JPH04168714A - Manufacture of solid electrolytic capacitor - Google Patents
Manufacture of solid electrolytic capacitorInfo
- Publication number
- JPH04168714A JPH04168714A JP2295964A JP29596490A JPH04168714A JP H04168714 A JPH04168714 A JP H04168714A JP 2295964 A JP2295964 A JP 2295964A JP 29596490 A JP29596490 A JP 29596490A JP H04168714 A JPH04168714 A JP H04168714A
- Authority
- JP
- Japan
- Prior art keywords
- anode
- insulating film
- anode lead
- lead wire
- solid electrolytic
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000003990 capacitor Substances 0.000 title claims abstract description 29
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 8
- 239000007787 solid Substances 0.000 title claims description 11
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 21
- 238000000034 method Methods 0.000 claims description 10
- 229920005989 resin Polymers 0.000 abstract description 7
- 239000011347 resin Substances 0.000 abstract description 7
- 238000002347 injection Methods 0.000 abstract description 6
- 239000007924 injection Substances 0.000 abstract description 6
- GUVRBAGPIYLISA-UHFFFAOYSA-N tantalum atom Chemical compound [Ta] GUVRBAGPIYLISA-UHFFFAOYSA-N 0.000 abstract description 5
- NUJOXMJBOLGQSY-UHFFFAOYSA-N manganese dioxide Chemical compound O=[Mn]=O NUJOXMJBOLGQSY-UHFFFAOYSA-N 0.000 abstract description 4
- 230000035939 shock Effects 0.000 abstract description 4
- 238000005476 soldering Methods 0.000 abstract description 3
- 239000003082 abrasive agent Substances 0.000 abstract 1
- 239000011248 coating agent Substances 0.000 description 7
- 238000000576 coating method Methods 0.000 description 7
- 238000009413 insulation Methods 0.000 description 5
- 239000000565 sealant Substances 0.000 description 3
- 229910052715 tantalum Inorganic materials 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 2
- 230000001070 adhesive effect Effects 0.000 description 2
- 238000007796 conventional method Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000006378 damage Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 229910002804 graphite Inorganic materials 0.000 description 1
- 239000010439 graphite Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002156 mixing Methods 0.000 description 1
- 238000005192 partition Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- 239000007921 spray Substances 0.000 description 1
Landscapes
- Fixed Capacitors And Capacitor Manufacturing Machines (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は固体電解コンデンサの製造方法に関し、特にコ
ンデンサ素子陽極リード線と陽極引出しリード端子との
接続方法に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for manufacturing a solid electrolytic capacitor, and more particularly to a method for connecting a capacitor element anode lead wire and an anode lead terminal.
従来の固体電解コンデンサの陽極接続方法としては、絶
縁被膜が陽極リード線に形成されたまま陽極引出しリー
ド線と抵抗溶接により接続する方法が一般的となってい
た。As a conventional method for connecting the anode of a solid electrolytic capacitor, it has been common to connect the anode lead wire with an anode lead wire by resistance welding while an insulating film is formed on the anode lead wire.
上述した従来の陽極接続方法においては、陽極リード線
に形成された絶縁被膜は抵抗溶接において被溶接体が加
圧される際破壊するが、破壊状態にバラツキがある為被
溶接体間では均一な接触抵抗が得られなく、この結果被
溶接体の溶解等のバラツキが生じ、陽極接続の信頼性を
低下させるという欠点を有していた。In the conventional anode connection method described above, the insulation coating formed on the anode lead wire breaks when the objects to be welded are pressurized during resistance welding, but because the state of destruction varies, it is not uniform between the objects to be welded. Contact resistance cannot be obtained, resulting in variations such as melting of the objects to be welded, which has the disadvantage of lowering the reliability of anode connection.
本発明の目的は、電気的の導電性を損なうことなく、製
造工程中の機械的ストレス及びプリント配線板等にはん
だ付けする際の熱的衝撃によるストレスに耐えうる接続
強度を有し、接続の信頼性を向上できる固体電解コンデ
ンサの製造方法を提供することにある。An object of the present invention is to have a connection strength that can withstand mechanical stress during the manufacturing process and stress due to thermal shock when soldering to a printed wiring board, etc., without impairing electrical conductivity. An object of the present invention is to provide a method for manufacturing a solid electrolytic capacitor that can improve reliability.
本発明の固体電解コンデンサの製造方法は、コンデンサ
素子陽極リード線の表面に形成された誘電体層としての
絶縁被膜の除去を行ない、しかるのち陽極リード線と陽
極引出しリード端子を接続することを特徴として構成さ
れる。The method for manufacturing a solid electrolytic capacitor of the present invention is characterized by removing an insulating film as a dielectric layer formed on the surface of a capacitor element anode lead wire, and then connecting the anode lead wire and the anode lead terminal. Constructed as.
