JPH04187769A - Substrate holder for dry coating process - Google Patents

Substrate holder for dry coating process

Info

Publication number
JPH04187769A
JPH04187769A JP31673590A JP31673590A JPH04187769A JP H04187769 A JPH04187769 A JP H04187769A JP 31673590 A JP31673590 A JP 31673590A JP 31673590 A JP31673590 A JP 31673590A JP H04187769 A JPH04187769 A JP H04187769A
Authority
JP
Japan
Prior art keywords
substrate
moving plate
plate
substrate holder
spring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP31673590A
Other languages
Japanese (ja)
Other versions
JP2788113B2 (en
Inventor
Toru Suga
亨 菅
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sumitomo Heavy Industries Ltd
Original Assignee
Sumitomo Heavy Industries Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Sumitomo Heavy Industries Ltd filed Critical Sumitomo Heavy Industries Ltd
Priority to JP31673590A priority Critical patent/JP2788113B2/en
Publication of JPH04187769A publication Critical patent/JPH04187769A/en
Application granted granted Critical
Publication of JP2788113B2 publication Critical patent/JP2788113B2/en
Anticipated expiration legal-status Critical
Expired - Lifetime legal-status Critical Current

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Abstract

PURPOSE:To prevent the warpage, deformation, etc., of a substrate and to easily mount the substrate by fixing the substrate to one longitudinal side of a rectangular frame and to a first mobile plate between the first and second mobile plates capable of being slid between the opposed longitudinal sides of the frame and connected by a spring. CONSTITUTION:Both ends of a substrate P are fixed to one longitudinal side 2A enclosing a substrate treating space S1 in a reactangular frame 2 of a holder 1 and to a first mobile plate 3 by bolts and nuts 12 and 13, etc., and a second mobile plate 4 is drawn in by a buckkle 6, etc., and fastened to the other longitudinal side 2B. A spring 5 is elastically deformed by the movement of the plate 4 toward the longitudinal side 2B, a tensile force is exerted on the substrate P by the elasticity through the plate 3. Even if the substrate P is heated and thermally expanded, the end of the substrate P on the plate 3 side pulled by the spring 5 and the plate 3 are smoothly moved toward the plate 4, the thermal expansion is absorbed, and the substrate P is not deformed. The substrate is mounted outside a vacuum chamber, the frame 2 is inserted into the housing groove of a substrate holder receiver, and the work is easily and rapidly performed.

Description

【発明の詳細な説明】 〔産業上の利用分野〕 この発明は、真空蒸着などのドライコーティングプロセ
スにおいて、表面処理を受ける基板を真空チャンバー内
に保持する基板ホルダに関するものである。
DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a substrate holder that holds a substrate undergoing surface treatment in a vacuum chamber in a dry coating process such as vacuum evaporation.

(従来技術〕 真空蒸着、イオンブレーティング等のドライコーティン
グは、金属や非金属を真空中で加熱蒸発させ、あるいは
イオン化して加速し、基板の表面に付着させて薄膜を形
成するプロセスであり、基板は一般に膜成形速度や膜質
の向上のために加熱しておく必要がある(常温〜500
°C程度)。
(Prior art) Dry coating such as vacuum evaporation and ion blating is a process in which metals and non-metals are heated and evaporated in vacuum, or ionized and accelerated, and then adhered to the surface of a substrate to form a thin film. Generally, the substrate needs to be heated to improve the film forming speed and film quality (from room temperature to 500 ℃).
(about °C).

第7図に示すのは、真空蒸着の例であり、真空チャンバ
ーC内の下部に蒸発容器50を配置し、上部にヒータを
内蔵した基板ホルダ51を固定し、この基板ホルダ51
の下面に、基板Pを処理面を下向きにして取付けるよう
にされている。
FIG. 7 shows an example of vacuum evaporation, in which an evaporation container 50 is placed in the lower part of the vacuum chamber C, and a substrate holder 51 with a built-in heater is fixed in the upper part.
The substrate P is mounted on the lower surface of the substrate P with the processing surface facing downward.

このような構成において、基板Pと基板ホルダ51の接
続に従来はボルト52を用い、基板Pの周辺部を数ケ所
ボルト締めすることにより基板Pを基板ホルダ51に取
付けていた。
In such a configuration, conventionally, bolts 52 are used to connect the board P and the board holder 51, and the board P is attached to the board holder 51 by tightening the bolts at several locations around the board P.

