JPH04171786A - Flexible wiring board cable - Google Patents
Flexible wiring board cableInfo
- Publication number
- JPH04171786A JPH04171786A JP2298360A JP29836090A JPH04171786A JP H04171786 A JPH04171786 A JP H04171786A JP 2298360 A JP2298360 A JP 2298360A JP 29836090 A JP29836090 A JP 29836090A JP H04171786 A JPH04171786 A JP H04171786A
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- flexible wiring
- circuit pattern
- bridge
- pattern
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000009975 flexible effect Effects 0.000 title claims abstract description 19
- 238000005520 cutting process Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 2
- 239000011889 copper foil Substances 0.000 abstract description 2
- 238000005530 etching Methods 0.000 abstract description 2
- 229920006255 plastic film Polymers 0.000 abstract description 2
- 239000002985 plastic film Substances 0.000 abstract description 2
- 229920006254 polymer film Polymers 0.000 abstract description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 229920001721 polyimide Polymers 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000004642 Polyimide Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000002699 waste material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/03—Use of materials for the substrate
- H05K1/0393—Flexible materials
Landscapes
- Coupling Device And Connection With Printed Circuit (AREA)
- Structure Of Printed Boards (AREA)
Abstract
Description
【発明の詳細な説明】
この発明は、機器の電子部品間を屈曲自在に接続するフ
レキシブル配線基板ケーブル、その製造方法及びその接
続方法に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a flexible wiring board cable that bendably connects electronic components of equipment, a method of manufacturing the same, and a method of connecting the same.
〔従来の技術]
フレキシブル配線基板ケーブル(以下FPCと称する)
は、ポリイミドフィルム等に回路パターンを形成し、基
板よりその回路パターン以外の部分を取り除き、回路パ
ターンの端末部に、端末処理を施してコネクターを取り
付けたものである。[Prior art] Flexible printed circuit board cable (hereinafter referred to as FPC)
In this method, a circuit pattern is formed on a polyimide film or the like, parts other than the circuit pattern are removed from the board, and a connector is attached to the terminal part of the circuit pattern by terminal treatment.
このFPCはその特徴である柔軟性と強さとを生かし、
機器内の回路基板間の接続や他のFPCとの接続に用い
られている。This FPC takes advantage of its characteristics of flexibility and strength,
It is used for connections between circuit boards in devices and for connections with other FPCs.
ところで上記FPCは、素材そのものが高価なため、例
えば長さaのFPCが必要な場合でも、第2図(a)に
示すように、長さa/2より少し大きな幅の基板10に
、同図(a)に示すように回路パターン11を往復させ
て形成し、このFPCを同図(b)のように、屈曲させ
て配線することによって長さaのFPCとして使用する
。このようにFPCは、極力、基板10のむだ部分がで
きないようにして、材料の歩留りを向上させ、コストの
」二昇を押えている。By the way, since the material itself of the above-mentioned FPC is expensive, for example, even if an FPC with a length a is required, as shown in FIG. The circuit pattern 11 is formed by reciprocating as shown in Figure (a), and this FPC is used as an FPC of length a by bending and wiring as shown in Figure (b). In this way, the FPC minimizes waste on the substrate 10 to improve material yield and keep costs down.
このため、例えば機器内の多数の回路基板間を接続する
ものでは、第4図に示すような複数の端末部5の設けら
れた複雑な形状のものとなっている。For this reason, for example, a device that connects a large number of circuit boards in a device has a complicated shape with a plurality of terminal portions 5 as shown in FIG.
しかしながら、第4図に示す上記のものでは、FPCl
の特長である薄くて柔軟な性質により、各端末部5や回
路パターン部6が端末処理時やジヨイント処理時にヒラ
ヒラとばらばらに動くため、邪魔になり作業性が悪い。However, in the above shown in FIG.
Due to its thin and flexible properties, each terminal section 5 and circuit pattern section 6 move loosely during terminal processing or joint processing, which becomes a nuisance and impairs workability.
また、この際端末部5を端末処理装置に引っ掛ける等し
てFPC3を破断させたり、それに伴う断線事故を起こ
す危険性も高い。Further, at this time, there is a high risk that the FPC 3 may be broken due to the terminal section 5 being hooked on the terminal processing device, or an accompanying disconnection accident may occur.
