JPH0417351A - Lead-pin bend measurement device of flat-package type ic - Google Patents

Abstract

PURPOSE:To obtain a simple structure for measuring by image processing by capturing measurement points at different height with a camera at one time for a relative bending at a root part and a tip part in a gull wing type lead pin by providing each specific optical system and one camera, an image processing device, and an arithmetic operation output part. CONSTITUTION:The title item is a lead-pin bending measurement device of a flat-package type IC 8 which measures bending between a root part 81 and a tip part 82 in a gull wing type lead pin 80 of the flat-package type IC 8 and has one camera 3 which captures an optical system 2 including an objective lens 23 which is placed on a line L2 which is perpendicular to a segment L1 and image light at both measurement points 81a and 82a in the above which passes the optical system 2, an image processing device 4 which measures a distance in a lead pin width direction between both measurement points 81a and 82a which are captured by the camera 3, and an arithmetic operation output part 5 which outputs a distance a which is obtained by the image processing device 4.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an apparatus for measuring bending of lead pins of flat packaged ICs.

[Conventional technology]

The lead pins of flat package ICs are so-called gull-wing type, which extend laterally from the package body, bend upward or downward, and then extend laterally again, and J-type, which wrap around to the bottom surface of the package body. There is.

These lead pins must maintain regular positions, directions, and spacing in order to accurately connect the IC package to the board, and those with deviations in these must be rejected as defective products.

Taking a gullwing lead pin as an example, bending, floating, twisting, abnormal height, abnormal pitch between the root and tip,
Possible abnormalities include irregular lengths, broken legs, and crab legs where several legs extend diagonally in the same direction.

Detecting abnormalities in these lead pins has been done through visual inspection using a tool microscope, inspection using jigs, etc., but recently, as the number of pins has been increasing, measurement and inspection using cameras and image processing devices have been proposed. It has reached this point.

[Problem to be solved by the invention]

In the case of measurement using image processing, in order to make accurate measurements, the optical system from the camera to the lead pin must have a high magnification to narrow down the measurement point in order to increase the resolution, but as the magnification increases, the depth of focus increases. For example, when measuring the relative bending of the root and tip of a gullwing lead pin, if this is done using an objective lens, the measurement point at the root and the tip at different distances from the lens may be measured. The measurement points must be captured by placing the camera at different distances from the objective lens.

Therefore, if two measurement points are to be captured at once by cameras in order to perform measurements in as short a time as possible, two cameras placed at different positions are required.

However, even though the two camera positions are different, they are not that far apart, and there is a limit to the miniaturization of cameras, so in the end, two positions for one objective lens are used.
Camera placement on the stand will be difficult.

Therefore, it is necessary to position two optical systems, each including an objective lens, and a camera corresponding to each optical system at different positions, which results in the problem of complicating the entire measuring device and increasing cost. be.

Therefore, the present invention has a simple structure in which the relative bending between the root and tip of a gullwing lead pin of a flat package IC can be measured by image processing by capturing the measurement point at the root and the measurement point at the tip at the same time. The purpose is to provide equipment.

[Means to solve the problem]

In accordance with the above-mentioned object, the present invention provides a lead pin bending measuring device for a flat package IC, which measures the bend between the root and tip of a gull wing lead pin of a flat package IC. - an optical system including an objective lens that passes through the midpoint of a line segment connecting the root measurement point and the tip measurement point in the doping pin and is placed on a line perpendicular to the line segment; It includes one camera that captures image light, an image processing device that measures the distance in the dobbin width direction between both measurement points captured by the camera, and a calculation output unit that outputs the distance determined by the image processing device. The present invention provides a measuring device characterized by the following.

[For production]

According to the measuring device of the present invention, an IC placed at a predetermined measuring position
The root measurement point and the tip measurement point of the lead pin are simultaneously captured by one camera through one optical system, and the distance in the width direction of the lead pin between the two measurement points is measured by an image processing device. The value is output from the calculation output section. If the output value exceeds a predetermined allowable range, it is determined that the lead pin is defective.

〔Example〕

Embodiments of the present invention will be described below with reference to the drawings.

Fig. 1 shows the schematic configuration of one embodiment, Fig. 2 shows the arrangement of the optical system with respect to the lead pin, and Fig. 3 shows images of the base and tip of the lead pin on the display. There is.