[この発明が解決しようとする課題] 前述のような従来のボルト締めでは、加熱された基板が
熱膨張する際、ボルト締め部分で拘束され、特に基板が
薄板の場合に熱歪による反り、変形等が発生し、コーテ
イング品質の低下の原因となる。
[Problems to be Solved by the Invention] In the conventional bolting method as described above, when the heated board expands thermally, it is restrained at the bolted part, which causes warpage and deformation due to thermal strain, especially when the board is a thin plate. etc., resulting in a decrease in coating quality.

また、狭い真空チャンバー内でのボルト締め作業である
ため、作業が面倒であると共に作業時間がかかり、作業
性が悪い。
Further, since the bolt tightening work is performed in a narrow vacuum chamber, the work is troublesome and takes a long time, resulting in poor work efficiency.

この発明は、前述のような問題点を解消すべ(なされた
もので、その目的は、基板の熱歪による反り、変形等を
防止でき、しかも基板の取付作業を容易に、迅速に行な
うことのできるドライコーティングプロセスにおける基
板ホルダを提供することにある。
This invention has been made to solve the above-mentioned problems, and its purpose is to prevent warping and deformation of the board due to thermal distortion, and to make the work of mounting the board easy and quick. The purpose of the present invention is to provide a substrate holder that can be used in a dry coating process.

〔課題を解決するための手段〕[Means to solve the problem]

本発明は、表面処理を受ける基板Pを真空チャンバーC
内に保持するドライコーティングプロセスにおける基板
ホルダにおいて、第1図ないし第3図に示すように、矩
形フレーム2の対向縦辺2A、2B間に、この対向縦辺
2 A、2Bと平行な第1移動プレート3と第2移動プ
レート4とを、基板処理スペースSlをおいて、他の対
向横辺2C12Dを案内としてスライド可能に配設し、
基板Pの両端部を前記基板処理スペースSIを挟む第1
移動プレート3と一方の縦辺2Aにそれぞれボルト・ナ
ンド12.13等により着脱可能に取付け、第1移動プ
レート3と第2移動プレート4とをばね5で連結し、第
2移動プレート4を他方の縦辺2Bにバックル6等を用
いて引込み連結するようにしたものである。
In the present invention, a substrate P to be subjected to surface treatment is placed in a vacuum chamber C.
As shown in FIGS. 1 to 3, in the substrate holder for the dry coating process held in the substrate holder, a first The movable plate 3 and the second movable plate 4 are arranged so as to be slidable with the substrate processing space Sl apart using the other opposing horizontal side 2C12D as a guide,
Both ends of the substrate P are connected to a first
The movable plate 3 and one vertical side 2A are removably attached to each other with bolts and nands 12, 13, etc., the first movable plate 3 and the second movable plate 4 are connected by a spring 5, and the second movable plate 4 is attached to the other side. A buckle 6 or the like is used to connect the vertical side 2B by pulling it.

また、引込み連結は、バックル6に限らず、C字形リン
ク30とレバー31によるもの(第8図参照)、あるい
はワイヤ40とウオーム機構41によるもの(第9図参
照)等でもよい。
Further, the retractable connection is not limited to the buckle 6, but may be a C-shaped link 30 and a lever 31 (see FIG. 8), or a wire 40 and a worm mechanism 41 (see FIG. 9).

さらに、第10図に示すように、第2移動プレート4を
省略し、移動プレート3にC字状ばね50の一端を連結
し、このC字状ばね50の他端を、縦辺2Bに回転支持
させたレバー51に連結するようにしてもよい。
Furthermore, as shown in FIG. 10, the second moving plate 4 is omitted, one end of a C-shaped spring 50 is connected to the moving plate 3, and the other end of this C-shaped spring 50 is rotated to the vertical side 2B. It may also be connected to the supported lever 51.

また、第6図に示すように、フレーム2と基板ホルダ受
7を別体とし、フレーム2を基板ホルダ受7の収納溝1
9内に挿入するようにする。
In addition, as shown in FIG.
Make sure to insert it within 9.