さらに、前記の処理の終わった多数のFPCIを機器に
実装するため運搬する際、運搬箱内で他のFPCiや自
身の端末部5同士が絡み合うことがある。このためFP
Clを箱から取り出す際、絡み合いを解きはくして、取
り出さなければならず作業性が悪い。Furthermore, when transporting a large number of FPCIs that have undergone the above processing to be mounted on equipment, other FPCIs or their own terminal units 5 may become entangled within the transport box. For this reason, FP
When taking out Cl from the box, it has to be disentangled and taken out, resulting in poor workability.
そこでこの発明では、各端末部が自由に動き回らないよ
うにすることを課題として上記の問題を解決することを
目的とする。Therefore, an object of the present invention is to solve the above problem by preventing each terminal section from freely moving around.
〔課題を解決するための手段及びその作用〕上記の目的
を達成するため、この発明にあっては、絶縁フィルム上
に、機器の電子部品間を接続する回路パターン同士を近
接して形成し、前記フィルムの回路パターン以外の部分
を取り除いたフレキシブル配線基板ケーブルにおいて、
前記回路パターンの端末部近傍にブリッジを形成し、そ
のブリッジは、前記取り除き部分を介して対向する前記
フィルムに至るものとする構成としたものである。[Means for Solving the Problems and Their Effects] In order to achieve the above object, in the present invention, circuit patterns connecting electronic components of a device are formed close to each other on an insulating film, In the flexible wiring board cable from which parts other than the circuit pattern of the film are removed,
A bridge is formed near the terminal portion of the circuit pattern, and the bridge extends to the opposing film via the removed portion.
このように構成されるフレキシブル配線基板ケーブルは
、端末部がブリッジでフィルムに接合されており、各端
末部がばらばらにならないように固定されている。In the flexible wiring board cable constructed in this way, the terminal portions are joined to the film by a bridge, and each terminal portion is fixed so as not to come apart.
この時、端末部にコネクターが設りられても同様に、各
コネクターはばらばらにならない。At this time, even if connectors are provided at the terminals, each connector will not come apart.
一方、上記のフレキソプル配線基板ケーブルは、絶縁フ
ィルム上に機器の電子部品間を接続する回路パターン同
士を近接して形成しかつ、前記回路パターンの端末部近
傍から、その近傍と対向する回路パターンに至るブリッ
ジを形成し、前記フィルムの回路パターン及びブリッジ
以外の部分を取り除いた後、前記端末部にコネクターを
設は製作することができる。On the other hand, the above-mentioned flexopull wiring board cable has circuit patterns that connect electronic components of a device formed close to each other on an insulating film, and a circuit pattern that extends from the vicinity of the terminal portion of the circuit pattern to the circuit pattern opposite to the vicinity thereof. After forming the bridge leading to the terminal and removing the circuit pattern and the portions of the film other than the bridge, a connector can be installed or manufactured at the terminal portion.
また、そのフレキシブル配線基板ケーブルは、フレキシ
ブル配線基板ケーブルのブリッジを切断してコネクター
を機器の対応するコネクターに接続する。In addition, the flexible wiring board cable is connected by cutting the bridge of the flexible wiring board cable and connecting the connector to the corresponding connector of the device.
第1図に示すFPClは、ポリイミド等の絶縁プラスチ
ックスフィルム上に銅箔を接着し、エツチング加工を行
って機器の電子部品間を接続する所要の回路パターン6
を形成する。このパターン6上に、端末部5を除いてポ
リマーフィルムの被覆を施し、同図に示すように、端末
部5近傍からこの近傍と対向するフィルムにブリッジ3
を形成し、前記パターン6に沿って型抜を行い、前記基
板からパターン6とブリッジ3以外の部分を取り除いて
いる。このため、FPCl間は各ブリッジ3で互いに繋
がった状態に接合され、各端末部5及び回路パターン部
6はばらばらにならずに一体なものとして固定されてお
り、各端末部5及び回路パターン部6は自由に動き回ら
ない。FPCl shown in Fig. 1 is made by gluing copper foil onto an insulating plastic film such as polyimide and etching it to create the required circuit pattern 6 for connecting electronic components of the device.
