JPH04188698A - Electronic equipment case - Google Patents

Abstract

PURPOSE:To enable an electronic equipment case to be lessened in weight keeping it high in mechanical strength and improved in portability by a method wherein a cover is formed of thin member, and a reinforcing member specified in height and shape is provided inside the cover. CONSTITUTION:Resin is molded into a lower cover 1 formed in the shape of a square plate, and the base 1a of the cover 1 is formed thin-walled. Ribs 2 are provided optional in shape to the lower cover 1 so as to serve as a reinforcing member, and mounting ribs 2a are provided. The ribs 2 are so set in height as to bear against a board 5 or almost bear against the board 5 or electronic components 4 mounted on the board 5. By this setup, an electronic component case of this design can be lessened in weight keeping excellent in mechanical strength and improved in portability.

Description

[Detailed Description of the Invention] [Summary] The purpose of this invention is to reduce the weight of the housing of a thin electronic device while maintaining its strength and improve portability. In a case of an electronic device that is assembled by placing a mounted board inside and predetermined components outside, the cover is formed of a thin member, and a reinforcing member of a predetermined height is provided in a predetermined shape within the cover. and the board is provided on a thin panel fitted with the cover, or the board has the electronic component mounted on one side with a predetermined lead length by an attachment means, or is mounted externally on the cover. The predetermined part is configured to be directly attached to the cover.

[Industrial application field]

The present invention relates to a casing for an electronic device, and particularly to the structure of a casing forming a thin electronic device.

In recent years, many portable and convenient laptop and notebook types of personal computers, word processors, etc. have been sold. Although these devices are intended for portability, they are still heavy, and a reduction in weight is desired. Therefore, it is necessary to reduce the weight without reducing the strength of the housing.

[Conventional technology]

Conventionally, for example, small portable electronic devices used for information processing have been assembled into casings that are molded from resin, with a plate thickness of 2.5 to 3 mm to maintain strength. .

FIG. 6 shows a partial sectional view of a conventional small electronic device. Fig. 6 shows a part of a laptop-type personal computer, Fig. 6 (A) is a cross-sectional view of a part of the keyboard, and Fig. 6 (B) is a cross-sectional view of the rotating mechanism part of the display section. It is.

In FIG. 6(A), one end of a hook-shaped decorative panel 51 is attached to the periphery of a rectangular plate-shaped lower cover 50 to form a housing, and a key top 52a etc. is attached to the periphery of the other end. The board 52b of the keyboard unit 52 is also arranged. In this case, the thickness of the board 52b is generally 5 to 6 mm.

In addition, in FIG. 6(B), the end of the decorative panel 51 is formed into a wide hook shape, and there are screws 53a inside.
A mounting plate 55 is fixed to the mounting panel 54 by 53b. A display section 57 is rotatably mounted on the mounting plate 55 with a rotation mechanism section 56 interposed therebetween.

[Problem to be solved by the invention]

However, as described above, since the lower cover 50 and the decorative panel 51 are formed thickly, this becomes an obstacle to reducing the weight of the entire casing. In this case, it is conceivable to reduce the thickness of the casing, but there is a problem that the strength of the casing decreases if the thickness is made thin. In addition, as shown in FIG. 6, the board 52b of the keyboard unit 52 and the decorative panel 51 do not come into close contact with each other, and when the keyboard unit 52 is carried, liquids or minute metal pieces such as pins or staplers may enter the interior through gaps. The problem is that it is not portable.

SUMMARY OF THE INVENTION The present invention has been made in view of the above-mentioned problems, and an object of the present invention is to provide a casing for an electronic device that maintains strength, is lightweight, and has good portability.

[Means to solve the problem]

The above problem is solved by forming the cover from a thin member in a case of an electronic device in which a board on which electronic components are mounted is installed inside the cover and predetermined components are installed outside the cover, a reinforcing member of a predetermined height is provided in a predetermined shape, and the substrate is provided on a thin panel that is fitted with the cover,
Alternatively, the electronic component may be mounted on one side of the board using a mounting means with a predetermined lead length, or the predetermined component installed externally on the cover may be directly mounted on the cover.

