JPH04175123A - Exchanging device of mold - Google Patents

Exchanging device of mold

Info

Publication number
JPH04175123A
JPH04175123A JP30446090A JP30446090A JPH04175123A JP H04175123 A JPH04175123 A JP H04175123A JP 30446090 A JP30446090 A JP 30446090A JP 30446090 A JP30446090 A JP 30446090A JP H04175123 A JPH04175123 A JP H04175123A
Authority
JP
Japan
Prior art keywords
mold
heating means
clamping mechanism
heating
slider
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP30446090A
Other languages
Japanese (ja)
Other versions
JPH0735072B2 (en
Inventor
Haruo Okada
晴雄 岡田
Kikuo Sakurada
桜田 喜久男
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nissei Plastic Industrial Co Ltd
Original Assignee
Nissei Plastic Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nissei Plastic Industrial Co Ltd filed Critical Nissei Plastic Industrial Co Ltd
Priority to JP2304460A priority Critical patent/JPH0735072B2/en
Publication of JPH04175123A publication Critical patent/JPH04175123A/en
Publication of JPH0735072B2 publication Critical patent/JPH0735072B2/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B29WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29CSHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17Component parts, details or accessories; Auxiliary operations
    • B29C45/1756Handling of moulds or mould parts, e.g. mould exchanging means

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)

Abstract

PURPOSE:To make a mold preheatable safely without making use of a tube through which a heating medium is passed, by a method wherein a heating device, which comes into contact with a mold placed on a placing part and is for heating the mold, is provided. CONSTITUTION:A mold 20 on a placing part provided close by a mold clamping mechanism 12 of an injection molding machine is set up to the first position by a moving mechanism, a heating device 34 provided on a mold exchange device 10 is brought into contact with the mold 20 and the mold 20 is heated. Then at the time of operation of the mold exchange device 10, the mold 20 is set up to the second position by the moving mechanism and the mold is separated from the heating device 34.

Description

【発明の詳細な説明】 (産業上の利用分野) 本発明は射出成形機の金型交換装置に関する。[Detailed description of the invention] (Industrial application field) The present invention relates to a mold changing device for an injection molding machine.

(従来の技術) 射出成形機において、型締機構に組み込む成形用金型を
交換する金型交換装置が有る。同装置は型締機構に接近
して載置部を設け、その載置部上に在る交換用の金型を
、既に型締機構内にセットされている金型と交換する交
換機構が設けられている。載置部で交換を待つ金型は、
交換後直ちに成形作業に使用できるよう通常は予備加熱
が行われている。
(Prior Art) In an injection molding machine, there is a mold changing device that replaces a molding die incorporated in a mold clamping mechanism. The device is equipped with a placing part close to the mold clamping mechanism, and an exchange mechanism that exchanges the replacement mold on the placing part with the mold already set in the mold clamping mechanism. It is being The mold waiting to be replaced in the mounting section is
Usually, it is preheated so that it can be used for molding work immediately after replacement.

従来の予備加熱は金型内に設けられている温調回路へチ
ューブで導いた熱媒(例:熱湯)を通すことによって行
われている(特公平1−48848号公報参照)。
Conventional preheating is performed by passing a heating medium (eg, boiling water) guided through a tube to a temperature control circuit provided in the mold (see Japanese Patent Publication No. 1-48848).

(発明が解決しようとする課題) しかしながら、上記の従来の金型交換装置には次のよう
な課題が有る。
(Problems to be Solved by the Invention) However, the conventional mold changing device described above has the following problems.

