JPH0266987A - Flat package type semiconductor laser light - Google Patents
Flat package type semiconductor laser lightInfo
- Publication number
- JPH0266987A JPH0266987A JP63219372A JP21937288A JPH0266987A JP H0266987 A JPH0266987 A JP H0266987A JP 63219372 A JP63219372 A JP 63219372A JP 21937288 A JP21937288 A JP 21937288A JP H0266987 A JPH0266987 A JP H0266987A
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor laser
- optical
- optical fiber
- cylindrical unit
- flat package
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 32
- 230000003287 optical effect Effects 0.000 claims abstract description 42
- 239000013307 optical fiber Substances 0.000 claims abstract description 38
- 238000001816 cooling Methods 0.000 claims abstract description 17
- 230000008878 coupling Effects 0.000 claims abstract description 13
- 238000010168 coupling process Methods 0.000 claims abstract description 13
- 238000005859 coupling reaction Methods 0.000 claims abstract description 13
- 229910000679 solder Inorganic materials 0.000 abstract description 12
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 2
- 229910052782 aluminium Inorganic materials 0.000 abstract description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 abstract description 2
- 229910052802 copper Inorganic materials 0.000 abstract description 2
- 239000010949 copper Substances 0.000 abstract description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 abstract description 2
- 239000010931 gold Substances 0.000 abstract description 2
- 229910052737 gold Inorganic materials 0.000 abstract description 2
- 229910052751 metal Inorganic materials 0.000 abstract description 2
- 239000002184 metal Substances 0.000 abstract description 2
- QVGXLLKOCUKJST-UHFFFAOYSA-N atomic oxygen Chemical compound [O] QVGXLLKOCUKJST-UHFFFAOYSA-N 0.000 abstract 1
- 238000012544 monitoring process Methods 0.000 abstract 1
- 229910052760 oxygen Inorganic materials 0.000 abstract 1
- 239000001301 oxygen Substances 0.000 abstract 1
- 230000002123 temporal effect Effects 0.000 abstract 1
- CNQCVBJFEGMYDW-UHFFFAOYSA-N lawrencium atom Chemical compound [Lr] CNQCVBJFEGMYDW-UHFFFAOYSA-N 0.000 description 12
- 239000000463 material Substances 0.000 description 4
- 238000003466 welding Methods 0.000 description 4
- 238000001514 detection method Methods 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 230000006866 deterioration Effects 0.000 description 2
- 229910000833 kovar Inorganic materials 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000006641 stabilisation Effects 0.000 description 2
- 238000011105 stabilization Methods 0.000 description 2
- 229910001220 stainless steel Inorganic materials 0.000 description 2
- 239000010935 stainless steel Substances 0.000 description 2
- 230000015556 catabolic process Effects 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000006731 degradation reaction Methods 0.000 description 1
- 239000006185 dispersion Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000009429 electrical wiring Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000000835 fiber Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/02208—Mountings; Housings characterised by the shape of the housings
- H01S5/02212—Can-type, e.g. TO-CAN housings with emission along or parallel to symmetry axis
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/022—Mountings; Housings
- H01S5/0225—Out-coupling of light
- H01S5/02251—Out-coupling of light using optical fibres
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S5/00—Semiconductor lasers
- H01S5/02—Structural details or components not essential to laser action
- H01S5/024—Arrangements for thermal management
Landscapes
- Optical Couplings Of Light Guides (AREA)
- Semiconductor Lasers (AREA)
- Optical Communication System (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は光伝送システムに用いられる光源に関し、特に
周囲温度の影響を受けずに半導体レーザの温度を安定に
保つことが可能なフラットパッケージ形半導体レーザ光
モジュールに関する。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a light source used in an optical transmission system, and in particular to a flat package type light source that can maintain a stable temperature of a semiconductor laser without being affected by ambient temperature. This invention relates to a semiconductor laser optical module.
第４図は従来のフラットパッケージ形半導体レーザ光モ
ジュールの断面図である。図において、１０１はフラッ
トパッケージ、１０２はフタ。FIG. 4 is a sectional view of a conventional flat package type semiconductor laser optical module. In the figure, 101 is a flat package and 102 is a lid.
