JPH04168402A - Optical semiconductor module - Google Patents
Optical semiconductor moduleInfo
- Publication number
- JPH04168402A JPH04168402A JP29591190A JP29591190A JPH04168402A JP H04168402 A JPH04168402 A JP H04168402A JP 29591190 A JP29591190 A JP 29591190A JP 29591190 A JP29591190 A JP 29591190A JP H04168402 A JPH04168402 A JP H04168402A
- Authority
- JP
- Japan
- Prior art keywords
- optical fiber
- package
- optical
- fixed
- terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 230000003287 optical effect Effects 0.000 title claims abstract description 33
- 239000004065 semiconductor Substances 0.000 title claims abstract description 29
- 239000013307 optical fiber Substances 0.000 claims abstract description 51
- 230000008878 coupling Effects 0.000 claims description 20
- 238000010168 coupling process Methods 0.000 claims description 20
- 238000005859 coupling reaction Methods 0.000 claims description 20
- 229910000679 solder Inorganic materials 0.000 abstract description 4
- 239000011521 glass Substances 0.000 abstract description 2
- 238000002844 melting Methods 0.000 abstract description 2
- 230000008018 melting Effects 0.000 abstract description 2
- 239000000835 fiber Substances 0.000 abstract 2
- 230000001105 regulatory effect Effects 0.000 abstract 2
- 229910045601 alloy Inorganic materials 0.000 description 3
- 239000000956 alloy Substances 0.000 description 3
- 238000009529 body temperature measurement Methods 0.000 description 3
- 238000001816 cooling Methods 0.000 description 3
- 238000003466 welding Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4204—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms
- G02B6/421—Packages, e.g. shape, construction, internal or external details the coupling comprising intermediate optical elements, e.g. lenses, holograms the intermediate optical component consisting of a short length of fibre, e.g. fibre stub
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/26—Optical coupling means
- G02B6/32—Optical coupling means having lens focusing means positioned between opposed fibre ends
-
- G—PHYSICS
- G02—OPTICS
- G02B—OPTICAL ELEMENTS, SYSTEMS OR APPARATUS
- G02B6/00—Light guides; Structural details of arrangements comprising light guides and other optical elements, e.g. couplings
- G02B6/24—Coupling light guides
- G02B6/42—Coupling light guides with opto-electronic elements
- G02B6/4201—Packages, e.g. shape, construction, internal or external details
- G02B6/4248—Feed-through connections for the hermetical passage of fibres through a package wall
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Mechanical Coupling Of Light Guides (AREA)
- Optical Couplings Of Light Guides (AREA)
- Semiconductor Lasers (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は光半導体モジュールに関し、特に光半導体素子
をパッケージ内に封入し、入出力用の光ファイバと結合
した光半導体モジュールの実装構造に関する。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to an optical semiconductor module, and more particularly to a mounting structure of an optical semiconductor module in which an optical semiconductor element is enclosed in a package and coupled to an optical fiber for input/output.
従来の光半導体モジュールは、第５図に示すように、入
出力用の光ファイバ１１を光軸調整を行った後に保持部
材１５を用いてパッケージ８ａに固定し、半導体レーザ
素子１と結合用レンズ３を介して直接結合させる構造と
なっていた。As shown in FIG. 5, in the conventional optical semiconductor module, an input/output optical fiber 11 is fixed to a package 8a using a holding member 15 after optical axis adjustment, and a semiconductor laser element 1 and a coupling lens are attached. The structure was such that they were directly bonded via 3.
上述した従来の光半導体モジュールは、光ファイバ１］
−がパッケージ８ａの側面に固定されているのに対して
、これと同一光軸上に配置されねばならない半導体レー
ザ素子１及び結合用レンズ３はパッケージ８ａの底面に
固定される構造となっているため、光半導体モジュール
の使用環境の温度変化や光半導体モジュールをパネルに
取付けるときの外力により、パッケージ８の変形が生じ
て両者の相対位置がずれ、光軸ずれが発生しやすいとい
う欠点がある。The conventional optical semiconductor module described above is an optical fiber 1]
- is fixed to the side surface of the package 8a, while the semiconductor laser element 1 and the coupling lens 3, which must be arranged on the same optical axis, are fixed to the bottom surface of the package 8a. Therefore, there is a drawback that the package 8 is deformed due to temperature changes in the environment in which the optical semiconductor module is used or external force when the optical semiconductor module is attached to a panel, causing the relative positions of the two to shift and optical axis misalignment.