予備加熱を行うため載置部上の金型に熱媒を通す必要が
有る。そのため、オペレータは載置部上へ金型が載置さ
れた際には熱媒が通ったチューブを金型の温調回路へ接
続せねばならない。さらに、熱媒を通したチューブの金
型への取付け、取外しの場合、高温の熱媒をオペレータ
が取り扱うので危険も伴う。また、チューブの配管によ
り空間利用が制約される。特に載置部が回転式(ターン
テーブル式)の場合、載置部の回転により熱媒を通した
チューブが絡むおそれが有るため自由度が制約されると
いう課題も有る。
In order to perform preheating, it is necessary to pass a heating medium through the mold on the mounting section. Therefore, when the mold is placed on the mounting section, the operator must connect the tube through which the heating medium passes to the temperature control circuit of the mold. Furthermore, when attaching or removing a tube through a heating medium to a mold, the operator handles a high-temperature heating medium, which is dangerous. In addition, the use of space is restricted by the tube piping. In particular, when the mounting section is of a rotary type (turntable type), there is a problem that the degree of freedom is restricted because the rotation of the mounting section may cause the tube through which the heating medium passes to become entangled.

従って、本発明は熱媒を通したチューブを使用すること
なく、安全に金型を予備加熱可能な金型交換装置を提供
することを目的とする。
Therefore, an object of the present invention is to provide a mold exchange device that can safely preheat a mold without using a tube through which a heating medium is passed.

(課題を解決するための手段) 上記課題を解決するため、本発明は次の構成を備える。(Means for solving problems) In order to solve the above problems, the present invention includes the following configuration.

すなわち、成形用金型を載置すべく、射出成形機の型締
機構と接近して設けられた載置部と、該載置部に載置さ
れている前記金型を前記型締機構内ヘセットし、又は型
締機構内にセットされている金型を載置部上に取出す交
換機構と、前記載置部上に載置されている前記金型と接
触して当該金型を加熱するための加熱手段とを具備する
ことを特徴とする。また、当該金型装置には、前記金型
を、金型が前記載置部の所定位置に在る場合は前記加熱
手段を金型を加熱すべく金型と当接する第1の位置と、
前記交換機構が作動している間は加熱手段を金型と干渉
しない第2の位置との間に亘って移動させる移動機構を
設けてもよい。
That is, in order to place a mold for molding, there is a mounting section provided close to the mold clamping mechanism of an injection molding machine, and the mold placed on the mounting section is placed inside the mold clamping mechanism. an exchange mechanism for setting the mold or taking out the mold set in the mold clamping mechanism onto the mounting section, and heating the mold by contacting with the mold placed on the mounting section. It is characterized by comprising a heating means for. The mold apparatus further includes a first position where the mold is brought into contact with the mold in order to heat the mold when the mold is in a predetermined position of the mounting portion, and the heating means is brought into contact with the mold in order to heat the mold.
A moving mechanism may be provided to move the heating means to a second position where it does not interfere with the mold while the exchange mechanism is in operation.

(作用) 作用について説明する。(effect) The effect will be explained.

載置部上の金型は、金型交換装置に設けられた加熱手段
が接触して加熱することができる。特ムこ加熱手段の移
動機構を用いると、金型交換に際して金型と加熱手段と
の干渉を防止可能となる。
The mold on the mounting part can be heated by contacting the heating means provided in the mold exchanging device. By using a special mechanism for moving the heating means, it is possible to prevent interference between the mold and the heating means when replacing the mold.

(実施例) 以下、本発明の好適な実施例について添付図面と共に詳
述する。本実施例の金型交換装置は射出成形機と一体に
組まれて成り、第1図は金型交換装置近傍の部分破断平
面図を、第2図はその部分破断側面図を示す。
(Embodiments) Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the accompanying drawings. The mold changing device of this embodiment is assembled integrally with an injection molding machine, and FIG. 1 shows a partially cutaway plan view of the vicinity of the mold changing device, and FIG. 2 shows a partially cutaway side view thereof.

金型交換装置10は射出成形機の型締機構12の側部に
並設されている。金型交換装置10のヘース14は射出
成形機本体16へ固定されている。
The mold changing device 10 is arranged side by side with a mold clamping mechanism 12 of an injection molding machine. The head 14 of the mold changing device 10 is fixed to the injection molding machine main body 16.