１０３は半導体レーザ素子、１０４はヒートシンク、１
０５はモニタ光検出用受光素子、１０６は半導体レーザ
素子１０３からの出力光を結合するための光学系である
先球光ファイバ、１０７は先球光ハアイバ１０６を固定
するための半田、１０８は先球光ファイバ保護とフラッ
トパッケージ１０１内の気密保持のためのスリーブ、１
０９はスリーブ１０８の固定と気密保持のための半田、
１１０は光ファイバのジャケラ）、１１１は半導体レー
ザ素子１０３の温度検出用のサーミスタ素子。103 is a semiconductor laser element, 104 is a heat sink, 1
05 is a light receiving element for detecting monitor light, 106 is a tip optical fiber which is an optical system for coupling the output light from the semiconductor laser element 103, 107 is solder for fixing the tip optical fiber 106, and 108 is a tip optical fiber. Sleeve for protecting the spherical optical fiber and maintaining airtightness inside the flat package 101, 1
09 is solder for fixing the sleeve 108 and keeping it airtight;
110 is an optical fiber jacket), and 111 is a thermistor element for detecting the temperature of the semiconductor laser element 103.
１１２は冷却素子、１１３はヒートシンクブロックであ
る。112 is a cooling element, and 113 is a heat sink block.
図においては便宜上電気配線を省略した。In the figure, electrical wiring is omitted for convenience.
第４図のように従来のフラットパッケージ形半導体レー
ザ光モジ−−ルは、ヒートシンクブロック１１３上に光
モジュールの主要部品である半導体レーザ素子１０３．
受光素子１０５．先球光ファイバ１０６および、サーミ
スタ素子１１１が実装されている。一般にこのような光
モジュールでは半導体レーザ素子１０３からの光出力、
出力光の中心波長が周囲温度の変化に関係なくほぼ一定
となるように制御されている。光出力の安定化に関して
は、
■ 半導体レーザ素子１０３からの出力光を受光素子１
０５が検出して、半導体レーザ素子１０３の駆動電流を
増減させながら光出力を一定に保つ方法と、
■ 半導体レーザ素子１０３の温度をサーミスタ素子１
１１が電気抵抗として検出し、その抵抗値が一定に保て
るように冷却素子１１２への電流を変化させる方法
のいづれかが採用されている。中心波長の安定化に関し
ては、■の方法が広く用いられている。これは、半導体
レーザ素子１０３の中心波長と光ファイバの零分散波長
との拡がりを最小に抑えて伝送距離を一層のばすための
システムニーズに基づいている。As shown in FIG. 4, a conventional flat package type semiconductor laser optical module has a semiconductor laser element 103, which is a main component of the optical module, mounted on a heat sink block 113.
Light receiving element 105. A tip optical fiber 106 and a thermistor element 111 are mounted. Generally, in such an optical module, the optical output from the semiconductor laser element 103,
The center wavelength of the output light is controlled to be approximately constant regardless of changes in ambient temperature. Regarding the stabilization of the optical output, ■ The output light from the semiconductor laser element 103 is
05 detects the temperature of the semiconductor laser element 103 and keeps the optical output constant while increasing/decreasing the driving current of the semiconductor laser element 103.
11 is detected as an electrical resistance, and the current to the cooling element 112 is changed so that the resistance value is kept constant. Regarding stabilization of the center wavelength, method (2) is widely used. This is based on the system needs to further extend the transmission distance by minimizing the spread between the center wavelength of the semiconductor laser element 103 and the zero dispersion wavelength of the optical fiber.
上記のような構成のフラットパッケージ形光モジュール
では、半導体レーザ素子１０３と先球光ファイバ１０６
を光学的に調整したのち、半田１０７を１００℃以上に
加熱して先球光ファイバ１０６を固定する方法が採用さ
れている。この場合、−時的にせよヒートシンクブロッ
ク１１３全体を１００℃程度にまで予備加熱するため、
温度分布の差により半導体レーザ素子１０３に構造的な
歪が生ずる。この歪は室温に戻ったときに解除されるが
、このとき半導体レーザ素子１０３と先球光ファイバ１
０６との光学的な調整は最適な状態からずれてしまう。In the flat package optical module configured as described above, the semiconductor laser element 103 and the tip optical fiber 106
A method is adopted in which the tip optical fiber 106 is fixed by optically adjusting the solder 107 and then heating the solder 107 to 100° C. or higher. In this case, in order to preheat the entire heat sink block 113 to about 100°C,
Structural distortion occurs in the semiconductor laser element 103 due to the difference in temperature distribution. This strain is released when the temperature returns to room temperature, but at this time the semiconductor laser element 103 and the tip optical fiber 1
The optical adjustment with 06 will deviate from the optimum state.