〔作 用〕[For production]

第1図ないし第3図において基板Pの両端部を基板処理
スペースS、を挟む一方の縦辺2Aと第1移動プレート
3とにボルト・ナツト12.13等により固定し、第2
移動プレート4を他方の縦辺2Bにバックル6等により
引込んで締結する。
In FIGS. 1 to 3, both ends of the substrate P are fixed to one vertical side 2A sandwiching the substrate processing space S and the first moving plate 3 with bolts and nuts 12, 13, etc., and the second
The movable plate 4 is pulled in and fastened to the other vertical side 2B using a buckle 6 or the like.

第2移動プレート4の縦辺2B側への移動により、ばね
5が弾性変形し、このばね5の弾性力により初張力が第
1移動プレート3を介して基板Pに付与される。基板P
が加熱により熱膨張しても、ばね5により引張状態の基
板Pの第1移動プレート側端および第1移動プレート3
が円滑に第2移動プレート4側に移動し、前記熱膨張が
吸収され、基板Pの変形が防止される。
As the second moving plate 4 moves toward the vertical side 2B, the spring 5 is elastically deformed, and the elastic force of the spring 5 applies initial tension to the substrate P via the first moving plate 3. Board P
Even if thermally expands due to heating, the first movable plate side end of the substrate P in tension due to the spring 5 and the first movable plate 3
moves smoothly toward the second moving plate 4, the thermal expansion is absorbed, and deformation of the substrate P is prevented.

第10図の場合には、C字状ばね50とレバー51がば
ねと連結具を兼ね、第2移動プレート4を省略できる利
点を有する。
In the case of FIG. 10, the C-shaped spring 50 and the lever 51 serve as both a spring and a connector, and there is an advantage that the second moving plate 4 can be omitted.

また、基板Pの取付けを真空チャンバーCの外部におい
て行なうことができ、また矩形フレーム2を基板ホルダ
受7の収納溝19に挿入すればよいので、作業を容易か
つ迅速に行なうことができる。
Further, since the substrate P can be attached outside the vacuum chamber C and the rectangular frame 2 only needs to be inserted into the storage groove 19 of the substrate holder receiver 7, the work can be carried out easily and quickly.

〔実施例] 以下、この発明を図示する一実施例に基づいて説明する
。第1図ないし第3図に示すように、本発明の基板ホル
ダ1は、主として矩形フレーム2、第1移動プレート3
、第2移動プレート4、引張コイルばね5、バックル6
から構成し、第6図に示すように、基板ホルダ受7に取
付けるようにする。
[Example] The present invention will be described below based on an illustrative example. As shown in FIGS. 1 to 3, the substrate holder 1 of the present invention mainly includes a rectangular frame 2, a first movable plate 3,
, second moving plate 4, tension coil spring 5, buckle 6
6, and is attached to the substrate holder receiver 7, as shown in FIG.

矩形フレーム2は、対向する一対の縦辺2A。The rectangular frame 2 has a pair of opposing vertical sides 2A.

2Bと一対の横辺2C,2Dからなる平面視四角枠であ
り、基板Pがその長さ方向が横辺長さ方向と一致するよ
うに矩形フレーム2の上面に重ねて取付けられ、また、
内部に基板Pの表面処理スペースS1と第1、第2移動
プレート3.4等の設置スペースS2を形成し得る大き
さとする。
2B, and a pair of horizontal sides 2C and 2D, which is a rectangular frame in plan view, and the substrate P is mounted on the upper surface of the rectangular frame 2 so that its length direction coincides with the length direction of the horizontal sides, and
The size is such that a surface treatment space S1 for the substrate P and an installation space S2 for the first and second moving plates 3.4 etc. can be formed inside.

第1、第2移動プレート3.4は、スペースs、、S、
の縦辺2B側に縦辺2A、2Bと平行となるように配設
し、かつ一対の横辺2C22Dに横辺長さ方向(基板長
さ方向)にスライド可能に案内支持させる。この案内支
持は、例えば横辺2C12DのスペースS2側における
上下面内側を切欠いて凸条8を形成し、この凸条8に係
合する凹溝9を第1、第2移動プレート3.4の両端部
に形成して行なう(第4図参照)。
The first and second moving plates 3.4 have spaces s, , S,
It is disposed on the vertical side 2B side of the board so as to be parallel to the vertical sides 2A and 2B, and is guided and supported by a pair of horizontal sides 2C22D so as to be slidable in the horizontal side length direction (substrate length direction). This guide support is achieved, for example, by cutting out the inner side of the upper and lower surfaces of the horizontal side 2C12D on the space S2 side to form a protrusion 8, and forming a groove 9 that engages with the protrusion 8 between the first and second moving plates 3.4. This is done by forming it on both ends (see Figure 4).