18は載置部の一例であるスライダであり、2個の入子
金型20・・・を載置可能であり、ベース14上面に固
定されたガイド22・・・と嵌合し、ガイド22・・・
に沿ってその長さ方向(第1図において左右方向)へ移
動自在になっている。
Reference numeral 18 denotes a slider, which is an example of a mounting section, on which two nested molds 20 can be mounted, and is fitted with a guide 22 fixed to the upper surface of the base 14. ...
It is movable along its length (left and right in FIG. 1).

24は第1のロッドレスシリンダであり、ガイド22・
・・と平行にベース14上に固定されている。第1のロ
ッドレスシリンダ24の移動体26は連結部材28を介
してスライダ18と連結されている。このため、スライ
ダ18は第1のロッドレスシリンダ24の移動体26と
共にガイド22・・・及び第1のロッドレスシリンダ2
4の長さ方向へ移動するようになっている。なお、移動
体26の4LI’については第1のロンドレスシリンダ
24に設けられたセンサ30・・・ (例:マイクロス
イッチ)によって検知可能になっている。
24 is the first rodless cylinder, and the guide 22.
... is fixed on the base 14 in parallel with. The moving body 26 of the first rodless cylinder 24 is connected to the slider 18 via a connecting member 28. Therefore, the slider 18 is moved together with the moving body 26 of the first rodless cylinder 24 and the guides 22... and the first rodless cylinder 2.
4 in the length direction. Note that 4LI' of the moving body 26 can be detected by a sensor 30 (eg, a microswitch) provided on the first rondless cylinder 24.

スライダ18が移動することにより、スライダ18上の
金型20・・・を選択的に型締機構12ヘセント、又は
型締機構12ヘセツトされている金型20・・・を取出
してスライダ18上に位置を選択して載置可能になる。
As the slider 18 moves, the mold 20 on the slider 18 is selectively placed on the mold clamping mechanism 12, or the mold 20 that is set on the mold clamping mechanism 12 is taken out and placed on the slider 18. You can select a location and place it.

スライダ18には金型20・・・が載置される部分の直
下に矩形穴32・・・がそれぞれ透設されている。
Rectangular holes 32 are transparently provided in the slider 18 directly below the portions on which the molds 20 are placed.

34は加熱手段の一例である電気ヒータであり、へ−ス
14の両端近傍に2個並設(第1図で左右方向へ2個並
設、但し一方のみ図示)されている。
Reference numeral 34 denotes electric heaters, which are an example of heating means, and two electric heaters are installed in the vicinity of both ends of the header 14 (two electric heaters are installed side by side in the left-right direction in FIG. 1, but only one is shown).

電気ヒータ34の配設位置は、スライダ18が金型20
・・・交換のため、選択的に移動した際にスライダ18
の各矩形穴32・・・の直下に対応する位置である。各
電気ヒータ34はそれぞれに設けられている移動機構の
一例である第1のエアシリンダ36によって上下動可能
になっている。
The arrangement position of the electric heater 34 is such that the slider 18 is located at the mold 20.
...Slider 18 when selectively moved for replacement.
This is a position corresponding to directly below each rectangular hole 32 . Each electric heater 34 can be moved up and down by a first air cylinder 36, which is an example of a moving mechanism provided therein.

電気ヒータ34は矩形穴32・・・を通常可能なサイズ
に形成されており、第1のエアシリンダ36のロッド3
8が伸長した際には矩形穴32・・・を通ってスライダ
18に載置されている金型20の下面と当接可能な第1
の位置と、ロッド38が短縮して金型20と離間すると
共にスライダ18と干渉しない第2の位置(第2図図示
の位置)との間を第1のエアシリンダ36によって移動
する。なお、第1の位置と第2の位置の検知は第1のエ
アシリンダ36に設けられたセンサ40・・・ (例:
マイクロスイッチ)によって可能になっている。電気ヒ
ータ34は第1の位置に在る場合にONとなり対応する
金型20を予備加熱する。
The electric heater 34 has a rectangular hole 32 formed in a size that is normally possible, and the rod 3 of the first air cylinder 36.
When the mold 8 is extended, the first part can come into contact with the lower surface of the mold 20 placed on the slider 18 through the rectangular hole 32...
The rod 38 is moved by the first air cylinder 36 between the position shown in FIG. Note that the detection of the first position and the second position is performed by a sensor 40 provided on the first air cylinder 36 (for example:
This is made possible by a microswitch. When the electric heater 34 is in the first position, it is turned on and preheats the corresponding mold 20.

