrylate resin solution of i amount % was obtained. The molecular weight of the obtained polyurethane acrylate resin A was 1500 G, and the phosphorus content was 1 l 100 pp.
このポリウレタン・アクリレート樹脂溶液をトルエン/
メチルエチルケトン(重量比50150)の混合溶液で
希釈して固形分濃度5重量%に調整した後、エアーナイ
フ方式でポリエステルフィルム上に塗布して120℃で
乾燥することにより、コート量0.3g10+2のコー
ティングポリエステルフィルムを得た。その後5Mra
dの放射線処理を行なってポリウレタンアクリレート樹
脂層を硬化させ、目的とするフィルム積層物を得た。This polyurethane acrylate resin solution was mixed with toluene/
After diluting with a mixed solution of methyl ethyl ketone (weight ratio 50150) to adjust the solid content concentration to 5% by weight, it was coated on a polyester film using an air knife method and dried at 120°C to form a coating with a coating weight of 0.3g10+2. A polyester film was obtained. After that 5Mra
The polyurethane acrylate resin layer was cured by the radiation treatment in step d, and the desired film laminate was obtained.
比較例1
放射線硬化型樹脂を構成するポリエステル共重合体組成
の酸成分としてテレフタル酸35モル%、イソフタル酸
35モル%、アジピン酸30モル%を、またグリコール
成分としてエチレングリコール50モル%、ネオペンチ
ルグリコール50モル%を夫々使用しく燐含有化合物は
使用せず)、溶媒としてトルエン/メチルエチルケトン
(重量比、50150 )を使用した他は実施例1と同
様にしてフィルム積層物を得た。Comparative Example 1 The acid components of the polyester copolymer composition constituting the radiation-curable resin were 35 mol% of terephthalic acid, 35 mol% of isophthalic acid, and 30 mol% of adipic acid, and the glycol components were 50 mol% of ethylene glycol and neopentyl. A film laminate was obtained in the same manner as in Example 1, except that 50 mol% of each glycol was used (no phosphorus-containing compound was used) and toluene/methyl ethyl ketone (weight ratio, 50150) was used as a solvent.
比較例2
未コーティングポリエステルフィルムをそのまま使用し
た。上記実施例1および比較例1.2で得た各フィルム
積層物(また単層フィルム)について、下記の方法で各
種ポリマー、金属および無機物質(磁性剤)に対する接
着性を調べた。Comparative Example 2 An uncoated polyester film was used as is. The adhesion of each film laminate (or single layer film) obtained in Example 1 and Comparative Example 1.2 to various polymers, metals, and inorganic substances (magnetic agents) was examined by the following method.
(ポリマーに対する接着性)
■ポリビニルアルコール、■ポリカーボネート、■アル
コール可溶性ナイロン、■ゼラチンまたは■セルロース
アセテートブチレートに、各ポリマーに対して相溶性の
良い赤色染料を添加した後各供試フィルム上に厚さ3μ
mとなるように塗布し、ニチバン製セロテープを貼付し
て剥離角度18Q°で剥離して剥離の有無を調べた。全
く剥離のないものを10.半分剥離したものを5.全面
剥離したものを1としてランク付けした。(Adhesion to polymers) After adding a red dye that is highly compatible with each polymer to ■polyvinyl alcohol, ■polycarbonate, ■alcohol-soluble nylon, ■gelatin, or ■cellulose acetate butyrate, a thick layer is applied onto each test film. 3μ
The adhesive tape was coated to give an angle of m, and Nichiban cellophane tape was applied and peeled off at a peeling angle of 18Q° to check for peeling. 10. No peeling at all. 5. Half peeled. Those that were completely peeled off were ranked as 1.
(金属に対する接着性)
各供試フィルムのコート層側にアルミニウムを蒸着し、
これを水に100℃で30分間浸漬したのち取り出し、
この蒸着面に上記テープを圧着して急速に剥離するテス
トを10回繰返し行ない、上記と同様にして接着性を評
価した。(Adhesion to metal) Aluminum was vapor-deposited on the coating layer side of each test film,
This was immersed in water at 100°C for 30 minutes and then taken out.
A test was repeated 10 times in which the tape was pressure-bonded to the vapor-deposited surface and rapidly peeled off, and the adhesiveness was evaluated in the same manner as above.