第1移動プレート3は、表面処理スペースS。The first moving plate 3 is a surface treatment space S.

側に配置し、この第1移動プレート3と縦辺2Aに、ボ
ルト孔11を長さ方向に間隔をおいて複数穿設し、基板
Pの長さ方向両端部をボルト12・ナツト13により取
付ける。第5図に示すように、ボルト12は座付ボルト
とし、基板Pのボルト孔10、プレート3・縦辺2Aの
ポルト孔工1に上から挿入し、ボルト12の先端にナツ
ト13を螺着する。また、ボルト12はローレット目付
ボルト、ナツト13は蝶ナツトとして容易に着脱ができ
るようにする。
A plurality of bolt holes 11 are formed at intervals in the length direction on the first moving plate 3 and the vertical side 2A, and both longitudinal ends of the board P are attached with bolts 12 and nuts 13. . As shown in FIG. 5, the bolt 12 is a bolt with a seat, and is inserted from above into the bolt hole 10 of the board P, the port hole 1 of the plate 3 and the vertical side 2A, and the nut 13 is screwed onto the tip of the bolt 12. do. Further, the bolt 12 is a knurled bolt, and the nut 13 is a wing nut so that they can be easily attached and detached.

第1移動プレート3と第2移動プレート4とは、長さ方
向に間隔をおいて複数配設した引張コイルばね5で連結
し、第2移動プレート4と縦辺2Bとをバックル6で着
脱可能に連結する。
The first moving plate 3 and the second moving plate 4 are connected by a plurality of tension coil springs 5 arranged at intervals in the length direction, and the second moving plate 4 and the vertical side 2B can be attached and detached with a buckle 6. Connect to.

バックル6は、取付板14にプレート移動方向(基板長
さ方向)に揺動自在にピン着されたレバー15と、この
レバー15に上下揺動自在にピン着されたフック16と
、このフック16が着脱可能に係止されるフック受17
からなり、レバー15を■方向に傾動させることにより
フック受17を取付板14側に引込んで締結する金具で
あり、取付板14を縦辺2Bの上面に、フック受17を
第2移動プレート4の上面に固定する。
The buckle 6 includes a lever 15 pinned to the mounting plate 14 so as to be swingable in the plate movement direction (board length direction), a hook 16 pinned to the lever 15 so as to be swingable up and down, and the hook 16 Hook receiver 17 to which is removably locked
It is a metal fitting that pulls the hook receiver 17 toward the mounting plate 14 side and fastens it by tilting the lever 15 in the {circle around (2)} direction. Fix it on the top surface of the

引張コイルばね5は、バックル締結前においてフック1
6がフック受17に係合し得る自由長さを有し、かつバ
ックル締結後は基板Pの長さ方向熱膨張を充分に吸収し
得る初張力を基板Pに付与し得るばね定数を有するもの
を用いる。
The tension coil spring 5 is attached to the hook 1 before the buckle is fastened.
6 has a free length that can be engaged with the hook receiver 17, and has a spring constant that can provide the substrate P with an initial tension that can sufficiently absorb the longitudinal thermal expansion of the substrate P after the buckle is fastened. Use.