したがって先球光ファイバ１０６の光学系では例えば単
一モードファイバ系の場合に、調整レベルでは結合効率
を１ｄＢ台に出来るにもかかわらず、光軸からのずれに
ともなう光出力劣化が大きいために結合効率を意図的に
劣化させてずれ量に対する光出力劣化の許容範囲を拡く
とれるようにしである。しかしながら、半田１０７が冷
えて固まったあとに先球光ファイバ１０６に機械的なス
トレスが加わると、半田１０７に内部応力に作用してク
リープ現象を生じる。このため半導体レーザ素子１０３
と先球光ファイバ１０６との相対位置関係がずれること
となり、経時的には光ファイバからの光出力が徐々に低
下するという問題があった。Therefore, in the optical system of the optical fiber 106, for example, in the case of a single mode fiber system, although the coupling efficiency can be reduced to the 1 dB level at the adjustment level, the optical output deterioration due to the deviation from the optical axis is large. This is to intentionally degrade the efficiency so that the allowable range of optical output degradation relative to the amount of deviation can be expanded. However, when mechanical stress is applied to the tip optical fiber 106 after the solder 107 has cooled and hardened, internal stress acts on the solder 107, causing a creep phenomenon. Therefore, the semiconductor laser element 103
The relative positional relationship between the optical fiber 106 and the optical fiber 106 becomes deviated, and there is a problem in that the optical output from the optical fiber gradually decreases over time.
この発明は、このような問題を解決するため、光軸固定
時に軸ずれをおこすことなくしかも長期的に光学特性が
安定となる半導体レーザ光モジュールを提供することを
目的としている。In order to solve these problems, it is an object of the present invention to provide a semiconductor laser optical module that does not cause axis deviation when the optical axis is fixed and has stable optical characteristics over a long period of time.
本発明によれば、半導体レーザ素子とモニタ光検出用受
光素子を内蔵したキャン形パッケージと、光ファイバ結
合用の光学系を実装したレンズホルダと、光ファイバ端
末部とが、光軸に沿って円筒状ユニットとして構成され
ており、しかも冷却素子と円筒状ユニットとの間を熱伝
導性の高いヒートシンクブロックで密着固定したことを
特徴としたフラットパッケージ形半導体レーザ光モジュ
ールが得られる。According to the present invention, a can-shaped package containing a semiconductor laser element and a light receiving element for detecting monitor light, a lens holder mounting an optical system for coupling optical fibers, and an optical fiber terminal portion are arranged along the optical axis. A flat package type semiconductor laser optical module is obtained, which is configured as a cylindrical unit and is characterized in that the cooling element and the cylindrical unit are closely fixed by a heat sink block with high thermal conductivity.
次に、本発明の実施例について図面を参照して説明する
。Next, embodiments of the present invention will be described with reference to the drawings.
第１図は本発明の一実施例の縦断面図であり、第２図は
その横断面図、さらに第３図は本発明の主要構成要素で
ある円筒状ユニットの縦断面図である。FIG. 1 is a longitudinal cross-sectional view of one embodiment of the present invention, FIG. 2 is a cross-sectional view thereof, and FIG. 3 is a vertical cross-sectional view of a cylindrical unit which is a main component of the present invention.
