JPH04168404A - Manufacture of wave-guiding channel type optical module - Google Patents

Manufacture of wave-guiding channel type optical module

Info

Publication number
JPH04168404A
JPH04168404A JP29601490A JP29601490A JPH04168404A JP H04168404 A JPH04168404 A JP H04168404A JP 29601490 A JP29601490 A JP 29601490A JP 29601490 A JP29601490 A JP 29601490A JP H04168404 A JPH04168404 A JP H04168404A
Authority
JP
Japan
Prior art keywords
stem
box
solder
box body
welded
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP29601490A
Other languages
Japanese (ja)
Inventor
Ryuichi Saito
隆一 斉藤
Toshihide Tokunaga
徳永 利秀
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Cable Ltd
Original Assignee
Hitachi Cable Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Cable Ltd filed Critical Hitachi Cable Ltd
Priority to JP29601490A priority Critical patent/JPH04168404A/en
Publication of JPH04168404A publication Critical patent/JPH04168404A/en
Pending legal-status Critical Current

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  • Optical Couplings Of Light Guides (AREA)
  • Semiconductor Lasers (AREA)

Abstract

PURPOSE:To satisfactorily fix an optical element loading stem to a box body and improve the position precision by using a recessed part having a soldering layer as the surface for welding the optical element loading stem to the box body, and welding this by heating. CONSTITUTION:The optical axis fitting of a LD stem 2 integrated with a LD element 3 is conducted, and the stem 2 is laser-welded and fixed to a box body 1. On the surface for welding the stem 2 and the body 1, a recessed part is provided, and a soldering layer having a determined thickness is preliminarily provided thereon. Then, the connecting part 6 between the stem 2 and the box body 1 is heated at high frequency for soldering. The reason for this is that, when a solder is placed on the whole connecting surface of the stem, and the stem 2 is not in contact with the box body 1 at all, there is the possibility that only the solder is welded at the time of laser welding, and the stem 2 is not welded. Thus, the LD 3 and a glass wave-guiding channel can be fixed with highly precisely fitting their optical axes to each other, and the exothermic of the LD also can be effectively removed.

Description

【発明の詳細な説明】 [産業上の利用分野] 本発明は導波路型光モジュールの製造方法に関するもの
である。
DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to a method for manufacturing a waveguide type optical module.

[従来の技術] 光ファイバまたはガラス導波路型を用いた光モジュール
は、LD(レーザダイオード)やLED(発光ダイオー
ド)と光ファイバあるいはガラス導波路とをレンズを介
したり、または直接光結合させる構造になっている。
[Prior Art] An optical module using an optical fiber or glass waveguide type has a structure in which an LD (laser diode) or LED (light emitting diode) and an optical fiber or glass waveguide are optically coupled through a lens or directly. It has become.

従来の光モジュールは第3図(a)または(b)に示す
ような構造である。同図において1は金属函体、2はL
Dステム、3はLDチップ、4は光ファイバである。同
図(a)に示す従来例は函体1にまずLDステム2をハ
ンダもしくはYAGレーザで固定し、その後光ファイバ
4の光軸合わせ、固定をしている。また同図(b)に示
す従来例は、まずガラス導波路5を函体1内にYAGレ
ーザ溶接で固定し、次にLDステム2を光軸合せしてハ
ンダもしくはYAGレーザ溶接で固定する。なをこれら
の図において6は、函体1とLDステム2との固定個所
である。
A conventional optical module has a structure as shown in FIG. 3(a) or (b). In the same figure, 1 is a metal box, 2 is an L
In the D stem, 3 is an LD chip, and 4 is an optical fiber. In the conventional example shown in FIG. 4A, the LD stem 2 is first fixed to the box 1 with solder or a YAG laser, and then the optical axis of the optical fiber 4 is aligned and fixed. Further, in the conventional example shown in FIG. 2B, the glass waveguide 5 is first fixed in the box 1 by YAG laser welding, and then the LD stem 2 is aligned with its optical axis and fixed by solder or YAG laser welding. In these figures, reference numeral 6 indicates a location where the box 1 and the LD stem 2 are fixed.