基板ホルダ受7は、真空チャンバーCの上部に固定され
ており、第6図に示すように、下部に下面が開口し、リ
ップ支持片18を有する収納溝19を形成し、この収納
溝19の上部にヒータHを配設し、下部に基板ホルダ1
を挿入するようにする。基板ホルダ1は基板1、バック
ル6を上にして収納溝19内に水平方向から挿入し、リ
ップ支持片18に支持させる。一方のリップ支持片18
の上面には凸条20を形成し、この凸条20に係合する
凹溝21を矩形フレーム2の縦辺あるいは横辺の下面に
形成し、基板ホルダ1を容易に挿入し、正確に位置決め
できるようにする。なお、挿入方向の位置決めは、基板
ホルダ受7に設けたストッパ(図示せず)にフレーム2
の端面を当てて行なう。また、基板ホルダ1の固定は基
板ホルダ受7に螺着した蝶ボルト22の先端をフレーム
2の側面に当てて行なう。
The substrate holder receiver 7 is fixed to the upper part of the vacuum chamber C, and as shown in FIG. A heater H is installed on the top, and a substrate holder 1 is placed on the bottom.
to be inserted. The substrate holder 1 is inserted horizontally into the storage groove 19 with the substrate 1 and buckle 6 facing upward, and is supported by the lip support piece 18. One lip support piece 18
A protruding strip 20 is formed on the upper surface, and a groove 21 that engages with the protruding strip 20 is formed on the lower surface of the vertical or horizontal sides of the rectangular frame 2, so that the substrate holder 1 can be easily inserted and positioned accurately. It can be so. Note that positioning in the insertion direction is performed by attaching the frame 2 to a stopper (not shown) provided on the board holder receiver 7.
Place the end face of the Further, the substrate holder 1 is fixed by applying the tip of a butterfly bolt 22 screwed onto the substrate holder receiver 7 to the side surface of the frame 2.

以上のような構成において、次のように基板Pの取付け
を行なう。
In the above configuration, the board P is attached as follows.

(i)  真空チャンバーCの外部において、矩形フレ
ーム2をバックル6を上にして作業テーブル、机等の上
に置く。
(i) Outside the vacuum chamber C, place the rectangular frame 2 on a work table, desk, etc. with the buckle 6 facing upward.

(jOバックル6のレバー15を■方向に引き起こして
フック16とフック受17の保合を外しておき、基板P
をその長さ方向両端部が縦辺2A、第1移動プレート3
上に位置するように矩形フレーム2の上面に載置する。
(Pull the lever 15 of the jO buckle 6 in the direction ■ to release the hook 16 and hook receiver 17, and then
Both longitudinal ends thereof are vertical sides 2A, and the first moving plate 3
It is placed on the upper surface of the rectangular frame 2 so as to be positioned above.

GiD  基板Pのボルト孔10と縦辺2A・第1移動
プレート3のボルト孔11を一致させ、ボルト・ナツト
12.13で基板Pの両端を縦辺2Aと第1移動プレー
ト3に固定する。
The bolt holes 10 of the GiD substrate P are aligned with the bolt holes 11 of the vertical side 2A and the first moving plate 3, and both ends of the substrate P are fixed to the vertical side 2A and the first moving plate 3 using bolts and nuts 12 and 13.

GV)  この状態でフック16はフック受17に保合
可能であり、レバー15を■方向に引き倒すことにより
、第2移動プレート4が縦辺2B側に引き込み移動しつ
つ縦辺2Bに締結される。第2移動プレート4の移動に
より引張コイルばね5が伸長され、伸長量とばね定数に
比例した初張力が第1移動プレート3を介して基板Pに
付与される。
GV) In this state, the hook 16 can be held in the hook receiver 17, and by pulling down the lever 15 in the {circle around (2)} direction, the second moving plate 4 is pulled toward the vertical side 2B and fastened to the vertical side 2B. Ru. The tension coil spring 5 is expanded by the movement of the second moving plate 4, and an initial tension proportional to the amount of extension and the spring constant is applied to the substrate P via the first moving plate 3.

(ロ) このように基板Pのセットが完了すると、基板
ホルダ1を真空チャンバーC内に入れ、基板ホルダ受7
の収納溝19内に凸条20と凹溝21を合わせて押し込
む。基板ホルダ1がストッパに当たると、蝶ボルト22
を締め付けて基板ホルダ1を基板ホルダ受7に固定する
(b) When the setting of the substrate P is completed in this way, the substrate holder 1 is placed in the vacuum chamber C, and the substrate holder holder 7
The protrusions 20 and the concave grooves 21 are aligned and pushed into the storage groove 19. When the board holder 1 hits the stopper, the butterfly bolt 22
Tighten to fix the board holder 1 to the board holder receiver 7.