図において、円筒状ユニット１０は３つの部分で構成さ
れている。すなわち第３図に示すように半導体レーザ素
子１１とモニタ光検出用受光素子１２を内蔵してキャン
形パッケージ１３を固定している光源部３０と、結合用
のレンズ１４を内蔵したレンズホルダ１５を有する結合
部３１と、光ファイバ１６と光ファイバ１６の端面を保
護し且つ強化するフェルール１７を有する光ファイバ端
末部３２である。光源部３０と結合部３１とはその境界
部をＹＡＧレーザで溶接しである。図中に塗りつぶされ
た部分が溶接部３３である。レンズ１４には半導体レー
ザ素子１１側に先球加工された集束性ロッドレンズを使
用した。結合部３１と光ファイバ端末部３２とはサポー
ト１８を介してＹＡＧレーザ溶接をしである。このよう
に円筒状ユニット１０はＹＡＧレーザ溶接の可能なステ
ンレス材料やコバール材料でまわりが覆われている。In the figure, the cylindrical unit 10 is composed of three parts. In other words, as shown in FIG. 3, a light source section 30 containing a semiconductor laser element 11 and a light receiving element 12 for detecting monitor light and fixing a can-shaped package 13, and a lens holder 15 containing a coupling lens 14 are included. and a ferrule 17 that protects and strengthens the optical fiber 16 and the end face of the optical fiber 16. The light source section 30 and the coupling section 31 are welded at their boundary using a YAG laser. The shaded portion in the figure is the welded portion 33. As the lens 14, a focusing rod lens whose tip is rounded on the side of the semiconductor laser element 11 is used. The coupling portion 31 and the optical fiber terminal portion 32 are welded by YAG laser via the support 18. In this way, the cylindrical unit 10 is covered with a stainless steel material or Kovar material that can be welded by YAG laser.
フラットパッケージ１９内での円筒状ユニットＩＯは熱
伝導性の高い金属例えば無酸素銅やアルミニウムに表面
を金メツキしたヒートシンクブロック２０を介して冷却
素子２１と密着固定されている。双方の固定には半田２
２を用いた。これによりヒートシンクブロック２０と半
導体レーザ素子１１の温度差は±２℃以内にはおさえる
ことができる。温度検出用にはサーミスタ素子２３をヒ
ートシンクブＧ１−７り２０中に挿入し固定した。The cylindrical unit IO within the flat package 19 is closely fixed to a cooling element 21 via a heat sink block 20 made of a highly thermally conductive metal such as oxygen-free copper or aluminum and plated with gold. Solder 2 to fix both
2 was used. Thereby, the temperature difference between the heat sink block 20 and the semiconductor laser element 11 can be suppressed to within ±2°C. For temperature detection, a thermistor element 23 was inserted into the heat sink G1-7 20 and fixed.
周囲温度が変化すると、サーミスタ素子２３が温度を検
出しフラツトパッケージ１９外部のＡＴＣ回路（オート
マチック・テンブリチャ・コントロールの略）によって
サーミスタ素子２３の抵抗が設定値からずれないように
冷却素子２１に電流を流す。これによって冷却素子２１
は発熱冷却を繰り返す。When the ambient temperature changes, the thermistor element 23 detects the temperature, and an ATC circuit (abbreviation for automatic temperature control) outside the flat package 19 applies current to the cooling element 21 so that the resistance of the thermistor element 23 does not deviate from the set value. flow. As a result, the cooling element 21
repeats exothermic cooling.
以上説明したように本発明の実施例では、外部からの温
度変化に対して光軸ずれの小さい円筒状ユニッ）１０内
に光モジュールの主要構成要素を殆んど含んでいるため
経時的な光軸ずれを無視できる。As explained above, in the embodiment of the present invention, most of the main components of the optical module are contained within the cylindrical unit (10) which has a small optical axis shift with respect to temperature changes from the outside, so that the light changes over time. Axis misalignment can be ignored.
すなわち光源部３０．結合部３１．光ファイバ端末部３
２が光軸を中心とする同心円構造をしているため、光軸
に垂直な方向の膨張収縮は従来例と違って光軸ずれとは
ならない。さらにレンズ１４として集束性ロッドレンズ
を用いているため光軸方向のずれに対しても緩くなって
いる。また各接続部分にＹＡＧレーザ溶接を用いている
ためクリープ量の問題がない。熱伝導性については円筒
状ユニット１０を半田２０を用いてヒートシンクブロッ
ク２０に固定しているため、冷却素子２１との熱のやり
とりが速くでき、したがって周囲環境の変化に対して即
座に対応できる。That is, the light source section 30. Connecting portion 31. Optical fiber terminal section 3
2 has a concentric structure centered on the optical axis, expansion and contraction in the direction perpendicular to the optical axis does not result in optical axis deviation, unlike in the conventional example. Furthermore, since a converging rod lens is used as the lens 14, it is tolerant to deviations in the optical axis direction. Furthermore, since YAG laser welding is used for each connection part, there is no problem with the amount of creep. Regarding thermal conductivity, since the cylindrical unit 10 is fixed to the heat sink block 20 using solder 20, heat can be exchanged quickly with the cooling element 21, and therefore it can respond immediately to changes in the surrounding environment.