form. This pattern 6 is coated with a polymer film except for the terminal part 5, and as shown in the figure, a bridge 3 is applied from the vicinity of the terminal part 5 to the film facing this vicinity.
is formed, and die cutting is performed along the pattern 6 to remove portions other than the pattern 6 and the bridge 3 from the substrate. Therefore, the FPCls are connected to each other by each bridge 3, and each terminal part 5 and circuit pattern part 6 are fixed as one piece without coming apart, and each terminal part 5 and circuit pattern part 6 cannot move around freely.
前記ブリッジ3の形状及びその幅はどの様なものでも良
く、例えば第3図(a)に示す長方形状のものの他、同
図(b)のように、ブリッジ3中央を細くして、切断の
目安として切り易くしたものや、また同図fc)のよう
にブリッジ3に切れ込みを入れておきニッパ−等の切断
具を用いずとも手のめで切り離しが行えるようにして作
業性の向上を計ったものとしてもよい。The shape and width of the bridge 3 may be any shape.For example, in addition to the rectangular shape shown in FIG. In order to improve workability, we made it easier to cut as a guide, and also made a notch in the bridge 3 as shown in the same figure (fc) so that it could be separated by hand without using cutting tools such as nippers. It can also be used as a thing.
このFPCiは、前記ブリッジ3で接合された状態で各
端末部5に端末処理装置(図示せず)により、コネクタ
ー接続の端末処理を行う。この時、FPClの端末部5
及び回路パターン部6は自由に動き回らないため、作業
性が向」ニし、端末処理装置に引っ掛けることも少なく
、従って断線事故も少なくなる。このようにして、端末
処理を終えた多数のFPCIは、ブリッジ3を残したま
ま、運搬箱に入れ、FPClの実装機器の近くへ運搬し
、運搬箱から取り出して機器への実装時にブリッジ3を
切り離して分離し、各端末部5のコネクターを対応する
機器のコネクターへ接続する。このため、運搬時のFP
C1同士の絡み合いも少なく、箱から取り出す際も簡単
で配線作業の効率もアップする。In this FPCi, a terminal processing device (not shown) performs terminal processing for connecting a connector to each terminal portion 5 while being joined by the bridge 3. At this time, the terminal section 5 of FPCl
Also, since the circuit pattern section 6 does not move around freely, workability is improved, and it is less likely to get caught in the terminal processing device, thus reducing the possibility of disconnection accidents. In this way, a large number of FPCIs that have completed terminal processing are placed in a transportation box with the bridge 3 left in place and transported near the equipment in which the FPCI is mounted. Cut and separate, and connect the connector of each terminal part 5 to the connector of the corresponding device. For this reason, the FP during transportation
C1s are less likely to get entangled with each other, making it easier to take them out of the box and increasing the efficiency of wiring work.
なお、上記接合部は、電子部品が実装されるフレキシブ
ル配線基板においても用いることができる。その場合は
、例えば主導体パターンとこのパターンから単独に離隔
配置される電子部品に接続される専用導体パターンとを
仮止めするのに用いて、各パターンの動きをなくして部
品実装時や基板実装時の効率アップを計ることもできる
。Note that the above bonding portion can also be used in a flexible wiring board on which electronic components are mounted. In that case, it can be used, for example, to temporarily fasten the main conductor pattern and a dedicated conductor pattern that is connected to an electronic component placed separately from this pattern, eliminating movement of each pattern during component mounting or board mounting. You can also measure time efficiency.
この発明は、以上のように構成したので端末処理時や運
搬時に、各端末が自由に動くことを防ぐことができる。Since the present invention is configured as described above, it is possible to prevent each terminal from moving freely during terminal processing or transportation.
このため前記作業の効率アップを計ることができると同
時に、フレキシブル配線基板ケーブルの破断事故を減少
させ、それに伴う断線事故も防止することができる。Therefore, it is possible to improve the efficiency of the above-mentioned work, and at the same time, it is possible to reduce the occurrence of breakage accidents of the flexible wiring board cable and to prevent the accompanying breakage accidents.
