JPH04176112A - Manufacture of chip type electric double layer capacitor - Google Patents

Abstract

PURPOSE:To make it possible to apply fixed pressure almost independent of the irregularity in thickness of a capacitor element, to obtain uniform quality characteristics, and to unnecessitate selection of thickness by a method wherein a capacitor element laminated body is compressed by the protruding part which is moved by a spring buried in a part of a molding die, and resin is poured in the molding die. CONSTITUTION:The lead terminal plates 2a and 2b for external lead-out of the are provided on both end parts of the electric double-layer capacitor laminated body which is formed by series-laminating a plurality of layers, and through the intermediary of the lead terminal plates 2a and 2b, the above-mentioned electric double-layer capacitor element laminated body is compressed by the protruding parts 4d and 4e, which are moved by the springs 5a and 5b buried in a part inside molding dies 4a and 4b. After an outer covering case 3 has been formed by pouring resin in the molding dies 4a and 4b, the lead terminals led out from the side face of the above-mentioned outer covering case 3 are bent and shaped up in one direction. As a result, the capacitor element 1 is pressurized by almost fixed pressure even when there is irregularity in the thickness of the capacitor element 1, and as a result, a uniform and stabilized equivalent series resistance value can be obtained, and the discrimination of thickness of the capacitor element 1, which was required in the past, can be unnecessitated.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a method for manufacturing a chip type electric double layer capacitor, and particularly to a method for molding a case.

[Conventional technology]

A conventional chip type electric double layer capacitor is shown in Fig. 4(a).
As shown in ~(C), lead terminal plates 2a, 2b for external extraction are installed at both ends of a plurality of electric double layer capacitor element laminates stacked in series, and these lead terminal plates 2a, 2b
The electric double layer capacitor element laminate is molded from above and below through molds 4a, 4. Convex portions 4f and 4g provided in b
The molds 4a and 4b are closed so as to be compressed to a constant size. Next, molding mold 4. Resin is injected into a and 4b from the gate part 4c, and the exterior case 3 is molded.

After that, the lead terminal 2a led out to the outside of the exterior case 3.
, 2b were assembled by bending them into a predetermined shape.

[Problem to be solved by the invention]

In this conventional manufacturing method for chip-type electric double layer capacitors, the electric double layer capacitor elements are compressed to a fixed size regardless of variations, so the equivalent series resistance value of the product characteristics may deviate from the standard due to variations in the compression ratio. In severe cases, there were problems such as rupture due to overcompression and poor contact between electric double layer capacitor elements due to insufficient compression ratio. For this reason, high dimensional accuracy that always falls within a certain size is required, and the number of man-hours required for sorting to meet this requirement and the yield decrease, resulting in an increase in costs.

The object of the present invention is to be able to pressurize electric double layer capacitor elements at a constant pressure regardless of variations in thickness, thereby obtaining uniform quality characteristics, eliminating the need for thickness selection, and reducing costs. An object of the present invention is to provide a chip type electric double layer capacitor element that can reduce the

[Means to solve the problem]

The method for manufacturing a chip type electric double layer capacitor of the present invention includes:
A lead terminal board for external extraction is installed at both ends of the electric double layer capacitor element laminate, which is a plurality of electric double layer capacitor elements laminated in series, and a part of the lead terminal plate is inserted through a spring, and the electric double layer capacitor element laminate is molded into a mold. After compressing with a movable convex part using a spring embedded in a part of the inner part and pouring resin into the mold to form an outer case, each lead terminal led out from the side of the outer case is connected in the same direction. The feature is that it can be bent and shaped.

〔Example〕

Next, the present invention will be explained with reference to the drawings.