本発明は以上の代表的な実施例の他にいくつかの変形が
考えられる。The present invention may be modified in several ways in addition to the above-described typical embodiments.
冷却素子２１上の円筒状ユニット１０は熱容量を小さく
できればできる程、冷却素子２１の消費電力を低く抑え
ることができる。そこで以上の実施例では外径を同じと
したが、光源部３０．結合部３１．光ファイバ端末部３
２の外径は任意でよい。ＹＡＧレーザ溶接する以外の材
料はステンレスやコバール以外の材料でもよい。The smaller the heat capacity of the cylindrical unit 10 on the cooling element 21 is, the lower the power consumption of the cooling element 21 can be. Therefore, in the above embodiments, the outer diameters are the same, but the light source section 30. Connecting portion 31. Optical fiber terminal section 3
The outer diameter of 2 may be arbitrary. Materials other than YAG laser welding may be materials other than stainless steel or Kovar.
また以上の実施例ではヒートシンクブロックとして半円
状のものを用いたが、冷却素子２１と接する側の面が平
坦であれば形状は任意でよいことは言うまでもない。Further, in the above embodiments, a semicircular heat sink block was used, but it goes without saying that any shape may be used as long as the surface in contact with the cooling element 21 is flat.
また以上の実施例では、光ファイバ端末部３２に光ファ
イバを斜め研磨したものを用いたが、集束性ロッドレン
ズと光ファイバを組合わせたレンズ付光ファイバにした
ものを用いてもよい。この場合には光ファイバ端末部３
２を固定する際の許容光軸ずれ量が拡がるためＹＡＧレ
ーザ溶接時のずれ量が１〜２μｍあったとしても光出力
劣化には殆んど問題なくなる。Further, in the above embodiments, an obliquely polished optical fiber is used as the optical fiber end portion 32, but an optical fiber with a lens, which is a combination of a focusing rod lens and an optical fiber, may also be used. In this case, the optical fiber terminal section 3
Since the allowable amount of optical axis deviation when fixing 2 is expanded, even if the amount of deviation during YAG laser welding is 1 to 2 μm, there is almost no problem with optical output deterioration.
以上説明したように本発明によれば、光軸合わせ時に軸
ずれをおこすことがなく結合損失が小さい光モジュール
が得られる。As described above, according to the present invention, it is possible to obtain an optical module that does not cause axis misalignment during alignment of optical axes and has low coupling loss.
第１図は本発明の一実施例の縦断面図、第２図は第１図
の横断面図、第３図は本発明の主要構成要素である円筒
状ユニットの縦面図、第４図は従来例の断面図である。
１０・・・・・・円筒状ユニット、１１・・・・・・半
導体装置ザ素子、１２・・・・・・モニタ光検出用受光
素子、１３・・・・・・キャン形パッケージ、１４・・
・・・・レンズ、１５・・・・・レンズホルダ、１６・
・・・・・光ファイバ、１７・・・・・・フェルール、
１８・・・・・・サポート、１９・・・・・・フラット
パッケージ、２０・・・・・・ヒートシンクブロック、
２１・・・・・・冷却素子、２２・・・・・・半田、２
３・・・・・・サーミスタ素子、３０・・・・・・光源
部、３１・・・・・・結合部、３２・・・・・・光ファ
イバ端末部、３３・・・・・・溶接部、１０１・・・・
・・フラットパッケージ、１０２・・・・・・フタ、１
０３・・・・・・半導体レーザ素子、１０４・・・・・
・ヒートシンク、１０５・・・・・・モニタ光検出用受
光素子、１０６・・・・・・先球光ファイバ、１０７・
・・・・・半田、１０８・・・・・・スリーブ、１０９
・・・・・・半田、１１０・・・・・・ジャケット、１
１１・・・・・・サーミスタ素子、１１２・・・・・・
冷却素子、１１３・・・・・・ヒートシンクブロック。
代理人 弁理士 内 原 晋FIG. 1 is a longitudinal cross-sectional view of one embodiment of the present invention, FIG. 2 is a cross-sectional view of FIG. 1, FIG. 3 is a vertical cross-sectional view of a cylindrical unit that is the main component of the present invention, and FIG. is a sectional view of a conventional example. DESCRIPTION OF SYMBOLS 10... Cylindrical unit, 11... Semiconductor device element, 12... Light receiving element for monitor light detection, 13... Can-shaped package, 14...・
... Lens, 15 ... Lens holder, 16.
