JPH041719Y2 - - Google Patents

Description

[Detailed description of the invention] [Industrial application field] This invention provides electrodes that are insulated from each other on the inner and outer peripheral surfaces of a dielectric material having a through hole, and connects a lead wire to the through hole of the dielectric material. This is particularly suitable for stepped feedthrough capacitors in which the shaft of the dielectric is short and the outer diameter of the dielectric material has a stepped portion on the outer circumferential side of the intermediate portion. This invention relates to improvements in the fixing structure of lead wires.

[Conventional technology]

This type of feedthrough capacitor usually has a stepped cylindrical ceramic dielectric body 1 having a through hole 4 as shown in FIGS. 5 and 6, and a relatively short cylinder axis.
is used, the inner and outer peripheral surfaces of which are plated, and electrodes 2 and 3 that are insulated from each other are provided. A sleeve 7 and a lead wire 5 are passed through the through hole 4 and connected to the electrode 2 on the inner peripheral side.

In this stepped feedthrough capacitor, since the cylindrical axis of the dielectric 1 is relatively short, the length of the electrode 2 on the inner peripheral side formed on the inner surface of the through hole 4 is short. For this reason,
There is a problem in that the strength of the lead wires with solder is weak and the lead wires 5 easily come off. Conventionally, in consideration of this point, the lead wires 5 of the stepped feedthrough capacitor were connected by the following means.

First, a suitable part of the lead wire 5 is flattened, and then a metal sleeve 7 is fitted therein. Further, the sleeves 7 are fitted into the through holes 4 of the dielectric 1 and immersed in molten solder.
And the lead wire 5 is soldered to the electrode 2 on the inner peripheral side.

The feedthrough capacitor thus produced is attached to the substrate a as shown in FIG.

[Problem that the invention attempts to solve]

However, the conventional lead wire connection means has the following drawbacks.

First of all, it is desirable to place the lead wire on the central axis of the dielectric, but it is often misaligned. The reason for this is that there is some gap between the sleeve 7 and the lead wire 5, so the sleeve 7 is inserted into the lead wire 5 during the process.
This is due to the fact that it is easy to move against. As a result, the lead wire 5 is often soldered while being deviated from or tilted from the central axis of the sleeve 7, and the lead wire 5 is often not soldered in the correct position or orientation.

Second, the bending strength of the lead wire is weak. This is because the flat portion 6 made by crushing the lead wire 5 to prevent the sleeve 7 and the dielectric 1 from falling off during the process is susceptible to deformation such as bending and easily breaks. Incidentally, in the experiments conducted by the inventors of the present invention, in Figure 6, a 0.8φ copper lead wire 5 was crushed into an oval shape with a width of 1.6 mm and a height of 1 mm, and the through hole 4 was connected. Insert lead wire 5 upwards.
Approximately 90° in the direction of the arrow while pulling with a force of 500g
When we conducted a test in which the lead wire was bent to a maximum angle and then returned to its original position in about 4 seconds, the lead wire broke after 3 cycles. The broken portion of the lead wire was the flattened portion 6 of the lead wire.

Thirdly, even if consideration was given to the possibility that the lead wire might come off, the lead wire of the feedthrough capacitor still occasionally came off. The reason is that between the lead wire 5 and the sleeve 7,
Also, since the gap between the sleeve 7 and the inner peripheral surface of the through hole is narrow, it is difficult for the solder 9 to enter the gap, and as a result, the adhesion of the lead wire is weak.

This invention was made to solve these conventional problems, and it is possible to reliably solder the lead wire in the correct position and in the correct posture in the through hole of the dielectric, and it also prevents bending of the lead wire. The purpose of this invention is to provide a feedthrough capacitor with a strong structure.

[Means to solve the problem]

That is, in the present invention, in order to achieve the above object, a dielectric body 11 having a through hole 4, electrodes 12 and 13 provided insulated from each other on the inner peripheral surface and outer peripheral surface of this dielectric body 11, and the dielectric The lead wire 15 is inserted into the through hole 14 of the body 11 and is fitted into the lead wire 15.
5, the metal sleeve 17 is inserted into the through hole 14 of the dielectric 11 and soldered to the electrode 12 on the inner circumferential side.
The lead wire 15 is narrowed down and crimped to the lead wire 15 at a plurality of locations approximately equally spaced in the circumferential direction in the vertical direction, and the lead wire 15 and the sleeve 17 and the sleeve 17 and the electrode 12 on the inner circumferential side of the dielectric material 11 are connected to each other. To provide a feedthrough capacitor characterized in that it is fixed by solder 19 in a through hole 14 of a body 11.

[Effect]

At this lead wire connection part, the sleeve 17 can be fixed without crushing a part of the lead wire 15.
The original strength of the lead wire 17 is exhibited as is against bending and the like. Further, since the lead wire 15 is fixed to the sleeve 17 in advance, the sleeve 17 does not fall off from the lead wire 15 during the connection process, and the sleeve 17
It does not tilt or shift.