同図(a)の光フアイバ型の光モジュールの場合、LD
システム2の固定後頁度光ファイバ4との光軸調整が可
能である。しかし同図(b)のガラス導波路型の場合、
ガラス導波路5を動かして光軸合わせすることは困難で
あり、光軸に対して数μの精度でLDステム2を固定す
る必要がある。
In the case of the optical fiber type optical module shown in Figure (a), the LD
After the system 2 is fixed, the optical axis can be adjusted with respect to the optical fiber 4. However, in the case of the glass waveguide type shown in figure (b),
It is difficult to align the optical axis by moving the glass waveguide 5, and it is necessary to fix the LD stem 2 with an accuracy of several microns with respect to the optical axis.

[発明が解決しようとする課題] 上記のように従来の光モジュールのLDステムの固定方
法としては、ハンダまたはYAGレーザ溶接が用いられ
ている。ハンダ固定ではハンダの凝固時にステムに不均
一な応力が加わり、最小でも5〜7μm程度の光軸ずれ
を生じる。また、外部に温度変化があった場合、ハンダ
のクリープ環象や線膨張により光軸ずれが生じる問題が
ある。
[Problems to be Solved by the Invention] As described above, solder or YAG laser welding is used as a conventional method for fixing the LD stem of an optical module. When fixing with solder, non-uniform stress is applied to the stem when the solder solidifies, causing optical axis deviation of about 5 to 7 μm at the minimum. Further, when there is a temperature change outside, there is a problem in that optical axis deviation occurs due to a creep phenomenon or linear expansion of the solder.

またレーザ溶接では、溶接部がスポットであるため、ス
テム函体まにギャップができ、この部分の熱抵抗が大き
くてLDの発熱が函体外に効率よく除去されていないた
め、LDの安定した特性が得られなくなる問題がある。
In addition, in laser welding, since the weld is a spot, a gap is created between the stem box and the thermal resistance of this part is large, and the heat generated by the LD is not efficiently removed outside the box, resulting in stable characteristics of the LD. There is a problem that it becomes impossible to obtain.

本発明は以上の点に鑑みなされたものであり、高精度で
温度変動によっても位置ずれをおこさないようにステム
を信頼性高く固定することを可能とした導波路型光モジ
ュールの製造方法を提供することを目的とするものであ
る。
The present invention has been made in view of the above points, and provides a method for manufacturing a waveguide type optical module that makes it possible to fix the stem with high precision and with high reliability so as to prevent positional shift even due to temperature fluctuations. The purpose is to

[課題を解決するための手段] 上記目的は、光素子搭載型ステムの函体と溶接される面
に凹部を設け該凹部に予め所定厚みのハンダ層を設けて
おき、ステムの同縁部と函体との接触部をレーザ溶接し
た後、ハンダ層を加熱溶接して、ステムと金属函体とを
ハンダ付けることにより、達成される。
[Means for Solving the Problems] The above object is to provide a concave portion in the surface of the optical element-mounted stem to be welded to the box, provide a solder layer of a predetermined thickness in the concave portion in advance, and connect the stem to the same edge portion of the stem. This is achieved by laser welding the contact portion with the box and then heat welding the solder layer to solder the stem and the metal box.

[作用] 上記手段を設(ブたので、ステムは金属函体に、レーザ
溶接及びハンダ付けによって良好に固定されるようにな
って、高精度な位置固定ができ、かつLDの熱雷導をよ
くすることができる。
[Function] With the above means installed, the stem can be well fixed to the metal box by laser welding and soldering, and the position can be fixed with high precision, and the thermal lightning conduction of the LD can be prevented. can do well.

[実施例] 以下図示した実施例に基づいて本発明を説明する。第1
図および第2図には本発明の一実施例が示されている。
[Example] The present invention will be described below based on the illustrated example. 1st
An embodiment of the invention is shown in FIG. 2 and FIG.

なお、従来と同じ部品には同じ符号を付したので説明を
省略する。本実施例ではLDシステム2の函体1と溶接
される面に凹部2aを設け、この凹部2aに予め所定厚
みのハンダ層7を設けている。LDステム2の周縁部を
函体1にレーザ溶接した後、ハンダ層7を加熱してLD
ステム2の凹部2aを金属函体1とハンダ付けさせた。
It should be noted that the same parts as in the prior art have been given the same reference numerals, so their explanation will be omitted. In this embodiment, a recess 2a is provided on the surface of the LD system 2 to be welded to the box 1, and a solder layer 7 of a predetermined thickness is provided in advance in the recess 2a. After the peripheral edge of the LD stem 2 is laser welded to the box 1, the solder layer 7 is heated and the LD
The recess 2a of the stem 2 was soldered to the metal case 1.