...Optical fiber, 17...Ferrule,
18...Support, 19...Flat package, 20...Heat sink block,
21... Cooling element, 22... Solder, 2
3... Thermistor element, 30... Light source section, 31... Coupling section, 32... Optical fiber terminal section, 33... Welding Department, 101...
...Flat package, 102...Lid, 1
03... Semiconductor laser element, 104...
・Heat sink, 105... Light receiving element for monitor light detection, 106... Tip optical fiber, 107...
... Solder, 108 ... Sleeve, 109
...Solder, 110 ...Jacket, 1
11... Thermistor element, 112...
Cooling element, 113...Heat sink block. Agent Patent Attorney Susumu Uchihara
Claims (2)
するフラットパッケージ形光モジュールにおいて、前記
半導体レーザ素子及びモニタ光検出用受光素子を内蔵し
たキャン形のパッケージと、前記半導体レーザ素子から
の出力光を光ファイバに結合するための光学系が実装さ
れたレンズホルダと、前記光学系で集束された前記出力
光が入射する光ファイバを実装した光ファイバ端末部と
が、光軸に沿って円筒状ユニットとして構成され、且つ
前記冷却素子と前記円筒状ユニットとの間を熱伝導性の
高いヒートシンクブロックで密着固定したことを特徴と
したフラットパッケージ形半導体レーザ光モジュール。(1) A flat package optical module having a cooling element for controlling the temperature of a semiconductor laser element, which includes a can-shaped package containing the semiconductor laser element and a light receiving element for detecting monitor light, and output light from the semiconductor laser element. A lens holder mounted with an optical system for coupling the output light to an optical fiber, and an optical fiber terminal section mounted with an optical fiber into which the output light focused by the optical system enters, are arranged in a cylindrical shape along the optical axis. 1. A flat package type semiconductor laser optical module configured as a unit, and characterized in that the cooling element and the cylindrical unit are tightly fixed by a heat sink block having high thermal conductivity.
合わせたレンズ付光ファイバを使用したことを特徴とす
る特許請求の範囲第（１）項記載のフラットパッケージ
形半導体レーザ光モジュール。(2) The flat package type semiconductor laser optical module according to claim 1, characterized in that the optical fiber terminal part uses an optical fiber with a lens combined with a part of the optical system. .
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63219372A JP2833760B2 (en) | 1988-08-31 | 1988-08-31 | Flat package type semiconductor laser optical module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63219372A JP2833760B2 (en) | 1988-08-31 | 1988-08-31 | Flat package type semiconductor laser optical module |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0266987A true JPH0266987A (en) | 1990-03-07 |
| JP2833760B2 JP2833760B2 (en) | 1998-12-09 |
Family
ID=16734385
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63219372A Expired - Lifetime JP2833760B2 (en) | 1988-08-31 | 1988-08-31 | Flat package type semiconductor laser optical module |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2833760B2 (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5706302A (en) * | 1995-03-14 | 1998-01-06 | Nec Corporation | Temperature control type semiconductor laser device |
| US5960142A (en) * | 1996-08-13 | 1999-09-28 | Nec Corporation | Peltier cooler and semiconductor laser module using Peltier cooler |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62166660U (en) * | 1986-03-06 | 1987-10-22 |
-
1988
- 1988-08-31 JP JP63219372A patent/JP2833760B2/en not_active Expired - Lifetime
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62166660U (en) * | 1986-03-06 | 1987-10-22 |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5706302A (en) * | 1995-03-14 | 1998-01-06 | Nec Corporation | Temperature control type semiconductor laser device |
| US5960142A (en) * | 1996-08-13 | 1999-09-28 | Nec Corporation | Peltier cooler and semiconductor laser module using Peltier cooler |
Also Published As
| Publication number | Publication date |
|---|---|
| JP2833760B2 (en) | 1998-12-09 |
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