本発明の目的は、温度変化や外力の影響によるパッケー
ジの変形があっても光軸ずれが発生しない光半導体モジ
ュールを提供することである。An object of the present invention is to provide an optical semiconductor module in which the optical axis does not shift even if the package is deformed due to temperature changes or external forces.
本発明の光半導体モジュールは、入出力用の光ファイバ
の端末を固定する第１の光ファイバ端末をパッケージの
側面に固定し、光半導体素子とその前面に配置された第
］−の結合レンズとを含む光学部を取り付けた保持部材
を前記パッケージの底面に固定し気密封入した光半導体
モジュールにおいて、前記第］の光ファイバ端末と前記
第１の結合レンズとの間に両端に第２及び第３の光ファ
イバ端末を有する中継光ファイバを配し、前記第２の光
ファイバ端末を前記第１の結合レンズと対向するよう前
記保持部材に固定し、前記第３の光ファイバ端末を前記
第１の光ファイバ端末と対向するよう前記パッケージの
側面に固定し、前′２第１と第３の光ファイバ端末の間
に第２の結合レンズを前記パッケージに気密を保つよう
に固着して構成されている。In the optical semiconductor module of the present invention, a first optical fiber terminal for fixing the terminal of an input/output optical fiber is fixed to the side surface of the package, and an optical semiconductor element and a second coupling lens disposed on the front surface thereof are connected to each other. In the optical semiconductor module in which a holding member to which an optical part including an optical part is attached is fixed to the bottom surface of the package and hermetically sealed, second and third optical fibers are disposed at both ends between the first optical fiber terminal and the first coupling lens. A relay optical fiber having an optical fiber terminal is arranged, the second optical fiber terminal is fixed to the holding member so as to face the first coupling lens, and the third optical fiber terminal is fixed to the holding member so as to face the first coupling lens. A second coupling lens is fixed to a side surface of the package so as to face the optical fiber terminal, and a second coupling lens is fixed to the package to maintain airtightness between the first and third optical fiber terminals. There is.
次に、本発明の実施例について図面を参照して説明する
。Next, embodiments of the present invention will be described with reference to the drawings.
第１図は本発明の一実施例の横断面図、第２図はその縦
断面図である。FIG. 1 is a cross-sectional view of one embodiment of the present invention, and FIG. 2 is a longitudinal cross-sectional view thereof.
半導体レーザ素子１及びレーザ出力モニタ素子２は、は
んだ合金等によって、結合用レンズ（第１の結合用レン
ズ）３を保持する保持部材４は、ＹＡＧ溶接等によって
、それぞれ保持部材５に固定されている。The semiconductor laser element 1 and the laser output monitor element 2 are each fixed to a holding member 5 by a solder alloy or the like, and a holding member 4 that holds a coupling lens (first coupling lens) 3 is fixed to a holding member 5 by YAG welding or the like. There is.
両端に光ファイバ端末６ａ、６ｂを有する中継光ファイ
バ６の一方の光ファイバ端末く第２の光ファイバ端末）
６ａは、半導体レーサ素子１との光軸調整後、保持部材
７を介してＹＡＧ溶接等により保持部材５に固定されて
いる。One optical fiber terminal of the relay optical fiber 6 having optical fiber terminals 6a and 6b at both ends (second optical fiber terminal)
6a is fixed to the holding member 5 by YAG welding or the like via the holding member 7 after adjusting the optical axis with the semiconductor laser element 1. As shown in FIG.