[Effect]

As described above, it is possible to reduce the weight by forming the cover with a thin member, and to avoid a decrease in strength caused by making the cover thinner by providing a reinforcing member.

In addition, by providing a board on which electronic components are mounted on a thin panel that is fitted to the cover, foreign objects are prevented from entering the cover and are prevented from entering during carrying, improving portability. I can do it.

Further, by mounting the electronic components installed inside the cover on only one side of the board with a lead length that does not protrude to the back side of the board, the electronic parts can be made thinner and lighter.

Further, by directly attaching predetermined parts externally provided to the cover, there is no need to provide a conventional mounting panel, and it is possible to further reduce the weight.

〔Example〕 FIG. 1 shows a configuration diagram of an embodiment of the present invention.

In the following embodiments, an example of a laptop-type personal computer among electronic devices will be described.

In FIG. 1, the lower cover 1 is molded from resin into a rectangular dish shape, and the cover bottom 1a is, for example, 300 x 2
It is molded into a thin shape with an area of 0.00 mm' and a thickness of 1 mm.

As shown in FIG. 2(A), this lower cover l has a rib 2 which is a reinforcing member or an arbitrary shape (for example, a honeycomb structure).
At the same time, a mounting rib 2a is provided. The rib 2 is set at a height at which it will come into contact with a board, which will be described later, or at a height just before it comes into contact with the board or an electronic component mounted on the board.

Returning to FIG. 1, a panel 3 is formed of resin in the shape of a rectangular plate corresponding to the lower cover 1, and the bottom portion 3a of the panel is formed into a thin shape with a thickness of one inch. Also,
The peripheral edge of the panel 3 is formed into a hook shape.

On the back side of this panel 3, various electronic components 4 are placed in close contact with the back side of a board 5 mounted on one side, and on the panel 3, a key top electrically connected to the board 5 is placed. 6 are provided. In this case, a membrane or the like on which a predetermined pattern is formed may be interposed between the panel 3 and the substrate 5.

A panel 3 provided with a board 5 and a key top 6
The hook-shaped tip of the peripheral edge and the tip of the side surface of the lower cover 1 are fitted together, and the mounting rib 2a of the lower cover 1 is fitted.
It is fixed with screws 7. The fitted state of the lower cover 1 and panel 3 in this case is shown in FIG. 2(B).

Here, FIG. 3 shows a conceptual diagram of the state in which the electronic component 4 is mounted on the board 5. That is, in order to bring the board 5 into close contact with the panel 3, the leads 4a of the electronic components 4 are prevented from protruding from the back surface of the board 5. In FIG. 3, through holes 5a and 5b are formed in a substrate 5, and leads 4a of an electronic component (for example, dip type) 4 are formed.
.

4b is set to a length that does not protrude from the through holes 5a and 5b. Then, ring solders 8a and 8b serving as attachment means are passed through the leads 4a and 4b, and held by a solder holder 9, so that the leads 4a are attached.

4b into the through holes 5a and 5b of the board 5. Therefore, when the ring solders 8a and 8b are melted by heating in a reflow oven, they flow into the through holes 5a and 5b and are electrically connected.

In this way, the lower cover 1 is molded in a thin shape with a thickness of 1 mm, so it is possible to reduce the weight, and the rib 2
Reinforcement is achieved by That is, the short ribs 2 are reinforced against torsion, and the ribs 2 that come into contact with the substrate 5 are reinforced against deflection when the key top 6 is pressed, improving the strength after assembly. In addition, since the lower cover 1 is integrated with the panel 3, unexpected liquids (
For example, coffee, etc.) and minute metal parts (for example, staplers, insect pins, etc.) can be prevented from entering the inside. In particular, this is an effective means for small and lightweight devices, which are often stored in a bag or the like for transportation. Furthermore, since the electronic components 4 are mounted on the board 5 only on one side and the leads are not protruded from the back surface, the panel 3 and the board 5 can be brought into close contact with each other, and a thinner device can be obtained.

Next, FIG. 4 shows a sectional view of the attachment of parts installed externally to the main body of the device. In FIG. 4, screw fixing members 10a and 10b are integrally formed on the lower cover 1, and a rotating mechanism portion 11 and a screw 11a are integrally formed.

