JPH0417330B2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION <<Industrial Application Field>> The present invention relates to a panel air-conditioning system using a heat pump.

<<Background of the Invention>> One type of air-conditioning equipment includes a method in which a floor or ceiling surface is constructed with a radiant panel, and cold and hot water is circulated within the radiant panel to heat and cool a room by radiation. This method uses radiant heat from the floor or ceiling for heating and cooling, so it provides high-quality air conditioning effects.

<<Problems to be Solved by the Invention>> However, this radiant heating and cooling system has the disadvantage that the equipment cost is extremely high compared to general air conditioning systems.

Therefore, in large-scale buildings, it has not been possible to adopt this type of heating and cooling system throughout the building due to cost constraints.

On the other hand, there are rooms in the building that require high quality air conditioning, such as executive offices and reception rooms.
In addition to the central air conditioning system, individual air conditioning systems are sometimes used in this type of room, but the heat pump type air conditioning system used in these individual air conditioning systems was exclusively an air cooling/heating system.

In this type of heating and cooling system, first of all, due to the feeling of airflow and the properties of air, the cold air is directed toward the floor.
Warm air convects toward the ceiling, which is a favorable condition, so to speak, and the condition called cold head and warm feet is a reaction.
Another disadvantage is that the temperature distribution tends to be ubiquitous.

The purpose of this invention is to enable high quality heating and cooling of a specific room by performing panel heating and cooling using a heat pump.

<Means for Solving the Problems> In order to achieve the above object, the present invention provides a part or all of the heat exchange coil in the heat pump unit within the heat exchanger, and also provides the heat medium passage of the radiant panel in the heat exchanger. It is characterized in that it is connected to a heat exchanger and a pump circulates the heat medium between the heat exchanger and the radiant panel.

<<Operation>> Hot or cold heat obtained by the heat pump unit is supplied into the radiant panel and radiated into the room through the panel.

Therefore, compared to conventional air blowing systems, there is no air flow sensation or uneven temperature distribution, and it is possible to maintain a uniform temperature throughout the room.

<<Example>> Hereinafter, an example of the present invention will be described in detail using the drawings.

FIG. 1 is an explanatory diagram showing a heating and cooling system according to the present invention.

In the figure, 1 is a heat pump unit. The heat pump unit 1 has a heat exchange coil 2 installed on the outdoor side and a heat exchange coil 3 installed on the indoor side.
, a fan 4 that blows outside air as a heat source to the outdoor heat exchange coil 2, a compressor 5 that circulates refrigerant between the substitute heat exchange coils 2 and 3, and a four-way valve that switches the refrigerant circuit between heating and cooling. It is equipped with 6.

The indoor heat exchange coil 3 is divided into two parts: an air contact heat exchange coil 3a for contacting return air and outside air and blowing out conditioned air indoors, and a heat exchange coil 3a for contacting the heat medium of the radiant panel. It consists of a coil 3b.

Heat exchange coil 3b for contacting heat medium of radiant panel
is housed in a sealed case 7 that constitutes a heat exchanger.

A radiation panel 8 disposed at a different position from the heat pump unit 1 is connected to the case 7.

A heat medium circulation coil 9 for circulating a heat medium such as water to the heat pump unit 1 is built into the radiant panel 8, and the outlet end and inlet end of this coil 9 are connected to the heat medium intake of the case 7, respectively. Connected to the inlet and outlet ends. A circulation pump 10 is disposed in this circulation path, and supplies the heat medium in the coil 9 into the case 7 through the pump 10, and supplies the heat medium in the coil 9 into the case 7.
By bringing the refrigerant into contact with the refrigerant, heat is removed from or given to the refrigerant in the coil, and the refrigerant is circulated within the radiant panel 8 again.

In addition, a three-way valve 11 for water temperature adjustment is arranged at an intermediate position between the circulation pump 10 and the case 7 in order to form a bypass passage for the heat medium in the coil 9. It is designed to prevent overheating.

In the figure, the heat pump unit 1 is in cooling mode, the outdoor heat exchange coil 2 acts as a condenser, the indoor heat exchange coil 3 acts as an evaporator, and there is a connection between the two as shown by the arrow. Refrigerant circulates.