そしてこの保持部材５は、はんな合金等でパッケージ８
の底面に固定されている。This holding member 5 is a package 8 made of solder alloy or the like.
is fixed to the bottom of the
パッケージ８の側面には、円筒状のホルダつがあり、そ
の内壁部には、はんだ合金または低融点ガラス等により
結合用レンズ（第２の結合用レンズ＞１０か気密を保持
できるように固着されている。There is a cylindrical holder on the side of the package 8, and a coupling lens (second coupling lens > 10) is fixed to the inner wall of the holder using a solder alloy or low melting point glass to maintain airtightness. There is.
光出力用光ファイバ１１の先端に取り付けられている光
ファイバ端末（第１の光ファイバ端末）１１ａは、中継
光ファイバ６と光ファイバ１１の最適結合を図るため、
光ファイバ端末（第３の光ファイバ端末）６ｂと光ファ
イバ端末１１ａの光軸調整を行った後、サポート１２を
介してホルダ９にＹＡＧレーザ溶接で固着されている。The optical fiber terminal (first optical fiber terminal) 11a attached to the tip of the optical fiber 11 for optical output is configured to optimally connect the relay optical fiber 6 and the optical fiber 11.
After adjusting the optical axes of the optical fiber terminal (third optical fiber terminal) 6b and the optical fiber terminal 11a, they are fixed to the holder 9 via the support 12 by YAG laser welding.
なお、結合用レンズ１０は、中継光ファイバ６と光ファ
イバ１１を光結合すると共に気密を保持する働きをして
いる。Note that the coupling lens 10 functions to optically couple the relay optical fiber 6 and the optical fiber 11 and maintain airtightness.
以上のように光半導体モジュールの光学系を形成するこ
とにより、周囲の温度変化や外力の影響でパッケージ８
が変形して、保持部材５とホルダ９との相対位置がずれ
た場合でも、中継光ファイバ６の柔軟性でずれを吸収し
、半導体レーザ素子１から出射されたレーザ電力を光フ
ァイバ１〕に安定に伝達することができる。By forming the optical system of the optical semiconductor module as described above, the package 8
Even if the relative position between the holding member 5 and the holder 9 shifts due to deformation, the flexibility of the relay optical fiber 6 absorbs the shift, and the laser power emitted from the semiconductor laser element 1 is transferred to the optical fiber 1]. It can be transmitted stably.
第４図および第５図は本発明の他の実施例の横断面図お
よび縦断面図であり、電子冷却素子１３と温度計測用サ
ーミスタ１４とを内蔵した例である。このように、温度
計測用サーミスタ１４を介して半導体レーサ素子を取付
けることも可能で応用がきく利点がある。FIGS. 4 and 5 are a cross-sectional view and a vertical cross-sectional view of another embodiment of the present invention, which is an example in which a thermoelectric cooling element 13 and a thermistor 14 for temperature measurement are incorporated. In this way, it is possible to attach a semiconductor laser element via the temperature measuring thermistor 14, which has the advantage of being versatile.
以上詳細に説明したように、本発明は、中継光ファイバ
をパッケージに内蔵することにより、周囲の温度変化や
外力の影響でパッケージが変形しても、中継光ファイバ
の柔軟性でずれを吸収し、半導体素子と入出力用光ファ
イバとの間の結合を損ねることがなく、効率の低下がな
いという効果がある。As explained in detail above, the present invention incorporates a relay optical fiber into a package, so that even if the package is deformed due to ambient temperature changes or external forces, the flexibility of the relay optical fiber can absorb the shift. This has the advantage that the coupling between the semiconductor element and the input/output optical fiber is not impaired, and there is no decrease in efficiency.