Furthermore, when a normal cylindrical sleeve 17 is simply placed over the lead wire 15 and fitted into the through hole 14 of the dielectric 11, the sleeve 17 fills the gap between the lead wire 15 and the electrode 12, and the gap is closed. It gets narrower.
On the other hand, as in this invention, by narrowing the sleeve 17 along the lengthwise direction at a plurality of locations approximately equally spaced in the circumferential direction and crimping it to the lead wire 15,
The lead wire 15 can be fixed at the center of the sleeve 17, and at the same time, uneven grooves and peaks are formed on the inner circumference and the outer circumference of the sleeve 17, respectively, along the longitudinal direction. These uneven grooves and ridges are formed between the lead wire 15 and the sleeve 1.
7, and a gap is formed in the vertical direction between the sleeve 17 and the electrode 12 on the inner circumferential side, and from there, the molten solder 19 is connected to the lead wire 15 and the sleeve 17, and between the sleeve 17 and the electrode 12 on the inner circumferential side. It becomes easier to flow in between. As a result, the lead wire 15 and the sleeve 17, and the sleeve 17 and the inner electrode 12 are reliably soldered in the through hole 14 of the dielectric 1, and the adhesion strength of the lead wire 15 is ensured. Ru.

〔Example〕

Hereinafter, an embodiment of this invention will be described with reference to FIGS. 1 to 4. In this invention, a dielectric body 11 having electrodes 12 and 13 provided on the inner and outer circumferential sides, respectively, is used. When connecting the lead wire 15 to the electrode 12, a metal sleeve 17 is fitted into the lead wire 15 without crushing it. and the second
As shown in the drawings and FIG. 4, this sleeve 17 is vertically narrowed at a plurality of equally spaced locations in the circumferential direction of the cylindrical portion and crimped onto the lead wire 15 to be fixed to the lead wire 15. Furthermore, this lead wire 15 is connected to the sleeve 17.
The lead wire 15 and sleeve 17 are inserted into the through hole 14 of the dielectric 11, and the lead wire 15 and the sleeve 17 are inserted into the electrode 1 on the inner circumferential side.
Solder to 2.

In the embodiment shown in FIGS. 1 and 2, a single wire is used as the lead wire 15, a sleeve 17 is fitted into this, and the sleeve 17 is narrowed in the vertical direction at three locations. Therefore, the lead wire 15 is sandwiched and fixed by the sleeve 17 at three locations around the lead wire 15. The outer side of the portion where the sleeve 17 contacts the lead wire 15 has a vertical groove shape and forms a gap between the sleeve 17 and the electrode 12, into which the solder 19 flows. Further, during this period, the outside of the sleeve 17 is in contact with the electrode 12 in the fitted state as shown in FIG. The inner side of the part in contact with the electrode 12 has a vertical groove shape, and the sleeve 1
A gap is formed between 7 and the lead wire 15, and the solder 19 also flows into this gap.

In this example, while applying a tensile load of 500 g to the lead wire 15 under the following conditions, approximately 4
When we conducted a test in which one cycle consisted of bending the lead wire 15 to 90 degrees in seconds and returning it to its original position, we found that
The lead wire broke during the cycle.

Lead wire to be used: Sleeve using 0.8φ copper wire. Cylindrical part outer diameter is 1.4φ. Inner diameter of brass dielectric through hole is 1.6φ. On the other hand, in the example shown in Figs. 3 and 4, lead wire 15 is used. It uses stranded copper wire.
In this invention, there is no need to crush the lead wire 15, so regardless of the material of the lead wire 15, whether it is a solid wire or a twisted wire, etc., the lead wire 15
The type can be selected as appropriate.

In this embodiment, the sleeve 17 is narrowed down at four locations.

[Effect of idea]

As explained above, according to this invention, the lead wire 15 can be accurately fixed at the center of the through hole 14 of the dielectric 11, and the bending strength of the lead wire 15 can be ensured. Furthermore, the lead wire 15 and the sleeve 17
Since the sleeve 17 and the electrode 12 are reliably soldered, troubles such as poor conduction are less likely to occur, and the lead wire 15 is less likely to come off, making it possible to provide a highly reliable feed-through capacitor.

[Brief explanation of the drawing]

Fig. 1 is an exploded perspective view of the lead wire connection portion of a feedthrough capacitor showing an embodiment of this invention before soldering, and a half-sectional perspective view of a sleeve used therein;
The figure is an enlarged cross-sectional plan view of the main part of the same connection part, FIG. 3 is an exploded perspective view of the lead wire connection part before soldering showing another embodiment, and FIG. 4 is an enlarged cross-sectional plan view of the main part of the same connection part. 5 is an exploded perspective view of a conventional example of a lead wire connection section before soldering, and FIG. 6 is a vertical sectional side view of a feedthrough capacitor equipped with the same connection section in use. 11... Dielectric material, 12... Inner peripheral side electrode, 13
...Electrode on the outer circumferential side, 14...Through hole, 15...Lead wire, 17...Sleeve, 19...Solder.

Claims (1)

[Claims for Utility Model Registration] A dielectric 11 having a through hole 14; electrodes 12 and 13 provided insulated from each other on the inner and outer peripheral surfaces of the dielectric 11; and a through hole in the dielectric 11. A lead wire 15 inserted into the hole 14 and passed through the hole 14; and a metal fitted into the lead wire 15, inserted together with the lead wire 15 into the through hole 14 of the dielectric 11, and soldered to the electrode 12 on the inner circumferential side. In the feedthrough capacitor, the metal sleeve 17 is fitted onto the lead wire 15, and the metal sleeve 17 is narrowed along the longitudinal direction at a plurality of locations approximately equally spaced in the circumferential direction, and is crimped onto the lead wire 15.
In addition, the lead wire 15, the sleeve 17, and the sleeve 1
7 and an electrode 12 on the inner peripheral side of a dielectric 11 are fixed to each other by solder 19 in a through hole 14 of the dielectric 11.