第1図及び第3図は、この考案に係るフレキシブル配線
基板ケーブルの一実施例を示し、第1図は平面図、第2
図(a)、(ハ)は、従来例の作用説明図、第3図(a
)、(b)、(C)は、接合部の他の実施例を示す要部
拡大図、第4図は従来例を示す平面図である。
6・・・・・・回路パターン、
1・・・・・・フレキシブル配線基板ケーブル、同
代理人 鎌 1) 文 二図
q
慢Figures 1 and 3 show an embodiment of the flexible wiring board cable according to this invention, with Figure 1 being a plan view and Figure 2 being a plan view.
Figures (a) and (c) are action explanatory diagrams of the conventional example, and Figure 3 (a).
), (b), and (C) are enlarged views of main parts showing other embodiments of the joint, and FIG. 4 is a plan view showing a conventional example. 6...Circuit pattern, 1...Flexible wiring board cable, same
Agent Sickle 1) Sentence 2 Figure q Arrogance
Claims (4)
回路パターン同士を近接して形成し、前記フィルムの回
路パターン以外の部分を取り除いたフレキシブル配線基
板ケーブルにおいて、 前記回路パターンの端末部近傍にブリッジを形成し、そ
のブリッジは、前記取り除き部分を介して対向する前記
フィルムに至るものとすることを特徴とするフレキシブ
ル配線基板ケーブル。(1) In a flexible wiring board cable in which circuit patterns connecting electronic components of a device are formed close to each other on an insulating film, and portions of the film other than the circuit patterns are removed, near the terminal portion of the circuit pattern. A flexible wiring board cable, characterized in that a bridge is formed in the cable, and the bridge extends to the opposing film via the removed portion.
ことを特徴とする請求項(1)記載のフレキシブル配線
基板ケーブル。(2) The flexible wiring board cable according to claim (1), wherein a connector is provided at a terminal portion of the circuit pattern.
路パターン同士を近接して形成しかつ、前記回路パター
ンの端末部近傍から、その近傍と対向する回路パターン
に至るブリッジを形成し、前記フィルムの回路パターン
及びブリッジ以外の部分を取り除いた後、前記端末部に
コネクターを設けたことを特徴とするフレキシブル配線
基板ケーブルの製造方法。(3) Form circuit patterns that connect electronic components of a device on an insulating film in close proximity to each other, and form a bridge extending from the vicinity of the terminal portion of the circuit pattern to the circuit pattern opposite to the vicinity; 1. A method for manufacturing a flexible wiring board cable, comprising: removing a portion of the film other than the circuit pattern and the bridge, and then providing a connector at the terminal portion.
ーブルのブリッジを切断してコネクターを機器の対応す
るコネクターに接続することを特徴とするフレキシブル
配線基板ケーブルの接続方法。(4) A method for connecting a flexible wiring board cable, which comprises cutting the bridge of the flexible wiring board cable according to claim (2) and connecting the connector to a corresponding connector of a device.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2298360A JPH04171786A (en) | 1990-11-02 | 1990-11-02 | Flexible wiring board cable |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2298360A JPH04171786A (en) | 1990-11-02 | 1990-11-02 | Flexible wiring board cable |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH04171786A true JPH04171786A (en) | 1992-06-18 |
Family
ID=17858683
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2298360A Pending JPH04171786A (en) | 1990-11-02 | 1990-11-02 | Flexible wiring board cable |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH04171786A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1168897A2 (en) * | 2000-06-30 | 2002-01-02 | Coroplast Fritz Müller GmbH & Co. KG | Foil printed circuit board and process for manufacturing and mounting the same |
-
1990
- 1990-11-02 JP JP2298360A patent/JPH04171786A/en active Pending
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
EP1168897A2 (en) * | 2000-06-30 | 2002-01-02 | Coroplast Fritz Müller GmbH & Co. KG | Foil printed circuit board and process for manufacturing and mounting the same |
EP1168897A3 (en) * | 2000-06-30 | 2004-01-02 | Coroplast Fritz Müller GmbH & Co. KG | Foil printed circuit board and process for manufacturing and mounting the same |
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