11b. A display section 12, which is an external component, is attached to the rotation mechanism section 11 so as to be rotatable in the direction of the arrow. That is, the load associated with the rotation of the display section 12 is no longer applied to the panel 3. Note that the rotation mechanism section 11 is covered by an up cover 3a.

This eliminates the need for a mounting plate (see Figure 6 (B)) for mounting the display section that is subject to a load, making it possible to reduce the size and weight of the panel 3 and prevent the accompanying decrease in strength. It is.

Here, FIG. 5 shows an exploded view of this embodiment. Fifth
In the figure, a board 5 on which electronic components are mounted on the opposite side in the drawing is fixed to a lower cover 1 provided with ribs 2 with screws 13, and a panel 3 is fitted onto the lower cover 1 from above, and the screws It is fixed by 7. In addition, 14
is a dummy board. In this case, the connector 15 on the board 5
．． 16 and the like are exposed from the rear of the panel 3, and the substrate 5 is in close contact with a conductive pattern membrane (not shown) provided on the back surface of the panel 3. Further, a plurality of key tops 6 are attached to the panel 3, and terminals 17 of the membrane are attached.
is connected to connector 16.

On the other hand, the rotation mechanism section 11 is fixed to the screw members 10a and 10b of the lower cover 1 on the substrate 5, and the display section 12 is rotatably attached to the rotation mechanism section 11. In this case, the terminal 12a of the display section 12 is connected to the connector 15 on the board 5. The exposed rear portion of the substrate 5 is covered by an upper cover 3a, and the rotation mechanism section 11 is covered by hidden plates 18a and 18b.

Although this embodiment shows the case where the present invention is applied to a laptop-type personal computer, the present invention is not limited to this and can be applied to small electronic devices such as word processors.

〔Effect of the invention〕

As described above, according to the present invention, a reinforcing member is provided on the cover of a thin member, a thin panel is fitted on the cover, a board is mounted on one side, or a predetermined external component is mounted on the cover. By abutting the device, it is possible to reduce the weight of the device while maintaining its strength, thereby improving portability.

[BRIEF DESCRIPTION OF THE DRAWINGS] Fig. 1 is a configuration diagram of an embodiment of the present invention, Fig. 2 is a diagram for explaining the lower cover and panel of Fig. 1, and Fig. 3 is a diagram showing mounting of electronic components on a board. FIG. 4 is a conceptual diagram of the state, FIG. 4 is a sectional view of the installation of parts installed externally on the main body of the device, FIG. 5 is an exploded assembly view of this embodiment, and FIG. 6 is a partial sectional view of a conventional small electronic device. In the figure, l is the lower cover, 1a is the bottom of the cover, 2 is the rib, 3 is the panel, 3a is the bottom of the panel, 4 is the electronic component, 5 is the board, 6 is the key top, 10a and 19b are the screw members, 11 is the rotation Mechanism part, 12 shows a display part. (B) Diagram 2 to explain the lower cover and panel in Figure 1 of the commode
Figure 3: A conceptual diagram of how electronic components are mounted on a board Figure 3: A cross-sectional view of the installation of components mounted outside the main body of the device Figure 4 (A): Partial cross-sectional view of a conventional laptop-type personal computer Figure 6:

Claims (4)

[Claims] (1) In a case of an electronic device that is assembled by installing a board (5) on which an electronic component (4) is mounted inside the cover (1) and installing a predetermined component (12) externally, the cover ( 1) is formed of a thin member, and a reinforcing member of a predetermined height is installed inside the cover (1). A casing for an electronic device, characterized in that (2) is provided in a predetermined shape. (2) The electronic device casing according to claim 1, wherein the substrate (5) is provided on a thin panel (3) that is fitted onto the cover (1). (3) Claim (1) characterized in that the electronic component (4) is mounted on one side of the board (5) with a predetermined lead length (4a, 4b) using attachment means (8a, 8b). Or (
2) The housing of the electronic device described. (4) The predetermined part (1) installed externally on the cover (1)
2) is directly attached to the cover (1), the electronic device housing according to claim 1, (2) or (3).