FIG. 1 is a sectional view of a chip type electric double layer capacitor according to an embodiment of the present invention. FIGS. 2(a) to 2(c) are side (perspective) views illustrating the case forming process, which characterizes the present invention. FIGS. 3(a) to 3(c) are a top view (a), a side view (b), and a bottom view (c) of a chip type electric double layer capacitor according to an embodiment of the present invention and a conventional example. Figure 4(a)~
(c) is a side (perspective) view showing a case molding process of a conventional chip type electric double layer capacitor. Figure 2 (a
) to (c), lead terminal plates 2a and 2b for leading out to the outside are in contact with both ends of the electric double layer capacitor element laminate stacked in series. As shown in the figure, the lead terminal plates 2a and 2b have electric double layer capacitor elements 1 stacked in series, spaced apart from electrodes (not shown) exposed layer by layer on the side surfaces of the electric double layer capacitor elements 1.
A bending process is added from approximately the center to the outer circumferential direction. In order to mold the case 3 with the lead terminal plates 2a, 2b in contact with each other, the molding molds 4a, 4. b, and resin is injected from the gate part 4c. As a molding resin, it satisfies the heat resistance required for chip parts.
So-called engineering plastics such as PPS (polyphenylene sulfite) resin are used. Molding mold 4a, 4. Within b,
The electric double layer condenser element 1 is installed in the molding molds 4a, 4b via the saw 1 and the terminal plates 2a, 2b in the convex portion 4.
d, 4e (eight in the present invention). In the case of an electric double layer capacitor, electric double layer capacitor element 1
Not only does the equal series resistance value change depending on the compressed state of
Since the contact resistance value between the parts increases, this compressed state has become a particularly important item to manage. In the case of the present invention, since the protrusions 4d and 4e that pressurize the electric double layer capacitor element 1 are movable by the springs 5a and 5b using metal coil springs, even if there are variations in the thickness of the electric double layer capacitor element 1, Since it is pressurized at a nearly constant pressure, not only can uniform and stable equal series resistance values be obtained, but the cost reduction effect is achieved because the thickness selection of the electric double layer capacitor element 1, which was previously required, is no longer required. There is also. The element diameter of the electric double layer capacitor element 1 is 1.1. m m, number of laminated sheets is 6
Sheet.

- When the thickness per sheet is 1.4 mm, the pressing force of the spring is preferably about 50 to 100 kg. After the case 3 is molded, the lead terminal plate 2 is led out from the case 3
A and 2b are bent into a predetermined electrode shape to complete a chip type electric double layer capacitor as shown in FIG.

The springs 5a and 5b used here are coil springs as shown in FIG. 2 in this embodiment, but it goes without saying that rubber springs or the like may also be used.

〔Effect of the invention〕

6. As explained above, the present invention can apply pressure at a constant pressure irrespective of the thickness variation of the electric double layer condenser element, so stable and uniform quality characteristics can be obtained and the electric double layer condenser element can be pressurized with a constant pressure. Since there is no need to select the thickness of the multilayer condenser element, it also has the advantage of lower costs.

[Brief explanation of drawings]

FIG. 1 is a cross-sectional view of a chip-type electric double layer capacitor according to an embodiment of the present invention, and FIGS. 2(a) to (c) show a method for manufacturing a chip-type electric double-layer capacitor according to an embodiment of the present invention. FIGS. 3(a) to 3(c) are top views, side views, and bottom views of chip-type electric double layer capacitors according to an embodiment of the present invention and a conventional example, and FIGS. 4(a) to (c). ) is a side view showing a conventional method for manufacturing a chip type electric double layer capacitor. 1. Electric double layer capacitor element, 2a, 2b... Lead terminal board, 3. Exterior case, 4a, 4b... Molding mold, 4. c-gate section, 4. d, 4. e, 4. f
, 4g... Convex portion, 5a, 5b... Splinter.

Claims (1)

[Claims] A lead terminal plate for external extraction is installed at both ends of a plurality of electric double layer capacitor element laminates stacked in series, and the electric double layer capacitor element laminate is inserted into a part of the molding die via the lead terminal plate. The resin is compressed by a movable convex part by a spring embedded in the mold, and the resin is poured into the mold to form an outer case, and then each lead terminal led out from the side surface of the outer case is bent in the same direction. A method for manufacturing a chip type electric double layer capacitor, which is characterized by shaping.