JPH0418474U - - Google Patents

Info

Publication number
JPH0418474U
JPH0418474U JP5724290U JP5724290U JPH0418474U JP H0418474 U JPH0418474 U JP H0418474U JP 5724290 U JP5724290 U JP 5724290U JP 5724290 U JP5724290 U JP 5724290U JP H0418474 U JPH0418474 U JP H0418474U
Authority
JP
Japan
Prior art keywords
wiring board
printed wiring
land portions
substrate
pair
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP5724290U
Other languages
English (en)
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP5724290U priority Critical patent/JPH0418474U/ja
Publication of JPH0418474U publication Critical patent/JPH0418474U/ja
Pending legal-status Critical Current

Links

Landscapes

  • Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
JP5724290U 1990-06-01 1990-06-01 Pending JPH0418474U (US06373033-20020416-M00071.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP5724290U JPH0418474U (US06373033-20020416-M00071.png) 1990-06-01 1990-06-01

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP5724290U JPH0418474U (US06373033-20020416-M00071.png) 1990-06-01 1990-06-01

Publications (1)

Publication Number Publication Date
JPH0418474U true JPH0418474U (US06373033-20020416-M00071.png) 1992-02-17

Family

ID=31581779

Family Applications (1)

Application Number Title Priority Date Filing Date
JP5724290U Pending JPH0418474U (US06373033-20020416-M00071.png) 1990-06-01 1990-06-01

Country Status (1)

Country Link
JP (1) JPH0418474U (US06373033-20020416-M00071.png)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006032622A (ja) * 2004-07-15 2006-02-02 Mitsubishi Electric Corp リードレスパッケージの実装構造
JP2008060182A (ja) * 2006-08-30 2008-03-13 Hitachi Ltd 車載用電子回路装置
JP2011142130A (ja) * 2010-01-05 2011-07-21 Murata Mfg Co Ltd 実装基板への電子部品の実装構造、実装基板、および電子部品が実装された実装基板
JP2012004590A (ja) * 2011-08-31 2012-01-05 Hitachi Automotive Systems Ltd 車載用電子回路装置の製造方法または電子回路装置
JP2013021486A (ja) * 2011-07-11 2013-01-31 Nippon Dempa Kogyo Co Ltd 発振器及びその製造方法

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2006032622A (ja) * 2004-07-15 2006-02-02 Mitsubishi Electric Corp リードレスパッケージの実装構造
JP2008060182A (ja) * 2006-08-30 2008-03-13 Hitachi Ltd 車載用電子回路装置
JP2011142130A (ja) * 2010-01-05 2011-07-21 Murata Mfg Co Ltd 実装基板への電子部品の実装構造、実装基板、および電子部品が実装された実装基板
JP2013021486A (ja) * 2011-07-11 2013-01-31 Nippon Dempa Kogyo Co Ltd 発振器及びその製造方法
JP2012004590A (ja) * 2011-08-31 2012-01-05 Hitachi Automotive Systems Ltd 車載用電子回路装置の製造方法または電子回路装置

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