このようにすることにより、LDステム2と金属函体1
とはレーザ溶接及びハンダ付けによって良好に固定され
るようになって、高精度な位置固定ができ、かつLDの
熱伝導をよくすることができるようになり、高精度で温
度変動によっても位置ずれをおこさず信頼性を高くする
ことができる。
By doing this, the LD stem 2 and the metal box 1
The laser welding and soldering have made it possible to fix the laser diode well, making it possible to fix the position with high precision and to improve the heat conduction of the LD. It is possible to improve reliability without causing problems.

すなわち、ガラス導波路5を函体1にレーザ溶接により
固定する。次にLD素子3と一体となったLDステム2
を光軸合せし、LDステム2の周縁部と函体1との接触
部をレーザ溶接で固定する。
That is, the glass waveguide 5 is fixed to the box 1 by laser welding. Next, the LD stem 2 integrated with the LD element 3
The optical axes of the LD stem 2 are aligned, and the contact portion between the peripheral edge of the LD stem 2 and the box 1 is fixed by laser welding.

その接受にLDステム2と函体1との接合部6を高周波
加熱器(図示せず)でハンダ7の融点以上まで加熱しハ
ンダ付けを行う。この際にLD3の耐熱性の点から加熱
時間は2秒以内とする。また、ステム2の接合面全面に
ハンダ7をのせ、ステム2と函体1とが全く接触してい
ないと、レーザ溶接のときハンダ7のみが溶けて、ステ
ム本体2が溶けないおそれがある(gなわちステム2と
函体1とはハンダ7により接合されるもののステム2と
函体1とは直接レーザ溶接されないことになる)ため、
LDステム2の構造は第2図に示されているように、函
体1に接合される面に凹部2aを設けた構造とした。な
お凹部2aは、溝を複数本設けた構造や、格子状構造で
もよい。ハンダ層7の厚さは、ハンダがしDステム2と
函体1との両面を十分濡らし、溶融時に新たに隙間ので
きない10uTrLから100um程度とした。この場
合に、函体1側にハンダめっきをitことにより、濡れ
性はより向上する。
For this purpose, the joint 6 between the LD stem 2 and the box 1 is heated to a temperature higher than the melting point of the solder 7 using a high-frequency heater (not shown) to perform soldering. At this time, the heating time is set to within 2 seconds in view of the heat resistance of the LD3. Furthermore, if the solder 7 is placed on the entire joint surface of the stem 2 and the stem 2 and the box 1 are not in contact at all, there is a risk that only the solder 7 will melt during laser welding and the stem body 2 will not melt ( (In other words, although the stem 2 and the box 1 are joined by the solder 7, the stem 2 and the box 1 are not directly laser welded.)
As shown in FIG. 2, the structure of the LD stem 2 was such that a recess 2a was provided on the surface to be joined to the box 1. Note that the recessed portion 2a may have a structure in which a plurality of grooves are provided or a lattice-like structure. The thickness of the solder layer 7 was set to about 10 uTrL to 100 um so that both sides of the desoldering D stem 2 and the box 1 were sufficiently wetted and no gaps were created when melted. In this case, wettability is further improved by applying solder plating to the side of the box 1.

このように本実施例によれば光モジュールにおいてLD
とガラス導波路との光軸を高精度に合わせて固定するこ
とができ、同時にLDの発熱を効果的に除去することが
できる。
In this way, according to this embodiment, the LD in the optical module
The optical axes of the optical axis and the glass waveguide can be aligned and fixed with high precision, and at the same time, the heat generated by the LD can be effectively removed.

なお、レーザの溶接の場合、レーザ照射の位置が函体内
部の接合部であるが、これが函体外部から函体壁を通し
てでも可能である。また、スポット溶接の熱源としては
、YAGレーザのほか電子ビームも使用できる。
In the case of laser welding, the position of laser irradiation is the joint inside the box, but this can also be done from outside the box through the wall of the box. In addition to a YAG laser, an electron beam can also be used as a heat source for spot welding.