(Vi)  このような状態でヒータHにより基板Pを
上から加熱し、真空状態で下から表面処理を施す。基板
Pが長さ方向に熱膨張しても、引張コイルばね5により
引張状態の基板Pのプレート側および第1移動プレート
3が円滑に第2移動プレート4側に移動し、基板Pの変
形が防止される。移動後も基板Pには張力が付与されて
おり、基板Pを拘束することはない。なお、基板Pはヒ
ータによる加熱を受けて幅方向(縦辺長さ方向)にも熱
膨張するが、引張コイルばね5による引張状態では幅方
向の変形は極めて少なくなり、特別な対策はいらない。
(Vi) In this state, the substrate P is heated from above by the heater H, and surface treatment is performed from below in a vacuum state. Even if the substrate P thermally expands in the length direction, the tension coil spring 5 smoothly moves the plate side of the substrate P in tension and the first moving plate 3 toward the second moving plate 4 side, and the deformation of the substrate P is prevented. Prevented. Tension is applied to the substrate P even after the movement, and the substrate P is not restrained. Note that although the substrate P thermally expands in the width direction (longitudinal length direction) when heated by the heater, deformation in the width direction becomes extremely small under tension by the tension coil spring 5, and no special measures are required.

に)表面処理が終了すると、基板ホルダ1を前述と逆の
手順で基板ホルダ受7から外し、作業テーブル等の上で
バックル6を外し、次いでボルト・ナツト12.13を
外せば、基板Pを基板ホルダ1から容易に取り外すこと
ができる。
(b) When the surface treatment is completed, remove the substrate holder 1 from the substrate holder holder 7 in the reverse order as described above, remove the buckle 6 on a work table, etc., and then remove the bolts and nuts 12 and 13 to remove the substrate P. It can be easily removed from the substrate holder 1.

なお、前記実施例では、バックル6により引込み連結す
る例を示したが、第8図に示すように、一端が第2移動
プレート4に軸着されたC字形リンク30と、縦辺2B
に基部が軸着されたし字状レバー31を用い、レバー3
1の回動によりC字形リンク30の先端をレバー31の
軸着部32に係止させるようにしたものでもよく、第9
図に示すように、ワイヤ40とウオーム機構41を用い
、一端を第2移動プレート4に接続したワイヤ40をウ
オーム機構41のホイールのドラム42に巻き掛け、ウ
オーム機構41によりワイヤ40を引張って引込み連結
するものでもよい。
In the above embodiment, an example was shown in which the buckle 6 is used to retract the connection, but as shown in FIG.
Using the L-shaped lever 31 whose base is pivoted to the
The tip of the C-shaped link 30 may be locked to the shaft attachment part 32 of the lever 31 by the rotation of No. 9.
As shown in the figure, using a wire 40 and a worm mechanism 41, the wire 40 whose one end is connected to the second moving plate 4 is wound around the drum 42 of the wheel of the worm mechanism 41, and the wire 40 is pulled and retracted by the worm mechanism 41. They may be connected.

また、第10図に示すように、第8図と同様のC字状ば
ね50とし字状レバー51を用い、C字状ばね50のば
ね作用により移動プレート3を引張って基板Pに初張力
を与え、かつC字状ばね50の先端をレバー51の軸着
部52に係止させるようにしてもよい。この場合、第2
移動プレート4が省略できる利点を有する。
Further, as shown in FIG. 10, using a C-shaped spring 50 and a cross-shaped lever 51 similar to that shown in FIG. In addition, the tip of the C-shaped spring 50 may be locked to the shaft attachment portion 52 of the lever 51. In this case, the second
This has the advantage that the moving plate 4 can be omitted.

なお、基板Pはフレーム2の下面に設けることもできる
。また、基板Pを処理面を下向きにして取付ける例を示
したが、これに限らずその他の基板の処理姿勢にも通用
できることはいうまでもない。
Note that the substrate P can also be provided on the lower surface of the frame 2. Further, although an example has been shown in which the substrate P is mounted with the processing surface facing downward, it goes without saying that the present invention is not limited to this and can be applied to other substrate processing positions.