In this state, outside air as a heat source taken in through the fan 4 contacts the condenser (heat exchange coil 2) to cool the liquefied refrigerant heated by the compressor 5. In this state, the refrigerant evaporates within the heat exchange coil 3 serving as an evaporator and takes away the heat of vaporization. The air contact heat exchange coil 3a of the heat exchange coil 3 comes into contact with the return air and the outside air, thereby blowing out the conditioned air cooled to a predetermined temperature toward the indoor side.

Further, the heat exchange coil 3b for contacting the heat medium of the radiant panel is contacted by the heat medium within the radiant panel 8, and is circulated within the radiant panel 8 by the pump 10.

Then, the interior of the room is cooled by radiation cooling from the surface of the radiation panel 8.

In addition, during heating in winter, by switching the four-way valve 6, the outdoor heat exchange coil 2 acts as an evaporator, and the indoor heat exchange coil 3 acts as a condenser. It performs heating and radiant heating using the radiant panel 8.

According to this embodiment, a part of the air-conditioning and heating is of the air blowing type, but all the indoor heat exchange coils can also be used as heat exchange coils for radiant heating.

Next, a case where the above-described heating and cooling system is applied to a ceiling panel type heating and cooling equipment will be explained using FIG. 2.

In the figure, a casing 1A of a heat pump unit 1 is placed at the bottom of a slab 20 of a building, and is connected to an outer wall 21 via an air intake/exhaust duct 22. A ceiling material 23 is spread all over the lower part of the casing 1A, and a part of it is covered with a ceiling panel 24 that constitutes the above-mentioned radiant panel 8.
The heat medium suction/discharge end of the ceiling panel 24 and the casing 1A are connected via a piping connector 25.

Further, the conditioned air outlet of the casing 1A communicates with an outlet 26 formed in a part of the ceiling material 23 via an air supply duct 27. Furthermore, suction ports 28 are also provided at appropriate positions on the ceiling material 23, and indoor air is returned into the heat pump unit 1 through the suction ports 28.

In this embodiment, at the time of cooling, the conditioned air for cooling is blown out from the outlet 26, and at the same time, the room can be cooled by the radiation cooling effect from the ceiling panel 24. As the air can be cooled overhead, air conditioning effects suitable for air conditioning can be obtained.

Next, FIG. 3 shows a case where the heating and cooling system of the present invention is applied to panel heating and cooling, and a part of the floor surface 30 has the same structure as the radiant panel 8 described above. The casing 1A of the heat pump unit 1 is fitted and fixed to the outer wall 21, and the casing 1A and the heat medium circulation coil 9 buried in the floor 30 are connected by a piping connector 25.
are connected via.

Therefore, in this example, the room can be heated and cooled by the radiation effect from the floor 30 at the same time as the cooling and heating air is blown out.

<<Effects of the Invention>> As explained in detail in each of the embodiments above, according to the panel heating and cooling system according to the present invention, radiant heating and cooling using a radiant panel can be used for both or exclusively, instead of heating and cooling using air conditioned air. Therefore, particularly important executive rooms and reception rooms in the building,
It is suitable as an individual heating and cooling system in cases where high-quality air conditioning is required, such as in conference rooms.

[Brief explanation of drawings]

Fig. 1 is an explanatory diagram showing the principle configuration of a panel heating and cooling system using a heat pump according to the present invention;
FIG. 3 is a cross-sectional explanatory diagram showing a case where the heating and cooling system of the present invention is applied to a ceiling radiation heating and cooling system, and FIG. 3 is a cross-sectional explanatory diagram showing a case where the heating and cooling system of the invention is applied to a floor radiation heating and cooling system. 1... heat pump unit, 3... indoor heat exchange coil, 3b... heat exchange coil for heat medium contact, 7... case (heat exchanger), 8... radiation panel, 9... heat medium circulation coil, 10... Circulation pump, 24... Ceiling panel, 30... Floor.

Claims (1)

[Scope of Claims] 1. Part or all of the heat exchange coil in the heat pump unit is provided in the heat exchanger, and the heat medium passage of the radiant panel is connected to the heat exchanger, and the heat medium is exchanged by the pump. A panel heating and cooling system using a heat pump, which is characterized by circulating heat between the container and the radiant panel. 2. A panel heating and cooling system using a heat pump according to claim 1, wherein the radiant panel is a ceiling panel. 3. A panel air-conditioning system using a heat pump according to claim 1, wherein the radiant panel is provided on a floor.