更に、本実施例ではLDステムに設けた凹部ハンダ層を
成形したが、LDステムに凹部だけを形成しおき、その
凹部の深さに合ったハンダの箔をはさんで溶接してもよ
い。
Further, in this embodiment, the solder layer in the concave portion provided on the LD stem is molded, but it is also possible to form only the concave portion in the LD stem, and weld by sandwiching a solder foil that matches the depth of the concave portion.

なおまた、発光素子としてLDのはかLED用にも利用
できる。
Furthermore, it can also be used as a short LED of an LD as a light emitting element.

[発明の効果コ 上述のように本発明は光素子搭載用のステムの函体と、
溶接される面に凹部を設け、この凹部に予じめ所定厚み
のハンダ層を設けておき、ステムと函体とをレーザ溶接
した後、ハンダ層を加熱してステムの凹部と金属函体と
をハンダ付けしたので、ステムと金属函体とは、高精度
に位置固定でき、光素子の熱伝導をよくすることができ
るようになり、高精度で温度変動によっても位置ずれを
おこすことのない信頼性の高い導波路型光モジュールを
得ることができる。
[Effects of the Invention] As described above, the present invention provides a stem case for mounting an optical element,
A concave portion is provided on the surface to be welded, a solder layer of a predetermined thickness is provided in advance in this concave portion, and after laser welding the stem and the casing, the solder layer is heated to bond the concave portion of the stem and the metal casing. Since the stem and metal box are soldered together, the position of the stem and metal box can be fixed with high precision, and the heat conduction of the optical element can be improved. A highly reliable waveguide type optical module can be obtained.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明により製造した導波路型光モジュールを
示す縦断側面図、第2図は本発明に使用されるLDステ
ムの一例を示す斜視図、第3図(a)、(b)は従来の
光モジコールを示す縦断側面図である。 1:金属函体、 2:LDステム、 2a:凹部、 5ニガラス導波路、 7:ハンダ層。 第 1 躬 児 2 ロ ア ゛ハン7層 第 3 菌 (α)
FIG. 1 is a longitudinal cross-sectional side view showing a waveguide type optical module manufactured according to the present invention, FIG. 2 is a perspective view showing an example of an LD stem used in the present invention, and FIGS. 3(a) and (b) are FIG. 2 is a vertical side view showing a conventional optical modicoll. 1: metal box, 2: LD stem, 2a: recess, 5 glass waveguide, 7: solder layer. 1st Bacteria 2 Lower Han 7th Layer 3rd Bacteria (α)

Claims (1)

【特許請求の範囲】[Claims] 1、金属函体の内部にガラス導波路を固定し、次いで前
記ガラス導波路と光軸合わせした光素子を搭載したステ
ム前記函体の内部にレーザ溶接により固定する工程を有
する導波路型光モジュールの製造方法において、前記ス
テムの前記函体と溶接される面に凹部を設け該凹部に予
め所定厚みのハンダ層を設けておき、前記ステムの周縁
部と前記函体との接触部をレーザ溶接した後に、前記ハ
ンダ層を加熱溶融させて前記ステムの凹部と前記函体と
をハンダ付けすることを特徴とする導波路型光モジュー
ルの製造方法。
1. A waveguide type optical module comprising the steps of fixing a glass waveguide inside a metal box, and then fixing a stem carrying an optical element whose optical axis is aligned with the glass waveguide inside the box by laser welding. In the manufacturing method, a recess is provided on the surface of the stem to be welded to the box, a solder layer of a predetermined thickness is provided in advance in the recess, and a contact area between the peripheral edge of the stem and the box is laser welded. After that, the solder layer is heated and melted to solder the concave portion of the stem and the case.
JP29601490A 1990-11-01 1990-11-01 Manufacture of wave-guiding channel type optical module Pending JPH04168404A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP29601490A JPH04168404A (en) 1990-11-01 1990-11-01 Manufacture of wave-guiding channel type optical module

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP29601490A JPH04168404A (en) 1990-11-01 1990-11-01 Manufacture of wave-guiding channel type optical module

Publications (1)

Publication Number Publication Date
JPH04168404A true JPH04168404A (en) 1992-06-16

Family

ID=17828004

Family Applications (1)

Application Number Title Priority Date Filing Date
JP29601490A Pending JPH04168404A (en) 1990-11-01 1990-11-01 Manufacture of wave-guiding channel type optical module

Country Status (1)

Country Link
JP (1) JPH04168404A (en)

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