JPH04192537A - Tab space tape - Google Patents
Tab space tapeInfo
- Publication number
- JPH04192537A JPH04192537A JP32125790A JP32125790A JPH04192537A JP H04192537 A JPH04192537 A JP H04192537A JP 32125790 A JP32125790 A JP 32125790A JP 32125790 A JP32125790 A JP 32125790A JP H04192537 A JPH04192537 A JP H04192537A
- Authority
- JP
- Japan
- Prior art keywords
- tape
- tab
- space
- embosses
- semiconductor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000004804 winding Methods 0.000 claims abstract description 4
- 239000000126 substance Substances 0.000 claims abstract description 3
- 239000004065 semiconductor Substances 0.000 abstract description 11
- 239000003960 organic solvent Substances 0.000 abstract description 6
- 238000001125 extrusion Methods 0.000 abstract description 5
- 238000000034 method Methods 0.000 abstract description 5
- 239000003795 chemical substances by application Substances 0.000 abstract description 4
- 238000004519 manufacturing process Methods 0.000 abstract description 4
- 239000002904 solvent Substances 0.000 abstract description 3
- 239000000428 dust Substances 0.000 abstract description 2
- 239000000203 mixture Substances 0.000 abstract description 2
- 230000002265 prevention Effects 0.000 abstract 2
- 238000010276 construction Methods 0.000 abstract 1
- 238000013036 cure process Methods 0.000 abstract 1
- 230000002349 favourable effect Effects 0.000 abstract 1
- 230000003068 static effect Effects 0.000 abstract 1
- YXFVVABEGXRONW-UHFFFAOYSA-N Toluene Chemical compound CC1=CC=CC=C1 YXFVVABEGXRONW-UHFFFAOYSA-N 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 6
- 229920000139 polyethylene terephthalate Polymers 0.000 description 5
- 239000005020 polyethylene terephthalate Substances 0.000 description 5
- CSCPPACGZOOCGX-UHFFFAOYSA-N Acetone Chemical compound CC(C)=O CSCPPACGZOOCGX-UHFFFAOYSA-N 0.000 description 4
- -1 polyethylene terephthalate Polymers 0.000 description 3
- 239000002216 antistatic agent Substances 0.000 description 2
- 239000008393 encapsulating agent Substances 0.000 description 2
- 238000000465 moulding Methods 0.000 description 2
- 229920001342 Bakelite® Polymers 0.000 description 1
- 239000004697 Polyetherimide Substances 0.000 description 1
- 230000015556 catabolic process Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000004049 embossing Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000009477 glass transition Effects 0.000 description 1
- 239000000314 lubricant Substances 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 229920001601 polyetherimide Polymers 0.000 description 1
- 239000003381 stabilizer Substances 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
Landscapes
- Polymers With Sulfur, Phosphorus Or Metals In The Main Chain (AREA)
- Macromolecular Compounds Obtained By Forming Nitrogen-Containing Linkages In General (AREA)
- Wire Bonding (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は耐熱性、耐薬品性に優れたテープオートメ−テ
ィラドボンディング用テープ（以下、ＴＡＢという）ス
ペーステープに関するものである。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a space tape for tape automated bonding (hereinafter referred to as TAB) which has excellent heat resistance and chemical resistance.
ＴＡＢ用スパスペーステープＡＢをリール状に巻く際に
、ＴＡＢとＴＡＢに装着した半導体装置か接触し破損す
るのを防止する目的でＴＡＢと重ね合わせて用いられる
テープであり、両側縁部には連続したエンボス凹凸か設
けられている。When TAB Spa Space Tape AB is wound into a reel, this tape is used by overlapping the TAB to prevent the TAB and the semiconductor device attached to the TAB from coming into contact and being damaged. It has an embossed texture.
ＴＡＢ用スパスペーステープ質としては一般にはポリエ
チレンテレフタレート（以下ＰＥＴ）か広く用いられて
いる。Generally, polyethylene terephthalate (hereinafter referred to as PET) is widely used as the material of the TAB superspace tape.