42は第2のロッドレスシリンダであり、スライダ18
の上方に在って、第1のロッドレスシリンダ24と直角
の方向へ配設されている。 第2のロッドレスシリンダ
42は型締機構12の、金型20をセットする位置に対
応して設けられている。従って、第2のロッドレスシリ
ンダ42の移動体44は型締機構12に対して離間する
方向(第2図左右方向)へ移動する。なお、移動体44
の移動位置はセンサ46・・・ (例:マイクロスイッ
チ)で検知可能になっている。
42 is a second rodless cylinder, and the slider 18
The rodless cylinder 24 is disposed above the rodless cylinder 24 in a direction perpendicular to the first rodless cylinder 24 . The second rodless cylinder 42 is provided in the mold clamping mechanism 12 at a position where the mold 20 is set. Therefore, the movable body 44 of the second rodless cylinder 42 moves in a direction away from the mold clamping mechanism 12 (left-right direction in FIG. 2). Note that the moving body 44
The moving position of can be detected by a sensor 46 (eg, a micro switch).

48は第2のエアシリンダであり、連結部材50を介し
て第2のロンドレスシリンダ42の移動体44へ連結さ
れ、移動体44と一体に移動する。
48 is a second air cylinder, which is connected to the movable body 44 of the second Rondres cylinder 42 via a connecting member 50, and moves together with the movable body 44.

第2のエアシリンダ48のコント52下端には掛止具5
4が固定されている。掛止具54はロッド52の伸縮に
よって上下動可能になっている。
A hook 5 is attached to the lower end of the control 52 of the second air cylinder 48.
4 is fixed. The hook 54 can be moved up and down by the expansion and contraction of the rod 52.

掛止具54は金型20・・・の掛合部56・・・へ掛止
可能になっている。掛合部56は1組の金型20を構成
する1対の可動金型部と固定金型部の側面に突設された
1対のコ字状部材が対向して形成されている。従って掛
止具54は第2のエアシリンダ48のロッド52の伸長
により上陸した際に掛合部56・・・と掛止しく第2図
の状態)、ロッド52が短縮した際に掛合部56・・・
との掛止を解除可能になる。なお、掛止具54の上下動
位置は第2のエアシリンダ48に設けられたセンサ58
・・・ (例:マイクロスイッチ)によって検知可能と
なる。
The latching tool 54 can be latched onto the engaging portions 56 of the molds 20 . The engaging part 56 is formed by a pair of U-shaped members protruding from the side surfaces of a pair of movable mold parts and a fixed mold part, which constitute one set of molds 20, facing each other. Therefore, when the rod 52 of the second air cylinder 48 is extended, the hook 54 is engaged with the engaging portion 56 (the state shown in FIG. 2), and when the rod 52 is shortened, the engaging portion 56 is engaged with the engaging portion 56.・・・
It becomes possible to release the latching. Note that the vertical movement position of the hook 54 is determined by a sensor 58 provided on the second air cylinder 48.
... Can be detected by (e.g. microswitch).

上記第2のロンドレスシリンダ42、連結部材50、第
2のエアシリンダ48及び掛止具54によって金型20
・・・の交換機構の一例を構成する。つまり、掛止具5
4が第2のエアシリンダ48により上下動し、第2のロ
ッドレスシリンダ42により型締機構12へ接離動する
ため、掛止具54が金型20・・・の掛合部56・・・
へ掛合した状態で接離動を行うことにより金型20・・
・内の温調回路と型締機構12の温調回路との結合を含
め、金型20・・・の型締機構12へのセット又は型締
機構12からの取出しが可能となる。
The mold 20 is connected to the second rondless cylinder 42, the connecting member 50, the second air cylinder 48, and the hook 54.
This constitutes an example of an exchange mechanism for... In other words, the hook 5
4 is moved up and down by the second air cylinder 48 and moved toward and away from the mold clamping mechanism 12 by the second rodless cylinder 42, so that the latch 54 engages the engaging portions 56 of the molds 20...
The mold 20...
- It becomes possible to set or take out the mold 20 .