次に本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図及び第２図は本発明の一実施例を説明するための
コンデンサ素子陽極リード線の絶縁被膜除去装置の縦断
面図及び横断面図である。また第５図は絶縁被膜除去後
、接続を行ない外装された樹脂モールドチップ型タンタ
ル固体電解コンデンサの断面図である。1 and 2 are a longitudinal sectional view and a transverse sectional view of an insulating coating removal device for a capacitor element anode lead wire for explaining one embodiment of the present invention. Further, FIG. 5 is a sectional view of a resin molded chip type tantalum solid electrolytic capacitor which is connected and packaged after the insulation coating is removed.
先ず、タンタル粉末に陽極酸化可能な陽極リード線４を
植立プレス形成した後、焼結し陽極体を形成した。この
陽極体に誘電体層として１７００人の酸化被膜を形成、
さらにその酸化被膜上に二酸化マンガン層、グラファイ
ト層、銀ペースト層を順次設はコンデンサ素子３を形成
した。形成されたコンデンサ素子３の陽極リード線４表
面に形成された絶縁被膜を除去する為、コンデンサ素子
３を上マスク板ＩＡと下マスク板ＩＢで仕切り、主噴射
ノズル２Ａと下噴射ノズル２Ｂより樹脂より成る研磨剤
を陽極リード線４に上下より吹き付け、表面に形成され
た絶縁膜の除去を行った。First, an anode lead wire 4 that can be anodized was formed on tantalum powder by planting and pressing, and then sintered to form an anode body. A 1,700-layer oxide film is formed on this anode body as a dielectric layer.
Further, a manganese dioxide layer, a graphite layer, and a silver paste layer were sequentially provided on the oxide film to form a capacitor element 3. In order to remove the insulating film formed on the surface of the anode lead wire 4 of the formed capacitor element 3, the capacitor element 3 is partitioned by an upper mask plate IA and a lower mask plate IB, and resin is injected from the main injection nozzle 2A and the lower injection nozzle 2B. An abrasive made of the following was sprayed onto the anode lead wire 4 from above and below to remove the insulating film formed on the surface.
しかる後、第５図に示す様にコンデンサ素子３を銀粉末
とエポキシ樹脂等を混合して得た導電性接着剤７を介し
て、はんだ付は可能な陰極引出しリード端子６に接続し
た。同時に絶縁被膜除去後の陽極リード線４とはんだ付
は可能な陽極引出しリード端子５とを公知の手段で電気
的に接続した。Thereafter, as shown in FIG. 5, the capacitor element 3 was connected to a solderable cathode lead terminal 6 via a conductive adhesive 7 obtained by mixing silver powder, epoxy resin, etc. At the same time, the anode lead wire 4 after the insulation coating was removed and the anode lead terminal 5, which can be soldered, were electrically connected by known means.
最後に全体を絶縁性樹脂封止剤８にてモールド成形を行
なった。Finally, the entire structure was molded using an insulating resin sealant 8.
第３図及び第４図は本発明の第二の実施例であるコンデ
ンサ素子陽極リード線の絶縁被膜除去装置の縦断面図及
び横断面図である。また第５図は絶縁被膜除去後、接続
を行ない外装された樹脂モールドチップ型タンタル固体
電解コンデンサの断面図である。3 and 4 are a longitudinal sectional view and a transverse sectional view of an insulating coating removal device for a capacitor element anode lead wire, which is a second embodiment of the present invention. Further, FIG. 5 is a sectional view of a resin molded chip type tantalum solid electrolytic capacitor which is connected and packaged after the insulation coating is removed.
第一の実施例で記述した如くコンデンサ素子３を形成し
、陽極リード線４表面に形成された絶縁被膜を除去する
為コンデンサ素子３を上マスク板ＩＡと下マスク板ＩＢ
で仕切り上やすり板２Ｃと下やすり板２Ｄを陽極リード
線４表面に接触させ、やすり板を左右に動作させること
により表面に形成された絶縁被膜の除去を行なった。The capacitor element 3 is formed as described in the first embodiment, and in order to remove the insulating film formed on the surface of the anode lead wire 4, the capacitor element 3 is placed between the upper mask plate IA and the lower mask plate IB.
The partition upper file plate 2C and lower file plate 2D were brought into contact with the surface of the anode lead wire 4, and the insulation coating formed on the surface was removed by moving the file plates from side to side.
しかる後第−の実施例で記述した如く陽極・陰極の接続
を行い、最後に全体を絶縁性樹脂封止剤８にてモールド
成形を行なった。Thereafter, the anode and cathode were connected as described in the first example, and finally the whole was molded with an insulating resin sealant 8.
以上説明した第１および第２の実施例のコンデンサと従
来方法で得たコンデンサをはんだ浴を通して（２８０℃
、３０秒）実装した場合（実装数量１０，０００個）の
陽極部接続外れ不良率を比較した場合結果を第１表およ
び第６図に示す。The capacitors of the first and second embodiments described above and the capacitors obtained by the conventional method were passed through a solder bath (at 280°C).
Table 1 and FIG. 6 show the results of a comparison of the failure rate due to disconnection of the anode section when mounting (10,000 pieces mounted) (10,000 pieces mounted).
