JPH04173853A - Styrene resin composition - Google Patents

Abstract

PURPOSE:To obtain a styrene resin composition having excellent flame- retardancy and light-resistance and suitable for electric parts, automobile parts, etc., by compounding specific amounts of a halogen-based flame-retardant and a polyethylene glycol having a specific molecular weight to a base resin. CONSTITUTION:The objective composition is produced by compounding (A) 100 pts.wt. of a styrene resin with (B) 3-50 pts.wt. (preferably 6-35 pts.wt.) of a halogen-based flame-retardant (e.g. tetrabromobisphenol A) and (C) 0.1-5 pts.wt. of a polyethylene glycol having a molecular weight of >=4,000 (preferably >=6,000).

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a styrenic resin composition, and more particularly to a flame-retardant styrenic resin composition with excellent light resistance.

[Prior Art] Styrenic resins are used for various purposes because of their excellent processability and physical properties.

In addition, the demand for flame retardancy in molded products, mainly for electrical insulation applications, has become increasingly strict in recent years, and although large amounts of flame retardants have been added to meet market demands, especially for electrical equipment parts, For housings, there is an increasing demand for improved light resistance as well as flame retardance.

Styrenic resins that use halogen flame retardants are exposed to physical energy such as heat and light in the presence of oxygen.
Dehydrohalogenation of flame retardants causes various changes in styrenic resins, such as the formation of carbonyl groups or conjugated double bonds, crosslinking, and molecular chain scission, that is, deterioration, which can lead to discoloration of resin compositions and a decrease in mechanical strength. known to cause

To prevent such deterioration of synthetic resins, additives such as binder monoamine light stabilizers, ultraviolet absorbers, phenolic antioxidants, and phosphoric acid stabilizers have been used singly or in combination.

[Problems to be Solved by the Invention] Stabilizers that prevent the deterioration of synthetic resins, particularly hindered amine light stabilizers and ultraviolet absorbers, are very expensive and may also cause mold contamination.

Therefore, the inventor of the present invention conducted intensive studies to obtain excellent light resistance, and found that the deterioration of flame-retardant polystyrene resin due to light can be dramatically prevented by adding a small amount of polyethylene glycol, which has higher fluidity than styrene resin. They discovered what they could do and completed the present invention.

An object of the present invention is to provide a flame-retardant styrenic resin composition with excellent light resistance by adding polyethylene glycol.

[Means for Solving the Problems] That is, the present invention includes (A) 100 parts by weight of styrene resin, (B) 3 to 50 parts by weight of a halogen flame retardant, and (C) a molecular weight of 4.00.
0.1 to 5 parts by weight of polyethylene glycol of 0 or more;
This is a styrenic resin composition characterized by containing the following.

In the present invention, styrene resins include polystyrene, styrene homopolymers such as polymethylstyrene, styrene-methylstyrene, styrene-divinylbenzene, styrene-rubber (referred to as HI resin), styrene-
Acrylonitrile (referred to as AS resin), styrene-rubber-acrylonitrile (referred to as ABS resin).

), or mixtures thereof.

The halogenated flame retardant used in the present invention is a halide of an organic compound, such as tetrabromobisphenol A,
TEA carbonate oligomer, brominated bisphenol A type epoxy polymer, decabromodiphenyl ether,
Bis(tribromophenoxy)ethane, perchlorocyclopentadecane and tris(tribromoneopentyl)
It is a phosphate, and one type or a mixture of two or more of these is added 3 to 5 times per 100 parts by weight of styrene resin.
It is preferable to add 0 parts by weight, especially 6 to 35 parts by weight.

If the amount is less than 3 parts by weight, sufficient flame retardancy cannot be obtained, and if it exceeds 50 parts by weight, mechanical properties such as Izot impact strength will be significantly reduced.

The polyethylene glycol used in the present invention has a molecular weight of 4,
000 or more, especially e, ooo or more is preferable.

When the molecular weight is less than 4,000, the deflection temperature under load of the resulting ABS resin is significantly lowered, and the Izot impact strength is also lowered.

If the amount of polyethylene glycol added is less than 0.1 part by weight, sufficient light resistance cannot be obtained. Moreover, if the amount exceeds 5 parts by weight, compatibility with styrene resin becomes difficult, delamination phenomenon occurs, and Izot impact strength and surface hardness decrease, which is not preferable.

The composition of the present invention can be produced by adding each component all at once or in stages using a conventional mixing machine such as a single-screw extruder, twin-screw extruder, Banbury mixer, roll, or kneader.

In addition, the styrenic resin composition of the present invention may optionally contain plasticizers, heat stabilizers, ultraviolet absorbers, pigments, dyes, etc., reinforcing agents such as glass fibers, glass beads, asbestos, etc., and flame retardant aids. It may contain antimony trioxide.

The composition of the present invention is subsequently made into molded products by extrusion molding, injection molding, etc., and these molded products have excellent flame retardancy and light resistance in addition to mechanical properties, and are suitable for use in electrical equipment parts (mainly Housing), automotive parts, etc.

[Effects of the Invention] According to the present invention, a flame-retardant styrenic resin composition with excellent light resistance can be obtained by adding polyethylene glycol having a molecular weight of 4.000 or more to a flame-retardant styrenic resin composition. can.

[Example] Hereinafter, the present invention will be explained in more detail with reference to Examples.
The present invention is not limited to these examples.

Performance tests of the molded products in Examples were conducted according to the following method.

