JPH0417552Y2 - - Google Patents
Info
- Publication number
- JPH0417552Y2 JPH0417552Y2 JP8953185U JP8953185U JPH0417552Y2 JP H0417552 Y2 JPH0417552 Y2 JP H0417552Y2 JP 8953185 U JP8953185 U JP 8953185U JP 8953185 U JP8953185 U JP 8953185U JP H0417552 Y2 JPH0417552 Y2 JP H0417552Y2
- Authority
- JP
- Japan
- Prior art keywords
- plasma processing
- processing chamber
- plasma
- chamber
- gas
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Treatments Of Macromolecular Shaped Articles (AREA)
- Physical Or Chemical Processes And Apparatus (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8953185U JPH0417552Y2 (cg-RX-API-DMAC7.html) | 1985-06-13 | 1985-06-13 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP8953185U JPH0417552Y2 (cg-RX-API-DMAC7.html) | 1985-06-13 | 1985-06-13 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS61206650U JPS61206650U (cg-RX-API-DMAC7.html) | 1986-12-27 |
| JPH0417552Y2 true JPH0417552Y2 (cg-RX-API-DMAC7.html) | 1992-04-20 |
Family
ID=30643696
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP8953185U Expired JPH0417552Y2 (cg-RX-API-DMAC7.html) | 1985-06-13 | 1985-06-13 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0417552Y2 (cg-RX-API-DMAC7.html) |
-
1985
- 1985-06-13 JP JP8953185U patent/JPH0417552Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS61206650U (cg-RX-API-DMAC7.html) | 1986-12-27 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR100280689B1 (ko) | 열처리 장치 | |
| TW200512793A (en) | Substrate heating apparatus and multi-chamber substrate processing system | |
| WO1999049705A1 (en) | Plasma processing apparatus | |
| TW201546934A (zh) | 電漿處理裝置及成膜方法 | |
| US20090114153A1 (en) | Method and apparatus for sealing an opening of a processing chamber | |
| CN109868458A (zh) | 一种半导体设备的清洗系统及清洗方法 | |
| TWI796030B (zh) | 具有串接處理區域的電漿腔室 | |
| JPH0417552Y2 (cg-RX-API-DMAC7.html) | ||
| KR101696252B1 (ko) | 기판처리장치의 샤워헤드 어셈블리 | |
| US20160008500A1 (en) | Method and device for plasma-treating hollow bodies | |
| JPH01309315A (ja) | 熱処理装置 | |
| JP4640891B2 (ja) | 熱処理装置 | |
| JP3891802B2 (ja) | 半導体製造装置 | |
| TW202322242A (zh) | 用於提高可維修性的預清潔腔室組件架構 | |
| JP3047750B2 (ja) | プラズマ装置 | |
| JPH01286424A (ja) | 半導体製造装置の洗浄方法 | |
| CN222923231U (zh) | 化学气相沉积设备 | |
| JPH0348194Y2 (cg-RX-API-DMAC7.html) | ||
| JPH02267290A (ja) | マイクロ波プラズマ処理装置 | |
| CN118431061B (zh) | 一种用于半导体腔体自清洁的远程等离子设备 | |
| JPH02184333A (ja) | ロードロック装置を備えた処理装置 | |
| JP2005171308A (ja) | プラズマ処理装置およびプラズマ処理方法 | |
| KR100815947B1 (ko) | 저압 화학기상증착장치 | |
| KR20180093685A (ko) | 플라즈마 화학 기상 증착 장치 | |
| JPH0514507Y2 (cg-RX-API-DMAC7.html) |