第１図は本発明の一実施例の横断面図、第２図は第１図
の縦断面図、第３図は従来の光半導体モジュールの縦断
面図、第４図および第５図は電子冷却素子および温度計
測用サーミスタを内蔵した本発明の他の実施例の横断面
図および縦断面図である。
１・・・・・・半導体レーザ素子、２・・・・・・レー
ザ出力モニタ素子、３，１０・・・・・・結合用レンズ
、４，５゜７．１５・・・・・・保持部材、６・・・・
・・中継光ファイバ、６ａ、６ｂ、ｌｌａ・・・・・・
光ファイバ端末、８゜８ａ・・・・・・パッケージ、９
・・・・・・ホルダ、１１・・・−・・光ファイバ、１
２・・・・・・サポート、１３・・・・・・電子冷却素
子、１４・・・・・・温度計測用サーミスタ。FIG. 1 is a cross-sectional view of an embodiment of the present invention, FIG. 2 is a vertical cross-sectional view of FIG. 1, FIG. 3 is a vertical cross-sectional view of a conventional optical semiconductor module, and FIGS. 4 and 5 are electronic FIG. 6 is a cross-sectional view and a vertical cross-sectional view of another embodiment of the present invention incorporating a cooling element and a thermistor for temperature measurement. 1...Semiconductor laser element, 2...Laser output monitor element, 3,10...Coupling lens, 4,5°7.15...Holding Parts, 6...
・Relay optical fiber, 6a, 6b, lla...
Optical fiber terminal, 8°8a...Package, 9
...Holder, 11...-Optical fiber, 1
2...Support, 13...Electronic cooling element, 14...Temperature measurement thermistor.
Claims (1)
バ端末をパッケージの側面に固定し、光半導体素子とそ
の前面に配置された第１の結合レンズとを含む光学部を
取り付けた保持部材を前記パッケージの底面に固定し気
密封入した光半導体モジュールにおいて、前記第１の光
ファイバ端末と前記第１の結合レンズとの間に両端に第
２及び第３の光ファイバ端末を有する中継光ファイバを
配し、前記第２の光ファイバ端末を前記第１の結合レン
ズと対向するよう前記保持部材に固定し、前記第３の光
ファイバ端末を前記第１の光ファイバ端末と対向するよ
う前記パッケージの側面に固定し、前記第１と第３の光
ファイバ端末の間に第２の結合レンズを前記パッケージ
に気密を保つように固着したことを特徴とする光半導体
モジュール。A holding member that fixes a first optical fiber terminal that fixes a terminal of an optical fiber for input/output to a side surface of a package, and has an optical section attached thereto that includes an optical semiconductor element and a first coupling lens arranged in front of the optical semiconductor element. in the optical semiconductor module fixed to the bottom surface of the package and hermetically sealed, a relay optical fiber having second and third optical fiber terminals at both ends between the first optical fiber terminal and the first coupling lens. , the second optical fiber terminal is fixed to the holding member so as to face the first coupling lens, and the third optical fiber terminal is fixed to the package so as to face the first optical fiber terminal. An optical semiconductor module, characterized in that a second coupling lens is fixed to a side surface of the package, and a second coupling lens is fixed to the package between the first and third optical fiber terminals so as to maintain airtightness.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29591190A JPH04168402A (en) | 1990-11-01 | 1990-11-01 | Optical semiconductor module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP29591190A JPH04168402A (en) | 1990-11-01 | 1990-11-01 | Optical semiconductor module |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH04168402A true JPH04168402A (en) | 1992-06-16 |
Family
ID=17826739
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP29591190A Pending JPH04168402A (en) | 1990-11-01 | 1990-11-01 | Optical semiconductor module |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH04168402A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012113094A (en) * | 2010-11-24 | 2012-06-14 | Opnext Japan Inc | Optical module |
| CN107238901A (en) * | 2017-06-27 | 2017-10-10 | 江苏长电科技股份有限公司 | A kind of side goes out the SiP encapsulating structures and its process of type optoelectronic transceiver functions |
-
1990
- 1990-11-01 JP JP29591190A patent/JPH04168402A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2012113094A (en) * | 2010-11-24 | 2012-06-14 | Opnext Japan Inc | Optical module |
| CN107238901A (en) * | 2017-06-27 | 2017-10-10 | 江苏长电科技股份有限公司 | A kind of side goes out the SiP encapsulating structures and its process of type optoelectronic transceiver functions |
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