第 １ 表
本発明実施品と従来品の陽極部接続外れ不良率比較図よ
り、本発明によって改善されていることがわかる。Table 1 Comparison of failure rate due to disconnection of the anode section between the product implementing the present invention and the conventional product shows that the present invention has improved.
以上説明したように本発明は、コンデンサ素子陽極リー
ド線表面に付いている絶縁被膜の除去を行なった後、陽
極引出しリード端子との陽極接続を行なうことにより電
気的の導電性を損なうことなく製造工程中の機械的スト
レス及びプリント配線板等にはんだ付けする際の熱的衝
撃によるストレスに耐えうる接続強度を有し、接続の信
頼性を向上できる効果がある。As explained above, the present invention can be manufactured without impairing electrical conductivity by removing the insulating film attached to the surface of the anode lead wire of a capacitor element and then making an anode connection with the anode lead terminal. It has a connection strength that can withstand mechanical stress during the process and stress due to thermal shock when soldering to a printed wiring board, etc., and has the effect of improving connection reliability.
第１図及び第２図は本発明の第一の実施例である。コン
デンサ素子陽極リード線の絶縁膜を噴射ガンにより除去
する方法の縦断面図及び横断面図、第３図及び第４図は
本発明の第二の実施例であるコンデンサ素子陽極リード
線の絶縁被膜をやすり板により除去する方法の縦断面図
及び横断面図、第５図は絶縁被膜除去後、接続を行ない
外装された樹脂モールドチップ型タンタル固体電解コン
デンサの断面図、第６図は本発明実施例と従来例のはん
だ浴を通して実装した後の陽極接続外れ不良率を示した
図である。
ＩＡ・・・・・・上マスク板、ＩＢ・・・・・・下マス
ク板、２Ａ・・・・・・上噴射ノズル、２Ｂ・・・・・
・下噴射ノズル、２Ｃ・・・・・・上やすり板、２Ｄ・
・・・・・下やすり板、３・・・・・・コンデンサ素子
、４・・・・・・陽極リード線、５・・・・・・陽極引
出しリード端子、６・・・・・・陰極引出しリード端子
、７・・・・・・導電性接着剤、訃・・・・・絶縁性樹
脂封止剤。
代理人 弁理士 内 原 晋
７一
Ｃっ −、＋ 噂 ’、Ｏｆ＞（０
く薗
り
０〈1 and 2 show a first embodiment of the present invention. A vertical cross-sectional view and a cross-sectional view of a method of removing an insulating film of a capacitor element anode lead wire using a spray gun, and FIGS. 3 and 4 show an insulating film of a capacitor element anode lead wire according to a second embodiment of the present invention. Fig. 5 is a cross-sectional view of a resin-molded chip type tantalum solid electrolytic capacitor which is connected and packaged after removing the insulating film, and Fig. 6 is a cross-sectional view of the method of removing the insulating film with a file plate. FIG. 3 is a diagram showing the anode disconnection failure rate after mounting through a solder bath in the example and the conventional example. IA... Upper mask plate, IB... Lower mask plate, 2A... Upper injection nozzle, 2B...
・Lower injection nozzle, 2C... Upper file plate, 2D・
...Lower file board, 3...Capacitor element, 4...Anode lead wire, 5...Anode lead terminal, 6...Cathode Drawer lead terminal, 7... Conductive adhesive, 7... Insulating resin sealant. Agent Patent Attorney Susumu Uchihara 71C -, + Rumor', Of＞(0 Kuzonori0〈
Claims (1)
ード端子を、陰極層に陰極引出しリード端子を接続する
工程を有する固体電解コンデンサの製造方法において、
コンデンサ素子陽極リード線の表面に形成された誘電体
層としての絶縁被膜の除去を行ない、しかるのち陽極引
出しリード端子を接続することを特徴とする固体電解コ
ンデンサの製造方法。A method for manufacturing a solid electrolytic capacitor comprising the step of connecting an anode lead terminal to an anode lead wire of a solid electrolytic capacitor element and a cathode lead terminal to a cathode layer,
A method for manufacturing a solid electrolytic capacitor, which comprises removing an insulating film as a dielectric layer formed on the surface of a capacitor element anode lead wire, and then connecting an anode lead terminal.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2295964A JPH04168714A (en) | 1990-11-01 | 1990-11-01 | Manufacture of solid electrolytic capacitor |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2295964A JPH04168714A (en) | 1990-11-01 | 1990-11-01 | Manufacture of solid electrolytic capacitor |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04168714A true JPH04168714A (en) | 1992-06-16 |
Family
ID=17827367
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2295964A Pending JPH04168714A (en) | 1990-11-01 | 1990-11-01 | Manufacture of solid electrolytic capacitor |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04168714A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017175012A (en) * | 2016-03-24 | 2017-09-28 | Koa株式会社 | Surface mounted resistor |
-
1990
- 1990-11-01 JP JP2295964A patent/JPH04168714A/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2017175012A (en) * | 2016-03-24 | 2017-09-28 | Koa株式会社 | Surface mounted resistor |
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