[発明の効果〕 前述の通り、この発明に係る基板ホルダは、矩形フレー
ムの対向縦辺間に、この対向縦辺と平行な第1、第2移
動プレートを他の対向横辺を案内としてスライド可能に
配設し、基板の両端部を第1移動プレートと一方の縦辺
にそれぞれ着脱可能に取付け、第1移動プレートと第2
移動プレートとをばねで連結し、第2移動プレートを他
方の縦辺に引込み連結し、あるいは移動プレートにC字
状ばねの一端を連結し、このばねの他端を、他方の縦辺
に回転支持させたレバーに連結するようにしたため、さ
らにフレームを基板フレーム受の収納溝に挿入するよう
にしたため、次のような効果を奏する。
[Effects of the Invention] As described above, the substrate holder according to the present invention slides the first and second movable plates parallel to the opposing vertical sides between the opposing vertical sides of the rectangular frame using the other opposing horizontal sides as guides. both ends of the board are removably attached to the first moving plate and one vertical side, and the first moving plate and the second
A second moving plate is connected to the moving plate by a spring, and the second moving plate is pulled and connected to the other vertical side, or one end of a C-shaped spring is connected to the moving plate, and the other end of this spring is rotated to the other vertical side. Since the frame is connected to the supported lever and the frame is inserted into the storage groove of the board frame holder, the following effects are achieved.

(i)  基板が加熱により熱膨張しても、基板に張力
を付加しているため、基板の移動プレート側端が円滑に
移動して前記熱膨張が吸収され、基板の反り、変形等が
防止される。これによりコーテイング品質の向上を図れ
る。
(i) Even if the substrate expands thermally due to heating, since tension is applied to the substrate, the end of the substrate on the moving plate side moves smoothly and absorbs the thermal expansion, preventing warpage, deformation, etc. of the substrate. be done. This makes it possible to improve coating quality.

(jO真空チャンバーの外部において、矩形フレームに
基板を取付けることができ、さらに基板を取付けた矩形
フレームを容易に真空チャンバー内に挿入、保持するこ
とができ、取付作業を容易かつ迅速に行なうことができ
、作業能率の向上を図ることができる。
(The board can be mounted on the rectangular frame outside the jO vacuum chamber, and the rectangular frame with the board mounted can be easily inserted and held in the vacuum chamber, making the mounting work easy and quick. It is possible to improve work efficiency.

【図面の簡単な説明】[Brief explanation of drawings]

第1図、第2図は、この発明に係る基板ホルダを示す平
面図、正面図、第3図、第4図は第1図のm−■線視図
、■線断面図、第5図は基板の取付部分を示す拡大断面
図、第6図は本発明の基板ホルダ受を示す正面図、第7
図は従来の基板ホルダを取付けた真空チャンバーを示す
概略図、第8図、第9図、第10図は本発明の変形例を
示す平面図である。 1・・・基板ホルダ、   2・・・矩形フレーム2A
、2B・・・縦辺    2C12D・・・横辺3・・
・第1移動プレート 4・・・第2移動プレート 5・・・引張コイルばね、6・・・ハ′ツクルア・・・
基板ホルダ受、 8・・・凸条9・・・凹溝、    
 10.11・・・ボルト孔12・・・ボルト、   
 13・・・ナツト14・・・取付1.15・・・レバ
ー 16・・・フック、     17・・・フック受18
・・・リップ支持片、 19・・・収納溝20・・・凸
条、     21・・・凹溝22・・・ボルト。 第6図
1 and 2 are a plan view and a front view showing a substrate holder according to the present invention, FIGS. 3 and 4 are a view taken along the line m-■ of FIG. 1, a cross-sectional view taken along the line ■, and FIG. 6 is an enlarged sectional view showing the mounting part of the board, FIG. 6 is a front view showing the board holder receiver of the present invention, and FIG.
The figure is a schematic view showing a vacuum chamber with a conventional substrate holder attached, and FIGS. 8, 9, and 10 are plan views showing modifications of the present invention. 1... Board holder, 2... Rectangular frame 2A
, 2B... Vertical side 2C12D... Horizontal side 3...
・First moving plate 4...Second moving plate 5...Tension coil spring, 6...Hatsukuru...
Board holder holder, 8... Convex line 9... Concave groove,
10.11...Bolt hole 12...Bolt,
13... Nut 14... Installation 1.15... Lever 16... Hook, 17... Hook receiver 18
... Lip support piece, 19 ... Storage groove 20 ... Convex strip, 21 ... Concave groove 22 ... Bolt. Figure 6

Claims (3)