金型交換装置10の制御はマイクロプロセンサ搭載のコ
ントローラ(不図示)によって制御される。
The mold changing device 10 is controlled by a controller (not shown) equipped with a microprocessor sensor.

スライダ18又は各電気ヒータ34等に設けられた不図
示のセンサ(例:光センサ)がスライダ18上に金型2
0・・・が載置されていることを検知すると、コントロ
ーラは対応する電気ヒータ34の第1のエアシリンダ3
6を駆動し、当該電気ヒータ34をONにすると共に、
第1の位置へ移動し、金型20・・・を予備加熱する。
A sensor (for example, an optical sensor), not shown, provided on the slider 18 or each electric heater 34 is mounted on the mold 2 on the slider 18.
0... is placed, the controller activates the first air cylinder 3 of the corresponding electric heater 34.
6 and turn on the electric heater 34,
Move to the first position and preheat the mold 20.

金型20・・・交換の動作を行う場合は、コントローラ
は第1の位置に在る電気ヒータ34をOFFとし、第1
のエアシリンダ36で第2の位置へ移動させた後、スラ
イダ18の移動及び掛止具54等から成る交換機構を作
動させて金型2o・・・の交換を行う。
When performing the operation of replacing the mold 20..., the controller turns off the electric heater 34 located in the first position, and
After moving the mold 2o to the second position using the air cylinder 36, the mold 2o is replaced by moving the slider 18 and activating the replacement mechanism including the hook 54 and the like.

なお、本実施例のように入子式の金型の場合、熱容量が
小さいため本方式による予備加熱を行うのが特に有利で
ある。
Note that in the case of a telescoping mold as in this embodiment, it is particularly advantageous to preheat by this method because the heat capacity is small.

以上、本発明の好適な実施例について種々述べて来たが
、本発明は上述の実施例に限定されるのではなく、例え
ば、載置部は直線方向へ移動するスライダではなく、タ
ーンテーブル式であって載置された金型を載置部のター
ンによって選択する方式であってもよいし、載置部が移
動せず交換機構によって金型を移動させて交換してもよ
い等、発明の精神を逸脱しない範囲で多くの改変を施し
得るのはもちろんである。
Various preferred embodiments of the present invention have been described above, but the present invention is not limited to the above embodiments. For example, the mounting section is not a slider that moves in a straight line, but a turntable type. The invention may include a method in which the placed mold is selected by the turn of the placing part, or a method in which the placing part does not move and the mold is moved and replaced by an exchange mechanism. Of course, many modifications can be made without departing from the spirit of the invention.

(発明の効果) 本発明に係る金型交換装置を用いると、載置部上の金型
は、金型交換装置に設けられた加熱手段が接触して加熱
することができるので、熱媒を通したチューブを金型の
温調回路へ接続又は取外す作業が不要となる。従って、
作業効率を向上させ得ると共に、オペレータの安全も確
保できる。さらにチューブが不要となるのでチューブの
絡み等による空間の使用制限も受けない。さらにチュー
ブが無い分、射出成形機近傍の空間的制約も無くなる。
(Effects of the Invention) When the mold exchanging device according to the present invention is used, the mold on the mounting portion can be heated by contact with the heating means provided in the mold exchanging device, so that the heating medium can be heated. There is no need to connect or disconnect the passed tube to the temperature control circuit of the mold. Therefore,
Work efficiency can be improved and operator safety can also be ensured. Furthermore, since no tubes are required, there is no restriction on space usage due to entanglement of tubes, etc. Furthermore, since there is no tube, there are no space restrictions near the injection molding machine.

特に、加熱手段の移動機構を用いると、金型交換に際し
て金型と加熱手段との干渉を防止可能となるので金型交
換の際に両者の干渉による損傷を確実に防止することが
できる等の著効を奏する。
In particular, when a heating means moving mechanism is used, it is possible to prevent interference between the mold and the heating means when replacing the mold, so damage due to interference between the two can be reliably prevented when replacing the mold. Effective.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明に係る金型交換装置を有する射出成形機
の金型交換装置近傍の部分破断平面図、第2図はその部
分破断側面図。 10・・・金型交換装置、  12・・・型締機構、 
 18・・・スライダ、 20・・・金型、24・・・
第1のロッドレスシリンダ、34・・・電気ヒータ、 
3B・・・第1のエアシリンダ、  42・・・第2の
ロッドレスシリンダ、 48・・・第2のエアシリンダ
、54・・・掛止具。
FIG. 1 is a partially cutaway plan view of the vicinity of the mold changing device of an injection molding machine having the mold changing device according to the present invention, and FIG. 2 is a partially broken side view thereof. 10... Mold changing device, 12... Mold clamping mechanism,
18...Slider, 20...Mold, 24...
first rodless cylinder, 34... electric heater;
3B...first air cylinder, 42...second rodless cylinder, 48...second air cylinder, 54...hanging tool.

Claims (1)

【特許請求の範囲】 1、成形用金型を載置すべく、射出成形機の型締機構と
接近して設けられた載置部と、 該載置部に載置されている前記金型を前記型締機構内へ
セットし、又は型締機構内にセットされている金型を載
置部上に取出す交換機構と、 前記載置部上に載置されている前記金型と接触して当該
金型を加熱するための加熱手段とを具備することを特徴
とする金型交換装置。 2、前記金型を、金型が前記載置部の所定位置に在る場
合は前記加熱手段を金型を加熱すべく金型と当接する第
1の位置と、前記交換機構が作動している間は加熱手段
を金型と干渉しない第2の位置との間に亘って移動させ
る移動機構を具備することを特徴とする請求項1記載の
金型交換装置。
[Claims] 1. A mounting part provided close to a mold clamping mechanism of an injection molding machine for mounting a molding die, and the mold placed on the mounting part. an exchange mechanism for setting the mold into the mold clamping mechanism or taking out the mold set in the mold clamping mechanism onto the mounting section; and an exchange mechanism that contacts the mold placed on the mounting section. 1. A mold changing device, comprising a heating means for heating the mold. 2. When the mold is in a predetermined position in the mounting section, the heating means is brought into contact with the mold in order to heat the mold, and the exchange mechanism is activated. 2. The mold changing device according to claim 1, further comprising a moving mechanism for moving the heating means between a second position where the heating means does not interfere with the mold while the heating means is in the mold.
JP2304460A 1990-11-09 1990-11-09 Mold changer Expired - Fee Related JPH0735072B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2304460A JPH0735072B2 (en) 1990-11-09 1990-11-09 Mold changer

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2304460A JPH0735072B2 (en) 1990-11-09 1990-11-09 Mold changer

Publications (2)

Publication Number Publication Date
JPH04175123A true JPH04175123A (en) 1992-06-23
JPH0735072B2 JPH0735072B2 (en) 1995-04-19

Family

ID=17933287

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2304460A Expired - Fee Related JPH0735072B2 (en) 1990-11-09 1990-11-09 Mold changer

Country Status (1)

Country Link
JP (1) JPH0735072B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012148319A (en) * 2011-01-19 2012-08-09 Kochi Univ Of Technology Apparatus and method for die casting

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62155947U (en) * 1986-03-27 1987-10-03
JPS63108716U (en) * 1987-01-08 1988-07-13

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62155947U (en) * 1986-03-27 1987-10-03
JPS63108716U (en) * 1987-01-08 1988-07-13

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2012148319A (en) * 2011-01-19 2012-08-09 Kochi Univ Of Technology Apparatus and method for die casting

Also Published As

Publication number Publication date
JPH0735072B2 (en) 1995-04-19

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