(lift性剤に対する接着性)
磁性をもったγ−Fe20.微分末粒子250部、ジオ
クチルスルホネート2部、共重合ポリエステル(酸成分
:テレフタル酸45モル%+イソフタル酸20モル%+
セバシン酸32.5モル%+5ナトリウムスルホイソフ
タル酸2.5モル%、グリコール成分;エチレングリコ
ール5ロ
テート600部を、ボールミルを用いて約24時間混合
した.この混合物400部に共重合ポリエステル樹脂1
00部、ニトロセルロース30部、塩化ビニル−酢酸ビ
ニル共重合体70部、ポリイソシアネート30部および
メチルエチルケトン400部、シクロヘキサン400部
を加え再びボールミルを用いて約70時間混合したもの
を、磁性層の厚みが2μmとなる様に上記各フィルム上
にコートした。(Adhesion to lift agent) Magnetic γ-Fe20. 250 parts of fine powder particles, 2 parts of dioctyl sulfonate, copolymerized polyester (acid component: 45 mol% terephthalic acid + 20 mol% isophthalic acid +
32.5 mol % of sebacic acid + 2.5 mol % of 5-sodium sulfoisophthalic acid, glycol component: 600 parts of ethylene glycol 5-rotate were mixed for about 24 hours using a ball mill. 400 parts of this mixture and 1 part of copolyester resin
00 parts of nitrocellulose, 70 parts of vinyl chloride-vinyl acetate copolymer, 30 parts of polyisocyanate, 400 parts of methyl ethyl ketone, and 400 parts of cyclohexane were added and mixed for about 70 hours using a ball mill again. It was coated on each of the above films so that the thickness was 2 μm.
コートした磁性層の表面に100個のクロスカットを施
した後、その表面に粘着テープを貼りつけ、全面に均一
に装着させて瞬間的に5回繰返し引き剥がした後の接着
状態を観察し、クロスカットの残存個数で接着性を評価
した。After making 100 crosscuts on the surface of the coated magnetic layer, adhesive tape was pasted on the surface, applied uniformly to the entire surface, and then instantly peeled off 5 times to observe the adhesion state. Adhesion was evaluated based on the number of remaining crosscuts.
結果は第1表に示す通りであり、実施例の積層フィルム
は、各種ポリマー、金属、磁性剤のいずれに対しても非
常に優れた接着性を有していることが分かる。The results are shown in Table 1, and it can be seen that the laminated films of Examples have very excellent adhesion to various polymers, metals, and magnetic agents.
第 1 表
実施例2
酸成分としてテレフタル酸70モル%、イソフタル酸2
5モル%、アジピン酸5モル%、グリコール成分として
エチレングリコール70モル%、ジエチレングリコール
26モル%、燐化合物として前記式(54)の化合物4
モル%を夫々使用した他は実施例と実質的に同様にして
、放射線硬化型樹脂溶液を作成し、その後溶剤を溜去す
ることにより該樹脂の粒状物を得た。Table 1 Example 2 Terephthalic acid 70 mol%, isophthalic acid 2 as acid components
5 mol%, adipic acid 5 mol%, ethylene glycol 70 mol%, diethylene glycol 26 mol% as a glycol component, compound 4 of the above formula (54) as a phosphorus compound.
A radiation-curable resin solution was prepared in substantially the same manner as in the example except that the respective mole % was used, and then the solvent was distilled off to obtain granules of the resin.
上記粒状樹脂300部とn−ブチルセロソルブ140部
とを、容器中150〜170℃で約3時間攪拌し、均一
で粘稠な溶融液を得た。この溶融液に水560部を徐々
に添加し約1時間攪拌すると均一な淡白色の固形分濃度
30%の水分散液が得られた。300 parts of the above granular resin and 140 parts of n-butyl cellosolve were stirred in a container at 150 to 170°C for about 3 hours to obtain a uniform and viscous melt. 560 parts of water was gradually added to this melt and stirred for about 1 hour to obtain a uniform pale white aqueous dispersion having a solid content concentration of 30%.
この水分散液に水4500部とエチルアルコール450
0部を加えて希釈し、固形分濃度3%の塗布液を得た。Add 4500 parts of water and 450 parts of ethyl alcohol to this aqueous dispersion.
0 parts was added to dilute it to obtain a coating liquid with a solid content concentration of 3%.
この塗布液を、未延伸ポリエステルフィルム上に固形分
厚さが1 g/m’となる様に塗布し、縦方向に90℃
で3.5倍延伸し、引続いて120℃で横方向に3.4
倍延伸した後210℃で熱処理し、得られるコート厚さ
O,1g/n’ 、ベース層50μmのフィルム積層物
5 M radで放射線処理した。This coating solution was applied onto an unstretched polyester film so that the solid content was 1 g/m', and the film was heated at 90°C in the longitudinal direction.
Stretched 3.5 times at
After double stretching, it was heat treated at 210 DEG C. and the resulting film laminate with a coating thickness of O, 1 g/n' and a base layer of 50 .mu.m was subjected to radiation treatment of 5 M rad.
この処理フィルムのコート層側に、A−1キユアKK赤
(永瀬スクリーン社製)を印刷厚み10−15μmとな
る様にスクリーン印刷し、紫外線照射装置を用い積算照
射エネルギー1500rnJ/cra2で照射を行なっ
た。A-1 Cure KK Red (manufactured by Nagase Screen Co., Ltd.) was screen printed on the coat layer side of this treated film so that the printing thickness was 10-15 μm, and irradiation was performed using an ultraviolet irradiation device with a cumulative irradiation energy of 1500 rnJ/cra2. Ta.
この印刷面に100個の基盤目をつけてセロテープ剥離
試験を行なったところ、剥離は全く認められなかった。When 100 substrates were placed on this printed surface and a cellophane tape peeling test was performed, no peeling was observed.
[発明の効果]
本発明は以上の様に構成されており、特定の燐含有化合
物で変性された放射線硬化型樹脂を積層し放射線硬化さ
せることによって、親木性ポリマー、疎水性ポリマー、
金属、無機物質のすべてに対して優れた接着性を有する
フィルム積層物を提供し得ることになった。[Effects of the Invention] The present invention is configured as described above, and by laminating radiation-curable resins modified with a specific phosphorus-containing compound and curing them with radiation, wood-philic polymers, hydrophobic polymers,
It has become possible to provide a film laminate that has excellent adhesion to all metals and inorganic substances.
Claims (1)
〜(V)で示される燐化合物の少なくとも1種を反応せ
しめてなる光硬化型樹脂を含む樹脂層を形成したもので
あることを特徴とする樹脂フィルム積層物。 ▲数式、化学式、表等があります▼( I )▲数式、化
学式、表等があります▼(II)▲数式、化学式、表等が
あります▼(III) ▲数式、化学式、表等があります▼(IV)▲数式、化学
式、表等があります▼(V) [式中X、Yはエステル形成性官能基、R_1は炭素数
3〜10の3価の炭化水素基、R_2は炭素数1〜12
のアルキル基、シクロアルキル基、アリール基、炭素数
1〜12のアルコキシ基、シクロアルコキシ基またはア
リールオキシ基を示す。アリール基およびアリールオキ
シ基はハロゲン原子、ヒドロキシ基、 −OM’(M’はアルカリ金属を示す)またはアミノ基
が置換したものでも良い。R_3、R_4は、炭素数1
〜12のアルキレン基、シクロアルキレン基、アリーレ
ン基、式 ■CH_2OR_5■_mで表される基(R_5は炭素
数1〜12のアルキレン基、シクロアルキレン基、アリ
ーレン基を示す。mは1〜4の任意の数値をとることが
できる。)、Mはアルカリ金属原子、水素、1価の炭化
水素基、またはアミノ基を示す][Claims] At least one side of the resin film has the following general formula (I).
A resin film laminate comprising a resin layer containing a photocurable resin reacted with at least one of the phosphorus compounds represented by (V). ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼ (I) ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼ (II) ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼ (III) ▲ There are mathematical formulas, chemical formulas, tables, etc. ▼ ( IV) ▲There are mathematical formulas, chemical formulas, tables, etc.▼(V) [In the formula, X and Y are ester-forming functional groups, R_1 is a trivalent hydrocarbon group having 3 to 10 carbon atoms, and R_2 is a carbon number 1 to 12
represents an alkyl group, a cycloalkyl group, an aryl group, an alkoxy group having 1 to 12 carbon atoms, a cycloalkoxy group, or an aryloxy group. The aryl group and aryloxy group may be substituted with a halogen atom, a hydroxy group, -OM'(M' represents an alkali metal), or an amino group. R_3 and R_4 have 1 carbon number
~12 alkylene group, cycloalkylene group, arylene group, group represented by the formula ■CH_2OR_5■_m (R_5 represents an alkylene group having 1 to 12 carbon atoms, a cycloalkylene group, or an arylene group. m is 1 to 4) ), M represents an alkali metal atom, hydrogen, a monovalent hydrocarbon group, or an amino group]
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP27393087A JPH01114437A (en) | 1987-10-28 | 1987-10-28 | Laminate of resin films |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP27393087A JPH01114437A (en) | 1987-10-28 | 1987-10-28 | Laminate of resin films |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH01114437A true JPH01114437A (en) | 1989-05-08 |
Family
ID=17534554
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP27393087A Pending JPH01114437A (en) | 1987-10-28 | 1987-10-28 | Laminate of resin films |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH01114437A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011013720A1 (en) * | 2009-07-30 | 2011-02-03 | 旭硝子株式会社 | Unsaturated urethane oligomer, curable resin composition, transparent laminate, and process for producing same |
-
1987
- 1987-10-28 JP JP27393087A patent/JPH01114437A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
WO2011013720A1 (en) * | 2009-07-30 | 2011-02-03 | 旭硝子株式会社 | Unsaturated urethane oligomer, curable resin composition, transparent laminate, and process for producing same |
JP5737180B2 (en) * | 2009-07-30 | 2015-06-17 | 旭硝子株式会社 | Unsaturated urethane oligomer, curable resin composition, transparent laminate and method for producing the same |
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