JPH04179146A - Semiconductor wafer housing case - Google Patents

Abstract

PURPOSE:To protect semiconductor wafers against fogging by a method wherein guides which enable the semiconductor wafers to be separately provided upright at prescribed intervals are provided to a housing case main body, a lid is provided so as to cover the housing case, and a thermal insulating layer is provided inside the housing case main body and the lid. CONSTITUTION:A housing case main body 1 formed of synthetic resin has a double-wall structure where a thermal insulating layer 2 which is hollow and filled with air is provided. A lid 6 is also formed of synthetic resin and has a double-wall structure where a thermal insulating layer 7 hollow and filled with air is provided. Semiconductor wafers 11 are separately arranged between guides 3 provided to the housing case at a certain interval. In this state, the housing main body 1 is covered with the lid 6, the main body 1 and the lid 6 are fixed together, and the wafers 11 are fixed by wafer pressing pieces 10. By this setup, wafers are protected against fogging when they are transferred, and the housing and the unloading operation of wafers can be easily carried out.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a storage case used when transporting semiconductor wafers.

[Conventional technology]

Conventionally, the following methods have been used to transport semiconductor wafers when shipping them. That is, the semiconductor wafer was stored in a special case in a clean room, and the special case was placed in a polyvinyl chloride bag or a composite bag made of layers of aluminum and synthetic resin, and the bag was melt-sealed and sealed. After that, they are transported out of the clean room and stored in an exterior box made of cardboard. Examples of composite bags made of layers of aluminum and synthetic resin include PET.
/PE/AfI/PE/LLDPE is known. This composite bag has superior strength and sealing properties to bags made of polyvinyl chloride.

The reasons for putting the special case in the bag are as follows. If the special case is not placed in a bag, impurities from the outside air will enter the special case. Furthermore, if the case is directly stored in an outer box, dust will adhere to the outer periphery of the case and will be carried into the clean room. On the contrary,
By putting the special case in a bag, you can prevent impurities from entering the outside air. In addition, by putting the special case in a bag, you can prevent dust from adhering to the case.
By removing the case from the bag before transporting it into the clean room, it is possible to prevent dust from being brought into the clean room.

[Problem to be solved by the invention]

However, with the conventional method described above, when a special case for wafers or an outer box containing them is transported by aircraft, the water vapor inside the case may condense on the surface of the wafer as the temperature in the cargo hold drops. .

On the other hand, NOx, 5SOx, 1NH3, etc., which originate from chemicals used in clean rooms, are attached to the special case. If condensation occurs on the wafer surface, No.
Since oX, NH3, etc. dissolve in the water droplets and etch the wafer, a so-called "clouding phenomenon" (a phenomenon in which the wafer surface appears cloudy) occurs. Especially in winter, when there is a large temperature difference between indoors and outdoors,
The second phenomenon became noticeable.

The present invention has been made to solve the above-mentioned problems, and its primary purpose is to provide a semiconductor wafer storage case that can prevent wafer clouding.

[Means for Solving the Problems] A conductor wafer storage case of the present invention comprises: a storage case body provided with guides for individually standing semiconductor wafers at predetermined intervals; and a storage case body. The storage case main body and the lid have a double structure with a heat insulating layer formed inside.

In the present invention, the material of the storage case main body and lid body includes synthetic resins such as polypropylene, polyethylene, PFA (tetrafluoroethylene perfluoroargyl vinyl ether), FEP (tetrafluoroethylene hexafluoropropylene), and polyvinyl chloride. , styrene resins, etc.

In the present invention, the storage case body and the lid may have a hollow structure in which the heat insulating layer is air, or may have a filled structure in which the heat insulating layer is filled with a heat insulating material.

[For production]

Since the semiconductor sea urchin storage case of the present invention has thermal insulation properties, it is possible to prevent the temperature inside the case from decreasing and to prevent dew condensation. As a result, it is possible to prevent the clouding phenomenon of the semiconductor urchin/'t. Moreover, the troublesome work of putting the case into a bag and sealing it becomes inconvenient.

〔Example〕

Embodiments of the present invention will be described below with reference to the drawings. 1st
The figure is a partially sectional front view of the storage case according to the present invention;
FIG. 2 is a partially cutaway side view of the storage case, and FIG. 3 is a partially cutaway perspective view of the storage case.

The storage case body 1 is made of synthetic resin and has a double structure with a hollow interior and a heat insulating layer 2 of air. A large number of guides 3 are provided on the inner surface of the storage case body to allow semiconductor wafers to be individually placed upright at predetermined intervals. A projection 4 is formed on the upper surface of the storage case body 1. Concave engaging portions 5 for fixing the lid are formed on two opposing side surfaces of the storage case body 1.

The lid body 6 is also made of synthetic resin and has a double structure in which the inside is hollow and a heat insulating layer 7 of air is formed.

The lower peripheral edge of the lid body 6 has a protrusion 4 on the upper surface of the storage case body.
Four parts corresponding to the four parts are formed, and a seal shrine 8 is provided inside the four parts. Engagement portions 9 corresponding to the engagement portions 5 of the storage case body 1 are formed on two opposing side surfaces of the lid body 6. A wafer holder 10 for fixing individual wafers is formed at the center of the lower surface of the lid 6.

The semiconductor wafers 11 are individually placed upright between the guides 3 of the storage case body 1 at predetermined intervals. In this state, the lid 6
The main body and the lid 6 are fixed together, and the wafer 11 is also fixed by the wafer presser 10.

Both the storage of the wafer 11 in the storage case and the removal of the wafer 11 from the storage case are performed in a clean room.

Since the semiconductor wafer storage case of the present invention has heat insulation properties, it is possible to prevent the temperature inside the case from decreasing and dew condensation, and it is possible to significantly reduce the clouding phenomenon of the wafer 1 during transportation. In addition, by storing and taking out the case in a clean room, it is possible to prevent dust from entering. No more work required.

〔Effect of the invention〕

As described in detail above [7], by using the semiconductor wafer storage case of the present invention, it is possible to significantly reduce the clouding phenomenon of wafers during transportation, and moreover, the work of storing and removing wafers becomes easier than before.

[Brief explanation of the drawing]

FIG. 1 is a front view partially showing a storage case according to the present invention in cross section, FIG. 2 is a side view partially showing the same storage case in cross section,
FIG. 3 is a partially cutaway perspective view of the storage case. 1. Storage case body, 2. Heat insulation layer, 3. Guide, 4.
・Protrusion, 5・Engaging portion, 6・・Lid body, 7・Insulating layer, 8 Seal 4i, 9・Engaging portion, 10・Wafer holding, 11・・
・Semiconductor wafer. Applicant's agent Patent attorney Takehiko Suzue

Claims (1)

[Claims] It has a storage case body provided with a guide for individually standing semiconductor wafers at predetermined intervals, and a lid body that is placed over the storage case body, and the storage case body and the lid body have a heat insulating layer inside. A semiconductor wafer storage case characterized by having a double structure.