しかし、半導体の封止剤を硬化させる工程ではＴＡＢと
スペーステープを重ね合わせて巻いた状態で１５０〜１
７０℃て１時開栓度加熱するため、ＰＥＴてはエンボス
成型部か成型戻りして、突起高さが低（なり、ＴＡＢと
半導体との間隙か狭くなり、接触して半導体か損傷した
り、ＴＡＢのリード線が損傷するという問題か生したり
していた。However, in the process of curing the semiconductor encapsulant, TAB and space tape are rolled together and rolled at a temperature of 150 to 1
Because the PET is heated to 70°C for 1 hour, the embossed part may return to its original form, resulting in a lower protrusion height (which reduces the gap between the TAB and the semiconductor, which may cause damage to the semiconductor due to contact). However, there was a problem that the TAB lead wires were damaged.
また、ＴＡＢ用スパスペーステープエンボス凹凸の代わ
りにに多数の凸状部品をつける方法も採られているか、
これは多数の手間を要するという欠点があった。Also, has a method of attaching many convex parts to the TAB spa space tape embossed concave and convex parts been adopted?
This had the disadvantage of requiring a lot of effort.
これらの問題はガラス転移温度（Ｔｇ）が１８０℃以上
の熱可塑性樹脂を使用することにより解決されるがポリ
サルホン（以下ＰＳＦ）ポリエーテルサルホン（以下Ｐ
Ｅ５） 、下記式て表されるポリエーテルイミドはＴＡ
Ｂ及び半導体装置の製造工程で使用されるアセトン、ト
リクレン、トルエン等の有機溶剤によりストレスクラッ
クを生じ易く、製造工程中の一部でしか使用てきないと
いう欠点があった。These problems can be solved by using thermoplastic resins with a glass transition temperature (Tg) of 180°C or higher.
E5) The polyetherimide represented by the following formula is TA
B and organic solvents used in the manufacturing process of semiconductor devices, such as acetone, trichlene, and toluene, tend to cause stress cracks and have the disadvantage that they can only be used in a part of the manufacturing process.
本発明の目的とするところは、半導体の封止剤の硬化工
程でも両側縁部に設けたエンボス凹凸か変形することな
く、耐有機溶剤性にも優れたＴＡＢ用スペーステープを
提供するにある。An object of the present invention is to provide a space tape for TAB which does not deform the embossed irregularities provided on both side edges even during the curing process of a semiconductor encapsulant and has excellent organic solvent resistance.
Ｃ課題を解決するための手段〕
本発明はＴＡＢをリールに巻く際に、ＴＡＢに重ね合わ
せて用いる両側縁部にエンボス凹凸を設けたスペーステ
ープてあって、その主構成要素が下記式て表されること
を特徴とするＴＡＢ用スペーステープである。Means for Solving Problem C] The present invention has a space tape with embossed unevenness on both side edges used to overlap the TAB when winding the TAB onto a reel, and its main components are expressed by the following formula. This is a TAB space tape characterized by:
本発明において用いられる組成のテープは溶融押出し法
により製造されるが、帯電防止剤を添加したもの、溶融
押出し後、帯電防止剤をテープの両面にコーティングし
たものは、防塵、半導体の静電気破壊防止の点て好まし
い。The tape having the composition used in the present invention is manufactured by a melt extrusion method, and tapes with an antistatic agent added or coated on both sides of the tape with an antistatic agent after melt extrusion are used to prevent dust and electrostatic breakdown of semiconductors. This is preferable.
また、溶融押出しの際、少量の滑剤、安定剤、アンチブ
ロッキング剤を添加してもさしつかえない。テープ厚み
は５０μｍから５００μｍ、更には１００μｍから３０
０μｍであることが、エンボス部の耐圧性、巻取加工性
の面から望ましい。Additionally, small amounts of lubricants, stabilizers, and antiblocking agents may be added during melt extrusion. Tape thickness ranges from 50μm to 500μm, and even from 100μm to 30μm.
A thickness of 0 μm is desirable from the viewpoint of pressure resistance and winding workability of the embossed portion.
テープ輻は、ＴＡＢの輻に合わせて簡単にスリット加工
できる。The tape radius can be easily slit to match the TAB radius.
また、エンボスの形状については実願平０２−０３８１
０３号で述べられている様に、ＴＡＢと重ね合わせて巻
いた際にＴＡＢの送り孔に入り込んだり、ひっかかった
りしない様考慮する必要かある。Regarding the shape of the emboss, please refer to Utility Application No. 02-0381.
As stated in No. 03, it is necessary to take care to avoid getting caught in or getting caught in the feed hole of the TAB when it is rolled over the TAB.
実施例１
ゼネラルエレクトリック社ＵＬＴＥＭ−Ｄ５００１を溶
融押出しして１５０μｍの厚さにシーテイングした後、
３５ｍｍ幅にスリットし、その両縁部に凸部（２）及び
凹部（３）からなるエンボスを成形し、第１図のエンボ
ス高さａか１．２ｍｍのスペーステープ（１）のシート
成形体を得た。Example 1 After melt-extruding General Electric Company ULTEM-D5001 and sheeting it to a thickness of 150 μm,
A slit with a width of 35 mm is formed, and an emboss consisting of a convex portion (2) and a concave portion (3) is formed on both edges of the slit, and a sheet molded body of space tape (1) with an emboss height a of 1.2 mm as shown in Fig. 1 is obtained. I got it.
実施例２
実施例１と同様にして得られたシートを連続プレス成形
して、第１図のエンボス高さａが３．０ ｍｍのシート
成型体を得た。Example 2 A sheet obtained in the same manner as in Example 1 was continuously press-molded to obtain a sheet molded body having an embossing height a of 3.0 mm as shown in FIG. 1.
比較例１
ゼネラルエレクトリック社Ｕ Ｌ Ｔ Ｅ Ｍ −１０
００を溶融押出しして１５０μｍの厚さにソーティング
した後、プレス成形して実施例１と同形状のシート成型
体を得た。Comparative Example 1 General Electric Company ULTEM-10
00 was melt-extruded and sorted to a thickness of 150 μm, and then press-molded to obtain a sheet molded body having the same shape as Example 1.
比較例２
厚さ１５０μｍのＰＥＳノートを連続プレス成型して、
実施例１と同形状のソート成型体を得た。Comparative Example 2 A PES notebook with a thickness of 150 μm was continuously press-molded,
A sorted molded body having the same shape as in Example 1 was obtained.
比較例３
厚さ１５０μｍのＰＳＦノートを連続プレス成型して実
施例１と同形状のシート成型体を得た。Comparative Example 3 A sheet molded body having the same shape as in Example 1 was obtained by continuous press molding of a PSF notebook having a thickness of 150 μm.
比較例４
厚さ１５０μｍのＰＥＴシートを連続プレス成型して、
実施例１と同形状のシート成型体を得た。Comparative Example 4 A PET sheet with a thickness of 150 μm was continuously press-molded,
A sheet molded body having the same shape as in Example 1 was obtained.
比較例５
厚さ１５０μｍのＰＥＴノートを連続プレス成型して実
施例２と同形状のソート成型体を得た。Comparative Example 5 A sorted molded body having the same shape as in Example 2 was obtained by continuous press molding of a PET notebook having a thickness of 150 μm.
実施例１，２、比較例１〜５て得たシート成型体を下記
の項目について比較評価し、その結果を表１に示す。The sheet molded bodies obtained in Examples 1 and 2 and Comparative Examples 1 to 5 were comparatively evaluated on the following items, and the results are shown in Table 1.
（１）耐熱寸法安定性＝１５０℃と１７０℃にオーブン
を調温し、それぞれにサンプルを１時間放置して、その
前後のエンボス凸部の高さ（第１図ａ）を測定した。(1) Heat-resistant dimensional stability: The temperature of the oven was adjusted to 150° C. and 170° C., and the samples were left in each for 1 hour, and the heights of the embossed convex portions before and after (Fig. 1 a) were measured.
（２）耐有機溶剤性・サンプルに１．０ｋｇ／ｍｍ２の
応力をかけた状態てアセトン、トリクレン、トルエンの
各溶剤中にｌｈｒ放置した後サンプルの外観変化を調へ
た。(2) Resistance to organic solvents - After being left in acetone, trichlene, and toluene solvents for 1 hour with a stress of 1.0 kg/mm2 applied to the sample, changes in the appearance of the sample were examined.
表 ｌ
Ｏ外観変化なし
× クラックまたは破断
〔発明の効果〕
本発明で得られるソート成型体は１７０℃の高温下ても
成型部の高さが変化することなく、ＴＡＢ及び半導体装
置の製造工程で使用される有機溶剤にもクラック変形等
か生しないため、ＴＡＢ用スペーステープとして好適で
ある。Table 1 O No change in appearance × Cracks or breaks [Effects of the invention] The sorted molded product obtained by the present invention does not change the height of the molded part even at a high temperature of 170°C, and can be used in the TAB and semiconductor device manufacturing processes. Since the organic solvent used does not cause cracks or deformation, it is suitable as a TAB space tape.
第１図は本発明のＴＡＢ用スペーステープの平面図及び
断面図である。
特許出願人 住友ベークライト株式会社第１図
２凸部 ３凹部FIG. 1 is a plan view and a sectional view of the TAB space tape of the present invention. Patent applicant Sumitomo Bakelite Co., Ltd. Figure 1 2 convex parts 3 concave parts
Claims (1)
（以下ＴＡＢという）をリールに巻く際に、ＴＡＢに重
ね合わせて用いる両側縁部にエンボス凹凸を設けたスペ
ーステープであって、その主構成要素が下記式で表され
ることを特徴とするＴＡＢ用スペーステープ。 ▲数式、化学式、表等があります▼(1) Tape automated bonding tape (hereinafter referred to as TAB) is a space tape with embossed unevenness on both side edges that is used by overlapping the TAB when winding it onto a reel, and its main components are as follows: A space tape for TAB characterized by: ▲Contains mathematical formulas, chemical formulas, tables, etc.▼
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32125790A JP2839704B2 (en) | 1990-11-27 | 1990-11-27 | Space tape for TAB |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP32125790A JP2839704B2 (en) | 1990-11-27 | 1990-11-27 | Space tape for TAB |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH04192537A true JPH04192537A (en) | 1992-07-10 |
| JP2839704B2 JP2839704B2 (en) | 1998-12-16 |
Family
ID=18130558
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP32125790A Expired - Fee Related JP2839704B2 (en) | 1990-11-27 | 1990-11-27 | Space tape for TAB |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2839704B2 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002076064A (en) * | 2000-08-31 | 2002-03-15 | Dainichi Kasei Kogyo Kk | Spacer tape for tab |
| JPWO2005054345A1 (en) * | 2003-12-05 | 2007-06-28 | 住友ベークライト株式会社 | Film circuit board production process tape |
| EP1839467A1 (en) * | 2005-01-10 | 2007-10-03 | Suh, Kwang Suck | Anti-static spacer for high temperature curing process of flexible printed circuit board |
| JP2009060123A (en) * | 2008-10-20 | 2009-03-19 | Mitsubishi Plastics Inc | Film for spacer base of chip carrier |
| JP2009060124A (en) * | 2008-10-20 | 2009-03-19 | Mitsubishi Plastics Inc | Film for spacer base of chip carrier |
-
1990
- 1990-11-27 JP JP32125790A patent/JP2839704B2/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002076064A (en) * | 2000-08-31 | 2002-03-15 | Dainichi Kasei Kogyo Kk | Spacer tape for tab |
| JP4588181B2 (en) * | 2000-08-31 | 2010-11-24 | 株式会社アテクト | TAB spacer tape |
| JPWO2005054345A1 (en) * | 2003-12-05 | 2007-06-28 | 住友ベークライト株式会社 | Film circuit board production process tape |
| EP1839467A1 (en) * | 2005-01-10 | 2007-10-03 | Suh, Kwang Suck | Anti-static spacer for high temperature curing process of flexible printed circuit board |
| EP1839467A4 (en) * | 2005-01-10 | 2009-07-29 | Kwang Suck Suh | Anti-static spacer for high temperature curing process of flexible printed circuit board |
| JP2009060123A (en) * | 2008-10-20 | 2009-03-19 | Mitsubishi Plastics Inc | Film for spacer base of chip carrier |
| JP2009060124A (en) * | 2008-10-20 | 2009-03-19 | Mitsubishi Plastics Inc | Film for spacer base of chip carrier |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2839704B2 (en) | 1998-12-16 |
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