This embodiment device includes a table 1 for arranging lead pins 80 to be measured of a flat package IC 8 at a predetermined measurement position. Can move in the horizontal plane in the direction of .

Several ICs 8 are placed in a tray 9 at predetermined intervals, and the tray is placed at a predetermined position on the table 1.

Thus, the lead pins 80 to be measured of the IC in the tray 9 are placed at a predetermined measurement position by the movement of the table 1.

An optical system 2 is provided above the lead pin measurement position. The optical system 2 includes a lower cylinder 21, an upper cylinder 22 that can be moved in and out of the lower cylinder, and an objective lens 23 provided at the lower end of the lower cylinder.

A CCD camera 3 is fixed to the upper end of the upper cylinder 22.

As shown in FIG. 2, the center line L2 of the optical system 2 and the camera 3 is a line segment L1 connecting the measurement point 81a of the root portion 81 and the measurement point 82a of the tip portion 82 of the lead pin 80 to be measured.
This is a line that passes through the midpoint M of and is perpendicular to the line segment, and the upper cylinder 22 and the camera 3 can be raised and lowered by a driving means that utilizes a hook-and-pinion mechanism (not shown) or the like. Therefore, the camera is focused on both the root measurement point 81a and the tip measurement point 82a of the IC lead pin 80 located at the measurement position below the objective lens 23 at the same time.

The camera 3 is connected to an image processing device 4, which in turn is connected to an arithmetic output section 5. The image processing device 4 includes a root portion 81 and a tip portion 82 of a lead pin 80 to be measured.
A display 6 for simultaneously displaying both images is also connected as shown in FIG.

A recording device 7 such as a printer and/or a display (not shown) are connected to the calculation output section 5.

The image processing device 4 is configured to measure and output the distance a in the width direction between the lead pin base measurement point 81a and the lead pin tip measurement point 82a captured by the camera 3.

The calculation output unit 5 is configured to output the distance a to the recording device 7 and/or a display (not shown) in response to an input from the image processing device 5.

Therefore, the IC 8 to be measured is placed in the tray 9 and placed at a predetermined position on the table 1, and as the table is moved, the lead pins 80 to be measured of the IC are placed at the measurement position.

When the measurement of one lead pin is completed, the next lead pin is placed at the same measurement position.

Both the root portion 81 and the tip portion 82 of the lead pin 80 at the measurement position are simultaneously captured by the camera 3 via the optical system 2, and the camera inputs their image signals to the image processing device 4.

The image processing device 4 measures the distance a between the lead pin root measurement point 81 a and the lead pin tip measurement point 82 a and inputs this to the calculation output section 5 .

The calculation output unit 5 outputs the distance a, the recording device 7 records this, and at the same time (or) a display (not shown) displays this.

When the distance a exceeds the predetermined tolerance range, the measured TC8
are excluded as having defective lead pins.

〔Effect of the invention〕

As explained above, the present invention is a flat package type I
This is a lead pin bending measurement device of C, which measures the relative surface curvature of the root and tip of a gullwing lead pin of a flat package IC by measuring the measurement point of the root and the measurement point of the tip through one optical system. It is possible to provide a measuring device with a simple structure that can capture images at once with a camera and perform measurements through image processing.

[Brief explanation of drawings]

The drawings show one embodiment of the present invention, and FIG. 1 is a schematic diagram of the overall configuration, FIG. 2 is an explanatory diagram of the arrangement of the optical system and camera with respect to the beam and dowel, and FIG. 3 is a display image of the lead pin. be. 1...Table 2...Optical system 23...Objective lens 3...Camera 4...Image processing device 5...Arithmetic output unit Applicant Person: M, I-Techno Co., Ltd.■
N-get-ichi~CVJr0 sun〔

Claims (1)

[Claims] (1) A lead pin bending measuring device for a flat package IC that measures the bend between the root and tip of a gull wing lead pin of a flat package IC, the root part of the lead pin of the IC being placed at a predetermined measurement position. an optical system that passes through the midpoint of a line segment connecting the measurement point and the tip measurement point and includes an objective lens placed on a line perpendicular to the line segment; The present invention is characterized by comprising a camera on the stand, an image processing device that measures the distance in the width direction of the lead pin between both measurement points captured by the camera, and an arithmetic output unit that outputs the distance determined by the image processing device. measuring device.