(Light resistance) (1) Light irradiation equipment Xenon long life fade meter Irradiation energy 4.0 s, W/cj (300ns ~ 4
00 nm) Tank temperature 63℃ (black panel temperature)
Humidity in tank 50%R [(2) Color difference Color difference was calculated using the following formula.

+ (b − b ) 2] 1/2 L, a, b; Brightness (L), chromaticity (a,
b) L, a, b; Brightness and chromaticity after irradiation with light (Izot impact strength) Measured based on ASTM test method D256.

(Flame resistance) Underwriters Laboratory (USA) UL standard.

Flammability test based on U L 94 (3rd edition dated September 3, 1985) The flame retardancy increases in the order of V-2, V-1, and V-0, whereas ■-〇 has no dropping. ,V-
2 is dropping.

(Load deflection temperature) ^ Measured based on STM test method D648.

Example 1 Brominated bisphenol A type was added to 100 parts by weight of a mixed resin of ABS resin containing 40% butadiene, 15% acrylonitrile, and 45% styrene and AS resin containing 30% acrylonitrile and 70% styrene in a 1:1 ratio. 2 epoxy polymers (Pratherm EC20 manufactured by Inu Nippon Ink)
8 parts by weight, 7 parts by weight of antimony trioxide, molecular weight 4.0
Blending 1 part by weight of polyethylene glycol 22
40III1φ extruder (with vent) set at 0°C
The mixture was melted and mixed to form chips. Then, a molded product was made by injection molding at 220° C., and a performance test was conducted. The results are shown in Table-1.

Example 2, 4.5 Molecular weight 6,000.10,000.20 instead of polyethylene glycol of Example 1 with a molecular weight of 4,000 e.
The same procedure as in Example 1 was conducted except that 000 polyethylene glycol was used. The results are shown in Table-1.

Example 3 The same procedure as in Example 1 was carried out except that 2 parts by weight of polyethylene glycol having a molecular weight of 6,000 and 4 parts by weight of antimony trioxide were used in place of the polyethylene glycol having a molecular weight of 4.000. The results are shown in Table-1.

Example 6 The same procedure as in Example 2 was carried out, except that 28 parts by weight of TEA carbonate oligomer (Fireguard FG 7500, manufactured by Konjin Kasei) was used instead of the brominated bisphenol A epoxy polymer of Example 2.

The results are shown in Table-2.

Example 7.8 Instead of the brominated bisphenol A type epoxy polymer of Example 2, 20 parts by weight of tetrabromobisphenol A1 bis(tribromophenoxy)ethane and 4 parts by weight of antimony trioxide were used, and during extrusion and molding. The set temperature is 20
The same procedure as in Example 2 was carried out except that the temperature was 0°C. The results are shown in Table-2.

Comparative Example 1 Brominated bisphenol A type was added to 100 parts by weight of a mixed resin in which an ABS resin containing 40% butadiene, 15% acrylonitrile, and 45% styrene was blended with an AS resin containing 30% acrylonitrile and 70% styrene in a 1:1 ratio. 2 epoxy polymers (Bratherm EC20 manufactured by Dainippon Ink)
8 parts by weight, 7 parts by weight of antimony trioxide added, 220
The mixture was melted and mixed in a 40°C extruder (with a vent) to form chips. Then, a molded product was made by injection molding at 220° C., and a performance test was conducted. The results are shown in Table-3. As shown in Table 3, the impact strength is high, but the light resistance is poor.

Comparative Examples 2 and 3 Comparative Example 1 had a molecular weight of 1,000. , 3.000 was added in the same manner as in Comparative Example 1, except that 1 part by weight of polyethylene glycol of 3.000% was added. As shown in Table 3, the results showed a decrease in the deflection temperature under load and the isot impact strength.

Comparative Example 4.5 Molecular weight of Comparative Example 2 1. The same procedure as Comparative Example 2 was carried out except that 7.10 parts by weight of polyethylene glycol with a molecular weight of e and ooo was added instead of the polyethylene glycol of OQo. The results are shown in Table 3, where a decrease in the deflection temperature under load and Izot impact strength was observed due to the large addition amount.

Comparative Example 6 The same procedure as Comparative Example 1 was carried out except that TBA carbonate oligomer (Fireguard PG7500 manufactured by Teijin Chemicals Ltd.) was used instead of the brominated bisphenol A type epoxy polymer of Comparative Example 1. As shown in Table 4, the light resistance was poor.

Examples 8 and 10 Instead of the brominated bisphenol A type epoxy polymer of Comparative Example 1, 20 parts by weight of tetrabromobisphenol A1 bis(tribromophenoxy)ethane and 4 parts by weight of antimony trioxide were added, and during extrusion and molding. The set temperature is 20
The same procedure as in Comparative Example 1 was conducted except that the temperature was 0°C. As shown in Table 4, the light resistance was poor.

Comparative Examples 7, 9.11 Comparative Examples 6, 8, and 8 are the same except that 10 parts by weight of polyethylene glycol with molecular weights e and ooo were added to Comparative Examples 6, 8, and 10, respectively, and the temperature during extrusion and molding was set at 200°C. 10
I did the same thing. As shown in Table 4, the results show a decrease in deflection temperature under load and Izot impact strength.

Claims (1)

Scope of Claims: (A) 3 to 50 parts by weight of (B) halogen flame retardant to 100 parts by weight of styrene resin, (C) 0.1 to 5 parts by weight of polyethylene glycol with a molecular weight of 4,000 or more. A styrenic resin composition comprising: