JPH04171107A - Burrless machining method for curved substrate - Google Patents

Abstract

PURPOSE:To prevent the occurrence of a burr in a drilling process for a through hole on a curved substrate by severally arranging a dummy plate having the same curvature as a substrate curvature and a fixture on the one face of the curved substrate, and similarly a dummy plate and a pressing tool on its other face, and drilling the substrate from the side of the other face. CONSTITUTION:A workpiece 1 is sandwichedly held between dummy plates 2a, 2b formed so as to have the same curvature as the curvature of the workpiece 1, and a fixture 8 having the curvature similar to the dummy plate 2b is applied to the plate 2b to support it. On the other hand, the workpiece l is pressed under the force of about 15-20kg from the outside of the dummy plate by a pressing tool 3 attached to the nonrotating part 4 of a drilling device for fixing it so as not to produce gaps between the workpiece 1 and the dummy plates 2a, 2b. Thus a through hole is drilled from the side of the dummy plate 2a using a drill 7.

Description

[Detailed Description of the Invention] [Industrial Field of Application] The present invention provides through-hole drilling of curved substrates in one work.
Komei's ability to obtain through holes without burrs is related to the working method.

[Prior art] Normally, drilling holes in a board formed into a single curved surface requires special processing equipment, and mounting a workpiece is subject to the above restrictions, so there may be burrs (copper) on the workpiece. (The foil may not be cut cleanly and thread-like lint may remain around the hole.) Because the workpiece is floating above the installation part, the workpiece vibrates when installed, making it impossible to obtain through-hole performance.9
It had not been done. If it is absolutely necessary, it may take a long time to remove the burrs by hand after the anointing.
I ignored the slight performance drop.

[Problem to be solved by the invention] Manual burr removal as described above.

It takes a long time to work. There were issues such as damage to the through holes.

In addition, in terms of hole performance, there were problems such as poor stability of the workpiece, resulting in unevenness on the side of the hole, resin welding called smear, and the inability to perform predetermined through-hole plating.

The present invention has been made to solve the above problems, and an object of the present invention is to realize processing with high through-hole performance and burr-free drilling in a substrate formed into a nine-curved shape.

[Means for Solving the Problems] The processing method and holding tool according to the present invention are made by molding the same material as the substrate (for example, glass epoxy) into the same shape as the workpiece for one workpiece.

Prepare two pieces and sandwich the workpiece between them. In this condition.

By pressing down the periphery of the hole to be drilled in an area of 5 to 10 mm in diameter using the holding tool of the present invention, the hole is free from burrs and the performance of the through hole is ensured.

[Function] The dummy plates on both sides of the workpiece in this invention are in a solid state with no gap between the workpiece and the dummy plate due to the pressing force of the holding tool in this invention. As a result, the copper foil of the workpiece has no place to escape, and no burrs occur. In addition, since the workpiece is firmly held down, there is no vibration during processing, and the side surface of the through hole has no irregularities and has high performance.

[Example] An embodiment of the present invention will be described below with reference to the drawings.

In the figure, the workpiece (1) is a dummy plate (2a,
2b), and is held down with a force of about 15 to 20 kg by a holding tool (3) so that no gap is created between these three pieces.

This holding tool (3) is attached to the non-rotating part (4) of the spindle head of the equipment.

Holes are drilled using a drill (7) attached to the spindle head rotating part (5) via a drill holder (6), and the holding tool (3) has a built-in spring so that it can expand and contract. When the workpiece approaches and the drill (7) drills the hole, the holding tool (3) holds down the workpiece (1) and the dummy plates (2a, 2b).

[Effects of the Invention] As described above, according to the present invention, the holding tool has a simple structure so that it can be attached to the spindle head, so it has the effect that high-quality through holes can be drilled at low cost using a 5-axis control machining center or the like. There is. Further, since the dummy plate is held down by a holding tool, it can be conveniently used by forming it with a mold for forming the workpiece.

[Brief explanation of the drawing]

The figure is a diagram for explaining the present invention. ) is the workpiece, (2) is the dummy plate, (3) is the holding tool, (4) is the spindle head (non-rotating part), (5) is the spindle head (rotating part), (6) is the drill holder , (7) is a drill, and (8) is a fixture.

Claims (1)

[Claims] In the method of drilling through holes at predetermined positions on a curved board, on one side of the curved board, a fixture machined to have the same curvature as the curved board and a dummy plate molded to follow the curved board surface are placed. Then, on the other side of the curved board, place a dummy plate similar to the above and a holding tool.
A burr-free processing method for a curved board, in which a burr-free through hole is obtained by the action of a holding tool on the dummy plate when drilling a hole from the other side of the board to one side.