JPH0417572Y2 - - Google Patents
Info
- Publication number
- JPH0417572Y2 JPH0417572Y2 JP308588U JP308588U JPH0417572Y2 JP H0417572 Y2 JPH0417572 Y2 JP H0417572Y2 JP 308588 U JP308588 U JP 308588U JP 308588 U JP308588 U JP 308588U JP H0417572 Y2 JPH0417572 Y2 JP H0417572Y2
- Authority
- JP
- Japan
- Prior art keywords
- face plate
- lead
- electrode
- electrode face
- support member
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000978 Pb alloy Inorganic materials 0.000 claims description 7
- 238000009713 electroplating Methods 0.000 claims description 4
- 239000000203 mixture Substances 0.000 claims description 3
- 239000010410 layer Substances 0.000 description 7
- 238000004519 manufacturing process Methods 0.000 description 4
- 229910000831 Steel Inorganic materials 0.000 description 2
- 239000011247 coating layer Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 238000000265 homogenisation Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000010959 steel Substances 0.000 description 2
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 229910020220 Pb—Sn Inorganic materials 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 238000005260 corrosion Methods 0.000 description 1
- 230000007797 corrosion Effects 0.000 description 1
- 230000020169 heat generation Effects 0.000 description 1
- 238000007654 immersion Methods 0.000 description 1
- 230000007774 longterm Effects 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 230000001172 regenerating effect Effects 0.000 description 1
- 230000008929 regeneration Effects 0.000 description 1
- 238000011069 regeneration method Methods 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
Description
【考案の詳細な説明】
（産業上の利用分野）
この考案は、不溶性鉛電極に関し、とくに該電
極を構成する電極面板とこれを保持する支持部材
との密着強度が高く、しかも通電効率の良好な電
気めつき用の不溶性鉛電極を提案しようとするも
のである。[Detailed description of the invention] (Industrial application field) This invention relates to an insoluble lead electrode, in particular, has a high adhesion strength between the electrode face plate and the support member that holds it, and has good current conduction efficiency. This paper attempts to propose an insoluble lead electrode for electroplating.
（従来の技術）
従来、亜鉛やクロム電気めつきなどに用いられ
る電極としては、鉛やPb−Sn、Pb−Sbなどより
なる不溶性電極が広く知られており、具体的には
電極の構成部材である支持部材の所定位置に鉛ホ
モゲン加工を施すことにより製造される。(Prior art) Insoluble electrodes made of lead, Pb-Sn, Pb-Sb, etc. are widely known as electrodes used for zinc or chromium electroplating. It is manufactured by applying lead homogenization to a predetermined position of a supporting member.
（考案が解決しようとする課題）
ところで上記のような加工を施した電極では、
その構造上、支持部材と電極面板との密着性が低
いため長期の連続使用には適さず、また渦電流に
よる高電圧発熱腐食のため、通電効率が低いこと
の他、製造コストがかさむという問題があつた。(Problem to be solved by the invention) By the way, with the electrode processed as above,
Due to its structure, the adhesion between the support member and the electrode face plate is low, making it unsuitable for long-term continuous use, and due to high voltage heat generation corrosion caused by eddy currents, there are problems such as low current conduction efficiency and high manufacturing costs. It was hot.
製造コストの上昇を招くことなしに支持部材と
電極面板との強固な密着が実現でき、しかも通電
効率を向上させるのに有利な不溶性鉛電極を与え
ることがこの考案の目的である。 The purpose of this invention is to provide an insoluble lead electrode that can achieve strong adhesion between the support member and the electrode face plate without increasing manufacturing costs, and is advantageous in improving current conduction efficiency.
（課題を解決するための手段）
この考案は、鉛ないしは鉛合金製の電極面板
と、該電極面板の裏面に密着してそれを保持する
支持部材と電極面板と同組成になり該支持部材の
電極面板保持面以外を取囲む被覆層および電極面
板への供電を司る吊手を備えた電気めつき用の鉛
電極において、上記支持部材に、その表裏面にお
いて開口径が異なる複数の貫通孔を形成し、この
貫通孔に電極面板と被覆層とを継合する鉛ないし
は鉛合金製の接合部材を設けたことを特徴とする
不溶性鉛電極である。(Means for Solving the Problem) This invention consists of an electrode face plate made of lead or a lead alloy, a support member that closely contacts and holds the back side of the electrode face plate, and a support member that has the same composition as the electrode face plate. In a lead electrode for electroplating that includes a covering layer surrounding the area other than the electrode face plate holding surface and a handle that controls power supply to the electrode face plate, the supporting member is provided with a plurality of through holes having different opening diameters on the front and back surfaces thereof. This is an insoluble lead electrode characterized in that a connecting member made of lead or a lead alloy is provided in the through hole to connect the electrode face plate and the covering layer.
第１図にこの考案に従う鉛電極の好適例をその
正面、側面、平面及び各断面につき模式で示し、
図における番号１は鉛ないしは鉛合金（以下単に
これらを鉛合金という）製の電極面板、２は電極
面板１への供電を司る鋼製の吊手（図示省略）を
有し、該電極面板１の裏面に密着してそれを保持
する支持部材（鋼製）であり、この支持部材２に
は、その表裏面において開孔径が異なる複数の貫
通孔２ａが形成される。また、３は被覆層であつ
て、この被覆層３は電極面板１と同組成になり支
持部材２における電極面板保持面以外を取り囲む
ように配置される。また４は電極面板１と被覆層
３とを接合する鉛合金になる接合部材である。な
お、上記被覆層３のとくに浸漬領域には、例えば
図示のように樹脂又はTiライニング３ａを配置
することもできる。 FIG. 1 schematically shows a preferred example of a lead electrode according to this invention in terms of its front, side, plane, and cross-sections.