【特許請求の範囲】[Claims] (1)表面処理を受ける基板を真空チャンバー内に保持
するドライコーティングプロセスにおける基板ホルダに
おいて、 矩形フレームの対向縦辺間に、この対向縦辺と平行な第
1移動プレートと第2移動プレートとを、基板処理スペ
ースをおいて、他の対向横辺を案内としてスライド可能
に配設し、基板Pの両端部を前記基板処理スペースを挟
む第1移動プレートと一方の縦辺にそれぞれ着脱可能に
取付け、第1移動プレートと第2移動プレートとをばね
で連結し、第2移動プレートを他方の縦辺に引込み連結
してなることを特徴とするドライコーティングプロセス
における基板ホルダ。
(1) In a substrate holder for a dry coating process that holds a substrate to be surface-treated in a vacuum chamber, a first moving plate and a second moving plate parallel to the opposing vertical sides are arranged between opposing vertical sides of a rectangular frame. , with a substrate processing space in between, the other opposite horizontal sides are arranged to be slidable as guides, and both ends of the substrate P are removably attached to a first moving plate sandwiching the substrate processing space and one vertical side, respectively. A substrate holder for use in a dry coating process, characterized in that a first moving plate and a second moving plate are connected by a spring, and the second moving plate is retracted and connected to the other vertical side.
(2)表面処理を受ける基板を真空チャンバー内に保持
するドライコーティングプロセスにおける基板ホルダに
おいて、 矩形フレームの対向縦辺間に、この対向縦辺と平行な移
動プレートを、基板処理スペースをおいて、他の対向横
辺を案内としてスライド可能に配設し、基板Pの両端部
を前記基板処理スペースを挟む移動プレートと一方の縦
辺にそれぞれ着脱可能に取付け、移動プレートにC字状
ばねの一端を連結し、該ばねの他端を、他方の縦辺に回
転支持させたレバーに連結してなることを特徴とするド
ライコーティングプロセスにおける基板ホルダ。
(2) In a substrate holder for a dry coating process that holds a substrate undergoing surface treatment in a vacuum chamber, a moving plate parallel to the opposite vertical sides of the rectangular frame is placed between the opposite vertical sides with a substrate processing space, It is arranged to be slidable using the other opposite horizontal side as a guide, and both ends of the substrate P are removably attached to a moving plate sandwiching the substrate processing space and one vertical side, and one end of a C-shaped spring is attached to the moving plate. A substrate holder for use in a dry coating process, characterized in that the other end of the spring is connected to a lever rotatably supported by the other vertical side.
(3)請求項(1)または(2)において、フレームと
基板ホルダ受を別体とし、フレームを基板ホルダ受の収
納溝に挿入してなることを特徴とするドライコーティン
グプロセスにおける基板ホルダ。
(3) A substrate holder for use in a dry coating process according to claim (1) or (2), characterized in that the frame and the substrate holder receiver are separate bodies, and the frame is inserted into a storage groove of the substrate holder receiver.
JP31673590A 1990-11-21 1990-11-21 Substrate holder in dry coating process Expired - Lifetime JP2788113B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP31673590A JP2788113B2 (en) 1990-11-21 1990-11-21 Substrate holder in dry coating process

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP31673590A JP2788113B2 (en) 1990-11-21 1990-11-21 Substrate holder in dry coating process

Publications (2)

Publication Number Publication Date
JPH04187769A true JPH04187769A (en) 1992-07-06
JP2788113B2 JP2788113B2 (en) 1998-08-20

Family

ID=18080324

Family Applications (1)

Application Number Title Priority Date Filing Date
JP31673590A Expired - Lifetime JP2788113B2 (en) 1990-11-21 1990-11-21 Substrate holder in dry coating process

Country Status (1)

Country Link
JP (1) JP2788113B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101042975B1 (en) * 2010-11-10 2011-06-20 주식회사 석원 Glass fixing device for sputtering coating
CN104213092A (en) * 2013-05-31 2014-12-17 信利光电股份有限公司 Clamp
CN104278248A (en) * 2013-07-03 2015-01-14 台积太阳能股份有限公司 Enhanced selenium supply in copper indium gallium selenide processes

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR101042975B1 (en) * 2010-11-10 2011-06-20 주식회사 석원 Glass fixing device for sputtering coating
CN104213092A (en) * 2013-05-31 2014-12-17 信利光电股份有限公司 Clamp
CN104278248A (en) * 2013-07-03 2015-01-14 台积太阳能股份有限公司 Enhanced selenium supply in copper indium gallium selenide processes

Also Published As

Publication number Publication date
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