In the figure, number 1 has an electrode face plate made of lead or a lead alloy (hereinafter simply referred to as lead alloy), and number 2 has a steel handle (not shown) that controls power supply to the electrode face plate 1. This is a support member (made of steel) that closely fits and holds the back surface of the support member 2, and a plurality of through holes 2a having different opening diameters are formed on the front and back surfaces of the support member 2. Moreover, 3 is a covering layer, and this covering layer 3 has the same composition as the electrode face plate 1 and is arranged so as to surround the supporting member 2 other than the electrode face plate holding surface. Further, 4 is a joining member made of a lead alloy that joins the electrode face plate 1 and the coating layer 3. In addition, a resin or Ti lining 3a can also be arranged, particularly in the immersion region of the coating layer 3, as shown in the figure, for example.
（作用）
さて、上記の構成になる電極では、電極面板１
を支持部材２に密着させてから、さらに支持部材
２の貫通孔２ａにおいて例えば鉛ホモゲン加工に
て肉盛り層を形成し被覆層３と接合するので電極
面板１と支持部材２は強固に密着されれることと
なり、また電極面板１と支持部材２、接合部材４
が貫通孔２ａを通じて平均に密着されるので電極
の製作及び補修時の鉛加工・鉛肉盛り作業時にお
けるひずみの防止効果があり、平均した密着強度
が確保されるとともに通電効率が有利に改善され
ることとなる。(Function) Now, in the electrode configured as above, the electrode face plate 1
After the electrode face plate 1 and the support member 2 are brought into close contact with the support member 2, a build-up layer is formed by, for example, lead homogenization in the through hole 2a of the support member 2 and joined to the covering layer 3, so that the electrode face plate 1 and the support member 2 are firmly attached. In addition, the electrode face plate 1, support member 2, and bonding member 4
is evenly adhered through the through hole 2a, which has the effect of preventing distortion during lead processing and lead overlay work during electrode manufacturing and repair, ensuring average adhesion strength and advantageously improving current conduction efficiency. The Rukoto.
（考案の効果）
この考案によれば、(1)電極を構成する電極面板
とこの電極面板を保持する支持部材との接合強度
を製造コストの上昇を招くことなしに高めること
が可能で、電極長寿命化を実現できる。(2)電極面
板の裏面や側面から無駄な放電が生じることはな
く、電流効率を向上させることが可能なので、そ
の分電圧を下げた低電圧作業により、低コストで
しかも良好なめつき処理が実現できる。(3)電極の
消耗に伴う補修再生に当つては、単なる肉盛り加
工でよいため、補修再生に要するコスト及びその
ための処理時間を極力抑制できる。(Effects of the invention) According to this invention, (1) it is possible to increase the bonding strength between the electrode face plate that constitutes the electrode and the support member that holds this electrode face plate without increasing the manufacturing cost; Longer life can be achieved. (2) There is no wasteful discharge from the back or side surfaces of the electrode face plate, and current efficiency can be improved, so lower voltage can be used for low-voltage work, resulting in a low-cost, high-quality plating process. can. (3) When repairing and regenerating the electrode due to wear, a simple build-up process is sufficient, so the cost and processing time required for repair and regeneration can be minimized.
第１図ａ，ｂ及びｃはこの考案に従う鉛電極の
構成説明図である。
１……電極面板、２……支持部材、２ａ……貫
通孔、３……被覆層、４……接合部材。
Figures 1a, b and c are explanatory views of the structure of a lead electrode according to this invention. DESCRIPTION OF SYMBOLS 1... Electrode face plate, 2... Supporting member, 2a... Through hole, 3... Covering layer, 4... Joining member.
Claims (1)
の裏面に密着してそれを保持する支持部材と、電
極面板と同組成になり該支持部材の電極面板保持
面以外を取囲む被覆層および電極面板への供電を
司る吊手を備えた電気めつき用の鉛電極におい
て、 上記支持部材に、その表裏面において開口径が
異なる複数の貫通孔を形成し、この貫通孔に電極
面板と被覆層とを継合する鉛ないしは鉛合金製の
接合部材を設けたことを特徴とする不溶性鉛電
極。[Claims for Utility Model Registration] An electrode face plate made of lead or a lead alloy, a support member that adheres to and holds the back surface of the electrode face plate, and an electrode face plate holding surface of the support member that has the same composition as the electrode face plate. In a lead electrode for electroplating, which is equipped with a covering layer surrounding the outside and a handle that controls power supply to the electrode face plate, a plurality of through holes with different opening diameters are formed on the front and back surfaces of the support member, and this An insoluble lead electrode characterized in that a connecting member made of lead or a lead alloy is provided in a through hole to connect an electrode face plate and a covering layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP308588U JPH0417572Y2 (en) | 1988-01-16 | 1988-01-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP308588U JPH0417572Y2 (en) | 1988-01-16 | 1988-01-16 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH01110264U JPH01110264U (en) | 1989-07-25 |
| JPH0417572Y2 true JPH0417572Y2 (en) | 1992-04-20 |
Family
ID=31204408
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP308588U Expired JPH0417572Y2 (en) | 1988-01-16 | 1988-01-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0417572Y2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5017275A (en) * | 1989-10-23 | 1991-05-21 | Eltech Systems Corporation | Electroplating cell anode |
-
1988
- 1988-01-16 JP JP308588U patent/JPH0417572Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPH01110264U (en) | 1989-07-25 |
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